Lenovo ThinkSystem SR665 V3 User manual

ThinkSystem SR665 V3
User Guide
Machine Type: 7D9A, 7D9B

Note
Before using this inform tion nd the product it supports, be sure to re d nd underst nd the s fety
inform tion nd the s fety instructions, which re v il ble t:
http://thinksystem.lenovofiles.com/help/topic/s fety_document tion/pdf_files.html
In ddition, be sure th t you re f mili r with the terms nd conditions of the Lenovo w rr nty for your server,
which c n be found t:
http://d t centersupport.lenovo.com/w rr ntylookup
First Edition (December 2022)
© Copyright Leno o 2022.
LIMITED AND RESTRICTED RIGHTS NOTICE: If d t or softw re is delivered pursu nt to Gener l Services
Administr tion (GSA) contr ct, use, reproduction, or disclosure is subject to restrictions set forth in Contr ct No. GS-35F-
05925.

Contents
Contents . . . . . . . . . . . . . . . . . i
Safety . . . . . . . . . . . . . . . . . .
S fety inspection checklist . . . . . . . . . . . vi
Chapter 1. Introduction . . . . . . . . . 1
Fe tures. . . . . . . . . . . . . . . . . . . 1
Tech Tips . . . . . . . . . . . . . . . . . . 2
Security dvisories . . . . . . . . . . . . . . 2
Specific tions . . . . . . . . . . . . . . . . 2
Technic l specific tions . . . . . . . . . . . 3
Mech nic l specific tions . . . . . . . . . . 5
Environment l specific tions . . . . . . . . . 5
M n gement options. . . . . . . . . . . . . . 8
Chapter 2. Ser er components . . . . 11
Front view . . . . . . . . . . . . . . . . . 11
Front I/O module . . . . . . . . . . . . . . 15
Re r view . . . . . . . . . . . . . . . . . 17
Top view . . . . . . . . . . . . . . . . . 19
System-bo rd- ssembly l yout . . . . . . . . 20
System-bo rd- ssembly connectors. . . . . 21
System-bo rd- ssembly switch . . . . . . 23
System LEDs nd di gnostics displ y . . . . . . 25
Chapter 3. Parts list . . . . . . . . . . 27
2.5-inch drive b y ch ssis. . . . . . . . . . . 27
3.5-inch drive b y ch ssis. . . . . . . . . . . 31
Power cords . . . . . . . . . . . . . . . . 33
Chapter 4. Unboxing and setup . . . . 35
Server p ck ge contents . . . . . . . . . . . 35
Identify the server nd ccess the Lenovo XCl rity
Controller . . . . . . . . . . . . . . . . . 35
Server setup checklist . . . . . . . . . . . . 36
Chapter 5. Hardware replacement
procedures . . . . . . . . . . . . . . . 39
Inst ll tion Guidelines . . . . . . . . . . . . 39
S fety inspection checklist. . . . . . . . . 40
System reli bility guidelines . . . . . . . . 41
Working inside the server with the power on . . 42
H ndling st tic-sensitive devices . . . . . . 42
Technic l rules . . . . . . . . . . . . . . . 43
Memory module inst ll tion rules nd order . . 44
PCIe slots nd PCIe d pters . . . . . . . 46
Therm l rules . . . . . . . . . . . . . . 47
Power on nd power off the server . . . . . . . 48
Power on the server . . . . . . . . . . . 48
Power off the server . . . . . . . . . . . 48
Server repl cement . . . . . . . . . . . . . 49
Remove the server from r ck . . . . . . . . 49
Inst ll the server to r ck . . . . . . . . . . 52
Air b ffle repl cement . . . . . . . . . . . . 57
Remove the ir b ffle . . . . . . . . . . . 57
Inst ll the ir b ffle . . . . . . . . . . . . 59
CMOS b ttery (CR2032) repl cement . . . . . . 61
Remove the CMOS b ttery . . . . . . . . 61
Inst ll the CMOS b ttery . . . . . . . . . 63
Front drive b ckpl ne repl cement . . . . . . . 65
Remove the front 2.5-inch drive b ckpl ne . . 65
Inst ll the front 2.5-inch drive b ckpl ne . . . 67
Remove the front 3.5-inch drive b ckpl ne . . 70
Inst ll the front 3.5-inch drive b ckpl ne . . . 71
Front I/O module repl cement . . . . . . . . . 73
Remove the front I/O module . . . . . . . . 73
Inst ll the front I/O module. . . . . . . . . 75
Hot-sw p drive repl cement . . . . . . . . . . 77
Remove hot-sw p drive . . . . . . . . . 77
Inst ll hot-sw p drive . . . . . . . . . . 78
Intrusion switch repl cement . . . . . . . . . 80
Remove the intrusion switch . . . . . . . . 80
Inst ll the intrusion switch . . . . . . . . . 82
M.2 drive nd M.2 b ckpl ne repl cement . . . . 83
Remove n M.2 drive . . . . . . . . . . . 83
Inst ll n M.2 drive . . . . . . . . . . . . 84
Remove the M.2 b ckpl ne . . . . . . . . 86
Inst ll the M.2 b ckpl ne . . . . . . . . . 88
Memory module repl cement . . . . . . . . . 90
Remove memory module . . . . . . . . 90
Inst ll memory module . . . . . . . . . 91
OCP module repl cement. . . . . . . . . . . 93
Remove the OCP module . . . . . . . . . 93
Inst ll the OCP module . . . . . . . . . . 95
PCIe d pter nd riser ssembly repl cement . . . 96
Remove riser ssembly . . . . . . . . . 97
Remove PCIe d pter . . . . . . . . . . 99
Inst ll PCIe d pter . . . . . . . . . . . 101
Inst ll riser ssembly . . . . . . . . . . 104
Power supply unit repl cement. . . . . . . . . 106
S fety prec utions . . . . . . . . . . . . 106
Remove power supply unit . . . . . . . . 108
Inst ll power supply unit . . . . . . . . . 110
© Copyright Lenovo 2022 i

