Lenovo ThinkSystem SR850P User manual

ThinkSystem SR850P
Setup Guide
Machine Types: 7D2F, 7D2G and 7D2H

Note
Befo e using this info mation and the p oduct it suppo ts, be su e to ead and unde stand the safety
info mation and the safety inst uctions, which a e available at:
http://thinksystem.lenovofiles.com/help/topic/safety_documentation/pdf_files.html
In addition, be su e that you a e familia with the te ms and conditions of the Lenovo wa anty fo you se ve ,
which can be found at:
http://datacente suppo t.lenovo.com/wa antylookup
Ninth Edition (June 2022)
© Copyright Lenovo 201 , 2021.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services
Administration (GSA) contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No.
GS-35F-05 25.

Contents
Contents . . . . . . . . . . . . . . . . . i
Safety . . . . . . . . . . . . . . . . . . iii
Safety inspection checklist . . . . . . . . . . . iv
Chapter 1. Introduction . . . . . . . . . 1
Se ve package contents . . . . . . . . . . . . 1
Featu es. . . . . . . . . . . . . . . . . . . 2
Specifications . . . . . . . . . . . . . . . . 4
Pa ticulate contamination . . . . . . . . . . 7
Management options. . . . . . . . . . . . . . 8
Chapter 2. Server components . . . . 13
F ont view . . . . . . . . . . . . . . . . . 13
F ont ope ato panel . . . . . . . . . . . 16
F ont ope ato panel with LCD display . . . . 16
Rea view . . . . . . . . . . . . . . . . . 21
P ocesso and memo y expansion t ay . . . . . 24
PCIe ise -ca ds. . . . . . . . . . . . . . . 27
2.5-inch d ive backplanes . . . . . . . . . . . 28
RAID adapte s . . . . . . . . . . . . . . . 30
Inte nal cable outing. . . . . . . . . . . . . 31
Cable outing fo 2.5-inch d ives . . . . . . 31
Pa ts list. . . . . . . . . . . . . . . . . . 40
Powe co ds . . . . . . . . . . . . . . 44
Chapter 3. Server hardware setup . . 45
Se ve setup checklist . . . . . . . . . . . . 45
Installation Guidelines . . . . . . . . . . . . 46
System eliability guidelines . . . . . . . . 47
Wo king inside the se ve with the powe on . . 47
Handling static-sensitive devices . . . . . . 48
Memo y module installation ules and o de . . . . 48
Memo y module installation guideline . . . . 49
DRAM DIMM installation o de . . . . . . . 49
DCPMM and DRAM DIMM installation o de . . 63
Install se ve ha dwa e options . . . . . . . . . 72
Remove the secu ity bezel . . . . . . . . . 73
Remove the top cove . . . . . . . . . . 74
Remove the p ocesso and memo y
expansion t ay . . . . . . . . . . . . . 75
Remove the fan cage assembly . . . . . . . 77
Install a memo y module . . . . . . . . . 78
Install a d ive backplane. . . . . . . . . . 80
Install a 2.5-inch hot-swap d ive . . . . . . 82
Install the PCIe ise -ca d assembly . . . . . 83
Install the LOM adapte . . . . . . . . . . 85
How to adjust the position of the etaine on
the M.2 backplane . . . . . . . . . . . . 86
Install an M.2 d ive in the M.2 backplane . . . 86
Install the M.2 backplane . . . . . . . . . 88
Install the fan cage assembly . . . . . . . . 89
Install the p ocesso and memo y expansion
t ay . . . . . . . . . . . . . . . . . . 90
Install the top cove . . . . . . . . . . . 93
Install the secu ity bezel. . . . . . . . . . 94
Install the se ve in a ack . . . . . . . . . . . 95
Cable the se ve . . . . . . . . . . . . . . 95
Powe on the se ve . . . . . . . . . . . . . 96
Validate se ve setup. . . . . . . . . . . . . 96
Powe off the se ve . . . . . . . . . . . . . 96
Chapter 4. System configuration . . . 7
Set the netwo k connection fo the Lenovo XCla ity
Cont olle . . . . . . . . . . . . . . . . . 97
Set f ont USB po t fo Lenovo XCla ity Cont olle
connection. . . . . . . . . . . . . . . . . 98
Update the fi mwa e . . . . . . . . . . . . . 98
Configu e the fi mwa e . . . . . . . . . . . . 102
Memo y configu ation . . . . . . . . . . . . 103
Configu e Pe sistent Memo y Module
(PMem) . . . . . . . . . . . . . . . . 103
RAID configu ation . . . . . . . . . . . . . 108
Deploy the ope ating system. . . . . . . . . . 108
Back up the se ve configu ation . . . . . . . . 109
Update the Vital P oduct Data (VPD). . . . . . . 110
Update the Unive sal Unique Identifie
(UUID). . . . . . . . . . . . . . . . . 110
Update the asset tag . . . . . . . . . . . 111
Chapter 5. Resolving installation
issues . . . . . . . . . . . . . . . . . 115
Appendix A. Getting help and
technical assistance . . . . . . . . . . 121
Befo e you call . . . . . . . . . . . . . . . 121
Collecting se vice data . . . . . . . . . . . . 122
Contacting Suppo t . . . . . . . . . . . . . 123
Index . . . . . . . . . . . . . . . . . . 125
© Copy ight Lenovo 2019, 2021 i

