LG F1200 User manual

Service Manual Model : F1200
Service Manual
F1200
P/N : MMBD0045801 Date : Feb, 2005 / Issue 1.0

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1. INTRODUCTION ................................... 3
1.1 Purpose ................................................ 3
1.2 Regulatory Information ......................... 3
1.3 Abbreviations ........................................ 5
2. PERFORMANCE .................................. 7
2.1 H/W Features ....................................... 7
2.2 Technical Specification ......................... 8
3. TECHNICAL BRIEF .......................... 12
3.1 RF Transceiver General Description .. 12
3.2 Receiver Part ...................................... 12
3.3 Synthesizer Part ................................. 14
3.4 Transmitter Part .................................. 16
3.5 Digital Baseband ................................ 18
3.6 Analog Baseband ............................... 31
3.7 LCD & Camera Interface .................... 36
4. TROUBLE SHOOTING .................... 38
4.1 Baseband Part Troubleshooting ......... 38
4.2 Trouble Shooting of Receiver Part ..... 64
4.3 Trouble Shooting Transmitter Part ..... 73
4.4 RF Rx Tx signal flow on Test mode ... 83
5. DISASSEMBLY INSTRUCTION .... 84
6.
DOWNLOAD AND CALIBRATION
.... 91
6.1 Download ............................................ 91
6.2 Download Procedure........................... 92
7. BLOCK DIAGRAM ............................ 99
8. CIRCUIT DIAGRAM ........................ 101
9. PCB LAYOUT .................................... 106
10. ENGINEERING MODE ................ 109
11. STAND ALONE TEST ................. 110
11.1 What’s the Standalone Test? ........ 110
11.2 Standalone Test Equipment
Setup ............................................ 111
11.3 HW Test : Software for Standalone
Test Setup .................................... 112
11.4 Tx Stand alone Test Setting ......... 114
11.5 Rx Stand alone Test Setting ........ 116
12. SERVICE AND CALIBRATION
.... 118
12.1 Service S/W................................... 118
12.2 Calibration .................................... 120
13. EXPLODED VIEW &
REPLACEMENT PART LIST ...... 125
13.1 Exploded View ............................ 125
13.2 REPLACEMENT PARTS ............ 127
Table Of Contents

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REVISED HISTORY
The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes
to equipment design as advances in engineering and manufacturing methods warrant.
This manual provides the information necessary to install, program, operate and maintain the
F1200.
DATE ISSUE CONTENTS OF CHANGES S/W VERSION
JAN/2005 ISSUE1 Initial Release

1. INTRODUCTION
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1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download
the features of F1200.
1.2 Regulatory Information
(1) Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for
example, persons other than your company’s employees, agents, subcontractors, or person
working on your company’s behalf) can result in substantial additional charges for your
telecommunications services. System users are responsible for the security of own system.
There may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use.
The manufacturer does not warrant that this product is immune from the above case but will
prevent unauthorized use of common-carrier telecommunication service of facilities accessed
through or connected to it. The manufacturer will not be responsible for any charges that are
resulted from such unauthorized use.
(2) Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and
possibly causing harm or interruption in service to the telephone network, it should disconnect
telephone service until repair can be done. A telephone company may temporarily disconnect
service as long as repair is not done.
(3) Changes in Service
A local telephone company may make changes in its communications facilities or procedure.
If these changes could reasonably be expected to affect the use of this phone or compatibility
with the network, the telephone company is required to give advanced written notice to the user,
allowing the user to take appropriate steps to maintain telephone service.
(4) Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its
authorized agent. Therefore, note that unauthorized alternations or repair may affect the
regulatory status of the system and may void any remaining warranty.
(5) Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.