Processor nd he t sink repl cement (tr ined
technici n only) . . . . . . . . . . . . . . . 112
Remove he t sink . . . . . . . . . . . 113
Remove processor . . . . . . . . . . . 116
Inst ll processor . . . . . . . . . . . . 117
Inst ll he t sink . . . . . . . . . . . . 119
R ck l tches repl cement. . . . . . . . . . . 122
Remove the r ck l tches . . . . . . . . . 122
Inst ll the r ck l tches . . . . . . . . . . 125
RAID fl sh power module repl cement. . . . . . 127
Remove RAID fl sh power module from the
ir b ffle . . . . . . . . . . . . . . . . 127
Inst ll RAID fl sh power module on the ir
b ffle . . . . . . . . . . . . . . . . . 128
Re rw ll br cket repl cement . . . . . . . . . 129
Remove re rw ll br cket. . . . . . . . . 130
Inst ll re rw ll br cket. . . . . . . . . . 132
Re r drive b ckpl ne nd drive c ge
repl cement . . . . . . . . . . . . . . . . 134
Remove the 4 x 2.5" drive b ckpl ne nd
drive c ge . . . . . . . . . . . . . . . 134
Inst ll the 4 x 2.5" drive b ckpl ne nd drive
c ge . . . . . . . . . . . . . . . . . 136
Security bezel repl cement . . . . . . . . . . 137
Remove the security bezel . . . . . . . . . 137
Inst ll the security bezel . . . . . . . . . . 138
System bo rd ssembly repl cement (tr ined
technici n only) . . . . . . . . . . . . . . . 140
Remove the firmw re nd RoT security
module . . . . . . . . . . . . . . . . 141
Inst ll the firmw re nd RoT security
module . . . . . . . . . . . . . . . . 143
Remove the system I/O bo rd or processor
bo rd . . . . . . . . . . . . . . . . . 147
Inst ll the system I/O bo rd or processor
bo rd . . . . . . . . . . . . . . . . . 150
System f n repl cement . . . . . . . . . . . 155
Remove system f n. . . . . . . . . . . 155
Inst ll system f n. . . . . . . . . . . . 157
System f n c ge repl cement . . . . . . . . . 159
Remove the system f n c ge . . . . . . . . 159
Inst ll the system f n c ge. . . . . . . . . 160
Top cover repl cement . . . . . . . . . . . . 161
Remove the top cover . . . . . . . . . . 161
Inst ll the top cover . . . . . . . . . . . 163
Complete the p rts repl cement . . . . . . . . 164
Chapter 6. Internal cable routing . . . 167
Identifying connectors . . . . . . . . . . . . 167
Drive b ckpl ne connectors . . . . . . . . 167
Front VGA connector nd extern l di gnostics
connector . . . . . . . . . . . . . . . . . 170
Front I/O module . . . . . . . . . . . . . . 171
Intrusion switch . . . . . . . . . . . . . . . 173
M.2 drive b ckpl ne . . . . . . . . . . . . . 174
RAID fl sh power module . . . . . . . . . . . 175
Riser c rds . . . . . . . . . . . . . . . . 176
4 xGMI links . . . . . . . . . . . . . . . . 178
B ckpl nes: server models with 2.5-inch front
drive b ys . . . . . . . . . . . . . . . . . 180
One 8 x SAS/SATA b ckpl ne . . . . . . . 182
Two 8 x NVMe b ckpl nes. . . . . . . . . 183
One 8 x SAS/SATA b ckpl ne nd two 8 x
NVMe b ckpl nes . . . . . . . . . . . . 185
B ckpl nes: server models with 3.5-inch front
drive b ys . . . . . . . . . . . . . . . . . 186
Chapter 7. System configuration . . . 189
Set the network connection for the Lenovo XCl rity
Controller . . . . . . . . . . . . . . . . . 189
Upd te the firmw re . . . . . . . . . . . . . 189
Configure the firmw re . . . . . . . . . . . . 192
Memory module configur tion . . . . . . . . . 193
RAID configur tion . . . . . . . . . . . . . 193
Deploy the oper ting system. . . . . . . . . . 194
B ck up the server configur tion . . . . . . . . 194
Chapter 8. Problem
determination . . . . . . . . . . . . . 197
Event logs . . . . . . . . . . . . . . . . . 197
Troubleshooting by system LEDs nd di gnostics
displ y . . . . . . . . . . . . . . . . . . 198
Drive LEDs . . . . . . . . . . . . . . . 198
Front oper tor p nel LEDs . . . . . . . . . 199
Extern l di gnostics h ndset . . . . . . . . 200
XCC system m n gement port LEDs. . . . . 206
Power supply LEDs . . . . . . . . . . . 207
System-bo rd- ssembly LEDs . . . . . . . 209
LEDs on the firmw re nd RoT security
module . . . . . . . . . . . . . . . . 211
Gener l problem determin tion procedures . . . . 212
Resolving suspected power problems . . . . 213
Resolving suspected Ethernet controller
problems . . . . . . . . . . . . . . . 213
Troubleshooting by symptom . . . . . . . . . 215
H rd disk drive problems . . . . . . . . . 215
Intermittent problems. . . . . . . . . . . 217
Keybo rd, mouse, KVM switch or USB-device
problems . . . . . . . . . . . . . . . 218
Memory problems . . . . . . . . . . . . 220
Monitor nd video problems . . . . . . . . 221
Observ ble problems. . . . . . . . . . . 222
Option l-device problems . . . . . . . . . 225
Perform nce problems . . . . . . . . . . 227
Power on nd power off problems. . . . . . 228
ii ThinkSystem SR665 V3 User Guide

