Lenovo ThinkSystem ST650 V2 User manual

ThinkSystem ST650 V2
Setup Guide
Machine Types: 7Z74 and 7Z75

Note
Before using this information and the product it supports be sure to read and understand the safety
information and the safety instructions which are available at:
http://thinksystem.lenovofiles.com/help/topic/safety_documentation/pdf_files.html
In addition be sure that you are familiar with the terms and conditions of the Lenovo warranty for your server
which can be found at:
http://datacentersupport.lenovo.com/warrantylookup
First Edition (May 2021)
© Copyright Lenovo 2021.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services
Administration (GSA) contract use reproduction or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
afety . . . . . . . . . . . . . . . . . . iii
Safety inspection checklist . . . . . . . . . . . iv
Chapter 1. Introduction . . . . . . . . . 1
Server package contents . . . . . . . . . . . . 1
Server form factor . . . . . . . . . . . . . . . 1
Features. . . . . . . . . . . . . . . . . . . 1
Specifications . . . . . . . . . . . . . . . . 3
Particulate contamination . . . . . . . . . . 9
Management options. . . . . . . . . . . . . 10
Chapter 2. erver components . . . . 15
Front view . . . . . . . . . . . . . . . . . 16
Front panel . . . . . . . . . . . . . . . 21
Rear view . . . . . . . . . . . . . . . . . 24
Rear view LEDs . . . . . . . . . . . . . 25
External LCD diagnostics handset. . . . . . 27
System board components . . . . . . . . . . 32
System board LEDs . . . . . . . . . . . 34
System board switches . . . . . . . . . . 35
Server locks . . . . . . . . . . . . . . . . 37
Backplates and backplanes . . . . . . . . . . 38
2.5-inch drive backplanes . . . . . . . . . 38
3.5-inch drive backplanes . . . . . . . . . 39
3.5-inch drive backplate. . . . . . . . . . 40
Power distribution board connectors . . . . . . 40
Parts list. . . . . . . . . . . . . . . . . . 41
Power cords . . . . . . . . . . . . . . 45
Chapter 3. Internal cable routing . . . 47
Backplane and backplate cable routing . . . . . 48
Front panel cable routing . . . . . . . . . . . 48
Front USB cable routing . . . . . . . . . . . 49
GPU cable routing . . . . . . . . . . . . . . 50
Internal CFF RAID adapter cable routing . . . . . 50
M.2 boot adapter cable routing. . . . . . . . . 51
Optical drive cable routing. . . . . . . . . . . 52
PCIe slot 8 cable routing . . . . . . . . . . . 52
Power distribution board cable routing . . . . . . 53
Tape drive cable routing . . . . . . . . . . . 54
Chapter 4. erver hardware setup . . 57
Server setup checklist . . . . . . . . . . . . 57
Installation guidelines . . . . . . . . . . . . 58
Safety inspection checklist. . . . . . . . . 59
System reliability guidelines . . . . . . . . 60
Working inside the server with the power on . . 60
Handling static-sensitive devices . . . . . . 60
Technical rules . . . . . . . . . . . . . . . 61
Technical rules for GPU . . . . . . . . . . 61
Technical rules for memory modules . . . . . 62
Technical rules for PCIe slots. . . . . . . . 77
Technical rules for system fans . . . . . . . 77
Install server hardware options . . . . . . . . . 80
Install a hot-swap power supply . . . . . . 80
Remove the front door . . . . . . . . . . 83
Remove the server cover . . . . . . . . . 84
Remove the front bezel . . . . . . . . . . 86
Remove a flash power module . . . . . . . 87
Remove the air baffle . . . . . . . . . . . 89
Remove an NVLink bridge . . . . . . . . . 90
Remove a full-length GPU adapter . . . . . 92
Remove a hot-swap fan . . . . . . . . . . 93
Remove the fan cage assembly . . . . . . . 94
Remove the expansion drive cage . . . . . . 96
Install the optical drive cage . . . . . . . . 97
Install an optical drive or a tape drive. . . . . 98
Install the 5.25-inch drive bay adapter
assembly . . . . . . . . . . . . . . . 101
Install a 2.5-inch hot-swap drive
backplane . . . . . . . . . . . . . . . 104
Install a 3.5-inch hot-swap drive
backplane . . . . . . . . . . . . . . . 105
Install a 3.5-inch simple-swap drive
backplate . . . . . . . . . . . . . . . 106
Install a 2.5-inch drive into a 3.5-inch drive
bay . . . . . . . . . . . . . . . . . . 108
Install a simple-swap drive. . . . . . . . . 109
Install a hot-swap drive . . . . . . . . . . 111
Install the internal CFF adapter . . . . . . . 112
Install a processor-heat-sink module. . . . . 114
Install a memory module . . . . . . . . . 117
Install the M.2 boot adapter . . . . . . . . 119
Adjust the retainer on the M.2 boot
adapter . . . . . . . . . . . . . . . . 121
Install an M.2 drive . . . . . . . . . . . . 122
Install the intrusion switch . . . . . . . . . 123
Install the fan cage assembly . . . . . . . . 125
Install a hot-swap fan . . . . . . . . . . . 126
Install a PCIe adapter holder . . . . . . . . 127
Install a PCIe adapter . . . . . . . . . . . 128
Install a full-length GPU adapter . . . . . . 129
Install an NVLink bridge . . . . . . . . . . 131
Install a GPU filler . . . . . . . . . . . . 133
Install a T4 filler . . . . . . . . . . . . . 134
© Copyright Lenovo 2021 i

