Lenovo ThinkSystem SR650 V3 7D75 User manual

ThinkSystem SR650 V3
User Guide
Machine Type: 7D75, 7D76, 7D77

Note
Before using this information and the roduct it su orts, be sure to read and understand the safety
information and the safety instructions, which are available at:
htt ://thinksystem.lenovofiles.com/hel /to ic/safety_documentation/ df_files.html
In addition, be sure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
htt ://datacentersu ort.lenovo.com/warrantylooku
Second Edition (April 2023)
© Copyright Lenovo 2023
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered ursuant to a General Services
Administration (GSA) contract, use, re roduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Contents i
Safety v
Safety ins ection checklist . . . . . . . . . . . vi
Chapter 1 Introduction 1
Features. . . . . . . . . . . . . . . . . . . 1
Tech Ti s . . . . . . . . . . . . . . . . . . 2
Security advisories . . . . . . . . . . . . . . 2
S ecifications . . . . . . . . . . . . . . . . 3
Technical s ecifications . . . . . . . . . . . 3
Mechanical s ecifications . . . . . . . . . . 7
Environmental s ecifications . . . . . . . . . 8
Management o tions. . . . . . . . . . . . . 11
Chapter 2 Server components 15
Front view . . . . . . . . . . . . . . . . . 15
Front I/O module . . . . . . . . . . . . . . 21
Rear view . . . . . . . . . . . . . . . . . 24
To view . . . . . . . . . . . . . . . . . 33
System-board-assembly layout . . . . . . . . 34
System-board-assembly connectors. . . . . 35
System-board-assembly switches. . . . . . 36
System LEDs and diagnostics dis lay . . . . . . 38
Chapter 3 Parts list 39
2.5-inch drive bay chassis. . . . . . . . . . . 40
3.5-inch drive bay chassis. . . . . . . . . . . 45
Power cords . . . . . . . . . . . . . . . . 49
Chapter 4 Unboxing and setup 51
Server ackage contents . . . . . . . . . . . 51
Identify the server and access the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 51
Server setu checklist . . . . . . . . . . . . 53
Chapter 5 Hardware replacement
procedures 55
Installation Guidelines . . . . . . . . . . . . 55
Safety ins ection checklist. . . . . . . . . 56
System reliability guidelines . . . . . . . . 57
Working inside the server with the ower on . . 58
Handling static-sensitive devices . . . . . . 58
Technical rules . . . . . . . . . . . . . . . 59
Memory module installation rules and order . . 59
PCIe slots and PCIe ada ters . . . . . . . 64
Thermal rules . . . . . . . . . . . . . . 69
Power on and ower off the server . . . . . . . 72
Power on the server . . . . . . . . . . . 73
Power off the server . . . . . . . . . . . 73
Server re lacement . . . . . . . . . . . . . 73
Remove the server from rack . . . . . . . . 73
Install the server to rack . . . . . . . . . . 77
Hot-swa drive re lacement . . . . . . . . . . 82
Remove a hot-swa drive . . . . . . . . . 82
Install a hot-swa drive . . . . . . . . . . 83
Air baffle re lacement . . . . . . . . . . . . 85
Remove the air baffle . . . . . . . . . . . 85
Install the air baffle . . . . . . . . . . . . 87
CMOS battery (CR2032) re lacement . . . . . . 90
Remove the CMOS battery . . . . . . . . 90
Install the CMOS battery . . . . . . . . . 92
Front drive back lane re lacement . . . . . . . 94
Remove the 2.5-inch front drive back lane . . 94
Install the 2.5-inch front drive back lane . . . 96
Remove the 3.5-inch front drive back lane . . 99
Install the 3.5-inch front drive back lane . . . 101
Front I/O module re lacement . . . . . . . . . 103
Remove the front I/O module . . . . . . . . 104
Install the front I/O module . . . . . . . . . 106
GPU re lacement . . . . . . . . . . . . . . 108
Remove a GPU ada ter . . . . . . . . . . 110
Install a GPU ada ter . . . . . . . . . . . 113
Heat sink Torx T30 nut re lacement . . . . . . . 117
Remove a heat sink Torx T30 nut . . . . . . 117
Install a heat sink Torx T30 nut . . . . . . . 118
Internal RAID/HBA/ex ander ada ter
re lacement . . . . . . . . . . . . . . . . 119
Remove an internal RAID/HBA/ex ander
ada ter . . . . . . . . . . . . . . . . 120
Install an internal RAID/HBA/ex ander
ada ter . . . . . . . . . . . . . . . . 121
Intrusion switch re lacement . . . . . . . . . 123
Remove the intrusion switch . . . . . . . . 123
Install the intrusion switch . . . . . . . . . 124
M.2 drive and M.2 drive back lane
re lacement . . . . . . . . . . . . . . . . 126
Remove an M.2 drive . . . . . . . . . . . 127
Install an M.2 drive . . . . . . . . . . . . 128
Remove the M.2 back lane . . . . . . . . 130
Install the M.2 back lane . . . . . . . . . 133
Memory module re lacement . . . . . . . . . 136
Remove a memory module . . . . . . . . 136
Install a memory module . . . . . . . . . 138
© Co yright Lenovo 2023 i