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(6) Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look
slightly different.
(7) Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference
from unsuppressed engines or electric motors may cause problems.
(8) Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the
sign.
Following information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange system
boards.
When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION

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1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Rate
CC-CV Constant Current – Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave

1. INTRODUCTION
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SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol

2. PERFORMANCE
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2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Standard Battery Li-Ion, 950mAh
AVG TCVR Current 240mA
Standby Current < 5.2mA
Talk time Over 5 hour (@ GSM Tx Level 7)
Standby time Over 250 hour (@ Paging Period 9, RSSI : -85dBm)
Charging time 3 hours
RX Sensitivity GSM900 : -105dBm, DCS/PCS : -105dBm
TX output power GSM, EGSM: 32dBm (Level 5)
DCS/PCS: 29dBm (Level 0)
GPRS compatibility Class 12
SIM card type 3.0V Only
Display Main : 128 x 160 TFT, Sub : 96 x 96 TFT
Status Indicator Key Pad (Main) : 0 ~ 9, #, *, Navigation Key,
Up/Down Side Key,
Camera Side Key, Confirm Key,
Send Key, END/PWR Key
Key Pad (Folder) : Rewind, Fasten Forward, Play
ANT Internal
EAR Phone Jack 12-pin
PC Synchronization Yes
Speech coding EFR / FR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recording Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Hands-Free Kit, Data Kit

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2.2 Technical Specification
Item Description Specification
GSM900
TX: 890 + n x 0.2 MHz (n=1 ~ 124)
890 + (n-1024) x 0.2 MHz (n=975 ~ 1023)
RX: TX + 45 MHz
DCS1800
1 Frequency Band TX: 1710 + (n-511) x 0.2 MHz (n = 512 x 885)
RX: TX + 95 MHz
PCS1900
TX: 1850 + (n-511) x 0.2 MHz
RX: 1930 + (n-511) x 02MHz (n = 512 x 810)
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
12 19 dBm 3dB
4 Power Level DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
2. PERFORMANCE

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2. PERFORMANCE
Item Description Specification
GSM900
Offset from Carrier (kHz) Max. dBc
100 +0.5
200 –30
250 –33
400 –60
600 ~ 1,200 –60
1,200 ~ 1,800 –60
1,800 ~ 3,000 –63
3,000 ~ 6,000 –65
5 Output RF Spectrum 6,000 –71
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz) Max. dBc
100 +0.5
200 –30
250 –33
400 –60
600 ~ 1,200 –60
1,200 ~ 1,800 –60
1,800 ~ 3,000 –65
3,000 ~ 6,000 –65
6,000 –73
GSM900
Offset from Carrier (kHz) Max. dBm
400 –19
600 –21
1,200 –21
6 Output RF Spectrum 1,800 –24
(due to switching DCS1800/PCS1900
transient)
Offset from Carrier (kHz) Max. dBm
400 –22
600 –24
1,200 –24
1,800 –27
7 Spurious Emissions Conduction, Emission Status

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2. PERFORMANCE
Item Description Specification
GSM900
8 Bit Error Rate BER (Class II) < 2.439% @–102 dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @–100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max. (dB) Min. (dB)
100 –12 –
200 0 –
300 0 –12
11 Sending Response 1,000 0 –6
2,000 4 –6
3,000 4 –6
3,400 4 –9
4,000 0 –
12 RLR 2 3 dB
Frequency (Hz) Max. (dB) Min. (dB)
100 –12 –
200 0 –
300 2 –7
500 ❈–5
13 Receiving Response 1,000 0 –5
3,000 2 –5
3,400 2 –10
4,000 2
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
–35 17.5
–30 22.5
16 Distortion –20 30.7
–10 33.3
0 33.7
7 31.7
10 25.5
17 Side tone Distortion Three stage distortion < 10%
18 <Change> System
frequency (13 MHz) ≤2.5 ppm
tolerance

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2. PERFORMANCE
Item Description Specification
19 <Change> 32.768KHz ≤30 ppm
tolerance
20 Power consumption Standby
- Normal, ≤5.2mA (Mix. power)
21 Talk Time GSM900/Lvl 7 (Battery Capacity 950mA): 321 min
GSM900/Lvl 12 (Battery Capacity 950mA): 499 min
Under conditions, at least 250 hours:
1. Brand new and full 950mAh battery
22 Standby Time 2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
23
Ringer Volume
At least 65 dB under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Voltage Fast Charge : < 500 mA
Slow Charge: < 60 mA
Antenna Bar Number Power
5 –85 dBm ~
4 –90 dBm ~ –86 dBm
25 Antenna Display 3 –95 dBm ~ –91 dBm
2 –100 dBm ~ –96 dBm
1 –105 dBm ~ –101 dBm
0 ~ –105 dBm
0 3.62V±0.03V
1 3.70V±0.03V
26 Battery Indicator 2 3.78V±0.03V
3 3.92V±0.03V
4 3.93V±0.03V
27 Low Voltage Warning 3.62V ±0.03V (Call)
3.50V ±0.03V (Standby)
28 Forced shut down 3.35 ± 0.03 V
Voltage
1 Li-ion Battery
29 Battery Type Standard Voltage = 3.7V
Battery full charge voltage = 4.2V
Capacity : 950mAh
Switching-mode charger
30 Travel Charger Input : 100 ~ 240V, 50/60 Hz
Output : 5.2V, 600 mA
➝
➝➝

