Lg A395 User manual

Internal Use Only

Service Manual

LG-A395

Date: April, 2013 / Issue 1.0

Only for training and service purposes

LGE Internal Use Only

Table Of Contents

1. INTRODUCTION..................................................................... 3

1.1 Purpose ........................................................................................................3

1.2 Regulatory Information.........................................................................3

1.3 Abbreviations.............................................................................................5

2. PERFORMANCE...................................................................... 7

2.1 H/W Features..............................................................................................7

2.2 Technical Specication...........................................................................9

3. TECHNICAL BRIEF................................................................ 14

3.1 Digital Main Processor......................................................................... 14

3.2 Power Management ............................................................................ 23

3.3 FEM with integrated Power Amplier Module (RF7182) ...... 27

3.4 Clocks......................................................................................................... 29

3.5 RFSYS of MT6253 (U101).................................................................... 31

3.6 MEMORY(H9DA1GH25HBMMMR, U100 ) ................................... 33

3.7 SIM Card Interface................................................................................. 37

3.8 Micro-SD Card Interface..................................................................... 41

3.9 LCD Interface........................................................................................... 42

3.10 Battery Charger Interface................................................................ 44

3.11 Keypad Interface................................................................................. 45

3.12 Audio Front-End.................................................................................. 47

3.13 Camera Interface................................................................................. 49

3.14 KEY BACLKLIGHT LED Interfac....................................................... 51

3.15 Vibrator Interface ................................................................................ 52

4. TROUBLE SHOOTING .......................................................... 53

4.1 RF Component ....................................................................................... 53

4.2 RX Trouble ................................................................................................ 54

4.3 TX Trouble................................................................................................. 58

4.4 Power On Trouble.................................................................................. 62

4.5 Charging Trouble................................................................................... 64

4.6 Vibrator Trouble ..................................................................................... 67

4.7 LCD Trouble ............................................................................................. 69

4.8 Camera Trouble...................................................................................... 73

4.9 Speaker Trouble ..................................................................................... 76

4.10 Earphone Trouble ............................................................................... 78

4.11 Receiver Trouble.................................................................................. 81

4.12 Microphone Trouble.......................................................................... 83

4.13 SIM Card Interface Trouble.............................................................. 85

4.14 KEY backlight Trouble....................................................................... 97

4.15 Micro SD Trouble................................................................................. 99

4.16 Bluetooth Trouble.............................................................................102

4.17 FM Radio Trouble ..............................................................................106

5. DOWNLOAD....................................................................... 109

6. BLOCK DIAGRAM...............................................................129

7. CIRCUIT DIAGRAM ............................................................135

8. BGA PIN MAP .................................................................... 139

9. PCB LAYOUT.......................................................................141

10. ENGINEERING MODE ......................................................143

11. CALIBRATION...................................................................145

12. HIDDEN MENU................................................................. 165

13. EXPLODED VIEW & REPLACEMENT PART LIST .............170

13.1 EXPLODED VIEW................................................................................170

13.2 Replacement Parts ...........................................................................171

13.3 Accessory .............................................................................................185

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LGE Internal Use Only

1. INTRODUCTION

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LGE Internal Use Only / 131

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system. There are may be risks of toll fraud

associated with your telecommunications system. System users are responsible for programming and

configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this

product is immune from the above case but will prevent unauthorized use of common-carrier

telecommunication service of facilities accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone service

until repair can be done. A telephone company may temporarily disconnect service as long as repair is

not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the this phone or compatibility with the

network, the telephone company is required to give advanced written notice to the user, allowing the

user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized

agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system

and may void any remaining warranty.

1. INTRODUCTION

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1. INTRODUCTION

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LGE Internal Use Only / 131

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated

by the sign. Following information is ESD handling:

•Service personnel should ground themselves by using a wrist strap when exchange system boards.

•When repairs are made to a system board, they should spread the floor with anti-static mat

which is also grounded.

•Use a suitable, grounded soldering iron.

•Keep sensitive parts in these protective packages until these are used.