MicroSD card re lacement . . . . . . . . . . 139
Remove the MicroSD card . . . . . . . . . 140
Install the MicroSD card. . . . . . . . . . 141
Middle drive cage and drive back lane
re lacement . . . . . . . . . . . . . . . . 143
Remove the middle drive cage and drive
back lanes. . . . . . . . . . . . . . . 144
Install the middle drive back lanes and drive
cage . . . . . . . . . . . . . . . . . 146
OCP module re lacement . . . . . . . . . . . 149
Remove the OCP module . . . . . . . . . 149
Install the OCP module . . . . . . . . . . 151
PCIe ada ter and riser assembly re lacement . . . 153
Remove a riser assembly . . . . . . . . . 155
Remove a PCIe ada ter . . . . . . . . . . 159
Install a PCIe ada ter . . . . . . . . . . . 162
Install a riser assembly . . . . . . . . . . 166
Power su ly unit re lacement. . . . . . . . . 169
Safety recautions . . . . . . . . . . . . 169
Remove a ower su ly unit . . . . . . . . 172
Install a ower su ly unit . . . . . . . . . 174
Processor and heat sink re lacement (trained
technician only) . . . . . . . . . . . . . . . 176
Remove a rocessor and heat sink . . . . . 176
Se arate the rocessor from carrier and heat
sink. . . . . . . . . . . . . . . . . . 181
Install a rocessor and heat sink . . . . . . 183
PSU air baffle re lacement . . . . . . . . . . 189
Remove a PSU air baffle . . . . . . . . . 189
Install a PSU air baffle . . . . . . . . . . 191
Rack latches re lacement. . . . . . . . . . . 192
Remove the rack latches . . . . . . . . . 192
Install the rack latches . . . . . . . . . . 195
RAID flash ower module re lacement . . . . . . 197
Remove a RAID flash ower module from the
chassis . . . . . . . . . . . . . . . . 198
Install a RAID flash ower module on the
chassis . . . . . . . . . . . . . . . . 200
Remove a RAID flash ower module from the
air baffle . . . . . . . . . . . . . . . . 202
Install a RAID flash ower module on the air
baffle . . . . . . . . . . . . . . . . . 203
Remove a RAID flash ower module from the
middle 2.5-inch drive cage. . . . . . . . . 204
Install a RAID flash ower module on the
middle drive cage . . . . . . . . . . . . 206
Rearwall bracket re lacement . . . . . . . . . 207
Remove a rearwall bracket. . . . . . . . . 209
Install a rearwall bracket. . . . . . . . . . 211
Rear 7mm drive back lane and drive cage
re lacement . . . . . . . . . . . . . . . . 213
Remove the 7mm drive cage . . . . . . . . 213
Remove the 7mm drive back lanes . . . . . 215
Install the 7mm drive back lanes . . . . . . 217
Install the 7mm drive cage . . . . . . . . . 219
Rear drive back lane and drive cage
re lacement . . . . . . . . . . . . . . . . 221
Remove the 4 x 2.5" drive back lane and
drive cage . . . . . . . . . . . . . . . 221
Install the 4 x 2.5" drive back lane and drive
cage . . . . . . . . . . . . . . . . . 223
Remove the 8 x 2.5" drive back lane and
drive cage . . . . . . . . . . . . . . . 225
Install the 8 x 2.5" drive back lane and drive
cage . . . . . . . . . . . . . . . . . 226
Remove the 2 x 3.5" drive back lane and
drive cage . . . . . . . . . . . . . . . 228
Install the 2 x 3.5" drive back lane and drive
cage . . . . . . . . . . . . . . . . . 230
Remove the 4 x 3.5" drive back lane and
drive cage . . . . . . . . . . . . . . . 232
Install the 4 x 3.5" drive back lane and drive
cage . . . . . . . . . . . . . . . . . 234
Security bezel re lacement . . . . . . . . . . 237
Remove the security bezel . . . . . . . . . 237
Install the security bezel. . . . . . . . . . 238
System board assembly re lacement (trained
technician only) . . . . . . . . . . . . . . . 240
Remove the firmware and RoT security
module . . . . . . . . . . . . . . . . 241
Install the firmware and RoT security
module . . . . . . . . . . . . . . . . 243
Remove the system I/O board or rocessor
board . . . . . . . . . . . . . . . . . 247
Install the system I/O board or rocessor
board . . . . . . . . . . . . . . . . . 250
System fan re lacement . . . . . . . . . . . 254
Remove a system fan. . . . . . . . . . . 255
Install a system fan. . . . . . . . . . . . 256
System fan cage re lacement . . . . . . . . . 259
Remove the system fan cage . . . . . . . . 259
Install the system fan cage. . . . . . . . . 260
Serial ort module re lacement . . . . . . . . 261
Remove a serial ort module . . . . . . . . 261
Install a serial ort module . . . . . . . . . 264
To cover re lacement . . . . . . . . . . . . 266
Remove the to cover . . . . . . . . . . 266
Install the to cover . . . . . . . . . . . 268
Com lete the arts re lacement . . . . . . . . 269
Chapter 6 Internal cable routing 271
Identifying connectors . . . . . . . . . . . . 271
Drive back lane connectors . . . . . . . . 271
7mm drives . . . . . . . . . . . . . . . . 276
Front I/O connectors . . . . . . . . . . . . . 279
GPUs . . . . . . . . . . . . . . . . . . . 281
ii ThinkSystem SR650 V3 User Guide