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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 RF Transceiver General Description
The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a
voltage supply part, and a DCXO part.
The SI4206[U102] is a triple band transceiver IC suitable for GSM 900, DCS 1800 and PCS
1900 GPRS class 12 applications. This device integrated a receiver based on a low IF (100KHz)
architecture and a transmitter based on modulation loop architecture. And, the synthesizer part
are included in the IC, a complete dual band synthesizer with built in VCOs.
The transceiver employed a 3 wire serial interface to allow an external system controller to write
the control registers for dividers, receive path gain, power down setting, and other controls.
3.2 Receiver Part
The receiver part uses a low-IF receiver architecture that allows for the on-chip integration of the
channel selection filters, eliminating the external RF image reject filters and the IF SAW filter
required in conventional super-heterodyne architecture. The Si4206[U102] integrates three
differential input LNAs that are matched to the 200 Ohm balanced-output SAW filters through
external LC matching networks. A quadrature image-rejection mixer downconverts the RF signal
to a 100kHz intermediate frequency (IF) with the RFLO. The mixer output is amplified with an
analog programmable gain amplifier (PGA) and quadrature IF signal is digitized with high
resolution A/D converters (ADCs). The Si4206[U102] downconverts the ADC output to
baseband with a digital 100kHz quadrature LO signal. Digital decimation and IIR filters perform
channel selection to remove blocking and reference interference signals. After channel
selection, the digital output is scaled with digital PGA, which is controlled with the DGAIN[5:0]
bits in register 05h.The amplified digital output signal go through with DACs that drive a
differential analog signal onto the RXIP,RXIN,RXQP and RXQN pins to interface to standard
analog ADC input baseband ICs.
Table 1. Antenna (RSSI) Display
Antenna Bar Number Power (dBm)
5≥-85
4≥-90
Antenna Display 3≥-95
2≥-100
2≥-105
1 < -105

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3. TECHNICAL BRIEF
Figure 1. RECEIVER PART Block Diagram
(1) RF Front End
RF front end consists of Antenna Switch Module with SAW filter for triple band (FL100), triple
band LNAs integrated in transceiver (U102).
The Received RF signals (EGSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz, PCS 1850 ~
1990MHz) are fed into the antenna or mobile switch. An antenna matching circuit is between the
antenna and the mobile switch. The Antenna Switch (in FL100) is used for control the Rx and
TX paths. And, the input signals ANT1, ANT2 and ANT3 of a FL100 are directly connected to
baseband controller to switch either TX or RX path on and select bands. Ant S/W module
(FL100) is an antenna switch module for dual band phone. The logic and current is given below.
Table 2. BAND/RTX SELECTION
The receiver part uses a low-IF receiver architecture that allows for the on-chip integration of the
channel selection filters, eliminating the external RF image reject filters and the IF SAW filter
required in conventional super-heterodyne architecture. The Si4206[U102] integrates three
differential input LNAs that are matched to the 200 ohm balanced-output SAW filters through
external LC matching networks.
Mode ANT1 ANT2 ANT3
EGSM TX HL L
DCS/PCS TX L H H
EGSM RX LLL
DCX RX LLL
PCS RX LLH