•When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

1. INTRODUCTION

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1. INTRODUCTION

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1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

Offset Phase Locked LoopOPLL

Light Emitting DiodeLED

Low Drop OutputLDO

Liquid Crystal DisplayLCD

Intermediate FrequencyIF

International Portable User IdentityIPUI

Global System for Mobile CommunicationsGSM

General Purpose Interface BusGPIB

Gaussian Minimum Shift KeyingGMSK

Flexible Printed Circuit BoardFPCB

Electrostatic DischargeESD

Electrical Erasable Programmable Read-Only MemoryEEPROM

Digital Signal ProcessingDSP

dB relative to 1 milli wattdBm

Digital Communication SystemDCS

Digital to Analog ConverterDAC

Constant Current – Constant VoltageCC-CV

Bit Error RatioBER

BasebandBB

Automatic Power ControlAPC

1. INTRODUCTION

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1. INTRODUCTION

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LGE Internal Use Only / 131

Wireless Application Protocol

WAP

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

Voltage Controlled OscillatorVCO

Universal Asynchronous Receiver/TransmitterUART

Time Division Multiple AccessTDMA

Time Division DuplexTDD

Travel AdapterTA

Side Tone Masking RatingSTMR

Pseudo SRAMPSRAM

Static Random Access MemorySRAM

Sending Loudness RatingSLR

Subscriber Identity ModuleSIM

Surface Acoustic WaveSAW

Real Time ClockRTC

Root Mean SquareRMS

Receiving Loudness RatingRLR

Radio FrequencyRF

Public Switched Telephone NetworkPSTN

Phase Locked LoopPLL

Programmable Gain AmplifierPGA

Printed Circuit BoardPCB

Power Amplifier ModulePAM

1. INTRODUCTION

2. PERFORMANCE

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2.1 H/W Features

2. SYSTEM SPECIFICATION

Item Feature Comment

Standard Battery Lithium Ion, 3.7V 1500mAh

Stand by TIME >993 hr., Min.@PP9

Stand by time >1145 hr., Min.@PP5

Talk time

>8.0hr., Min.@GSM900, PL=5

>22.0 hr., Min.@GSM900, PL=13

>11 hr., Min.@PCS, PL=0

>27 hr., Min.@PCS, PL=9

Charging time Approx. 3 hours 30 min.

RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm

TX output power GSM, EGSM: 32.3dBm(Level 5),

DCS , PCS: 29.5dBm(Level 0)

SIM card type 3V Small

Display MAIN : TFT 320 ×240(QVGA) pixel 262K Color

Status Indicator

KEY TOTAL 22EA

Hard icons. Key Pad

Numeric(12EA : 0 ~ 9, #, *) Navigation Key OK Key(5EA)

Menu Key, Clear Key, Send Key, End Key,

SIM Switch Key(5EA)

ANT Internal

EAR Phone Jack Yes(3.5Ø)

PC Synchronization Yes

Speech coding EFR/FR/HR

Data and Fax Yes

GPRS compatibility Class 10

Vibrator Yes

Loud Speaker Yes

Voice Recoding Yes

Microphone Yes

2. PERFORMANCE

2.1 H/W Features

2. PERFORMANCE

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2. SYSTEM SPECIFICATION

Item Feature Comment

Speaker/Receiver 18 x 10 (Speaker & Receiver Dual Mode Assembly)

Travel Adapter Yes

MIDI SW MIDI (Mono SPK)

Camera 1.3M FF

Bluetooth / FM Radio Bluetooth version 2.1 / 76~108MHz supported

2. PERFORMANCE

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2.2 Technical Specification

Item Description Specification

1 Frequency Band

GSM850 EGSM

TX: 824 ~ 849 MHz TX: 880 ~ 915MHz

RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz

DCS

TX: 1710 ~ 1785 MHz

RX: 1805 ~ 1880 MHz

PCS

TX: 1850 ~ 1910 MHz

RX: 1930 ~ 1990 MHz

2 Phase Error RMS < 5 degrees

Peak < 20 degrees

3 Frequency Error < 0.1 ppm

4 Power Level

Level Power Toler. Level Power Toler.

6 31dBm ±3dB 14 15dBm ±3dB

7 29dBm ±3dB 15 13dBm ±3dB

8 27dBm ±3dB 16 11dBm ±5dB

9 25dBm ±3dB 17 9dBm ±5dB

10 23dBm ±3dB 18 7dBm ±5dB

11 21dBm ±3dB 19 5dBm ±5dB

12 19dBm ±3dB

GSM850/EGSM

5 33dBm ±2dB 13 17dBm ±3dB

Level Power Toler. Level Power Toler.