M.2 drive back lanes . . . . . . . . . . . . 282
RAID flash ower module . . . . . . . . . . . 287
Riser 3 cage . . . . . . . . . . . . . . . . 289
Riser 3/4 cage . . . . . . . . . . . . . . . 294
Back lanes: server models with 2.5-inch front
drive bays . . . . . . . . . . . . . . . . . 297
One 8 x SAS/SATA back lane . . . . . . . 299
One 8 x AnyBay back lane (Gen 4) . . . . . 302
One 8 x NVMe back lane (Gen 4) . . . . . . 306
Two 8 x SAS/SATA back lanes . . . . . . . 307
Two 8 x AnyBay back lanes (Gen 4) . . . . . 311
Two 8 x NVMe back lanes (Gen 4) . . . . . 315
One 8 x SAS/SATA and one 8 x AnyBay (Gen
4) back lanes . . . . . . . . . . . . . . 317
One 8 x SAS/SATA and one 8 x NVMe (Gen 4)
back lanes. . . . . . . . . . . . . . . 323
One 8 x AnyBay and one 8 x NVMe
back lanes (Gen 4). . . . . . . . . . . . 329
Three 8 x SAS/SATA back lanes . . . . . . 333
Three 8 x AnyBay back lanes . . . . . . . 382
Three 8 x NVMe back lanes (Gen 4) . . . . . 384
One 8 x AnyBay and two 8 x NVMe
back lanes (Gen 4). . . . . . . . . . . . 387
One 8 x SAS/SATA and two 8 x NVMe (Gen 4)
back lanes. . . . . . . . . . . . . . . 389
One 8 x SAS/SATA and two 8 x AnyBay
back lanes. . . . . . . . . . . . . . . 391
Two 8 x SAS/SATA and one 8 x AnyBay (Gen
4) back lanes . . . . . . . . . . . . . . 392
Two 8 x SAS/SATA and one 8 x NVMe (Gen 4)
back lanes. . . . . . . . . . . . . . . 408
24 x 2.5" SAS/SATA ex ander back lane . . . 411
Back lanes: server models with 3.5-inch front
drive bays . . . . . . . . . . . . . . . . . 416
8 x 3.5-inch SAS/SATA back lane. . . . . . 417
12 x 3.5-inch SAS/SATA back lane . . . . . 419
12 x 3.5-inch AnyBay back lane . . . . . . 432
12 x 3.5-inch SAS/SATA ex ander
back lane . . . . . . . . . . . . . . . 438
Chapter 7 System configuration 443
Set the network connection for the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 443
Set front USB ort for Lenovo XClarity Controller
connection. . . . . . . . . . . . . . . . . 444
U date the firmware . . . . . . . . . . . . . 445
Configure the firmware . . . . . . . . . . . . 448
Memory module configuration . . . . . . . . . 449
Enable Software Guard Extensions (SGX). . . . . 450
RAID configuration . . . . . . . . . . . . . 450
De loy the o erating system. . . . . . . . . . 451
Back u the server configuration . . . . . . . . 452
Chapter 8 Problem
determination 453
Event logs . . . . . . . . . . . . . . . . . 453
Troubleshooting by system LEDs and diagnostics
dis lay . . . . . . . . . . . . . . . . . . 455
Drive LEDs . . . . . . . . . . . . . . . 455
Front o erator anel LEDs . . . . . . . . . 455
Integrated diagnostics anel . . . . . . . . 457
External diagnostics handset . . . . . . . . 462
Rear system LEDs . . . . . . . . . . . . 468
XCC system management ort LEDs. . . . . 469
Power su ly LEDs . . . . . . . . . . . 469
System-board-assembly LEDs . . . . . . . 470
LEDs on the Firmware and RoT Security
Module . . . . . . . . . . . . . . . . 473
General roblem determination rocedures . . . . 474
Resolving sus ected ower roblems . . . . 475
Resolving sus ected Ethernet controller
roblems . . . . . . . . . . . . . . . 475
Troubleshooting by sym tom . . . . . . . . . 476
Hard disk drive roblems . . . . . . . . . 476
Intermittent roblems. . . . . . . . . . . 479
Keyboard, mouse, KVM switch or USB-device
roblems . . . . . . . . . . . . . . . 480
Memory roblems . . . . . . . . . . . . 481
Monitor and video roblems . . . . . . . . 483
Observable roblems. . . . . . . . . . . 485
O tional-device roblems . . . . . . . . . 487
Performance roblems . . . . . . . . . . 489
Power on and ower off roblems . . . . . . 490
Power roblems . . . . . . . . . . . . . 491
Serial-device roblems . . . . . . . . . . 491
Software roblems. . . . . . . . . . . . 492
Appendix A Hardware
disassembling for recycle 493
Disassemble the system board assembly for
recycle . . . . . . . . . . . . . . . . . . 493
Appendix B Getting help and
technical assistance 497
Before you call . . . . . . . . . . . . . . . 497
Collecting service data . . . . . . . . . . . . 498
Contacting Su ort . . . . . . . . . . . . . 499
Appendix C Documents and
supports 501
Documents download . . . . . . . . . . . . 501
Su ort websites . . . . . . . . . . . . . . 501
Appendix D Notices 503
Trademarks . . . . . . . . . . . . . . . . 504
© Co yright Lenovo 2023 iii