Power problems. . . . . . . . . . . . . 229
Softw re problems. . . . . . . . . . . . 230
Appendix A. Hardware
disassembling for recycle . . . . . . . 231
Dis ssemble the system bo rd ssembly for
recycle . . . . . . . . . . . . . . . . . . 231
Appendix B. Getting help and
technical assistance . . . . . . . . . . 235
Before you c ll . . . . . . . . . . . . . . . 235
Collecting service d t . . . . . . . . . . . . 236
Cont cting Support . . . . . . . . . . . . . 237
Appendix C. Documents and
supports . . . . . . . . . . . . . . . . 239
Documents downlo d . . . . . . . . . . . . 239
Support websites . . . . . . . . . . . . . . 239
Appendix D. Notices. . . . . . . . . . 241
Tr dem rks . . . . . . . . . . . . . . . . 242
Import nt notes . . . . . . . . . . . . . . . 242
Electronic emission notices . . . . . . . . . . 242
T iw n Region BSMI RoHS decl r tion . . . . . 243
T iw n Region import nd export cont ct
inform tion . . . . . . . . . . . . . . . . 243
© Copyright Lenovo 2022 iii

i ThinkSystem SR665 V3 User Guide

Safety
Before inst lling this product, re d the S fety Inform tion.
Antes de inst l r este produto, lei s Inform ções de Segur nç .
在安装本产品之前，请仔细阅读 S fety Inform tion （安全信息）。
Læs sikkerhedsforskrifterne, før du inst llerer dette produkt.
Lees voord t u dit product inst lleert eerst de veiligheidsvoorschriften.
Ennen kuin senn t tämän tuotteen, lue turv ohjeet kohd st S fety Inform tion.
Av nt d'inst ller ce produit, lisez les consignes de sécurité.
Vor der Inst ll tion dieses Produkts die Sicherheitshinweise lesen.
Prim di inst ll re questo prodotto, leggere le Inform zioni sull Sicurezz .
Les sikkerhetsinform sjonen (S fety Inform tion) før du inst llerer dette produktet.
Antes de inst l r este produto, lei s Inform ções sobre Segur nç .
© Copyright Lenovo 2022

Antes de inst l r este producto, le l inform ción de segurid d.
Läs säkerhetsinform tionen inn n du inst ller r den här produkten.
Safety inspection checklist
Use the inform tion in this section to identify potenti lly uns fe conditions with your server. As e ch m chine
w s designed nd built, required s fety items were inst lled to protect users nd service technici ns from
injury.
Note: The product is not suit ble for use t visu l displ y workpl ces ccording to §2 of the Workpl ce
Regul tions.
Note: The set-up of the server is m de in the server room only.
CAUTION:
This equipment must be installed or ser iced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Leno o assumes you are qualified in the
ser icing of equipment and trained in recognizing hazards energy le els in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.
Important: Electric l grounding of the server is required for oper tor s fety nd correct system function.
Proper grounding of the electric l outlet c n be verified by certified electrici n.
Use the following checklist to verify th t there re no potenti lly uns fe conditions:
1. If you need to power off the server, m ke sure th t the power cord is disconnected.
S002
CAUTION:
i ThinkSystem SR665 V3 User Guide