ii ThinkSystem SR850P Setup Guide

Safety
Befo e installing this p oduct, ead the Safety Info mation.
Antes de instala este p oduto, leia as Info mações de Segu ança.
Læs sikke hedsfo sk ifte ne, fø du installe e dette p odukt.
Lees voo dat u dit p oduct installee t ee st de veiligheidsvoo sch iften.
Ennen kuin asennat tämän tuotteen, lue tu vaohjeet kohdasta Safety Info mation.
Avant d'installe ce p oduit, lisez les consignes de sécu ité.
Vo de Installation dieses P odukts die Siche heitshinweise lesen.
P ima di installa e questo p odotto, legge e le Info mazioni sulla Sicu ezza.
Les sikke hetsinfo masjonen (Safety Info mation) fø du installe e dette p oduktet.
Antes de instala este p oduto, leia as Info mações sob e Segu ança.
© Copy ight Lenovo 2019, 2021 iii

Antes de instala este p oducto, lea la info mación de segu idad.
Läs säke hetsinfo mationen innan du installe a den hä p odukten.
Safety inspection checklist
Use the info mation in this section to identify potentially unsafe conditions with you se ve . As each machine
was designed and built, equi ed safety items we e installed to p otect use s and se vice technicians f om
inju y.
Notes:
1. The p oduct is not suitable fo use at visual display wo kplaces acco ding to §2 of the Wo kplace
Regulations.
2. The set-up of the se ve is made in the se ve oom only.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60 50-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.
Important: Elect ical g ounding of the se ve is equi ed fo ope ato safety and co ect system function.
P ope g ounding of the elect ical outlet can be ve ified by a ce tified elect ician.
Use the following checklist to ve ify that the e a e no potentially unsafe conditions:
1. Make su e that the powe is off and the powe co d is disconnected.
2. Check the powe co d.
• Make su e that the thi d-wi e g ound connecto is in good condition. Use a mete to measu e thi d-
wi e g ound continuity fo 0.1 ohm o less between the exte nal g ound pin and the f ame g ound.
• Make su e that the powe co d is the co ect type.
To view the powe co ds that a e available fo the se ve :
a. Go to:
iv ThinkSystem SR850P Setup Guide

http://dcsc.lenovo.com/#/
b. Click Preconfigured Model o Configure to order.
c. Ente the machine type and model fo you se ve to display the configu ato page.
d. Click Power ➙ Power Cables to see all line co ds.
• Make su e that the insulation is not f ayed o wo n.
3. Check fo any obvious non-Lenovo alte ations. Use good judgment as to the safety of any non-Lenovo
alte ations.
4. Check inside the se ve fo any obvious unsafe conditions, such as metal filings, contamination, wate o
othe liquid, o signs of fi e o smoke damage.
5. Check fo wo n, f ayed, o pinched cables.
6. Make su e that the powe -supply cove fastene s (sc ews o ivets) have not been emoved o tampe ed
with.
© Copy ight Lenovo 2019, 2021 v