1 28dBm ±3dB 9 12dBm ±4dB

2 26dBm ±3dB 10 10dBm ±4dB

3 24dBm ±3dB 11 8dBm ±4dB

4 22dBm ±3dB 12 6dBm ±4dB

5 20dBm ±3dB 13 4dBm ±4dB

6 18dBm ±3dB 14 2dBm ±5dB

7 16dBm ±3dB 15 0dBm ±5dB

DCS/PCS

0 30dBm ±2dB 8 14dBm ±3dB

2. SYSTEM SPECIFICATION

2.2 Technical Specication

2. PERFORMANCE

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Output RF Spectrum

(due to switching

transient)

1,800 -24

5 Output RF Spectrum

(due to modulation)

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -63

3,000~ <6,000 -65

6,000 -71

GSM850/ EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -65

3,000~ <6,000 -65

6,000 -73

DCS/PCS

GSM850/ EGSM

Offset from Carrier (kHz). Max. dBm

400 -19

600 -21

1,200 -21

Item Description Specification

2. SYSTEM SPECIFICATION

2. PERFORMANCE

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Item Description Specification

Output RF Spectrum

(due to switching

transient)

Offset from Carrier (kHz). Max. dBm

400 -22

600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

8 Bit Error Ratio

GSM850, EGSM

BER (Class II) < 2.439% @-102 dBm

DCS,PCS

BER (Class II) < 2.439% @-100 dBm

9 RX Level Report Accuracy ±3 dB

10 SLR 15±3 dB

11 Sending Response

300 -12

1,000 -6

2,000 -6

3,000 -6

Frequency (Hz) Max.(dB) Min.(dB)

100 -

200 -

4,000 -

3,400 -9

-12

12 RLR 2±3 dB

DCS/PCS

2. SYSTEM SPECIFICATION

2. PERFORMANCE

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Item Description Specification

13 Receiving Response

300 -11

500 -10

1,000 -9

3,000 -13

Frequency (Hz) Max.(dB) Min.(dB)

100 -

200 -

4,000

3,400 -

14 STMR > 8 dB

* Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

15 Stability Margin > 6 dB

-20

-10

dB to ARL (dB) Level Ratio (dB)

-35

-30

30.7

33.3

33.7

31.7

17.5

22.5

25.5

16 Distortion

17 Side Tone Distortion Three stage distortion < 10%

18 System frequency

(13 MHz) tolerance ≤ 2.5 ppm

19 32.768KHz tolerance ≤ 30 ppm

20 Ringer Volume

At least 67 dBspl under below conditions:

1. Ringer set as ringer.

2. Test distance set as 100 cm

2. SYSTEM SPECIFICATION

2. PERFORMANCE

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2. SYSTEM SPECIFICATION

Item Description Specification

21 Charge Current

Fast Charge : Typ. 700 mA

Slow Charge : Typ. 400mA

Total Charging Time : < Approx. 3 hours 30min.

1 -> 0

Bar Number Power

2 -> 1

-105dBm±2dBm

-99dBm±2dBm

-103dBm±2dBm

22 Antenna Display

2 -> 1

1 -> 0

Battery Bar Number Voltage

3 -> 2 3.75 ±0.05 V

23 Battery Indicator

24 Low Voltage Warning

( Blinking Bar)

≤ 3.5 ±0.05V (Call), every 1 minute.

≤ 3.5 ±0.05V (Standby), every 3 minute.

25 Forced shut down

Voltage 3.35 ±0.05V

27 Battery Type

Li-Ion Battery

Standard Voltage = 3.7 V

Battery full charge voltage = 4.2 V

Capacity: 1500mAh

28 Travel Charger

Switching-mode charger

Input: 1000 ~ 240 V, 50/60 Hz

Output: 5.1 V, 700 mA

≥ 3.75±0.05 V

26 Sustain RTC

without battery Over 1 min

3.65 ±0.05 V

3.5 ±0.05 V

4 -> 3

3 -> 2

over -91dBm±2dBm

-91dBm±2dBm

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.1 Digital Main Processor

Figure. 3.1.1 MT6255 Hardware Block Diagram

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.1.1 General

•Integrated power management unit, analog baseband and radio circuitry.