Install the air baffle . . . . . . . . . . . . 136
Install a flash power module . . . . . . . . 137
Install the front bezel . . . . . . . . . . . 139
Install the front door . . . . . . . . . . . 140
Install the server cover . . . . . . . . . . 141
Install the foot stands . . . . . . . . . . . 143
Install the tower to rack conversion kit . . . . . . 145
Install the EIA brackets . . . . . . . . . . 145
Install the rail and latch covers . . . . . . . 147
Cable the server . . . . . . . . . . . . . . 148
Power on the server . . . . . . . . . . . . . 148
Validate server setup . . . . . . . . . . . . . 149
Power off the server . . . . . . . . . . . . . 149
Chapter 5. ystem configuration . . . 151
Set the network connection for the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 151
Set the front USB 2.0 connector for Lenovo
XClarity Controller connection . . . . . . . . . 152
Update the firmware . . . . . . . . . . . . . 152
Configure the firmware . . . . . . . . . . . . 156
Memory configuration . . . . . . . . . . . . 157
Enable Software Guard Extensions (SGX). . . . . 157
RAID configuration . . . . . . . . . . . . . 158
Deploy the operating system. . . . . . . . . . 158
Back up the server configuration . . . . . . . . 159
Update the Vital Product Data (VPD). . . . . . . 159
Update the Universal Unique Identifier
(UUID). . . . . . . . . . . . . . . . . 159
Update the asset tag . . . . . . . . . . . 161
Chapter 6. Resolving installation
issues . . . . . . . . . . . . . . . . . 163
Appendix A. Getting help and
technical assistance . . . . . . . . . . 167
Before you call . . . . . . . . . . . . . . . 167
Collecting service data . . . . . . . . . . . . 168
Contacting Support . . . . . . . . . . . . . 169
Appendix B. Trademarks . . . . . . . 171
Index . . . . . . . . . . . . . . . . . . 173
ii ThinkSystem ST650 V2 Setup Guide

afety
Before installing this product read the Safety Information.
Antes de instalar este produto leia as Informações de Segurança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne før du installerer dette produkt.
Lees voordat u dit product installeert eerst de veiligheidsvoorschriften.
Ennen kuin asennat tämän tuotteen lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce produit lisez les consignes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo prodotto leggere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette produktet.
Antes de instalar este produto leia as Informações sobre Segurança.
© Copyright Lenovo 2021 iii

Antes de instalar este producto lea la información de seguridad.
Läs säkerhetsinformationen innan du installerar den här produkten.
afety inspection checklist
Use the information in this section to identify potentially unsafe conditions with your server. As each machine
was designed and built required safety items were installed to protect users and service technicians from
injury.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for afety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products.
Important: Electrical grounding of the server is required for operator safety and correct system function.
Proper grounding of the electrical outlet can be verified by a certified electrician.
Notes:
1. The product is not suitable for use at visual display workplaces according to §2 of the Workplace
Regulations.
2. The set-up of the server is made in the server room only.
Use the following checklist to verify that there are no potentially unsafe conditions:
1. Make sure that the power is off and the power cord is disconnected.
2. Check the power cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground pin and the frame ground.
• Make sure that the power cord is the correct type.
To view the power cords that are available for the server:
a. Go to:
http://dcsc.lenovo.com/#/
iv ThinkSystem ST650 V2 Setup Guide