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3. TECHNICAL BRIEF
(2) Low IF
A quadrate image-rejection mixer downconverts the RF signal to a 100kHz intermediate
frequency (IF) with the RFLO. The RFLO frequency is between 1849.8 and 1918.8 MHz, and is
divided by two for EGSM modes. The RFLO frequency is between 1804.9 and 1879.9 MHz, and
is divided by one for DCS modes. The RFLO frequency is between 1929.9 and 1989.9 MHz,
and is divided by one for PCS modes. The mixer output is amplified with an analog
programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in register 05h.
The quadrate IF signal is digitized with high resolution A/D converters (ADCs). The
Si4206[U101] down-converts the ADC output to baseband with a digital 100kHz quadrate LO
signal. Digital decimation and IIR filters perform channel selection to remove blocking and
reference interference signals. The response of the IIR filter is programmable to a high
selectivity setting (CSEL=0) or a low selectivity setting (CSEL=1). After channel selection, the
digital output is scaled with digital PGA, which is controlled with the DGAIN[5:0] bits in register
05h.
(3) Demodulator and Baseband Processing
The amplified digital output signal go through with DACs that drive a differential analog signal
onto the RXIP, RXIN, RXQP and RXQN pins to interface to standard analog ADC input
baseband ICs. No special processing is required in the baseband for offset compensation or
extended dynamic range. Compared to a direct-conversion architecture, the low-IF architecture
has a much greater degree of immunity to dc offsets that can arise from RF local oscillator
(RFLO) self-mixing, 2nd order distortion of blockers, and device 1/f noise.
3.3 Synthesizer Part
The Si4206[U101] integrates two complete PLLs including VCOs, varactors, resonators, loop
filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed
VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode.
The IF PLL is used only during transmit mode. All VCO tuning inductors are also integrated. The
IF and RF output frequencies are set by programming the N-Divider registers, NRF1, NRF2, and
NIF. Programming the N-Divider register for either RF1 or RF2 automatically selects the proper
VCO. The output frequency of each PLL is as follows:
FOUT = N x f
A programmable divider in the input stage allows either a 13 or 26 MHz reference frequency
depending on the choice of crystal. A 26 MHz reference clock can be divided by 2 using the
DIV2 bit in Register 31h. The RF PLL phase detector update rate (f) can be programmed with
the RFUP bit in register 31h to either f= 100 kHz or f= 200 kHz. The IF PLL always uses f
= 200 kHz. Receive mode should use f= 100 kHz in DCS 1800 and PCS 1900 bands, and f
= 200 kHz in the E-GSM 900 bands. Transmit modes should always use f= 200 kHz.

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3. TECHNICAL BRIEF
Figure 2. SYNTHESIZER PART Block Diagram
(1) DCXO
The Aero I+ transceiver integrates the DCXO circuitry required to generate a precise system
reference clock using only an external crystal resonator. (See Figure 15.) An internal digitally
programmable capacitor array (CDAC) provides a coarse method of adjusting the reference
frequency in discrete steps. An integrated analog varactor (CVAR) allows for a fine and
continuous adjustment of the reference frequency by an external control voltage (XAFC). This
control voltage is supplied by the AFC DAC on the baseband IC. The complete DCXO solution
effectively replaces TCVCXO modules typically required to provide a 13 or 26 MHz reference
clock for the system.
Figure 3. DCXO

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3. TECHNICAL BRIEF
3.4 Transmitter Part
The Transmitter part contains Si4206[U102] active parts, Power Amp Module[U100] and
Antenna Switch Module[FL100]. The transmit section of Si4206[U102] consists of an I/Q
baseband pconverter, an offset phaselocked loop (OPLL) and two 50 ohm output buffers that
can drive external power amplifiers. The RF GMSK outputs from the transmit VCO are fed
directly to the RF power amplifiers. The peak output power and the profile of the transmitted
burst are controlled by means of incorporated power control circuits inside of PA and DAC
output from the Baseband Controller. The PA outputs pass to the antenna connector via
Antenna Switch Module.
Figure 4. TRANSMITTER PART Block Diagram
(1) IF Modulator
The baseband converter (BBC) within the GSM chipset generates I and Q baseband signals for
the Transmit vector modulator. The modulator provides more than 40dBc of carrier and
unwanted sideband. Rejection and produces a GMSK modulated signal. The baseband
software is able to cancel out differential DC offsets in the I/Q baseband signals caused by
imperfections in the D/A converters. The TX-Modulator implements a quadrature modulator. A
quadrature mixer upconverts the differential I/Q signals with the IFLO to generate a SSB IF
signal, which is filtered and used as the reference input to the OPLL. The Si4206 [U102]
generates the IFLO frequency. The IFLO is divided by two to generate the quadrature LO
signals for the quadrature modulator.
(2) OPLL
The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated
TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is
divided by 2 for the E-GSM 900 bands. The Si4206 generates the RFLO frequency between
1327 and 1402 MHz. To allow a single VCO to be used for the RFLO, high-side injection is used
for the E-GSM 900 bands, and low-side injection is used for the DCS 1800 and PCS 1900
bands. Low-pass filters before the OPLL phase detector reduce the harmonic content of the
quadrature modulator and feedback mixer outputs. The cutoff frequency of the filters is
programmable with the FIF[3:0] bits in register 04h. The OPLL requires no external duplexer to
attenuate transmitter noise and spurious signals in the receive band. Additionally, the output of
the transmit VCO (TXVCO) is a constant-envelope signal which reduces the problem of spectral
spreading caused by non-linearity in the PA.