Im ortant notes . . . . . . . . . . . . . . . 504
Electronic emission notices . . . . . . . . . . 504
Taiwan Region BSMI RoHS declaration . . . . . 505
Taiwan Region im ort and ex ort contact
information . . . . . . . . . . . . . . . . 505
iv ThinkSystem SR650 V3 User Guide

Safety
Before installing this roduct, read the Safety Information.
Antes de instalar este roduto, leia as Informações de Segurança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne, før du installerer dette rodukt.
Lees voordat u dit roduct installeert eerst de veiligheidsvoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce roduit, lisez les consignes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo rodotto, leggere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette roduktet.
Antes de instalar este roduto, leia as Informações sobre Segurança.
© Co yright Lenovo 2023 v

Antes de instalar este roducto, lea la información de seguridad.
Läs säkerhetsinformationen innan du installerar den här rodukten.
Safety inspection checklist
Use the information in this section to identify otentially unsafe conditions with your server. As each machine
was designed and built, required safety items were installed to rotect users and service technicians from
injury.
Note: The roduct is not suitable for use at visual dis lay work laces according to §2 of the Work lace
Regulations.
Note: The set-u of the server is made in the server room only.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology Lenovo assumes that you are qualified in
the servicing of equipment and trained in recognizing hazards energy levels in products Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location
Important: Electrical grounding of the server is required for o erator safety and correct system function.
Pro er grounding of the electrical outlet can be verified by a certified electrician.
Use the following checklist to verify that there are no otentially unsafe conditions:
1. If your working condition necessitates the server being owered off or you intend to ower off, make
sure that the ower cord is disconnected.
S002
CAUTION:
vi ThinkSystem SR650 V3 User Guide

The power-control button on the device and the power switch on the power supply do not turn off
the electrical current supplied to the device The device also might have more than one power
cord To remove all electrical current from the device, ensure that all power cords are
disconnected from the power source
Note: Under certain circumstances, owering off the server is not a rerequisite. Refer to the
recautions before conducting any tasks.
2. Check the ower cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground in and the frame ground.
• Make sure that the ower cord is the correct ty e.
To view the ower cords that are available for the server:
a. Go to:
htt ://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine ty e and model for your server to dis lay the configurator age.
d. Click Power ➙ Power Cables to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filings, contamination, water or
other liquid, or signs of fire or smoke damage.
5. Check for worn, frayed, or inched cables.
6. Make sure that the ower-su ly cover fasteners (screws or rivets) have not been removed or tam ered
with.
© Co yright Lenovo 2023 vii