b. In the Customize a Model pane:
1) Click elect Options/Parts for a Model.
2) Enter the machine type and model for your server.
c. Click the Power tab to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions such as metal filings contamination water or
other liquid or signs of fire or smoke damage.
5. Check for worn frayed or pinched cables.
6. Make sure that the power-supply cover fasteners (screws or rivets) have not been removed or tampered
with.
© Copyright Lenovo 2021 v

vi ThinkSystem ST650 V2 Setup Guide

Chapter 1. Introduction
The ThinkSystem ST650 V2 server is a 4U tower server designed for performance and expansion for various
IT workloads. With the modular design the server is flexible to be customized for maximum storage capacity
or high storage density with selectable input/output options and tiered system management.
Performance ease of use reliability and expansion capabilities were key considerations in the design of the
server. These design features make it possible for you to customize the system hardware to meet your needs
today and provide flexible expansion capabilities for the future.
The server comes with a limited warranty. For details about the warranty see: https://support.lenovo.com/us/
en/solutions/ht503310
For details about your specific warranty see: http://datacentersupport.lenovo.com/warrantylookup
erver package contents
When you receive your server verify that the shipment contains everything that you expected to receive.
The server package includes the following items:
Note: Some of the items listed are available on select models only.
• The server.
• Rail kit (optional). Detailed instructions for installing the rail kit are provided in the package with the rail kit.
• Material box including items such as accessory kit and documentation.
erver form factor
The ThinkSystem ST650 V2 server is designed to support both tower and rack form factors.
You can change the server from tower form factor to rack form factor by installing the tower to rack
conversion kit. For instructions on how to install the tower to rack conversion kit refer to “Install the tower to
rack conversion kit” on page 145.
Features
Performance ease of use reliability and expansion capabilities were key considerations in the design of the
server. These design features make it possible for you to customize the system hardware to meet your needs
today and provide flexible expansion capabilities for the future.
Your server implements the following features and technologies:
• Features on Demand
If a Features on Demand feature is integrated in the server or in an optional device that is installed in the
server you can purchase an activation key to activate the feature. For information about Features on
Demand see:
https://fod.lenovo.com/lkms
• Lenovo XClarity Controller (XCC)
© Copyright Lenovo 2021 1

The Lenovo XClarity Controller is the common management controller for Lenovo Lenovo ThinkSystem
server hardware. The Lenovo XClarity Controller consolidates multiple management functions in a single
chip on the server system board.
Some of the features that are unique to the Lenovo XClarity Controller are enhanced performance higher-
resolution remote video and expanded security options. For additional information about the Lenovo
XClarity Controller see:
http://sysmgt.lenovofiles.com/help/topic/com.lenovo.systems.management.xcc.doc/product_page.html
• UEFI-compliant server firmware
Lenovo ThinkSystem firmware is Unified Extensible Firmware Interface (UEFI) 2.5 compliant. UEFI
replaces BIOS and defines a standard interface between the operating system platform firmware and
external devices.
Lenovo ThinkSystem servers are capable of booting UEFI-compliant operating systems BIOS-based
operating systems and BIOS-based adapters as well as UEFI-compliant adapters.
• Active Memory
The Active Memory feature improves the reliability of memory through memory mirroring. Memory
mirroring mode replicates and stores data on two pairs of DIMMs within two channels simultaneously. If a
failure occurs the memory controller switches from the primary pair of memory DIMMs to the backup pair
of DIMMs.
• Large system-memory capacity
The server supports TruDDR4 registered DIMMs (RDIMMs) and Persistent Memory Modules (PMEM). For
more information about the specific types and maximum amount of memory see “Specifications” on page
3.
• Integrated Trusted Platform Module (TPM)
This integrated security chip performs cryptographic functions and stores private and public secure keys.
It provides the hardware support for the Trusted Computing Group (TCG) specification. You can
download the software to support the TCG specification.
Note: For customers in Chinese Mainland TPM is not supported. However customers in Chinese
Mainland can install a TPM card (sometimes called a daughter card).
• Large data-storage capacity and hot-swap capability
Some server models support a maximum of thirty-two 2.5-inch hot-swap drives sixteen 3.5-inch hot-
swap drives or twelve 3.5-inch simple-swap drives.
For server models supporting the hot-swap feature you can add remove or replace drives without
turning off the server.
• Mobile access to Lenovo ervice Information website
The server provides a QR code on the system service label which is on the inside of the server cover that
you can scan the QR code with a mobile device and a QR code reader application to get quick access to
the Lenovo Service Information website. The Lenovo Service Information web site provides additional
information for parts installation replacement videos and error codes for server support.
• Redundant networking connection
The Lenovo XClarity Controller provides failover capability to a redundant Ethernet connection with the
applicable application installed. If a problem occurs with the primary Ethernet connection all Ethernet
traffic that is associated with the primary connection is automatically switched to the optional redundant
Ethernet connection. If the applicable device drivers are installed this switching occurs without data loss
and without user intervention.
• Redundant cooling and power capabilities
2ThinkSystem ST650 V2 Setup Guide