vi ThinkSystem SR850P Setup Guide

Chapter 1. Introduction
The ThinkSystem SR850P se ve is a 2U ack se ve designed fo high-volume netwo k t ansaction
p ocessing. This high-pe fo mance, multi-co e se ve is ideally suited fo netwo king envi onments that
equi e supe io p ocesso pe fo mance, input/output (I/O) flexibility, and high manageability.
Figure 1. ThinkSystem SR850P
The se ve comes with a limited wa anty. Fo details about the wa anty, see:
https://suppo t.lenovo.com/us/en/solutions/ht503310
Fo details about you specific wa anty, see:
http://datacente suppo t.lenovo.com/wa antylookup
In addition, the system se vice label on the top cove of the se ve p ovides a QR code fo mobile access to
se vice info mation. You can scan the QR code with a mobile device fo quick access to additional
info mation including pa ts installation, eplacement, and e o codes.
Following illust ation is the QR code: https://suppo t.lenovo.com/p/se ve s/s 850
Figure 2. QR code
Server package contents
When you eceive you se ve , ve ify that the shipment contains eve ything that you expected to eceive.
The se ve package includes the following items:
Note: Some of the items listed a e available on select models only.
© Copy ight Lenovo 2019, 2021 1

• Se ve
• Rail installation kit (optional). Detailed inst uctions fo installing the ail installation kit a e p ovided in the
package with the ail installation kit.
• Cable management a m o cable management ba .
• Mate ial box, including items such as ack installation guide and accesso y kit.
Features
Pe fo mance, ease of use, eliability, and expansion capabilities we e key conside ations in the design of
you se ve . These design featu es make it possible fo you to customize the system ha dwa e to meet you
needs today and p ovide flexible expansion capabilities fo the futu e.
You se ve implements the following featu es and technologies:
• Features on Demand
If a Featu es on Demand featu e is integ ated in the se ve o in an optional device that is installed in the
se ve , you can pu chase an activation key to activate the featu e. Fo info mation about Featu es on
Demand, see:
https://fod.lenovo.com/lkms
• Lenovo XClarity Controller (XCC)
The Lenovo XCla ity Cont olle is the common management cont olle fo Lenovo ThinkSystem se ve
ha dwa e. The Lenovo XCla ity Cont olle consolidates multiple management functions in a single chip on
the se ve system boa d.
Some of the featu es that a e unique to the Lenovo XCla ity Cont olle a e enhanced pe fo mance, highe -
esolution emote video, and expanded secu ity options. Fo additional info mation about the Lenovo
XCla ity Cont olle , efe to the XCC documentation compatible with you se ve at:
https://sysmgt.lenovofiles.com/help/topic/lxcc_f ontend/lxcc_ove view.html
Important: Lenovo XCla ity Cont olle (XCC) suppo ted ve sion va ies by p oduct. All ve sions of Lenovo
XCla ity Cont olle a e efe ed to as Lenovo XCla ity Cont olle and XCC in this document, unless
specified othe wise. To see the XCC ve sion suppo ted by you se ve , go to https://
sysmgt.lenovofiles.com/help/topic/lxcc_f ontend/lxcc_ove view.html.
• UEFI-compliant server firmware
Lenovo ThinkSystem fi mwa e is Unified Extensible Fi mwa e Inte face (UEFI) compliant. UEFI eplaces
BIOS and defines a standa d inte face between the ope ating system, platfo m fi mwa e, and exte nal
devices.
Lenovo ThinkSystem se ve s a e capable of booting UEFI-compliant ope ating systems, BIOS-based
ope ating systems, and BIOS-based adapte s as well as UEFI-compliant adapte s.
Note: The se ve does not suppo t DOS (Disk Ope ating System).
• Active Memory
The Active Memo y featu e imp oves the eliability of memo y th ough memo y mi o ing. Memo y
mi o ing mode eplicates and sto es data on two pai s of DIMMs within two channels simultaneously. If a
failu e occu s, the memo y cont olle switches f om the p ima y pai of memo y DIMMs to the backup pai
of DIMMs.
• Large system-memory capacity
2ThinkSystem SR850P Setup Guide