The power-control button on the de ice and the power switch on the power supply do not turn off
the electrical current supplied to the de ice. The de ice also might ha e more than one power
cord. To remo e all electrical current from the de ice, ensure that all power cords are
disconnected from the power source.
Note: Under cert in circumst nces, powering off the server is not prerequisite. Refer to the
prec utions before conducting ny t sks.
2. Check the power cord.
• M ke sure th t the third-wire ground connector is in good condition. Use meter to me sure third-
wire ground continuity for 0.1 ohm or less between the extern l ground pin nd the fr me ground.
• M ke sure th t the power cord is the correct type.
To view the power cords th t re v il ble for the server:
. Go to:
http://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the m chine type nd model for your server to displ y the configur tor p ge.
d. Click Power ➙ Power Cables to see ll line cords.
• M ke sure th t the insul tion is not fr yed or worn.
3. Check for ny obvious non-Lenovo lter tions. Use good judgment s to the s fety of ny non-Lenovo
lter tions.
4. Check inside the server for ny obvious uns fe conditions, such s met l filings, cont min tion, w ter or
other liquid, or signs of fire or smoke d m ge.
5. Check for worn, fr yed, or pinched c bles.
6. M ke sure th t the power-supply cover f steners (screws or rivets) h ve not been removed or t mpered
with.
© Copyright Lenovo 2022 ii

iii ThinkSystem SR665 V3 User Guide

Chapter 1. Introduction
The ThinkSystem SR665 V3 server (7D9A nd 7D9B) is 2-socket 2U server th t fe tures the 4th gener tion
EPYCTM processor f mily of AMD®. The server offers bro d selection of drive nd slot configur tions, high
perform nce, nd exp nsion for v rious IT worklo ds. Combining perform nce nd flexibility, the server is
gre t choice for enterprises of ll sizes.
Figure 1. ThinkSystem SR665 V3
Features
Perform nce, e se of use, reli bility, nd exp nsion c p bilities were key consider tions in the design of
your server. These design fe tures m ke it possible for you to customize the system h rdw re to meet your
needs tod y nd provide flexible exp nsion c p bilities for the future.
Your server implements the following fe tures nd technologies:
• Features on Demand
If Fe tures on Dem nd fe ture is integr ted in the server or in n option l device th t is inst lled in the
server, you c n purch se n ctiv tion key to ctiv te the fe ture. For inform tion bout Fe tures on
Dem nd, see:
https://fod.lenovo.com/lkms
• Leno o XClarity Controller (XCC)
The Lenovo XCl rity Controller is the common m n gement controller for Lenovo ThinkSystem server
h rdw re. The Lenovo XCl rity Controller consolid tes multiple m n gement functions in single chip on
the server system bo rd ssembly. Some of the fe tures th t re unique to the Lenovo XCl rity Controller
re enh nced perform nce, higher-resolution remote video, nd exp nded security options.
The server supports Lenovo XCl rity Controller 2 (XCC2). For ddition l inform tion bout Lenovo XCl rity
Controller 2 (XCC2), refer to https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• UEFI-compliant ser er firmware
Lenovo ThinkSystem firmw re is Unified Extensible Firmw re Interf ce (UEFI) compli nt. UEFI repl ces
BIOS nd defines st nd rd interf ce between the oper ting system, pl tform firmw re, nd extern l
devices.
Lenovo ThinkSystem servers re c p ble of booting UEFI-compli nt oper ting systems, BIOS-b sed
oper ting systems, nd BIOS-b sed d pters s well s UEFI-compli nt d pters.
Note: The server does not support Disk Oper ting System (DOS).
• Large system-memory capacity
The server supports up to 24 TruDDR5 du l inline memory modules (DIMMs) with error correcting code
(ECC). For more inform tion bout the specific types nd m ximum mount of memory, see “Technic l
specific tions” on p ge 3.
© Copyright Lenovo 2022 1