viii ThinkSystem SR650 V3 User Guide

Chapter 1 Introduction
The ThinkSystem SR650 V3 server (7D75, 7D76, 7D77) is a 2-socket 2U rack server, based on the 4th
generation Intel Xeon Scalable rocessor family. With a very configuration-rich offering, it is a great choice
for enter rises of all sizes that need industry-leading reliability, management, and security, as well as
maximizing erformance and flexibility for future growth.
Figure 1. ThinkSystem SR650 V3
Features
Performance, ease of use, reliability, and ex ansion ca abilities are key considerations in the design of your
server. These design features make it ossible for you to customize the system hardware to meet your needs
today and rovide flexible ex ansion ca abilities for the future.
Your server im lements the following features and technologies:
• Features on Demand
If a Features on Demand feature is integrated in the server or in an o tional device that is installed in the
server, you can urchase an activation key to activate the feature. For information about Features on
Demand, see:
htt s://fod.lenovo.com/lkms
• Lenovo XClarity Controller (XCC)
The Lenovo XClarity Controller is the common management controller for Lenovo ThinkSystem server
hardware. The Lenovo XClarity Controller consolidates multi le management functions in a single chi on
the server system board assembly. Some of the features that are unique to the Lenovo XClarity Controller
are enhanced erformance, higher-resolution remote video, and ex anded security o tions.
The server su orts Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2), refer to htt s://sysmgt.lenovofiles.com/hel /to ic/lxcc_frontend/lxcc_overview.html.
• UEFI-compliant server firmware
Lenovo ThinkSystem firmware is Unified Extensible Firmware Interface (UEFI) com liant. UEFI re laces
BIOS and defines a standard interface between the o erating system, latform firmware, and external
devices.
Lenovo ThinkSystem servers are ca able of booting UEFI-com liant o erating systems, BIOS-based
o erating systems, and BIOS-based ada ters as well as UEFI-com liant ada ters.
Note: The server does not su ort Disk O erating System (DOS).
• Large system-memory capacity
The server su orts u to 32 TruDDR5 memory DIMMs o erating at u to 4800 MHz. For more
information about the s ecific ty es and maximum amount of memory, see “Technical s ecifications” on
age 3.
© Co yright Lenovo 2023 1

• Large data-storage capacity and hot-swap capability
The server models su ort front, middle, and rear drive bays, scalable u to 20 x 3.5-inch hot-swa drives
or 40 x 2.5-inch hot-swa drives. See “Technical s ecifications” on age 3 for more information.
With the hot-swa feature, you can add, remove, or re lace hard disk drives without turning off the server.
• Lightpath Diagnostics
Light ath Diagnostics rovides LEDs to hel you diagnose roblems. For more information about the
Light ath Diagnostics, see “Troubleshooting by system LEDs and diagnostics dis lay” on age 455.
• Mobile access to Lenovo Service Information website
The server rovides a QR code on the system service label, which is on the cover of the server, that you
can scan using a QR code reader and scanner with a mobile device to get quick access to the Lenovo
Service Information website. The Lenovo Service Information website rovides additional information for
arts installation, re lacement videos, and error codes for server su ort.
• Active Energy Manager
Lenovo XClarity Energy Manager is a ower and tem erature management solution for data centers. You
can monitor and manage the ower consum tion and tem erature of Converged, NeXtScale, System x,
and ThinkServer servers, and im rove energy efficiency using Lenovo XClarity Energy Manager.
• Redundant networking connection
The Lenovo XClarity Controller rovides failover ca ability to a redundant Ethernet connection with the
a licable a lication installed. If a roblem occurs with the rimary Ethernet connection, all Ethernet
traffic that is associated with the rimary connection is automatically switched to the o tional redundant
Ethernet connection. If the a licable device drivers are installed, this switching occurs without data loss
and without user intervention.
• Redundant cooling
The redundant cooling by the fans in the server enables continued o eration if one rotor of a fan fails.
• ThinkSystem RAID support
The ThinkSystem RAID ada ter rovides hardware redundant array of inde endent disks (RAID) su ort
to create configurations, su orting RAID levels 0, 1, 5, 6, 10, 50, and 60.
Tech Tips
Lenovo continually u dates the su ort website with the latest ti s and techniques that you can use to solve
issues that your server might encounter. These Tech Ti s (also called retain ti s or service bulletins) rovide
rocedures to work around issues or solve roblems related to the o eration of your server.
To find the Tech Ti s available for your server:
1. Go to htt ://datacentersu ort.lenovo.com and navigate to the su ort age for your server.
2. Click on How To’s from the navigation ane.
3. Click Article Type ➙ Solution from the dro -down menu.
Follow the on-screen instructions to choose the category for the roblem that you are having.
Security advisories
Lenovo is committed to develo ing roducts and services that adhere to the highest security standards in
order to rotect our customers and their data. When otential vulnerabilities are re orted, it is the
res onsibility of the Lenovo Product Security Incident Res onse Team (PSIRT) to investigate and rovide
2ThinkSystem SR650 V3 User Guide