The server supports up to four hot-swap fans and two hot-swap power supplies. The redundant cooling
by the dual rotor fans in the server enables continued operation if one of the fans fails.
• Think ystem RAID support
The ThinkSystem RAID adapter provides hardware redundant array of independent disks (RAID) support
to create configurations. The standard RAID adapter provides RAID levels 0 and 1. An optional RAID
adapter is available for purchase.
pecifications
The following information is a summary of the features and specifications of the server. Depending on the
model some features might not be available or some specifications might not apply.
Table 1. Specifications
pecification Description
Dimension 4U server
• Height:
– Without foot stand: 448 mm (17.64 inches)
– With foot stand: 461.4 mm (18.17 inches)
• Width:
– Without foot stand: 174.2 mm (6.86 inches)
– With foot stand: 247.4 mm (9.74 inches)
• Depth:
– Without front door: 710.8 mm (27.98 inches)
– With front door: 733.8 mm (28.89 inches)
Weight (depending on the
configuration)
• 2.5-inch drive configuration:
– Maximum: 39.28 kg (86.60 lb)
• 3.5-inch drive configuration:
– Maximum: 46.23 kg (101.92 lb)
Processor Supports multi-core Intel Xeon processors with integrated memory controller and Intel
Mesh UPI (Ultra Path Interconnect) topology.
• Supports up to two 250W processors
• Designed for the LGA 4189 socket
• Scalable up to 52 cores (with two processors installed)
• Supports up to 4 UPI links at 11.2 GT/s
Notes:
• Only two-socket type CPUs are supported in two CPU configurations.
• UPI function is only available when two or more processors are installed.
For a list of supported processors see:
https://static.lenovo.com/us/en/serverproven/index.shtml
Memory • Minimum: 16 GB
• Maximum:
– 2048 GB using registered DIMMs (RDIMMs)
– 3072 GB using registered DIMMs (RDIMMs) and Persistent Memory Modules
(PMEM)
• Slots: thirty-two DIMM slots
• Supports:
– 16 GB 32 GB 64 GB TruDDR4 3200 MHz RDIMM
– 128 GB Persistent Memory Modules (PMEM)
For a list of supported memory modules see:
https://static.lenovo.com/us/en/serverproven/index.shtml
Chapter 1.Introduction 3

Table 1. Specifications (continued)
pecification Description
Drive bays (varies by
model)
Drive bays and drives supported by your server vary by model.
• Storage drive bays:
– Server models with 3.5-inch simple-swap drive bays
– Supports up to twelve SATA drives
– Server models with 3.5-inch hot-swap drive bays
– Supports up to sixteen SAS/SATA drives
– Supports up to eight SAS/SATA drives and eight NVMe drives
– Server models with 2.5-inch hot-swap drive bays
– Supports up to thirty-two SAS/SATA drives
– Supports up to sixteen SAS/SATA drives and sixteen NVMe drives
• Optical drive bays
– Two optical drive bays
– Supports up to one tape drive (RDX or LTO) and one optical disk drive
Notes:
• The server supports the installation of 2.5-inch SSDs in a 3.5 inch disk bay through
the use of a conversion kit. See “Install a 2.5-inch drive into a 3.5-inch drive bay” on
page 108 for details.
• When GPUs are installed only two backplanes or backplates are supported and no
optical drive or tape drive can be installed.
M.2 drive Supports up to two M.2 drives:
• 42 mm (2242)
• 60 mm (2260)
• 80 mm (2280)
• 110 mm (22110)
Expansion slots Nine PCIe expansion slots are available:
• Slot 1: PCIe4 x16 75W Full-height half-length
• Slot 2: PCIe4 x8 (open end) 75W Full-height half-length
• Slot 3: PCIe4 x16 75W Full-height half-length
• Slot 4: PCIe4 x8 (open end) 75W Full-height half-length
• Slot 5: PCIe4 x16 75W Full-height half-length
• Slot 6: PCIe4 x8 (open end) 75W Full-height half-length
• Slot 7: PCIe4 x16 75W Full-height half-length
• Slot 8: PCIe3 x8 (open end) 75W Full-height half-length (requires additional cable
connection see “PCIe slot 8 cable routing” on page 52)
• Slot 9: PCIe4 x8 (open end) 75W Full-height half-length
Notes: When Slot 8 is used:
• Up to 6 NVMe drives can be supported in 3.5-inch configurations with two NVMe/
AnyBay backplanes.
• Up to 14 NVMe drives can be supported in 2.5-inch configurations with two NVMe/
AnyBay backplanes.
• 3.5-inch configurations with two NVMe/AnyBay backplanes and no NVMe Retimer
Adapter or one NVMe Retimer Adapter is not supported.
• 2.5-inch configurations with two NVMe/AnyBay backplanes and two NVMe Retimer
Adapters or three NVMe Retimer Adapters are not supported.
4ThinkSystem ST650 V2 Setup Guide