• Large data-storage capacity and hot-swap capability
With the hot-sw p fe ture, you c n dd, remove, or repl ce h rd disk drives without turning off the server.
Stor ge c p city is different depending on server model. See “Technic l specific tions” on p ge 3 for
more inform tion.
• Lightpath Diagnostics
Lightp th Di gnostics provides LEDs to help you di gnose problems. For more inform tion bout the
Lightp th Di gnostics, see “Troubleshooting by system LEDs nd di gnostics displ y” on p ge 198.
• Redundant networking connection
The Lenovo XCl rity Controller provides f ilover c p bility to redund nt Ethernet connection with the
pplic ble pplic tion inst lled. If problem occurs with the prim ry Ethernet connection, ll Ethernet
tr ffic th t is ssoci ted with the prim ry connection is utom tic lly switched to the option l redund nt
Ethernet connection. If the pplic ble device drivers re inst lled, this switching occurs without d t loss
nd without user intervention.
• Redundant cooling
The redund nt cooling by the f ns in the server en bles continued oper tion if one rotor of f n f ils.
• ThinkSystem RAID support
The ThinkSystem RAID d pter provides h rdw re redund nt rr y of independent disks (RAID) support
to cre te configur tions, supporting RAID levels 0, 1, 5, 6, 10, 50, nd 60.
Tech Tips
Lenovo continu lly upd tes the support website with the l test tips nd techniques th t you c n use to solve
issues th t your server might encounter. These Tech Tips ( lso c lled ret in tips or service bulletins) provide
procedures to work round issues or solve problems rel ted to the oper tion of your server.
To find the Tech Tips v il ble for your server:
1. Go to http://d t centersupport.lenovo.com nd n vig te to the support p ge for your server.
2. Click on How To’s from the n vig tion p ne.
3. Click Article Type ➙ Solution from the drop-down menu.
Follow the on-screen instructions to choose the c tegory for the problem th t you re h ving.
Security ad isories
Lenovo is committed to developing products nd services th t dhere to the highest security st nd rds in
order to protect our customers nd their d t . When potenti l vulner bilities re reported, it is the
responsibility of the Lenovo Product Security Incident Response Te m (PSIRT) to investig te nd provide
inform tion to our customers so they m y put mitig tion pl ns in pl ce s we work tow rd providing
solutions.
The list of current dvisories is v il ble t the following site:
https://d t centersupport.lenovo.com/product_security/home
Specifications
Summ ry of the fe tures nd specific tions of the server. Depending on the model, some fe tures might not
be v il ble, or some specific tions might not pply. The l test specific tions inform tion is lw ys v il ble
t https://lenovopress.lenovo.com/.
2ThinkSystem SR665 V3 User Guide

Refer to the below t ble for specific tions c tegories nd the content of e ch c tegory.
Specification
category
Technic l specific tions Mech nic l specific tions Environment l specific tions
Content • Processor
• Memory
• Intern l drives
• Exp nsion slots
• Stor ge controller
• Integr ted functions nd I/O
connectors
• Network
• System f n
• Power supplies
• Minim l configur tion for
debugging
• Oper ting systems
• Dimension
• Weight
• Acoustic l noise emissions
• Environment
• P rticul te cont min tion
Technical specifications
Summ ry of the technic l specific tions of server. Depending on the model, some fe tures might not be
v il ble, or some specific tions might not pply. The l test specific tions inform tion is lw ys v il ble t
https://lenovopress.lenovo.com/.
Processor
Supports fourth-gener tion AMD® EPYCTM processors, with 5nm process technology.
• Up to two processors with the new LGA 6096 (SP5) socket
• Up to 96 Zen4 cores (192 thre ds) per socket
• Up to 4 xGMI3 links t up to 32 GT/s
• Therm l Design Power (TDP): up to 400 w tts
For list of supported processors, see https://serverproven.lenovo.com/.
Memory
See “Memory module inst ll tion rules nd order” on p ge 44 for det iled inform tion bout memory configur tion nd
setup.
• Slots: 24 du l inline memory module (DIMM) slots (12 ch nnels per processor, 1 DIMM per ch nnel)
• Memory module type: TruDDR5 RDIMM 16 GB (1Rx8), 32 GB (2Rx8), 64 GB (2Rx4 10x4)
• C p city:
– Minimum: 16 GB (1 x 16 GB RDIMM)
– M ximum: 1.5 TB (24 x 64 GB RDIMM)
• Speed: 4800 MT/s
For list of supported memory modules, see https://serverproven.lenovo.com/.
Internal dri es
• Front drive b ys:
– Up to 24 x 2.5-inch hot-sw p SAS/SATA/NVMe drives
– Up to 12 x 3.5-inch hot-sw p SAS/SATA drives
• Re r drive b ys:
– Up to 4 x 2.5-inch hot-sw p SAS/SATA drives
• Up to two intern l M.2 drives
Ch pter 1.Introduction 3