information to our customers so they may ut mitigation lans in lace as we work toward roviding
solutions.
The list of current advisories is available at the following site:
htt s://datacentersu ort.lenovo.com/ roduct_security/home
Specifications
Summary of the features and s ecifications of the server. De ending on the model, some features might not
be available, or some s ecifications might not a ly.
Refer to the below table for s ecifications categories and the content of each category.
Specification
category
“Technical s ecifications” on
age 3
“Mechanical s ecifications” on
age 7
“Environmental s ecifications”
on age 8
Content • Processor
• Memory
• Internal drives
• Ex ansion slots
• Storage controller
• Gra hics rocessing units
(GPU)
• Integrated functions and I/O
connectors
• Network
• System fan
• Power su lies
• O erating systems
• Minimal configuration for
debugging
• Dimension
• Weight
• Acoustical noise emissions
• Ambient tem erature
management
• Particulate contamination
Technical specifications
Summary of the technical s ecifications of server. De ending on the model, some features might not be
available, or some s ecifications might not a ly for your server model.
Processor
Su orts multi-core Intel Xeon rocessors, with integrated memory controller and Intel Mesh UPI (Ultra Path
Interconnect) to ology.
• U to two 4th Gen Intel Xeon scalable rocessors with the new LGA 4677 socket
• U to 60 cores er socket
• U to 4 UPI links at u to 16 GT/s
• Thermal Design Power (TDP): u to 350 watts
For a list of su orted rocessors, see htt s://server roven.lenovo.com.
Cha ter 1.Introduction 3

Memory
• Slots: 32 dual inline memory module (DIMM) connectors that su ort u to 32 TruDDR5 DIMMs
• Memory module ty e:
– TruDDR5 4800 MHz RDIMM: 16 GB (1Rx8), 32 GB (2Rx8)
– TruDDR5 4800 MHz 10x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 4800 MHz 9x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 4800 MHz 3DS RDIMM: 128 GB (4Rx4), 256 GB (8Rx4)
• S eed: O erating s eed de ends on rocessor model and UEFI settings.
– 4800 MT/s for 1 DIMM er channel
– 4400 MT/s for 2 DIMMs er channel
• Minimum memory: 16 GB
• Maximum memory: 8 TB: 32 x 256 GB 3DS RDIMMs
For a list of su orted memory modules, see htt s://server roven.lenovo.com.
Internal drives
• Front drive bays:
– U to 24 x 2.5-inch hot-swa SAS/SATA/NVMe drives
– U to 12 x 3.5-inch hot-swa SAS/SATA drives
– U to 4 x 3.5-inch hot-swa NVMe drives
• Middle drive bays:
– U to 8 x 2.5-inch hot-swa SAS/SATA/NVMe drives
– U to 4 x 3.5-inch hot-swa SAS/SATA drives
• Rear drive bays:
– U to 8 x 2.5-inch hot-swa SAS/SATA drives
– U to 4 x 3.5-inch hot-swa SAS/SATA drives
– U to two 7mm drives
• U to two internal M.2 drives
Expansion slots
• U to ten PCIe slots in the rear and two PCIe slots in the front
• One OCP module slot in the rear and one o tional OCP module slot in the front
PCIe slot availability is based on riser selection and rear drive bay selection. See “Rear view” on age 24 and “PCIe
slots and PCIe ada ters” on age 64.
4ThinkSystem SR650 V3 User Guide

Storage controller
• SAS/SATA HBA ada ters
– ThinkSystem 4350-8i SAS/SATA 12Gb HBA
– ThinkSystem 4350-16i SAS/SATA 12Gb HBA
– ThinkSystem 440-8i SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb Internal HBA*
– ThinkSystem 440-8e SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16e SAS/SATA PCIe Gen4 12Gb HBA
• SAS/SATA RAID ada ters
– ThinkSystem RAID 5350-8i PCIe 12Gb Ada ter
– ThinkSystem RAID 5350-8i PCIe 12Gb Internal Ada ter*
– ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Ada ter
– ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Internal Ada ter*
– ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Ada ter
– ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Internal Ada ter*
– ThinkSystem RAID 540-8i PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 540-16i PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-8i 4GB Flash PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-16i 4GB Flash PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Internal Ada ter*
– ThinkSystem RAID 940-32i 8GB Flash PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-8e 4GB Flash PCIe Gen4 12Gb Ada ter
• Ex ander: ThinkSystem 48 ort 12Gb Internal Ex ander*
Notes:
• *Custom form factor (CFF) ada ters that are su orted only for server models with 2.5-inch front drive bays.
• For more information about the RAID/HBA ada ters, see Lenovo ThinkSystem RAID Ada ter and HBA Reference.
Graphics processing unit (GPU)
Your server su orts the following GPUs:
• Double-wide: NVIDIA® A16, A30, A40, A100, H100, RTX A2000, RTX A4500, RTX A6000
• Single-wide: NVIDIA A2, T1000, T400
For GPU su orting rules, see “Thermal rules” on age 69.
Cha ter 1.Introduction 5