Table 1. Specifications (continued)
pecification Description
Onboard NVMe
connectors
Four onboard NVMe connectors are available:
• PCIe 1: Gen3
• PCIe 2: Gen3
• PCIe 3: Gen4
• PCIe 4: Gen4 when connected to backplane Gen3 when connected to PCIe slot 8
enable connector.
Input/Output (I/O)
features
• Front panel
– One USB 2.0 connector with Lenovo XClarity Controller management
– One USB 3.2 Gen 1 connector
• Rear panel
– One External LCD diagnostics handset connector
– Four USB 3.2 Gen 1 connectors
– Two 10Gb Ethernet connectors
– One VGA connector
– One serial-port-module slot
– One XClarity Controller network connector (RJ-45 Ethernet connector)
Network • Two 10Gb ethernet connectors
• One XClarity Controller network connector (RJ-45 Ethernet connector)
Note: Use CAT6A UTP cables rated at 625 MHz bandwidth for the 10Gb on-board
LAN.
torage controller • Twelve onboard SATA ports (only the first 8 drives can be configured using Intel
VROC SATA RAID)
• Eight onboard NVMe ports (Intel VROC NVMe RAID)
• NVMe Retimer Adapter (Intel VROC NVMe RAID)
• The following SAS/SATA RAID/HBA options are available for this server:
– ThinkSystem 430-8i SAS/SATA 12Gb HBA (No RAID)
– ThinkSystem 430-8e SAS/SATA 12Gb HBA (No RAID)
– ThinkSystem 430-16i SAS/SATA 12Gb HBA (No RAID)
– ThinkSystem 430-16e SAS/SATA 12Gb HBA (No RAID)
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb Internal HBA (No RAID)
– ThinkSystem RAID 530-8i PCIe 12Gb Adapter (RAID 0 1 10 5 50)
– ThinkSystem RAID 930-8i 2GB Flash PCIe 12Gb Adapter (RAID 0 1 10 5 50 6
60)
– ThinkSystem RAID 930-8e 4GB Flash PCIe 12Gb Adapter (RAID 0 1 10 5 50 6
60)
– ThinkSystem RAID 940-8i 4GB Flash PCIe Gen4 12Gb Adapter (RAID 0 1 10 5
50 6 60)
– ThinkSystem RAID 940-8i 8GB Flash PCIe Gen4 12Gb Adapter (RAID 0 1 10 5
50 6 60)
– ThinkSystem RAID 530-16i PCIe 12Gb Adapter (RAID 0 1 10)
– ThinkSystem RAID 930-16i 4GB Flash PCIe 12Gb Adapter (RAID 0 1 10 5 50 6
60)
– ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Adapter (RAID 0 1 10 5
50 6 60)
– ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Internal Adapter (RAID 0
1 10 5 50 6 60)
– ThinkSystem RAID 940-32i 8GB Flash PCIe Gen4 12Gb Adapter (RAID 0 1 10 5
50 6 60)
Note: ThinkSystem RAID 940-32i 8GB Flash PCIe Gen4 12Gb Adapter can only be
installed in slot 9 in one CPU configurations and installed in slot 9 5 6 7 or 8 in two
CPU configurations.
For a list of supported adapters see:
https://static.lenovo.com/us/en/serverproven/index.shtml
Chapter 1.Introduction 5

