LG G3100 User manual

Table Of Contents
1. INTRODUCTION................................…5
1.1 Purpose ............................................….
1.2 Regulatory Information ..........................
1.3 Abbreviations .........................................
2. PERFORMANCE ..............................….9
2.1 H/W Features .....................................…..
2.2 Technical Specification ..........................
3. TECHNICAL BRIEF ............................15
3.1 Transceiver ......…………………………..
3.2 Power Amplifier Module .....................….
3.3 13MHz Clock ……..………………………
3.4 Power Supplies for RF Circuits .........….
3.5 Testing Set-up and Checking Signals.….
3.6 Digital Main Processor ………………..….
3.7 Analog Main Processor ......................….
3.8 Power Management …….....................…
3.9 Memories ……………….....................….
3.10 Display and Interface ........................... .
3.11 Keypad Switches and Scanning ........ .
3.12 Microphone ........................................ .
3.13 Earpiece .....................………………..…
3.14 Hands free / Headset Interface ………..
3.15 Key Back-light Illumination ...............….
3.16 LCD Back-light Illumination ……………
3.17 Speaker & MIDI IC ..........................….
4. TROUBLE SHOOTING ................… 56
4.1 RF Components .............................….
4.2 Rx Trouble ..........................................
4.3 Tx Trouble ..........................................
4.4 Power On Trouble ..........................….
4.5 Charging Trouble ...........................….
4.6 LCD Trouble .......................................
4.7 Receiver Trouble ................................
4.8 Speaker Trouble .................................
4.9 Mic. Trouble ...................................….
4.10 Vibrator Trouble ...............................
4.11 Key Backlight LED Trouble ..............
4.12 SIM Detect Trouble ..........................
4.13 Earphone Trouble ............................
4.14 HFK Trouble ......................................
5. DISASSEMBLY INSTRUCTION .... 105
5.1 Disassembly .......................................
6. SOFTWARE DOWNLOAD ............. 108
6.1 Download Setup ............................…..
6.2 Download Procedure .......................…..
7. BLOCK DIAGRAM ........................... 114
5
5
7
9
10
15
20
21
21
22
35
40
45
47
47
48
49
50
50
52
53
54
56
57
65
77
79
81
82
84
87
90
92
94
96
101
105
108
109
-3 -

9. PCB LAYOUT .................................. 119
10. ENGINEERING MODE .................. 121
10.1 BB Test [MENU 1] .....................……
10.2 RF Test [MENU 2] .....................……
10.3 MF Mode [MENU 3] ...................……
10.4 Trace option [MENU 4] ..............……
10.5 Call Timer [MENU 5] ..................……
10.6 Fact. Reset [MENU 6] ................……
10.7 S/W version [MENU 7] ...............……
11. STAND ALONE TEST ................... 125
11.1 What’s the Standalone Test? .....……
11.2 Standalone Test Equipment Setup…
11.3 H/W Test …….............................……
11.4 Tx Stand alone Test Setting …………..
11.5 Rx Stand alone Test Setting …………..
12. AUTO CALIBRATION ................... 132
12.1 Overview ....................................……
12.2 Equipment List ............................……
12.3 Equipment Setup ….........................…
12.4 AGC for RX ..…………………………..
12.5 APC for TX ……..………………………
12.7 How to do calibration .................……
13. EXPLODED VIEW &
REPLACEMENT PART LIST ...…. 137
13.1 Exploded View ...........................……
13.2 Accessory ...............................……..
13.3 Replacement Parts
< Mechanic component > ……………..
Replacement Parts
< Main component > ………………….
121
123
123
124
124
124
124
125
126
127
128
130
132
132
133
134
134
135
137
139
140
142
-4 -
8. CIRCUIT DIAGRAM ......................... 115
8.1 Main Chipset and Memory ..............…..
8.2 Audio Part ………………….........……….
8.3 PMIC, LCD and I/O Connector …......….
8.4 RF Part ………..................................…..
115
116
117
118
9.1 Rear Part …………………...............…..
9.2 Front Part ………………….........……….
119
120