The se ve suppo ts synch onous dynamic andom-access memo y (SDRAM) egiste ed dual inline
memo y modules (DIMMs) with e o co ecting code (ECC). Fo mo e info mation about the specific types
and maximum amount of memo y, see “Specifications” on page 4.
• Integrated Trusted Platform Module (TPM)
This integ ated secu ity chip pe fo ms c yptog aphic functions and sto es p ivate and public secu e keys.
It p ovides the ha dwa e suppo t fo the T usted Computing G oup (TCG) specification. You can
download the softwa e to suppo t the TCG specification when the softwa e is available.
Note: Fo custome s in Chinese Mainland, integ ated TPM is not suppo ted. Howeve , custome s in
Chinese Mainland can install a T usted C yptog aphic Module (TCM) adapte o a Lenovo-qualified TPM
adapte (sometimes called a daughte ca d).
• Large data-storage capacity and hot-swap capability
The hot-swap se ve models suppo t a maximum of fou teen 3.5-inch hot-swap Se ial Attached SCSI
(SAS) ha d disk d ives o hot-swap Se ial ATA (SATA) ha d disk d ives. The simple-swap se ve models
suppo t a maximum of eight 3.5-inch simple-swap SATA ha d disk d ives.
With the hot-swap featu e, you can add, emove, o eplace ha d disk d ives without tu ning off the se ve .
• Light path diagnostics
Light path diagnostics p ovides LEDs to help you diagnose p oblems. Fo mo e info mation about the light
path diagnostics, see Light path diagnostics panel and Light path diagnostics LEDs.
• Mobile access to Lenovo Service Information website
The se ve p ovides a QR code on the system se vice label, which is on the cove of the se ve , that you
can scan using a QR code eade and scanne with a mobile device to get quick access to the Lenovo
Se vice Info mation website. The Lenovo Se vice Info mation website p ovides additional info mation fo
pa ts installation, eplacement videos, and e o codes fo se ve suppo t.
• Active Energy Manager
Lenovo XCla ity Ene gy Manage is a powe and tempe atu e management solution fo data cente s. You
can monito and manage the powe consumption and tempe atu e of Conve ged, NeXtScale, System x,
and ThinkSe ve se ve s, and imp ove ene gy efficiency using Lenovo XCla ity Ene gy Manage .
• Redundant networking connection
The Lenovo XCla ity Cont olle p ovides failove capability to a edundant Ethe net connection with the
applicable application installed. If a p oblem occu s with the p ima y Ethe net connection, all Ethe net
t affic that is associated with the p ima y connection is automatically switched to the optional edundant
Ethe net connection. If the applicable device d ive s a e installed, this switching occu s without data loss
and without use inte vention.
• Redundant cooling and optional power capabilities
The se ve suppo ts a maximum of two 550-watt o 750-watt hot-swap powe supplies and th ee dual-
moto non hot-swap fans, which p ovide edundancy fo a typical configu ation. The edundant cooling by
the fans in the se ve enables continued ope ation if one of the fans fails. The se ve comes with one 550-
watt o 750-watt hot-swap powe supply and th ee non hot-swap fans.
Note: You cannot mix 550-watt and 750-watt powe supplies in the se ve .
• ThinkSystem RAID support
The ThinkSystem RAID adapte p ovides ha dwa e edundant a ay of independent disks (RAID) suppo t
to c eate configu ations. The standa d RAID adapte p ovides RAID levels 0 and 1. An optional RAID
adapte is available fo pu chase.
Chapte 1.Int oduction 3

Specifications
The following info mation is a summa y of the featu es and specifications of the se ve . Depending on the
model, some featu es might not be available, o some specifications might not apply.
Table 1. S ecifications, Ty e 7D2F, 7D2G, and 7D2H
Specification Description
Dimension 2U se ve
• Height: 86.5 mm (3.4 inches)
• Width:
– With ack handles: 482 mm (19.0 inches)
– Without ack handles: 444.6 mm (17.5 inches)
• Depth: 763.7 mm (30.1 inches)
Note: The depth is measu ed with ack handles installed, but without the secu ity bezel
installed.
Weight (depending on the
configu ation)
27.0 kg (59.6 lb) in maximum.
P ocesso (depending on
model)
Suppo ts multi-co e Intel Xeon p ocesso s, with integ ated memo y cont olle and Intel
Ult a Path Inte connect (UPI) a chitectu e.
• Fou p ocesso s a e equi ed:
– Two sockets on the system boa d
– Two sockets on the p ocesso and memo y expansion t ay
• Designed fo LGA 3647 sockets
• Scalable up to 28 co es
• Suppo ts Intel Extended Memo y 32/64 Technology (EM32/64T)
Memo y See “Memo y module installation ules and o de ” on page 48 fo detailed info mation
about memo y configu ation and setup.
• Minimum: 32 GB
• Maximum:
– RDIMM: 1.5 TB
– LRDIMM: 3 TB
– 3DS-RDIMM: 6 TB
– DC Pe sistent Memo y (DCPMM): 12 TB in Memo y Mode
• Memo y module types:
– Double-data- ate 4 (T uDDR4) e o co ecting code (ECC) 2666/2933 MT/s
egiste ed DIMM (RDIMM) o load educed DIMM (LRDIMM)
– DC Pe sistent Memo y (DCPMM)
• Capacity (depending on the model):
– 8 GB, 16 GB, 32 GB, and 64 GB RDIMM
– 64 GB LRDIMM
– 64 GB and 128 GB 3DS-RDIMM
– 128 GB, 256 GB, and 512 GB DCPMM
Note: DCPMM can be mixed with DRAM DIMMs with capacity of mo e than 16
GB. See “DC Pe sistent Memo y Module (DCPMM) setup” on page 64 fo mo e
info mation.
• Slots: 48 two-way inte leaved slots
Fo a list of suppo ted memo y modules, see https://static.lenovo.com/us/en/
se ve p oven/index.shtml.
D ive expansion Sixteen 2.5-inch d ive bays:
• Eight 2.5-inch hot-swap SATA/SAS d ive bays (bay 0-3, 8-11)
• Eight 2.5-inch hot-swap SATA/SAS/NVMe d ive bays (bay 4-7, 12-15)
4ThinkSystem SR850P Setup Guide