Table 1. Specifications (continued)
pecification Description
Fans Supports up to four hot-swap fans:
• 9238 single-rotor hot-swap fans
• 9256 dual-rotor hot-swap fans
Note: Single-rotor hot-swap fans cannot be mixed with dual-rotor hot-swap fans.
Power supply Supports up to two power supplies with N+N redundancy:
• ThinkSystem 2400W (230V) v2 Platinum hot-swap power supply
• ThinkSystem 1800W (230V) v2 Platinum hot-swap power supply
• ThinkSystem 1100W (230V/115V) v2 Platinum hot-swap power supply
• ThinkSystem 750W (230V) v2 Titanium hot-swap power supply
• ThinkSystem 750W(230/115V) v2 Platinum hot-swap power supply
Notes:
• 100V+ is only allowed on the following:
– 750W Platinum
– 1100W Platinum
• 200V+ is only allowed on the following:
– 750W Platinum
– 750W Titanium
– 1100W Platinum
– 1800W Platinum
– 2400W Platinum
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is ONLY supported in Chinese
Mainland.
• Power supplies with 240 V dc are not hot-swappable. To remove the power
cord, ensure you have turned off the server or disconnected the dc power
sources at the breaker panel.
• In order for the Think ystem products to operate error free in both a DC or AC
electrical environment, a TN- earthing system which complies to 60364-1 IEC
2005 standard has to be present or installed.
Minimal configuration for
debugging
• One processor in processor socket 1
• One DRAM DIMM in DIMM slot 14
• One power supply in PSU slot 1
• One drive with RAID adapter and backplane or backplate (if OS is needed for
debugging)
• Three single rotor fans in fan slot 1 2 and 4.
• One fan filler in fan slot 3.
6ThinkSystem ST650 V2 Setup Guide

Table 1. Specifications (continued)
pecification Description
Environment The ThinkSystem ST650 V2 server complies with ASHRAE Class A2 specifications.
Depending on the hardware configuration some models comply with ASHRAE Class A3
and Class A4 specifications. System performance may be impacted when operating
temperature is outside ASHRAE A2 specification.
• Air temperature:
– Operating
– ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient
temperature decreases by 1°C for every 300 m (984 ft) increase in altitude
above 900 m (2 953 ft).
– ASHRAE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient
temperature decreases by 1°C for every 175 m (574 ft) increase in altitude
above 900 m (2 953 ft).
– ASHRAE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient
temperature decreases by 1°C for every 125 m (410 ft) increase in altitude
above 900 m (2 953 ft).
– Server off: -10°C to 60°C (14°F to 140°F)
– Shipment/storage: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3 050 m (10 000 ft)
• Relative Humidity (non-condensing):
– Operating
– ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
– ASHRAE Class A3: 8% to 85%; maximum dew point: 24°C (75°F)
– ASHRAE Class A4: 8% to 90%; maximum dew point: 24°C (75°F)
– Shipment/storage: 8% to 90%
• Particulate contamination
Attention: Airborne particulates and reactive gases acting alone or in combination
with other environmental factors such as humidity or temperature might pose a risk to
the server. For information about the limits for particulates and gases see
“Particulate contamination” in ThinkSystem ST650 V2 Maintenance Manual.
Acoustical noise
emissions
The server has the following acoustic noise emissions declaration:
• Sound power level (LWAd)
– Idling:
– Min: 5.0 Bel
– Typical: 5.6 Bel
– GPU: 6.4 Bel
– Operating:
– Min: 5.6 Bel
– Typical: 5.6 Bel
– GPU: 8.2 Bel
• Sound pressure level (LpAm):
– Idling:
– Min: 37 dBA
– Typical: 41 dBA
– GPU: 48 dBA
– Operating:
– Min: 41 dBA
– Typical: 41 dBA
– GPU: 66 dBA
Chapter 1.Introduction 7