1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of G3100.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common-carrier telecommunication service of
facilities accessed through or connected to it. The manufacturer will not be responsible for any charges
that are resulted from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is
not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of this phone or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and
may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
-5 -

E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system
boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION
-6-

1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RateBER
BasebandBB
Automatic Power ControlAPC
-7-
1. INTRODUCTION

Wireless Application ProtocolWAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
-8-
1. INTRODUCTION

2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Standard Battery
Li-ion, 850 mAh
Size: 42.08 ×66.65 ×9.3mm
Weight: 29.32g
Stand by Current
Under the minimum current consumption environment
(such as paging period 9), the level of standby current
is below 4mA.
Talk time Up to 3hours (GSM TX Level 7)
Stand by time Up to 200hours (Paging Period: 9, RSSI: -85 dBm)
Charging time 3hours
RX Sensitivity GSM, EGSM: -105dBm, DCS: -105dBm
TX output power GSM, EGSM: 32dBm(Level 5),
DCS: 29dBm(Level 0)
SIM card type 3V Small
Display 128 ×96 pixel 65K Color
Status Indicator
Hard icons. Key Pad;
0 ~ 9, #, *, Up/Down Navigation Key
Confirm Key, Clear Key, Back Key,
Send Key, END/PWR Key
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
2. PERFORMANCE
GPRS compatibility Class 10
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
C-Mike Yes
-9-
Travel Adapter Yes
Options Hands-free kit, CLA, Data Kit
Receiver Yes

2.2 Technical Specification
Item Description Specification
1Frequency Band
GSM
TX: 890 + n ×0.2 MHz
RX: 935 + n ×0.2 MHz (n=1~124)
EGSM
TX: 890 + (n-1024) ×0.2 MHz
RX: 935 + (n-1024) ×0.2 MHz (n=975~1024)
DCS
TX: 1710 + (n-512) ×0.2 MHz
RX: 1805 + (n-512) ×0.2 MHz (n=512~885)
2Phase Error RMS < 5 degrees
Peak < 20 degrees
3Frequency Error < 0.1 ppm
4Power Level
Level Power Toler. Level Power Toler.
6 31dBm ±3dB 14 15dBm ±3dB
7 29dBm ±3dB 15 13dBm ±3dB
8 27dBm ±3dB 16 11dBm ±5dB
9 25dBm ±3dB 17 9dBm ±5dB
10 23dBm ±3dB 18 7dBm ±5dB
11 21dBm ±3dB 19 5dBm ±5dB
12 19dBm ±3dB
GSM, EGSM
5 33dBm ±2dB 13 17dBm ±3dB
Level Power Toler. Level Power Toler.
1 28dBm ±3dB 9 12dBm ±4dB
2 26dBm ±3dB 10 10dBm ±4dB
3 24dBm ±3dB 11 8dBm ±4dB
4 22dBm ±3dB 12 6dBm ±4dB
5 20dBm ±3dB 13 4dBm ±4dB
6 18dBm ±3dB 14 2dBm ±5dB
7 16dBm ±3dB 15 0dBm ±5dB
DCS
0 30dBm ±2dB 8 14dBm ±3dB
- 10 -
2. PERFORMANCE

5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
DCS
6
Output RF Spectrum
(due to switching
transient)
GSM, EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
1,800 -24
- 11 -
Item Description Specification
2. PERFORMANCE

Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
1,800 -27
7Spurious Emissions Conduction, Radiation
8Bit Error Rate
GSM, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS
BER (Class II) < 2.439% @-100 dBm
9RX Level Report Accuracy ±3 dB
10 SLR 8±3 dB
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000 -
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 2±3 dB
GSM
- 12 -
2. PERFORMANCE

Item Description Specification
13 Receiving Response
300 -7
500 -5
1,000 -5
3,000 -5
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000
3,400 -10
2
*
0
2
-12
0
2
2
14 STMR 13±5 dB
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
15 Stability Margin > 6 dB
-20
-10
0
7
dB to ARL (dB) Level Ratio (dB)
-35
-30
10
30.7
33.3
33.7
31.7
17.5
22.5
25.5
16 Distortion
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency
(13 MHz) tolerance ≤2.5 ppm
19 32.768KHz tolerance ≤30 ppm
20 Ringer Volume
At least 80 dB under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
- 13 -
2. PERFORMANCE