Expansion slots
• Up to eight PCIe slots
• One OCP module slot
PCIe slot v il bility is b sed on riser selection nd re r drive b y selection. See “Re r view” on p ge 17 nd “PCIe
slots nd PCIe d pters” on p ge 46.
Storage controller
• ThinkSystem RAID 540-8i PCIe Gen4 12Gb Ad pter
• ThinkSystem RAID 940-8i 4GB Fl sh PCIe Gen4 12Gb Ad pter
• ThinkSystem RAID 940-16i 4GB Fl sh PCIe Gen4 12Gb Ad pter
• ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb HBA
Note:
For more inform tion bout the RAID/HBA d pters, see Lenovo ThinkSystem RAID Ad pter nd HBA Reference.
Integrated functions and I/O connectors
• Lenovo XCl rity Controller (XCC), which provides service processor control nd monitoring functions, video
controller, nd remote keybo rd, video, mouse, nd remote drive c p bilities.
– The server supports Lenovo XCl rity Controller 2 (XCC2). For ddition l inform tion bout Lenovo XCl rity
Controller 2 (XCC2), refer to https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• Front connectors:
– One VGA connector (option l)
– One USB 3.2 Gen 1 (5 Gbps) connector
– One USB 2.0 connector
– One extern l di gnostics connector
• Re r connectors:
– One VGA connector
– Three USB 3.2 Gen 1 (5 Gbps) connectors
– One XCC system m n gement port
– Two or four Ethernet connectors on the OCP module (option l)
Network
• OCP module, which provides two or four Ethernet connectors for network support
System fan
• Supported f n types:
– St nd rd f n 6038 (single-rotor, 17000 RPM)
– Perform nce f n 6056 (du l-rotor, 21000 RPM)
• F n redund ncy: N+1 redund ncy, one redund nt f n rotor
– One processor: five hot-sw p system f ns (one redund nt f n rotor)
– Two processors or one processor with middle/re r b y or Riser 3: six hot-sw p system f ns (one redund nt f n
rotor)
Notes:
• Single-rotor hot-sw p f ns c nnot be mixed with du l-rotor hot-sw p f ns.
• The redund nt cooling by the f ns in the server en bles continued oper tion if one rotor of f n f ils.
Power supplies
The server supports up to two power supplies for redund ncy.
Power supply 200–240 V ac 240 V dc
4ThinkSystem SR665 V3 User Guide

Power supplies
1800W Pl tinum √ √
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY.
• Power supply with 240 V dc input cannot support hot plugging power cord function. Before remo ing the
power supply with dc input, please turn off ser er or disconnect dc power sources at the breaker panel or by
turning off the power source. Then, remo e the power cord.
Minimal configuration for debugging
• One processor in socket 1
• One memory module in slot 7
• One power supply unit
• One HDD/SSD drive or one M.2 drive (if OS is needed for debugging)
• Five system f ns
Operating systems
Supported nd certified oper ting systems:
• Microsoft Windows Server
• Red H t Enterprise Linux
• VMw re ESXi
References:
• Complete list of v il ble oper ting systems: https://lenovopress.lenovo.com/osig.
• OS deployment instructions, see “Deploy the oper ting system” on p ge 194.
Mechanical specifications
Summ ry of the mech nic l specific tions of server. Depending on the model, some fe tures might not be
v il ble, or some specific tions might not pply. The l test specific tions inform tion is lw ys v il ble t
https://lenovopress.lenovo.com/.
Dimension
• Form f ctor: 2U
• Height: 86.5 mm (3.4 inches)
• Width:
– With r ck l tches: 482.0 mm (19.0 inches)
– Without r ck l tches: 444.6 mm (17.5 inches)
• Depth: 763.7 mm (30.1 inches)
Note: The depth is me sured with r ck l tches inst lled, but without the security bezel inst lled.
Weight
Up to 39 kg (86 lb), depending on the server configur tion
En ironmental specifications
Summ ry of the environment l specific tions of server. Depending on the model, some fe tures might not be
v il ble, or some specific tions might not pply. The l test specific tions inform tion is lw ys v il ble t
https://lenovopress.lenovo.com/.
• “Acoustic l noise emissions” on p ge
Ch pter 1.Introduction 5

• “Environment” on p ge
Acoustical noise emissions
The server h s the following coustic noise emissions decl r tion.
Minimal Typical Storage GPU
Sound power levels (LWAd)
Idling 5.9 Bel 6.5 Bel 7.3 Bel 7.3 Bel
Oper ting 6.5 Bel 8.1 Bel 7.5 Bel 8.7 Bel
Sound pressure level (LpAm)
Idling 41.5 dBA 51 dBA 60.2 dBA 60.2 dBA
Oper ting 48.3 dBA 66.6 dBA 61.3 dBA 71.9 dBA
The decl red sound levels re b sed on the following configur tions, which m y ch nge depending on configur tions
or conditions.
Config. Minimal Typical Storage GPU
CPU 2 x 240 W 2 x 300 W 2 x 240 W 2 x 300 W
DIMM 12 x 64 GB 24 x 64 GB 12 x 64 GB 24 x 64 GB
Drive 8 x 2.5'' SAS HDD 16 x 2.5'' SAS HDD Front 12 x 3.5'' + re r 4
x 2.5'' SAS HDD 16 x 2.5'' SAS HDD
RAID 1 x RAID 940-8i 1 x RAID 940-8i 1 x RAID 940-8i 1 x RAID 940-16i
Ethernet 1 x Intel E810-DA2 10/25GbE SFP28 2-Port OCP
PSU 2 x 1100 W 2 x 1800 W 2 x 1800 W 2 x 2400 W
GPU NA NA NA 3 x A100
Notes:
• These sound levels were me sured in controlled coustic l environments ccording to procedures specified by
ISO7779 nd re reported in ccord nce with ISO 9296.
• Government regul tions (such s those prescribed by OSHA or Europe n Community Directives) m y govern noise
level exposure in the workpl ce nd m y pply to you nd your server inst ll tion. The ctu l sound pressure levels
in your inst ll tion depend upon v riety of f ctors, including the number of r cks in the inst ll tion; the size,
m teri ls, nd configur tion of the room; the noise levels from other equipment; the room mbient temper ture, nd
employee's loc tion in rel tion to the equipment. Further, compli nce with such government regul tions depends
on v riety of ddition l f ctors, including the dur tion of employees' exposure nd whether employees we r
he ring protection. Lenovo recommends th t you consult with qu lified experts in this field to determine whether
you re in compli nce with the pplic ble regul tions.
6ThinkSystem SR665 V3 User Guide

