LG G3100 User manual

Table Of Contents
1. INTRODUCTION................................…5
1.1 Purpose ............................................….
1.2 Regulatory Information ..........................
1.3 Abbreviations .........................................
2. PERFORMANCE ..............................….9
2.1 H/W Features .....................................…..
2.2 Technical Specification ..........................
3. TECHNICAL BRIEF ............................15
3.1 Transceiver ......…………………………..
3.2 Power Amplifier Module .....................….
3.3 13MHz Clock ……..………………………
3.4 Power Supplies for RF Circuits .........….
3.5 Testing Set-up and Checking Signals.….
3.6 Digital Main Processor ………………..….
3.7 Analog Main Processor ......................….
3.8 Power Management …….....................…
3.9 Memories ……………….....................….
3.10 Display and Interface ........................... .
3.11 Keypad Switches and Scanning ........ .
3.12 Microphone ........................................ .
3.13 Earpiece .....................………………..…
3.14 Hands free / Headset Interface ………..
3.15 Key Back-light Illumination ...............….
3.16 LCD Back-light Illumination ……………
3.17 Speaker & MIDI IC ..........................….
4. TROUBLE SHOOTING ................… 56
4.1 RF Components .............................….
4.2 Rx Trouble ..........................................
4.3 Tx Trouble ..........................................
4.4 Power On Trouble ..........................….
4.5 Charging Trouble ...........................….
4.6 LCD Trouble .......................................
4.7 Receiver Trouble ................................
4.8 Speaker Trouble .................................
4.9 Mic. Trouble ...................................….
4.10 Vibrator Trouble ...............................
4.11 Key Backlight LED Trouble ..............
4.12 SIM Detect Trouble ..........................
4.13 Earphone Trouble ............................
4.14 HFK Trouble ......................................
5. DISASSEMBLY INSTRUCTION .... 105
5.1 Disassembly .......................................
6. SOFTWARE DOWNLOAD ............. 108
6.1 Download Setup ............................…..
6.2 Download Procedure .......................…..
7. BLOCK DIAGRAM ........................... 114
5
5
7
9
10
15
20
21
21
22
35
40
45
47
47
48
49
50
50
52
53
54
56
57
65
77
79
81
82
84
87
90
92
94
96
101
105
108
109
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9. PCB LAYOUT .................................. 119
10. ENGINEERING MODE .................. 121
10.1 BB Test [MENU 1] .....................……
10.2 RF Test [MENU 2] .....................……
10.3 MF Mode [MENU 3] ...................……
10.4 Trace option [MENU 4] ..............……
10.5 Call Timer [MENU 5] ..................……
10.6 Fact. Reset [MENU 6] ................……
10.7 S/W version [MENU 7] ...............……
11. STAND ALONE TEST ................... 125
11.1 What’s the Standalone Test? .....……
11.2 Standalone Test Equipment Setup…
11.3 H/W Test …….............................……
11.4 Tx Stand alone Test Setting …………..
11.5 Rx Stand alone Test Setting …………..
12. AUTO CALIBRATION ................... 132
12.1 Overview ....................................……
12.2 Equipment List ............................……
12.3 Equipment Setup ….........................…
12.4 AGC for RX ..…………………………..
12.5 APC for TX ……..………………………
12.7 How to do calibration .................……
13. EXPLODED VIEW &
REPLACEMENT PART LIST ...…. 137
13.1 Exploded View ...........................……
13.2 Accessory ...............................……..
13.3 Replacement Parts
< Mechanic component > ……………..
Replacement Parts
< Main component > ………………….
121
123
123
124
124
124
124
125
126
127
128
130
132
132
133
134
134
135
137
139
140
142
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8. CIRCUIT DIAGRAM ......................... 115
8.1 Main Chipset and Memory ..............…..
8.2 Audio Part ………………….........……….
8.3 PMIC, LCD and I/O Connector …......….
8.4 RF Part ………..................................…..
115
116
117
118
9.1 Rear Part …………………...............…..
9.2 Front Part ………………….........……….
119
120

1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of G3100.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common-carrier telecommunication service of
facilities accessed through or connected to it. The manufacturer will not be responsible for any charges
that are resulted from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is
not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of this phone or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and
may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system
boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RateBER
BasebandBB
Automatic Power ControlAPC
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1. INTRODUCTION

Wireless Application ProtocolWAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
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1. INTRODUCTION

2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Standard Battery
Li-ion, 850 mAh
Size: 42.08 ×66.65 ×9.3mm
Weight: 29.32g
Stand by Current
Under the minimum current consumption environment
(such as paging period 9), the level of standby current
is below 4mA.
Talk time Up to 3hours (GSM TX Level 7)
Stand by time Up to 200hours (Paging Period: 9, RSSI: -85 dBm)
Charging time 3hours
RX Sensitivity GSM, EGSM: -105dBm, DCS: -105dBm
TX output power GSM, EGSM: 32dBm(Level 5),
DCS: 29dBm(Level 0)
SIM card type 3V Small
Display 128 ×96 pixel 65K Color
Status Indicator
Hard icons. Key Pad;
0 ~ 9, #, *, Up/Down Navigation Key
Confirm Key, Clear Key, Back Key,
Send Key, END/PWR Key
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
2. PERFORMANCE
GPRS compatibility Class 10
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
C-Mike Yes
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Travel Adapter Yes
Options Hands-free kit, CLA, Data Kit
Receiver Yes

2.2 Technical Specification
Item Description Specification
1Frequency Band
GSM
TX: 890 + n ×0.2 MHz
RX: 935 + n ×0.2 MHz (n=1~124)
EGSM
TX: 890 + (n-1024) ×0.2 MHz
RX: 935 + (n-1024) ×0.2 MHz (n=975~1024)
DCS
TX: 1710 + (n-512) ×0.2 MHz
RX: 1805 + (n-512) ×0.2 MHz (n=512~885)
2Phase Error RMS < 5 degrees
Peak < 20 degrees
3Frequency Error < 0.1 ppm
4Power Level
Level Power Toler. Level Power Toler.
6 31dBm ±3dB 14 15dBm ±3dB
7 29dBm ±3dB 15 13dBm ±3dB
8 27dBm ±3dB 16 11dBm ±5dB
9 25dBm ±3dB 17 9dBm ±5dB
10 23dBm ±3dB 18 7dBm ±5dB
11 21dBm ±3dB 19 5dBm ±5dB
12 19dBm ±3dB
GSM, EGSM
5 33dBm ±2dB 13 17dBm ±3dB
Level Power Toler. Level Power Toler.
1 28dBm ±3dB 9 12dBm ±4dB
2 26dBm ±3dB 10 10dBm ±4dB
3 24dBm ±3dB 11 8dBm ±4dB
4 22dBm ±3dB 12 6dBm ±4dB
5 20dBm ±3dB 13 4dBm ±4dB
6 18dBm ±3dB 14 2dBm ±5dB
7 16dBm ±3dB 15 0dBm ±5dB
DCS
0 30dBm ±2dB 8 14dBm ±3dB
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2. PERFORMANCE

5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
DCS
6
Output RF Spectrum
(due to switching
transient)
GSM, EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
1,800 -24
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Item Description Specification
2. PERFORMANCE

Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
1,800 -27
7Spurious Emissions Conduction, Radiation
8Bit Error Rate
GSM, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS
BER (Class II) < 2.439% @-100 dBm
9RX Level Report Accuracy ±3 dB
10 SLR 8±3 dB
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000 -
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 2±3 dB
GSM
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2. PERFORMANCE