Item Description Specification
21 Charge Current CC Charge : < 500 mA
Trickle Charge : < 60 mA
3
2
1
0
Antenna Bar Number Power
5
4
-95 dBm ~ -91 dBm
-100 dBm ~ -96 dBm
-105 dBm ~ -101 dBm
~ -105 dBm
-85 dBm ~
-90 dBm ~ -86 dBm
22 Antenna Display
2
3
Battery Bar Number Voltage
0
1
3.73 ~ 3.82 V
3.82 V ~
~ 3.62 V
3.62 ~ 3.73 V
23 Battery Indicator
24 Low Voltage Warning
3.5 ±0.03V (Standby)
3.62 ±0.03V (Call)
25 Forced shut down
Voltage 3.35 ±0.03V
26 Battery Type
1 Li-ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 850mAh
27 Travel Charger
Switching-mode charger
Input: 100 ~ 240 V, 50/60 Hz
Output: 5.2 V, 800 mA
- 14 -
2. PERFORMANCE

3.1 Transceiver (CX74017, U401)
The RF parts consists of a transmitter part,a receiver part,a synthesizer part,a voltage supply part,a
VCTCXO part. And the main RF Chipset CX74017[U401]is a single-chip dual-band transceiver for the
extended global system for mobile communication[E-GSM900MHz]/
Digital communication system[DCS1800MHz] voice and data transfer applications.
This device integrated a direct conversion receiver architecture, which eliminates the need of
Intermediate Frequency, a transmitter based on a modulation loop architecture and fractional-N
synthesizer part with built in TXVCO and Local-VCO.
(1) Receiver Part
The Receiver part in CX74017 contains all active circuits completely, full receiver chain with the
exception of discrete front-end RF SAW filters. The filtered and amplified signal is down converted in
the RF-mixer to the baseband output. The receiver path is supported by internal channel filtering.
The RF front-end circuit is shown Fig. 3-1.
Figure. 3-1 Receiver Block diagram
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
- 15 -
ANT
S/W
CX74017
Base
Band
Block
DCS : 1805 ~ 1880MHz
GSM : 925 ~ 960MHz
90
0
90
02/3
RXIP
RXIN
RXQP
RXQN
4/3
PCS : 1805 ~ 1880MHz
fvco
GSMSEL
DCSSEL
LMSP54AA-097
FAR-G6CS-1G8425-L257

A. RF Front End
RF front end consists of Antenna Switch(FL401), dual band LNAs integrated in transceiver(U401).
The Received RF signals (GSM 925MHz ∼960MHz, DCS 1805MHz ∼1880MHz) are fed into the
antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile switch.
The Antenna Switch (FL401) is used to control the Rx and TX paths. And, the input signals VC1 and
VC2 of a FL401 are connected to DCSSEL(GPO_9) and GSMSEL(GPO_11) ports of U101 to switch
either TX or RX path on. When the RX path is turned on, the received RF signal then feeds either Rx
_900_RF or RX_1800_RF path controlled by GSM-RX and DCS-RX respectively. This Rx_900_RF
path contains one SAW filter, followed after the Antenna Switch (FL401), to filter any unwanted signal
apart from the DCS RX band. And, the RX_1800_RF path is the same case.
The logic and current for Antenna Switch is given below Table 3-1.
Table 3-1 The logic and current
<0.1 mA0 V0 VGSM/DCS RX
10.0 mA max0 V2.7 VDCS TX
10.0 mA max2.7 V0 VGSM TX
CurrentVC2VC1
These two paths are then connected to the LNAGSMIN (#11) and LNADCSIN (#13) of
CX74017 (U401), respectively. A low-noise bipolar RF amplifier, contained within the U401,
amplifies the RF signal. The RF signals from the front-end pass to the receiver mixers
within the U401 device.
- 16 -
In direct conversion receiver there is only one mixer that is down-converting received RF signal to BB
signal directly. The gain of the mixer is 40dB at high gain mode and 22dB at low gain mode.
The Rx gain setting is done in the AGC algorithm. The nominal gain of the receiver is set as a
function of the expected signal strength at the antenna input so that a desired level is reached at the
Rx I/Q. 7 blocks in the receiver chain have variable gains, LNA, Mixer, LPF1, VGA1, gmC Filter,
Auxiliary gain control and VGA2. The gain settings can be adjustable via 3-wire bus control lines.
The baseband signals pass via integrated low-pass filters to the baseband A/D converters.
The remainder of the channel filtering is performed by the baseband chipset. The demodulator
contains switches to maintain the sense of the baseband I/Q outputs with respect to the incoming RF
signal on both GSM900 and DCS1800.
B. Demodulator and baseband processing
3. TECHNICAL BRIEF