En ironment
ThinkSystem SR665 V3 is designed for st nd rd d t center environment nd is recommended to be pl ced in
industri l d t center. Depending on h rdw re configur tions, the server complies with ASHRAE Cl ss H1, A2, A3, or
A4 specific tions with cert in therm l restrictions. For det iled therm l inform tion, see “Therm l rules” on p ge 47.
System perform nce m y be imp cted when oper ting temper ture is outside permitted conditions.
• Air temperature:
– Oper ting
– ASHRAE cl ss H1: 5°C to 25°C (41°F to 77°F)
The m ximum mbient temper ture decre ses by 1°C for every 500 m (1640 ft) incre se in ltitude bove 900
m (2,953 ft)
– ASHRAE cl ss A2: 10°C to 35°C (50°F to 95°F)
The m ximum mbient temper ture decre ses by 1°C for every 300 m (984 ft) incre se in ltitude bove 900
m (2,953 ft)
– ASHRAE cl ss A3: 5°C to 40°C (41°F to 104°F)
The m ximum mbient temper ture decre ses by 1°C for every 175 m (574 ft) incre se in ltitude bove 900
m (2,953 ft)
– ASHRAE cl ss A4: 5°C to 45°C (41°F to 113°F)
The m ximum mbient temper ture decre ses by 1°C for every 125 m (410 ft) incre se in ltitude bove 900
m (2,953 ft)
– Server off: 5°C to 45°C (41°F to 113°F)
– Shipment/stor ge: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relati e Humidity (non-condensing):
– Oper ting
– ASHRAE cl ss H1: 8%–80%; m ximum dew point: 17°C (62.6°F)
– ASHRAE cl ss A2: 8%–80%; m ximum dew point: 21°C (70°F)
– ASHRAE cl ss A3: 8%–85%; m ximum dew point: 24°C (75°F)
– ASHRAE cl ss A4: 8%–90%; m ximum dew point: 24°C (75°F)
– Shipment/stor ge: 8% to 90%
Particulate contamination
Attention: Airborne p rticul tes (including met l fl kes or p rticles) nd re ctive g ses cting lone or in
combin tion with other environment l f ctors such s humidity or temper ture might pose risk to the
device th t is described in this document.
Risks th t re posed by the presence of excessive p rticul te levels or concentr tions of h rmful g ses
include d m ge th t might c use the device to m lfunction or ce se functioning ltogether. This
specific tion sets forth limits for p rticul tes nd g ses th t re intended to void such d m ge. The limits
must not be viewed or used s definitive limits, bec use numerous other f ctors, such s temper ture or
moisture content of the ir, c n influence the imp ct of p rticul tes or environment l corrosives nd g seous
cont min nt tr nsfer. In the bsence of specific limits th t re set forth in this document, you must
implement pr ctices th t m int in p rticul te nd g s levels th t re consistent with the protection of hum n
he lth nd s fety. If Lenovo determines th t the levels of p rticul tes or g ses in your environment h ve
c used d m ge to the device, Lenovo m y condition provision of rep ir or repl cement of devices or p rts
on implement tion of ppropri te remedi l me sures to mitig te such environment l cont min tion.
Implement tion of such remedi l me sures is customer responsibility.
Ch pter 1.Introduction 7