Table 1. S ecifications, Ty e 7D2F, 7D2G, and 7D2H (continued)
Expansion slots Ten expansion slots:
• Slot 1: PCI Exp ess 3.0 x16 (suppo ts PCIe switch ca d)
• Slot 2: PCI Exp ess 3.0 x8 (suppo ts RAID adapte s fo SATA/SAS d ives)
• Slot 3 - 5: PCI Exp ess 3.0 fo PCIe ise -ca d with the following slots available
depending on the ise -ca d installed:
– x8/x8/x8 PCIe full-height ise assembly p ovides:
– Slot 3: PCI Exp ess 3.0 x8
– Slot 4: PCI Exp ess 3.0 x8
– Slot 5: PCI Exp ess 3.0 x8
– x8/x8/x8ML2 PCIe full-height ise assembly p ovides:
– Slot 3: PCI Exp ess 3.0 x8
– Slot 4: PCI Exp ess 3.0 x8
– Slot 5: Customized slot fo x8 ML2 adapte
– x8/x16ML2 PCIe full-height ise assembly p ovides:
– Slot 3: PCI Exp ess 3.0 x8
– Slot 4: Not available
– Slot 5: Customized slot fo x16 ML2 adapte
– x16/x8 PCIe full-height ise assembly p ovides:
– Slot 3: PCI Exp ess 3.0 x16
– Slot 4: Not available
– Slot 5: PCI Exp ess 3.0 x8
• Slot 6: Customized slot fo dual M.2 backplane that suppo ts M.2 d ives in th ee
diffe ent physical sizes:
– 42 mm (2242)
– 60 mm (2260)
– 80 mm (2280)
• Slot 7: Customized slot fo LOM adapte
• Slot 8: PCI Exp ess 3.0 x8 (suppo ts RAID adapte s fo SATA/SAS d ives)
• Slot 10: PCI Exp ess 3.0 x16
• Slot 11: PCI Exp ess 3.0 x16 (suppo ts PCIe switch ca d)
Integ ated functions • Lenovo XCla ity Cont olle (XCC), which p ovides se vice p ocesso cont ol and
monito ing functions, video cont olle , and emote keyboa d, video, mouse, and
emote d ive capabilities.
• One system-management RJ-45 connecto on the ea to connect to a systems-
management netwo k. This connecto is dedicated to the Lenovo XCla ity Cont olle
functions and uns at 1 GB speed.
• Light-path diagnostics
• Fou unive sal se ial bus (USB) po ts:
– Two on the f ont of the se ve
– One USB 2.0 with Lenovo XCla ity Cont olle management
– One USB 2.0 o 3.0 (depending on the model)
– Two USB 3.0 on the ea of the se ve
• One se ial po t
Netwo k This se ve suppo ts 1GbE and 10 GbE LOM adapte s with the following equi ements:
• 1GbE LOM adapte : maximal bandwidth of netwo k envi onment is 1GB.
• 10GbE LOM adapte : minimal bandwidth of netwo k envi onment is 1GB.
RAID adapte
(depending on model)
The following options with suppo t fo RAID levels 0, 1, and 10 a e available fo this
se ve :
• ThinkSystem RAID 530-8i PCIe 12 GB Adapte
• ThinkSystem RAID 730-8i 1 GB Cache PCIe 12 GB Adapte
• ThinkSystem RAID 730-8i 2 GB Cache PCIe 12 GB Adapte
• ThinkSystem RAID 930-8i 2 GB Flash PCIe 12 GB Adapte
• ThinkSystem RAID 930-16i 4 GB Flash PCIe 12 GB Adapte
• ThinkSystem RAID 930-8e 4 GB Flash PCIe 12 GB Adapte
Fans Six (60 mm x 38 mm) inte nal system fans (N+1 edundancy)
Chapte 1.Int oduction 5