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3. TECHNICAL BRIEF
(3) Power Amplifier Module
The SKY77325[U100] is a triple-band GSM/DCS/PCS power amplifier module that incorporates
an indirect closed loop method of power control. The indirect closed loop is fully self-contained
and it does not require loop optimization. It can be driven directly from the DAC output in the
baseband circuit. On-board power control provides typical 50 dB of control range with an analog
voltage input (Vapc). Efficiency is 53% at GSM, DCS and PCS.
Figure 5. POWER AMP
(4) Power Supplies and Control Signals
An external regulator (U104) is used to provide DC power to RF part. Every RF component
except power amp module uses this external regulator.
Figure 6. POWER SUPPLY & CONTROL
C130
1000p
C131
2.2u0.01u
C132
4BYP EN 3
GND 2
IN 15 OUT
U104MIC5255-2.85BM5
RF2.85V VBAT
1u
C133
RF_EN

3.5 Digital Baseband
Figure 7. Top level block diagram of the Calypso-Plus
(1) General Description
Calypso-Plus device is an evolution of Calypso (C035) device integrating hardware
enhancements targeting the implementation of a new range of user’s applications. It supports
the digital baseband processing of GSM radio signals in switching circuit mode and packet data
mode up to class 12 in compliance with the ETSI specification of the GPRS protocol. The
functional enhancement of the Calypso-Plus offer an increase computing performance of both
ARM7 based MCU and C54x based DSP sub-system in addition to numerous new connectivity.
The enhanced computing performances mainly rely on :
[MCU Sub-system]
- 5.5Mbit Internal SRAM (with 0.5Mb shared with DSP)
- DMA to internal SRAM
- Page Mode Memory Interface
- Sizable 6 Chip-Select
- 2 Generic Purpose external interrupts
- Patch Unit
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3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF
[ DSP Sub-system]
- 0.5Mb Program/Data Memory Extension shared with MCU
The new connectivity peripherals are :
- LCD controller parallel physical interface (6800 & 8080 protocol)
- USB client (W2FC)
- Multi Media and Secure Digital Card (MMC/SD) interface
- Memory Stick (MS) interface (using exclusive with MMC/SD)
- Audio and Data interface for external Bluetooth Modem connection
- Audio Codec serial interface (I2S)
- Smart Card physical interface (ISO-7816)
- NAND-Flash Interface
- Enhanced Keyboard controller
(2) Memory Interface
Calypso-Plus has 6-sizable chip select port and can configure as follow :
Table 3. Configuration of addressable ranges
F1200 applies configuration #1 as its external memory interface, the external devices are
connected to as follow.
Table 4. External Device Spec. connected to memory interface
In Mbytes nCS0 nCS1 nCS2 nCS3 nCS4 nCS5
Config #1 8 8 8 16 16 64
Config #2 8 16 16 16 32 32
Config #3 4 8 16 32 32 32
Config #4 4 8 8 8 32 64
nCS External Device nCS External Device
nCS0 32Mbit SRAM nCS3 64Mbit NOR Flash
nCS1 64Mbit SRAM nCS4 Camera (LCD) control IC
nCS2 MIDI (MP3/AAC) Chip nCS5 128Mbit NOR Flash