Three correction loops ensure that DC offsets, generated in the CX74017, do not overload the
baseband chain at any point.
After compensation, the correction voltages are held on capacitors for the duration of the
receive slot(s). A rising edge on the RXEN signal, selected via the serial interface, placed the
DC compensation circuitry in the track mode.
C. DC offset compensation
- 17 -
3. TECHNICAL BRIEF

(2) Transmitter Part
Fig.3-2 Transmitter Block diagram
- 18 -
The Transmitter part contains CX74017 active parts, power amplifier module (PAM) and antenna
switch. The CX74017 active part consists of a vector modulator and offset phase-locked loop
block (OPLL) including down-converter, phase detector, loop filter and dual band transmit VCO
which can operate at either final RF output frequency. The RF GMSK outputs from the transmit
VCO are fed directly to the RF power amplifiers.
ANT
S/W
GSM
TXVCO
PAM(RF3110)
CX74017
Base
Band
Block
DCS : 1710 ~ 1785MHz
GSM : 880 ~ 925MHz
90
0
LF
TXIP
TXIN
TXQP
TXQN
PFD
/D2
/D1
X2
DCS
fvco
/3
X2
fTX fIF
fLO
GSMSEL
DCSSEL
TXPA
TXRAMP
BANDSEL1
LMSP54AA-097
A. IF Modulator
The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for
the transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted
sideband rejection and produces a GMSK modulated signal. The baseband software is able to
cancel out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A
converters.
The TX-Modulator implements a quadrature modulator. The IF-frequency input signal is split into
two precise orthogonal carriers, which are multiplied by the baseband modulation signal IT/ITX
and QT/QTX. It is used as reference signal for the OPLL.
3. TECHNICAL BRIEF

The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating
signal. The IF signal goes via external passive bandpass filter to one port of the phase detector.
The other side of the phase detector input is LO signal. The phase detector generates an error
current proportional to the phase difference between the modulated signal from the offset mixer
and the reference signal from the LO.
The error current is filtered by a second order low-pass filter to generate an output voltage which
depends on the GMSK modulation and the desired channel frequency. This voltage controls the
transmit VCO such that the VCO output signal, centered on the correct RF channel, is frequency
modulated with the original GMSK data. The OPLL acts as a tracking narrowband band pass filter
tuned to the desired channel frequency. This reduces the wideband noise floor of the modulation
and up-conversion process and provides significant filtering of spurious products.
B. OPLL
The CX74017 includes a fully integrated UHF VCO with an on-chip LC tank.
A single sigma-delta fractional-N synthesizer can phase lock the local oscillator used in both
transmit and receive path to a precision frequency reference input. Fractional-N operation offers low
phase noise and fast setting times, allowing for multiple slot applications such as GPRS.
The generated frequency is given by the following equation.
(3) Synthesizer Part
- 19 -
3. TECHNICAL BRIEF
R
f
FN
N
f
ref
VCO





++
=22
2
5.3
where : = Generated VCO frequency
N = N-divider ratio integer part
FN = Fractional setting
R = R-divider ratio
= Reference Frequency
VCO
f
VCO
f