Table 1. S ecifications, Ty e 7D2F, 7D2G, and 7D2H (continued)
Ope ating System Suppo ted and ce tified ope ating systems include:
• Mic osoft Windows Se ve
• VMwa e ESXi
• Red Hat Ente p ise Linux
• SUSE Linux Ente p ise Se ve
Refe ences:
• Complete list of available ope ating systems: https://lenovop ess.com/osig.
• OS deployment inst uctions: “Deploy the ope ating system” on page 108.
Elect ical input This se ve comes with th ee types of powe supply units:
• 750-watt platinum powe supply
– Input powe 115V o 220V ac
• 1100-watt platinum powe supply
– Input powe 115V o 220V ac
• 1600-watt platinum powe supply
– Input powe 220V ac
Two powe supplies p ovide N+1 edundancy suppo t.
Minimal configu ation fo
debugging
• Fou p ocesso s
• Fou DIMMs in slot 8, 20, 32 and 44
• One powe supply
• One d ive with RAID adapte and backplane (If OS is needed fo debugging)
• Six system fans (fan 1 to fan 6)
Acoustical noise emissions With the maximum configu ation of fou p ocesso s, 48 memo y modules, 16 d ives,
and two powe supply units:
• Sound powe :
– Idle: 5.5 bels
– Ope ating: 6.3 bels
• Sound p essu e
– Idle: 39 dBA
– Ope ating: 46 dBA
6ThinkSystem SR850P Setup Guide

Table 1. S ecifications, Ty e 7D2F, 7D2G, and 7D2H (continued)
Heat output App oximate heat output:
• Minimum configu ation: 447 BTU, 131 W (in BTU pe hou and watts)
• Maximum configu ation: 5265 BTU, 1543 W (in BTU pe hou and watts)
Envi onment ThinkSystem SR850P complies with ASHRAE Class A2 specifications. Depending on
the ha dwa e configu ation, some models comply with ASHRAE Class A3 and Class A4
specifications. System pe fo mance may be impacted when ope ating tempe atu e is
outside AHSARE A2 specification.
• Ai tempe atu e:
– Ope ating
– ASHARE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient
tempe atu e dec eases by 1°C fo eve y 300 m (984 ft) inc ease in altitude
above 900 m (2,953 ft).
– ASHARE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient
tempe atu e dec eases by 1°C fo eve y 175 m (574 ft) inc ease in altitude
above 900 m (2,953 ft).
– ASHARE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient
tempe atu e dec eases by 1°C fo eve y 125 m (410 ft) inc ease in altitude
above 900 m (2,953 ft).
– Se ve off: 5°C to 45°C (41°F to 113°F)
– Shipment/sto age: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relative Humidity (non-condensing):
– Ope ating
– ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
– ASHRAE Class A3: 8% to 85%; maximum dew point: 24°C (75°F)
– ASHRAE Class A4: 8% to 90%; maximum dew point: 24°C (75°F)
– Shipment/sto age: 8% to 90%
• Pa ticulate contamination
Attention: Ai bo ne pa ticulates and eactive gases acting alone o in combination
with othe envi onmental facto s such as humidity o tempe atu e might pose a isk to
the se ve . Fo info mation about the limits fo pa ticulates and gases, see
“Pa ticulate contamination” in ThinkSystem SR850P Maintenance Manual.
Note: To maintain component eliability, system pe fo mance might va y at ambient tempe atu e highe than
35°C while all the fans a e functioning. With one fan failing, system pe fo mance might va y at ambient
tempe atu e highe than 27°C.
Particulate contamination
Attention: Ai bo ne pa ticulates (including metal flakes o pa ticles) and eactive gases acting alone o in
combination with othe envi onmental facto s such as humidity o tempe atu e might pose a isk to the
device that is desc ibed in this document.
Risks that a e posed by the p esence of excessive pa ticulate levels o concent ations of ha mful gases
include damage that might cause the device to malfunction o cease functioning altogethe . This
specification sets fo th limits fo pa ticulates and gases that a e intended to avoid such damage. The limits
must not be viewed o used as definitive limits, because nume ous othe facto s, such as tempe atu e o
moistu e content of the ai , can influence the impact of pa ticulates o envi onmental co osives and gaseous
contaminant t ansfe . In the absence of specific limits that a e set fo th in this document, you must
implement p actices that maintain pa ticulate and gas levels that a e consistent with the p otection of human
health and safety. If Lenovo dete mines that the levels of pa ticulates o gases in you envi onment have
caused damage to the device, Lenovo may condition p ovision of epai o eplacement of devices o pa ts
on implementation of app op iate emedial measu es to mitigate such envi onmental contamination.
Implementation of such emedial measu es is a custome esponsibility.
Chapte 1.Int oduction 7