• Package:

– 12.1x11.6mm

– 0.5 mm pitch

– TFBGA 354balls, 0.5mm pitch package

3.1.2 MCU Subsystem

• ARM926EJ-STM 32-bit RISC processor

• Java hardware acceleration for fast Java-based games and applets

• High performance multi-layer AHB bus

• Operating frequency : Max. 416MHz with dynamic clock gating

• Dedicated DMA bus with 18 DMA channels

• On-chip boot ROM for Factory Flash Programming

• Watchdog timer for system crash recovery

• 4 sets of General Purpose Timer

• Circuit Switch Data coprocessor

• Division coprocessor

3.1.3 External Memory Interface

• Supports up to 2 external devices

• Supports 16-bit memory components with maximum size of up to 256M Bytes for each bank

• Supports mobile DDR SDRAM and cellular RAM

• Support Flash and SRAM/PSRAM with burst mode

• Support multi-media companion chips with 8/16 bits data width

• Configurable driving strength for memory interface

3.1.4 User Interface

• 8-row x 8-column keypad control with hardware scanner

• Support multiple key press for gaming

• Dual SIM/USIM Controller with hardware T=0/T=1 protocol control

• Real Time Clock(RTC) operating with a low quiescent current power supply

• General Purpose I/Os (GPIOs) available for auxiliary application

• 2 sets of Pulse Width Modulation(PWM) Output

• 15 external interrupt lines

• 2 external channel auxiliary 12 bit A/D converter

3.1.5 Security

• Support security key and 128bit chip random ID

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.1.6 Connectivity

• 3 UARTs with hardware flow control and supports of baud rate up to 921600 bps

• USB 2.0 high speed capability

• Multi Media Card, Secure Digital Memory Card host controller with

flexible I/O voltage power

• Supports SDIO interface for SDIO peripherals as well as WIFI connectivity

• I2S interface for Audio application

• I2C master interface for peripheral management including image sensor.

• SPI master interface for peripheral management including digital TV chip.

3.1.7 Power Management

• Li-ion battery charger

• High efficiency bulk converter for core power and memory power supply with programmable voltage scaling

• 14 LDOs for the power supply of memory card, camera, Bluetooth, RF, SIM card, and other diversified

usage

• Six Open-Drain Output Switches to Supply / control the LED

• LDO type Vibrator

• One NMOS switch to control Keypad LED

• Thermal Overload Protection

• Under voltage Lock out Protection

• Over voltage Protection

• Different levels of power down modes with sophisticated software control enables excellent power saving

performance

3.1.8 Radio Interface and Baseband Front End

• Digital PM data path with baseband front-end

• 96dB dynamic range delta-sigma ADC converts the downlink IF baseband I and Q signals to

digital baseband.

• 10-bit D/A Converter for Automatic Power Control.

• Programmable Radio RX filter with adaptive bandwidth control

• Dedicated Rx filter for FB acquisition

• 6-Pin Baseband Parallel Interface(BRI) with programmable driving strength

• support Multi-band

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3. TECHNICAL BRIEF

3.1.9 Voice and Modem CODEC

• Digital tone generation

• Voice Memo

• Noise Reduction

• Echo Suppression

• Advanced Sidetone Oscillation Reduction

• Digital sidetone generator with programmable gain

• Two programmable acoustic compensation filters

• GSM quad vocoders for adaptive multirate(AMR), enhanced full rate(EFR), full

rate(FR), and half rate(HR)

• GSM channel coding, equalization and A5/1, A5/2 and A5/3 ciphering

• GPRS GEA1, GEA2 and GEA3 ciphering

• support GSM/GPRS/EDGE-Rx modem

• Packet Switched Data With CS1/CS2/CS3/CS4 coding schemes

• GSM circuit switch Data

• GPRS/EDGE-Rx Class 12

3.1.10 Voice Interface and Voice Front End

• Two microphone inputs shares one low noise amplifier with programmable gain and automatic gain

control(AGC) mechanism

• Voice power amplifier with programmable gain

• 2nd order Sigma-delta A/D Converter for voice uplink path

• shares D/A Converter for audio playback path

• Supports half-duplex hands-free operation

• Compliant with GSM 03.05

3.1.11 LCD/NAND Flash Interface

• Dedicated Parallel Interface supports 3 external devices with 8_/16-bit NAND flash interface,

8_/9_/16_/18-bit parallel interface, and serial interface for LCM

• supports simultaneous connection to 2 NAND devices

• Built-in NAND Flash Controller with 8-bit ECC for mass storage

3.1.12 LCD Controller

• Supports simultaneous connection to 3 parallel LCD modules, 2 parallel LCD and 1 serial LCD

modules or 1 parallel LCD and 2 serial LCD modules

• Supports LCM format: RGB332, RGB444, RGB565, RGB666, RGB888

• Supports LCD module with maximum resolution up to 800x480 at 18bpp @ 200MHz, 16bit LPDDR1.