Table 1. Limits for particulates an gases
Contaminant Limits
Re ctive g ses Severity level G1 s per ANSI/ISA 71.04-19851:
• The copper re ctivity level sh ll be less th n 300 Angstroms per month (Å/month ≈ 0.0039 μg/
cm2-hour weight g in).2
• The silver re ctivity level sh ll be less th n 200 Å/month (Å/month ≈ 0.0035 μg/cm2-hour
weight g in).3
• The re ctive monitoring of g seous corrosivity must be conducted pproxim tely 5 cm (2 in.) in
front of the r ck on the ir inlet side t one-qu rter nd three-qu rter fr me height off the floor
or where the ir velocity is much higher.
Airborne
p rticul tes D t centers must meet the cle nliness level of ISO 14644-1 cl ss 8.
For d t centers without irside economizer, the ISO 14644-1 cl ss 8 cle nliness might be met by
choosing one of the following filtr tion methods:
• The room ir might be continuously filtered with MERV 8 filters.
• Air entering d t center might be filtered with MERV 11 or prefer bly MERV 13 filters.
For d t centers with irside economizers, the choice of filters to chieve ISO cl ss 8 cle nliness
depends on the specific conditions present t th t d t center.
• The deliquescent rel tive humidity of the p rticul te cont min tion should be more th n 60%
RH.4
• D t centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental con itions for process measurement an control systems: Airborne
contaminants. Instrument Society of Americ , Rese rch Tri ngle P rk, North C rolin , U.S.A.
2 The deriv tion of the equiv lence between the r te of copper corrosion growth in the thickness of the corrosion
product in Å/month nd the r te of weight g in ssumes th t Cu2S nd Cu2O grow in equ l proportions.
3 The deriv tion of the equiv lence between the r te of silver corrosion growth in the thickness of the corrosion
product in Å/month nd the r te of weight g in ssumes th t Ag2S is the only corrosion product.
4 The deliquescent rel tive humidity of p rticul te cont min tion is the rel tive humidity t which the dust bsorbs
enough w ter to become wet nd promote ionic conduction.
5 Surf ce debris is r ndomly collected from 10 re s of the d t center on 1.5 cm di meter disk of sticky
electric lly conductive t pe on met l stub. If ex min tion of the sticky t pe in sc nning electron microscope
reve ls no zinc whiskers, the d t center is considered free of zinc whiskers.
Management options
The XCl rity portfolio nd other system m n gement options described in this section re v il ble to help
you m n ge the servers more conveniently nd efficiently.
8ThinkSystem SR665 V3 User Guide

O er iew
Options Description
Lenovo XCl rity Controller
B sebo rd m n gement controller (BMC).
Consolid tes the service processor function lity, Super I/O, video controller, nd
remote presence c p bilities into single chip on the server system bo rd ssembly.
Interface
• CLI pplic tion
• Web GUI interf ce
• REST API
Usage and downloads
https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html
Lenovo XCl rity Essenti ls
toolset
Port ble nd light toolset for server configur tion, d t collection, nd firmw re
upd tes. Suit ble both for single-server or multi-server m n gement contexts.
Interface
• OneCLI: CLI pplic tion
• Bootable Media Creator: CLI pplic tion, GUI pplic tion
• UpdateXpress: GUI pplic tion
Usage and downloads
http://sysmgt.lenovofiles.com/help/topic/xcl rity_essenti ls/overview.html
Lenovo XCl rity Provisioning
M n ger
UEFI-b sed embedded GUI tool on single server th t c n simplify m n gement
t sks.
Interface
• Web interf ce (BMC remote ccess)
• GUI pplic tion
Usage and downloads
https://sysmgt.lenovofiles.com/help/topic/lxpm_frontend/lxpm_product_p ge.html
Important:
Lenovo XCl rity Provisioning M n ger (LXPM) supported version v ries by product. All
versions of Lenovo XCl rity Provisioning M n ger re referred to s Lenovo XCl rity
Provisioning M n ger nd LXPM in this document, unless specified otherwise. To see
the LXPM version supported by your server, go to https://sysmgt.lenovofiles.com/help/
topic/lxpm_frontend/lxpm_product_p ge.html.
Ch pter 1.Introduction 9

Functions
Options
Functions
Multi-
system
mgmt
OS
deploy-
ment
System
configu-
ration
Firm-
ware
up-
dates1
E ent-
s/alert
moni-
toring
In en-
tory/
logs
Pow-
er
mgmt
Power
planning
Lenovo XCl rity Controller √ √2√ √4
Lenovo
XCl rity
Essen-
ti ls
toolset
OneCLI √ √ √2√ √4
Boot ble Medi
Cre tor √ √2√4
Upd teXpress √ √2
Lenovo XCl rity Provisioning
M n ger √ √ √3√5
Notes:
1. Most options c n be upd ted through the Lenovo tools. Some options, such s GPU firmw re or Omni-
P th firmw re require the use of supplier tools.
2. The server UEFI settings for option ROM must be set to Auto or UEFI to upd te firmw re using Lenovo
XCl rity Essenti ls or Lenovo XCl rity Controller.
3. Firmw re upd tes re limited to Lenovo XCl rity Provisioning M n ger, Lenovo XCl rity Controller, nd
UEFI upd tes only. Firmw re upd tes for option l devices, such s d pters, re not supported.
4. The server UEFI settings for option ROM must be set to Auto or UEFI for det iled d pter c rd
inform tion, such s model n me nd firmw re levels, to be displ yed in Lenovo XCl rity Controller or
Lenovo XCl rity Essenti ls.
5. Limited inventory.
10 ThinkSystem SR665 V3 User Guide