Table 2. Limits for articulates and gases
Contaminant Limits
Reactive gases Seve ity level G1 as pe ANSI/ISA 71.04-19851:
• The coppe eactivity level shall be less than 300 Angst oms pe month (Å/month ≈ 0.0039 μg/
cm2-hou weight gain).2
• The silve eactivity level shall be less than 200 Å/month (Å/month ≈ 0.0035 μg/cm2-hou
weight gain).3
• The eactive monito ing of gaseous co osivity must be conducted app oximately 5 cm (2 in.) in
f ont of the ack on the ai inlet side at one-qua te and th ee-qua te f ame height off the floo
o whe e the ai velocity is much highe .
Ai bo ne
pa ticulates Data cente s must meet the cleanliness level of ISO 14644-1 class 8.
Fo data cente s without ai side economize , the ISO 14644-1 class 8 cleanliness might be met by
choosing one of the following filt ation methods:
• The oom ai might be continuously filte ed with MERV 8 filte s.
• Ai ente ing a data cente might be filte ed with MERV 11 o p efe ably MERV 13 filte s.
Fo data cente s with ai side economize s, the choice of filte s to achieve ISO class 8 cleanliness
depends on the specific conditions p esent at that data cente .
• The deliquescent elative humidity of the pa ticulate contamination should be mo e than 60%
RH.4
• Data cente s must be f ee of zinc whiske s.5
1 ANSI/ISA-71.04-1985. Environmental conditions for rocess measurement and control systems: Airborne
contaminants. Inst ument Society of Ame ica, Resea ch T iangle Pa k, No th Ca olina, U.S.A.
2 The de ivation of the equivalence between the ate of coppe co osion g owth in the thickness of the co osion
p oduct in Å/month and the ate of weight gain assumes that Cu2S and Cu2O g ow in equal p opo tions.
3 The de ivation of the equivalence between the ate of silve co osion g owth in the thickness of the co osion
p oduct in Å/month and the ate of weight gain assumes that Ag2S is the only co osion p oduct.
4 The deliquescent elative humidity of pa ticulate contamination is the elative humidity at which the dust abso bs
enough wate to become wet and p omote ionic conduction.
5 Su face deb is is andomly collected f om 10 a eas of the data cente on a 1.5 cm diamete disk of sticky
elect ically conductive tape on a metal stub. If examination of the sticky tape in a scanning elect on mic oscope
eveals no zinc whiske s, the data cente is conside ed f ee of zinc whiske s.
Management options
The XCla ity po tfolio and othe system management options desc ibed in this section a e available to help
you manage the se ve s mo e conveniently and efficiently.
8ThinkSystem SR850P Setup Guide

Overview
Options Description
Lenovo XCla ity Cont olle
Baseboa d management cont olle . (BMC)
Consolidates the se vice p ocesso functionality, Supe I/O, video cont olle , and
emote p esence capabilities into a single chip on the se ve system boa d.
Interface
• CLI application
• Web GUI inte face
• Mobile application
• REST API
Usage and downloads
https://sysmgt.lenovofiles.com/help/topic/lxcc_f ontend/lxcc_ove view.html
Lenovo XCla ity Administ ato
Cent alized inte face fo multi-se ve management.
Interface
• Web GUI inte face
• Mobile application
• REST API
Usage and downloads
http://sysmgt.lenovofiles.com/help/topic/com.lenovo.lxca.doc/aug_p oduct_page.html
Lenovo XCla ity Essentials
toolset
Po table and light toolset fo se ve configu ation, data collection, and fi mwa e
updates. Suitable both fo single-se ve o multi-se ve management contexts.
Interface
• OneCLI: CLI application
• Bootable Media Creator: CLI application, GUI application
• UpdateXpress: GUI application
Usage and downloads
http://sysmgt.lenovofiles.com/help/topic/xcla ity_essentials/ove view.html
Chapte 1.Int oduction