Table 1. Specifications (continued)
pecification Description
Notes:
• The fans will temporarily run at higher speeds on system boot due to processor
power calibration.
• These sound levels were measured in controlled acoustical environments according
to procedures specified by ISO7779 and are reported in accordance with ISO 9296.
• The declared acoustic sound levels are based on the specified configurations which
may change slightly depending on configuration/conditions.
– Min configuration: one 105W processor four 16 GB DIMMs two 480 GB SSD
drives two onboard 10GB LAN ports one 750W power supply unit.
– Typical configuration: two 125W processors sixteen 32 GB DIMMs eight SAS
hard disk drives one 530-8i RAID Adapter two onboard 10GB LAN ports two
750W power supply units.
– GPU configuration: two 165W processors thirty-two 64 GB DIMMs eight SAS
hard disk drives one 930-8i RAID adapter two onboard 10GB LAN ports eight
Nvidia Tesla T4 GPU adapters two 1800W power supply units.
• The declared acoustic noise levels may increase greatly if high-power components
are installed such as high-power NICs high-power processors and GPUs.
• Government regulations (such as those prescribed by OSHA or European Community
Directives) may govern noise level exposure in the workplace and may apply to you
and your server installation. The actual sound pressure levels in your installation
depend upon a variety of factors including the number of racks in the installation; the
size materials and configuration of the room; the noise levels from other equipment;
the room ambient temperature and employee's location in relation to the equipment.
Further compliance with such government regulations depends on a variety of
additional factors including the duration of employees' exposure and whether
employees wear hearing protection. Lenovo recommends that you consult with
qualified experts in this field to determine whether you are in compliance with the
applicable regulations.
Ambient temperature
management
Adjust ambient temperature when specific components are installed:
Note: Ensure that you observe the fan installation rules and sequence in “Technical
rules for system fans” on page 77.
• Keep ambient temperature to 30°C or lower when one or more of the following
components are installed.
– Processors with 205 to 250 watts
– GPU adapter
• Keep ambient temperature to 35°C or lower when one or more of the following
components are installed.
– Processors with 165 to 195 watts
– Thirty-two registered DIMMs (RDIMMs) with 64 GB or less
– Persistent Memory Modules (PMEM)
– Retimer
– ThinkSystem Mellanox ConnectX series adapter
– Fibre Channel adapter
– NVMe drive
– RAID/HBA adapter
– External NIC adapter
8ThinkSystem ST650 V2 Setup Guide

Table 1. Specifications (continued)
pecification Description
• Keep ambient temperature to 40°C or lower when one or more of the following
components are installed.
– Processors with 135 to 150 watts
• Keep ambient temperature to 45°C or lower when one or more of the following
components are installed.
– Processors with 120 watts or less
– Thirty-two registered DIMMs (RDIMMs) with 32 GB or less
– Two backplanes/backplates
Operating systems
Supported and certified operating systems:
• Microsoft Windows Server
• VMware ESXi
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
References:
• Complete list of available operating systems: https://lenovopress.com/osig.
• OS deployment instructions: “Deploy the operating system” on page 158.
Particulate contamination
Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or temperature might pose a risk to the
device that is described in this document.
Risks that are posed by the presence of excessive particulate levels or concentrations of harmful gases
include damage that might cause the device to malfunction or cease functioning altogether. This
specification sets forth limits for particulates and gases that are intended to avoid such damage. The limits
must not be viewed or used as definitive limits because numerous other factors such as temperature or
moisture content of the air can influence the impact of particulates or environmental corrosives and gaseous
contaminant transfer. In the absence of specific limits that are set forth in this document you must
implement practices that maintain particulate and gas levels that are consistent with the protection of human
health and safety. If Lenovo determines that the levels of particulates or gases in your environment have
caused damage to the device Lenovo may condition provision of repair or replacement of devices or parts
on implementation of appropriate remedial measures to mitigate such environmental contamination.
Implementation of such remedial measures is a customer responsibility.
Chapter 1.Introduction 9