480x320 at 18bpp @ 133MHz, 16bit LPDDR1.

• Per pixel alpha channel

• True color engine

• Capable of combining display memories with up to 4 blending layers

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3. TECHNICAL BRIEF

3.1.13 Audio CODEC

• Wavetable including GM full set of 128 instruments and 47 sets of percussions

• Advanced wavetable synthesizer capable of generating simulated stereo

• PCM Playback and Record

• Digital Audio Playback

• Supports HE-AAC codec decode

• Supports ASC codec decode

3.1.14 Audio Interface and Audio Front End

• Supports I2S interface

• High resolution D/A Converters for Stereo Audio playback

• Voice band A/D converter with digital MIC input support

• Stereo to Mono Conversion

3.1.15 Camera interface

• YUV422 format image input

• Capable of processing image of size up to 1.3M pixels(Mediatek serial Interface), 3M pixels(w/o

compression) and 5M pixels (with JPEG compression)

• Support panorama

• Support zero shutter delay

3.1.16 JPEG Decoder

• Hardware-accelerated baseline JPEG decoding

• SW based progressive JPEG decoding

• Supports various YUV format, DC/AC Huffman tables, and quatization Tables

3.1.17 JPEG Encoder

• ISO/IEC 10918-1 JPEG baseline mode

• ISO/IEC 10918-2 compliance

• Supports YUV420 formats

• Supports EXIF/JFIF

• Standard DC and AC Huffman tables

• Provides 5 levels of encode quality

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3. TECHNICAL BRIEF

3.1.18 Image Data Processing

• Supports Digital Zoom

• Supports RGB and YCbCr image processing

• High throughput hardware scaler. Capable of tailoring an image to an arbitrary size

• Horizontal scaling with bicubic interpolation

• vertical scaling with bicubic interpolation

• Simultaneous scaling for video buffer and display buffer

• YUV and RGB color space conversion

• Boundary padding

• Pixel processing: hue/saturation/intensity/color adjustment, Gamma correction and grayscale/

invert/sepia-tone effects

• Hardware accelerated image editing

• RGB/YCbCr format thumbnail output

3.1.19 MPEG-4/H.263 CODEC

• ISO/IEC 14496-2 simple profile

decode @ level 0/1/2/3

encode @ level 0

• ISO/IEC 14496- 2 advanced simple profile : Decode @ level 0/1/2/3

• ITU-T H.263 profile 0 @ level 40

• Encoder resync maker and HEC

• Supported visual tools for decoder: I-VOP, P-VOP, AC/DC Prediction, 4-MV, Unrestricted MV,

Error Resilience, Short Header

• Error Resilience for decoder : Slice Resynchronization, Data Partitioning, Reversible VLC

• Supported visual tools for encoder : I-VOP, P-VOP, Half-Pel, DC Prediction, Unrestricted MV,

Reversible VLC, Short Header

• Supports encoding motion vector of range up to -64/+63.5 pixels

• HE-AAC decode support

• AAC/AMR/WB-AMR audio decode support

• AMR/WB-AMR audio encode support

• Software Video CODEC

3.1.20 H.264 Decode

• Software Decoder

• ISO/IEC 14496-10 baseline profile :

decode @ level 2. 1

encode @ level 1

• ISO/IEC 14496-10 main/high profile :

decode @ level 2. 1

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.1.21 2D Accelerator

• Supports 32-bpp ARGB8888, 24-bpp RGB888, 16-bpp RGB565, and 8-bpp index color modes

• Rectangle fill with constant or gradient color

• BitBlt : capable with 7 rotation types, ROP4, Mask

• Alpha blending with 7 rotation types, per-pixel alpha and pre-multiplied alpha

• Font caching : normal and italic font

• Linear transform : Support perspective transform, truncate/nearest/bi-linear sample filter

• Command queue with max depth of 1024

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