Options Description
Lenovo XCla ity P ovisioning
Manage
UEFI-based embedded GUI tool on a single se ve that can simplify management
tasks.
Interface
• Web inte face (BMC emote access)
• GUI application
Usage and downloads
https://sysmgt.lenovofiles.com/help/topic/lxpm_f ontend/lxpm_p oduct_page.html
Important:
Lenovo XCla ity P ovisioning Manage (LXPM) suppo ted ve sion va ies by p oduct.
All ve sions of Lenovo XCla ity P ovisioning Manage a e efe ed to as Lenovo
XCla ity P ovisioning Manage and LXPM in this document, unless specified
othe wise. To see the LXPM ve sion suppo ted by you se ve , go to https://
sysmgt.lenovofiles.com/help/topic/lxpm_f ontend/lxpm_p oduct_page.html.
Lenovo XCla ity Integ ato
Se ies of applications that integ ate the management and monito ing functionalities of
the Lenovo physical se ve s with the softwa e used in a ce tain deployment
inf ast uctu e, such as VMwa e vCente , Mic osoft Admin Cente , o Mic osoft System
Cente while delive ing additional wo kload esiliency.
Interface
GUI application
Usage and downloads
https://sysmgt.lenovofiles.com/help/topic/lxci/lxci_p oduct_page.html
Lenovo XCla ity Ene gy
Manage
Application that can manage and monito se ve powe and tempe atu e.
Interface
• Web GUI Inte face
Usage and downloads
https://datacente suppo t.lenovo.com/solutions/lnvo-lxem
Lenovo Capacity Planne
Application that suppo ts powe consumption planning fo a se ve o ack.
Interface
• Web GUI Inte face
Usage and downloads
https://datacente suppo t.lenovo.com/solutions/lnvo-lcp
10 ThinkSystem SR850P Setup Guide

Functions
Options
Functions
Multi-
system
mgmt
OS
deploy-
ment
System
configu-
ration
Firm-
ware
up-
dates1
Event-
s/alert
moni-
toring
Inven-
tory/
logs
Pow-
er
mgmt
Power
planning
Lenovo XCla ity Cont olle √ √2√ √4
Lenovo XCla ity
Administ ato √ √ √ √2√ √4
Lenovo
XCla ity
Essen-
tials
toolset
OneCLI √ √ √2√ √4
Bootable Media
C eato √ √2√4
UpdateXp ess √ √2
Lenovo XCla ity P ovisioning
Manage √ √ √3√5
Lenovo XCla ity Integ ato √ √6√ √ √ √ √7
Lenovo XCla ity Ene gy
Manage √ √ √
Lenovo Capacity Planne √8
Notes:
1. Most options can be updated th ough the Lenovo tools. Some options, such as GPU fi mwa e o Omni-
Path fi mwa e equi e the use of supplie tools.
2. The se ve UEFI settings fo option ROM must be set to Auto o UEFI to update fi mwa e using Lenovo
XCla ity Administ ato , Lenovo XCla ity Essentials, o Lenovo XCla ity Cont olle .
3. Fi mwa e updates a e limited to Lenovo XCla ity P ovisioning Manage , Lenovo XCla ity Cont olle , and
UEFI updates only. Fi mwa e updates fo optional devices, such as adapte s, a e not suppo ted.
4. The se ve UEFI settings fo option ROM must be set to Auto o UEFI fo detailed adapte ca d
info mation, such as model name and fi mwa e levels, to be displayed in Lenovo XCla ity Administ ato ,
Lenovo XCla ity Cont olle , o Lenovo XCla ity Essentials.
5. Limited invento y.
6. The Lenovo XCla ity Integ ato deployment check fo System Cente Configu ation Manage (SCCM)
suppo ts Windows ope ating system deployment.
7. Powe management function is suppo ted only by Lenovo XCla ity Integ ato fo VMwa e vCente .
8. It is highly ecommended that you check the powe summa y data fo you se ve using Lenovo
Capacity Planne befo e pu chasing any new pa ts.
Chapte 1.Int oduction 11

12 ThinkSystem SR850P Setup Guide