Table 2. imits for particulates and gases
Contaminant Limits
Gaseous Severity level G1 as per ANSI/ISA 71.04-19851 which states that the reactivity rate of copper
coupons shall be less than 300 Angstroms per month (Å/month ≈ 0.0039 μg/cm2-hour weight
gain).2 In addition the reactivity rate of silver coupons shall be less than 200Å/month (≈ 0.0035
μg/cm2-hour weight gain).3 The reactive monitoring of gaseous corrosivity must be conducted
approximately 5 cm (2 in.) in front of the rack on the air inlet side at one-quarter and three-quarter
frame height off the floor or where the air velocity is much higher.
Particulate Data centers must meet the cleanliness level of ISO 14644-1 class 8. For data centers without
airside economizer the ISO 14644-1 class 8 cleanliness might be met by choosing one of the
following filtration methods:
• The room air might be continuously filtered with MERV 8 filters.
• Air entering a data center might be filtered with MERV 11 or preferably MERV 13 filters.
For data centers with airside economizers the choice of filters to achieve ISO class 8 cleanliness
depends on the specific conditions present at that data center.
The deliquescent relative humidity of the particulate contamination should be more than 60%
RH.4
Data centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental conditions for process measurement and control systems: Airborne
contaminants. Instrument Society of America Research Triangle Park North Carolina U.S.A.
2 The derivation of the equivalence between the rate of copper corrosion growth in the thickness of the corrosion
product in Å/month and the rate of weight gain assumes that Cu2S and Cu2O grow in equal proportions.
3 The derivation of the equivalence between the rate of silver corrosion growth in the thickness of the corrosion
product in Å/month and the rate of weight gain assumes that Ag2S is the only corrosion product.
4 The deliquescent relative humidity of particulate contamination is the relative humidity at which the dust absorbs
enough water to become wet and promote ionic conduction.
5 Surface debris is randomly collected from 10 areas of the data center on a 1.5 cm diameter disk of sticky
electrically conductive tape on a metal stub. If examination of the sticky tape in a scanning electron microscope
reveals no zinc whiskers the data center is considered free of zinc whiskers.
Management options
The XClarity portfolio and other system management options described in this section are available to help
you manage the servers more conveniently and efficiently.
10 ThinkSystem ST650 V2 Setup Guide

Overview
Options Description
Lenovo XClarity Controller
Baseboard management controller.
Consolidates the service processor functionality Super I/O video controller and
remote presence capabilities into a single chip on the server system board.
Interface
• CLI application
• GUI application
• Mobile application
• Web interface
• REST API
Usage and downloads
http://sysmgt.lenovofiles.com/help/topic/com.lenovo.systems.management.xcc.doc/
product_page.html
Lenovo XClarity Administrator
Centralized interface for multi-server management.
Interface
• GUI application
• Mobile application
• Web interface
• REST API
Usage and downloads
http://sysmgt.lenovofiles.com/help/topic/com.lenovo.lxca.doc/aug_product_page.html
Lenovo XClarity Essentials
toolset
Portable and light toolset for server configuration data collection and firmware
updates. Suitable both for single-server or multi-server management contexts.
Interface
• OneCLI: CLI application
• Bootable Media Creator: CLI application GUI application
• UpdateXpress: GUI application
Usage and downloads
http://sysmgt.lenovofiles.com/help/topic/xclarity_essentials/overview.html
Lenovo XClarity Provisioning
Manager V3
UEFI-based embedded GUI tool on a single server that can simplify management
tasks.
Interface
• Web interface (BMC remote access)
• GUI application
Usage and downloads
https://sysmgt.lenovofiles.com/help/topic/lxpm_frontend/lxpm_v3_about.html
Chapter 1.Introduction 11

Options Description
Lenovo XClarity Integrator
Series of applications that integrate the management and monitoring functionalities of
the Lenovo physical servers with the software used in a certain deployment
infrastructure such as VMware vCenter Microsoft Admin Center or Microsoft System
Center while delivering additional workload resiliency.
Interface
GUI application
Usage and downloads
https://sysmgt.lenovofiles.com/help/topic/lxci/lxci_product_page.html
Lenovo XClarity Energy
Manager
Application that can manage and monitor server power and temperature.
Interface
• GUI application
• Web Interface
Usage and downloads
https://datacentersupport.lenovo.com/solutions/lnvo-lxem
Lenovo Capacity Planner
Application that supports power consumption planning for a server or rack.
Interface
• GUI application
• Web Interface
Usage and downloads
https://datacentersupport.lenovo.com/solutions/lnvo-lcp
Functions
Options
Functions
Multi-
system
mgmt
O
deploy-
ment
ystem
configu-
ration
Firm-
ware
up-
dates1
Event-
s/alert
moni-
toring
Inven-
tory/
logs
Pow-
er
mgmt
Power
planning
Lenovo XClarity Controller √ √ √ √
Lenovo XClarity
Administrator √ √ √ √2√ √4
Lenovo
XClarity
Essen-
tials
toolset
OneCLI √ √ √ √ √
Bootable Media
Creator √ √ √
UpdateXpress √ √
Lenovo XClarity Provisioning
Manager V3 √ √ √3√5
Lenovo XClarity Integrator √ √6√ √ √ √ √7
12 ThinkSystem ST650 V2 Setup Guide