Integrated functions and I/O connectors
• Lenovo XClarity Controller (XCC), which rovides service rocessor control and monitoring functions, video
controller, and remote keyboard, video, mouse, and remote drive ca abilities.
– The server su orts Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2), refer to htt s://sysmgt.lenovofiles.com/hel /to ic/lxcc_frontend/lxcc_overview.html.
• Front connectors:
– One VGA connector (o tional)
– One USB 3.2 Gen1 (5 Gb s) connector
– One USB 2.0 connector with XCC system management function
– One external diagnostics connector
– One integrated diagnostics anel (o tional)
• Rear connectors:
– One VGA connector
– Three USB 3.2 Gen1 (5 Gb s) connectors
– One XCC system management ort
– Two or four Ethernet connectors on the OCP module (o tional)
– One serial ort (o tional)
Network
• OCP module, which rovides two or four Ethernet connectors for network su ort
System fan
• Su orted fan ty es:
– Standard fan (60 x 60 x 36 mm, single-rotor, 17000 RPM)
– Performance fan (60 x 60 x 56 mm, dual-rotor, 21000 RPM)
• Fan redundancy: N+1 redundancy, one redundant fan rotor
– One rocessor: five hot-swa system fans (one redundant fan rotor)
– Two rocessors: six hot-swa system fans (one redundant fan rotor)
Notes:
• Single-rotor hot-swa fans cannot be mixed with dual-rotor hot-swa fans.
• The redundant cooling by the fans in the server enables continued o eration if one rotor of a fan fails.
Power supplies
The server su orts u to two hot-swa ower su lies for redundancy.
Power supply 100–127 V ac 200–240 V ac 240 V dc -48 V dc
750W Platinum √ √ √
750W Titanium √ √
1100W Platinum √ √ √
1100W Titanium √ √
1800W Platinum √ √
6ThinkSystem SR650 V3 User Guide

Power supplies
1800W Titanium √ √
2400W Platinum √ √
2600W Titanium √ √
1100W -48V DC √
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY
• Power supply with 240 V dc input cannot support hot plugging power cord function Before removing the
power supply with dc input, please turn off server or disconnect dc power sources at the breaker panel or by
turning off the power source Then, remove the power cord
Operating systems
Su orted and certified o erating systems:
• Microsoft Windows Server
• Microsoft Windows
• Red Hat Enter rise Linux
• SUSE Linux Enter rise Server
• VMware ESXi
• Canonical Ubuntu
References:
• Com lete list of available o erating systems: htt s://lenovo ress.com/osig.
• OS de loyment instructions, see “De loy the o erating system” on age 451.
Minimal configuration for debugging
• One rocessor in socket 1
• One DIMM in slot 7
• One ower su ly
• One HDD/SSD drive, one M.2 drive, or one 7mm drive (if OS is needed for debugging)
• Five system fans
Mechanical specifications
Summary of the mechanical s ecifications of server. De ending on the model, some features might not be
available, or some s ecifications might not a ly.
Cha ter 1.Introduction 7

Dimension
• Form factor: 2U
• Height: 86.5 mm (3.4 inches)
• Width:
– With rack latches: 482.0 mm (19.0 inches)
– Without rack latches: 444.6 mm (17.5 inches)
• De th: 763.7 mm (30.1 inches)
Note: The de th is measured with rack latches installed, but without the security bezel installed.
Weight
U to 39 kg (86 lb), de ending on the server configuration
Environmental specifications
Summary of the environmental s ecifications of server. De ending on the model, some features might not be
available, or some s ecifications might not a ly.
8ThinkSystem SR650 V3 User Guide