Figure 3-3. Synthesizer Block diagram.
- 20 -
3. TECHNICAL BRIEF
The counter and mode settings of the synthesizer are also programmed via 3-wire interface.
GSM
REFCLK
CX74017
Base
Band
Block
13MHz
Fractional-N
PLL
X2
DCS
/R
fvco = (N+3.5+FN/2^22)fref/R
fvco fref
/3
LF
fLO
AFC
13MHz
2V7_VTCXO
GSM
DCS
4/3 2/3
The RF3110[U402] is a dual band amplifier module for E-GSM(880 to 915MHz) and DCS1800(1710
to 1785MHz). The efficiency of the module is 50% at nominal output power for E-GSM and 45%
for DCS1800. This module should be operated under the GSM burst pulse. To avoid permanent
degradation, CW operation should not be applied. To avoid the oscillation at no input power,
before the input is cut off, the control voltage Vapc should be control to less than 0.5V.
In order to improve thermal resistance, the through holes should be layouted as many as possible on
PCB under the module. And to get good stability, all the GND terminals should be soldered to ground
plane of PCB.
3.2 Power Amplifier Module

A VCTCXO (Voltage Controlled Temperature Compensated Crystal Oscillator, X401) is used as a
clock and oscillates at a frequency of 13MHz.
The output of the clock is fed to the CX74017 RF Main Chip, analog baseband chipset (AD6521,
U102), and digital baseband chipset (AD6522, U101)
Figure 3-4. VCTCXO Circuit.
3.3 13 MHz Clock
- 21 -
3. TECHNICAL BRIEF
Two regulators are used for RF circuits. One is ADP3330 (U404), the other is one port of ADP3408
(U301). ADP3330 (U404) supplies power to all the RF circuits except the VCTCXO(X401) that is
supplied power from ADP3408.
3.4 Power Supplies for RF Circuits
VSYNTHENRF circuitry2.85V±0.5VRegulator 2 (U404,RF2V8)
VCTCXO2.7V±0.5VRegulator 1(U301,2V7_VTCXO)
Enable SignalPowersVoltageRegulator
Figure 3-5. Regulator Circuit..

This section shows the typical RF power levels expected throughout the receiver path. A block diagram
shows the locations of the RF measurement points and levels as shown in Fig. 3-11.
Receiver Testing Set-up
To check the receiver the test equipment should be set as the following conditions:
On a signal generator or a GSM/DCS test box, output amplitude of CW sugnal = -60 dBm at either:
947.4 MHz (CH62) when testing the GSM RX path or 1842.6 MHz (CH699) when testing the DCS
RX path. Set the DC power supply to 4.0 V.
Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should always be taken into
account when performing such RF measurements.
Testing Receiver
Measure the RF power levels of the points which is shown in Fig. 3-9. If there are any major
difference between your measurement results and the values shown in the figure, then further
investigation about the particular point will be required. It will also be necessary to ensure that all the
following power supplies and signals which control this part of the receiver circuit are present :
1. The Control Signal of FEM (see Fig. 3-15, 16, 17)
2. RF2V8 (see Fig. 3-12)
3. 2V7_VTCXO (see Fig. 3-13)
4. 13MHz (see Fig. 3-14)
5. PLL_CLK, PLL_DATA, PLL_LE (see Fig. 3-18)
8. RX IP, IN, QP, QN (see Fig. 3-21)
This section shows the typical RF power levels expected throughout the transmitter path. A block
diagram shows the locations of the RF measurement points and levels as shown in Fig. 3-8.
Transmitter Testing Set-up
To check the transmitter the test equipment should be set as the following conditions:
1. Set the DC Power supply to 4.0 V.
2. Power up the GSM/DCS test set and then establishing a call with an attached mobile on active
mode.
3. Select Channel, TX Level and Input Level according to which parameter is required.
Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should be always taken into
account during the measurement.
3.5 Testing Set-up and Checking Signals
- 22 -
3. TECHNICAL BRIEF
A. Received RF Power Level and Checks
B. Transmitted RF Power Level and Checks