Acoustical noise emissions
The server has the following acoustic noise emissions declaration.
Configuration Ty ical Storage GPU
Sound power
levels (LWAd)
• Idling: 5.6 Bel
• O erating: 5.6 Bel
• Idling: 7.3 Bel
• O erating: 7.3 Bel
• Idling: 7.3 Bel
• O erating: 8.9 Bel
Sound pressure
level (LpAm)
• Idling: 41.5 dBA
• O erating: 41.5 dBA
• Idling: 60.2 dBA
• O erating: 60.2 dBA
• Idling: 60.2 dBA
• O erating: 74.1 dBA
The declared sound levels are based on the following configurations, which may change de ending on configurations
or conditions.
Component Typical configuration Storage configuration GPU configuration
Chassis (2U) 8 x 2.5-inch front drive bays 12 x 3.5-inch front drive
bays
16 x 2.5-inch front drive
bays
Fan 6 x standard fans 6 x high erformance fans 6 x high erformance fans
Processor 2 x 205 W CPUs 2 x 205 W CPUs 2 x 205 W CPUs
Memory 8 x 64 GB RDIMMs 16 x 64 GB RDIMMs 32 x 64 GB RDIMMs
Drive 8 x 2.4 TB SAS HDDs 20 x 14 TB SAS HDDs 16 x 2.4 TB SAS HDDs
RAID adapter 1 x RAID 940-8i 1 x RAID 940-32i 1 x RAID 940-16i
OCP adapter 1 x Intel X710-T2L 10GBASE-T 2- ort OCP
Power supply 2 x 750 W PSUs 2 x 1100 W PSUs 2 x 1800 W PSUs
GPU adapter None None 3 x A100
Notes:
• These sound levels were measured in controlled acoustical environments according to rocedures s ecified by
ISO7779 and are re orted in accordance with ISO 9296.
• Government regulations (such as those rescribed by OSHA or Euro ean Community Directives) may govern noise
level ex osure in the work lace and may a ly to you and your server installation. The actual sound ressure levels
in your installation de end u on a variety of factors, including the number of racks in the installation; the size,
materials, and configuration of the room; the noise levels from other equi ment; the room ambient tem erature, and
em loyee's location in relation to the equi ment. Further, com liance with such government regulations de ends
on a variety of additional factors, including the duration of em loyees' ex osure and whether em loyees wear
hearing rotection. Lenovo recommends that you consult with qualified ex erts in this field to determine whether
you are in com liance with the a licable regulations.
Cha ter 1.Introduction 9

Environment
ThinkSystem SR650 V3 com lies with ASHRAE Class A2 s ecifications with most configurations, and de ending on
the hardware configuration, also com lies with ASHRAE Class A3 and Class A4 s ecifications. System erformance
may be im acted when the o erating tem erature is outside ASHRAE A2 s ecification.
De ending on the hardware configuration, SR650 V3 server also com lies with ASHRAE Class H1 s ecification.
System erformance may be im acted when the o erating tem erature is outside ASHRAE H1 s ecification.
For detailed thermal information, see “Thermal rules” on age 69.
Note: When the ambient tem erature is greater than the su orted max tem erature (ASHARE A4 45°C), the server
will shut down. The server will not ower on again until the ambient tem erature falls within the su orted tem erature
range.
• Air temperature:
– O erating:
– ASHRAE class H1: 5°C to 25°C (41°F to 77°F)
The maximum ambient tem erature decreases by 1°C for every 500 m (1640 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A2: 10°C to 35°C (50°F to 95°F)
The maximum ambient tem erature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A3: 5°C to 40°C (41°F to 104°F)
The maximum ambient tem erature decreases by 1°C for every 175 m (574 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A4: 5°C to 45°C (41°F to 113°F)
The maximum ambient tem erature decreases by 1°C for every 125 m (410 ft) increase in altitude above 900
m (2,953 ft)
– Server off: -10°C to 60°C (14°F to 140°F)
– Shi ment/storage: -40°C to 70°C (-40°F to 158°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relative Humidity (non-condensing):
– O erating
– ASHRAE class H1: 8%–80%; maximum dew oint: 17°C (62.6°F)
– ASHRAE class A2: 20%–80%; maximum dew oint: 21°C (70°F)
– ASHRAE class A3: 8%–85%; maximum dew oint: 24°C (75°F)
– ASHRAE class A4: 8%–90%; maximum dew oint: 24°C (75°F)
– Shi ment/storage: 8% to 90%
Particulate contamination
Attention: Airborne articulates (including metal flakes or articles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or tem erature might ose a risk to the
device that is described in this document.
Risks that are osed by the resence of excessive articulate levels or concentrations of harmful gases
include damage that might cause the device to malfunction or cease functioning altogether. This
s ecification sets forth limits for articulates and gases that are intended to avoid such damage. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as tem erature or
moisture content of the air, can influence the im act of articulates or environmental corrosives and gaseous
contaminant transfer. In the absence of s ecific limits that are set forth in this document, you must
im lement ractices that maintain articulate and gas levels that are consistent with the rotection of human
health and safety. If Lenovo determines that the levels of articulates or gases in your environment have
caused damage to the device, Lenovo may condition rovision of re air or re lacement of devices or arts
on im lementation of a ro riate remedial measures to mitigate such environmental contamination.
Im lementation of such remedial measures is a customer res onsibility.
10 ThinkSystem SR650 V3 User Guide