LG GD350 User manual

Service Manual Model : GD350
Internal Use Only
Service Manual
GD350
Date: JANUARY, 2010 / Issue 1.0

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION................................................. 5
1.1 Purpose............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.3 Abbreviations................................................................................... 7
2. PERFORMANCE..................................................9
2.1 H/W Features.................................................................................... 9
2.2 Technical Specification...............................................................11
3. TECHNICAL BRIEF............................................16
3.1 Baseband Processor Introduction .........................................16
3.2 Power Management....................................................................21
3.3 FEM with integrated Power Amplifier Module
(SKY77531, U400) ................................................................................34
3.4 Crystal(26 MHz, X100).................................................................36
3.5 RF Subsystem of PMB8810 (U100).........................................37
3.6 MEMORY(PF38F5060M0Y0BE, U101)...................................42
3.7 BT module .......................................................................................44
3.8 SIM Card Interface........................................................................46
3.9 LCD Interface..................................................................................47
3.10 Battery Charger Interface .......................................................50
3.11 Keypad Interface........................................................................51
3.12 Audio Front-End.........................................................................53
3.13 Camera Interface(2M Fixed Focus Camera).....................59
3.14 KEY BACLKLIGHT LED Interface............................................61
3.15 Vibrator Interface .......................................................................62
3.16 Folder SW Interface...................................................................63
3.17 Sub Display (LED Module) SW Interface...........................64
4. TROUBLE SHOOTING ......................................65
4.1 RF Component...............................................................................65
4.2 RX Trouble .......................................................................................66
4.3 TX Trouble........................................................................................70
4.4 Power On Trouble.........................................................................74
4.5 Charging Trouble..........................................................................77
4.6 Vibrator Trouble.............................................................................79
4.7 LCD Trouble.....................................................................................82
4.8 Camera Trouble.............................................................................86
4.9 Speaker Trouble ............................................................................90
4.10 Earphone Trouble ......................................................................92
4.11 Receiver Trouble.........................................................................95
4.12 Microphone Trouble.................................................................97
4.13 SIM Card Interface Trouble.....................................................99
4.14 KEY backlight Trouble........................................................... 101
4.15 Micro SD (uSD) Trouble......................................................... 103
4.16 Bluetooth Trouble................................................................... 105
4.17 FM Radio Trouble.................................................................... 107
4.18 Folder on/off Trouble.............................................................110
4.19 LED Module Trouble .............................................................. 112
5. DOWNLOAD...................................................114
5.1 S/W Download............................................................................ 114
5.2 Download program user guide........................................... 115
5.3 FlashTool Program Setting..................................................... 116
6. BLOCK DIAGRAM...........................................118
7. CIRCUIT DIAGRAM ........................................119
8. BGA PIN MAP .................................................123
9. PCB LAYOUT...................................................125
10.ENGINEERING MODE...................................131
11. AUTO CALIBRATION....................................132
11.1 Overview .................................................................................... 132
11.2 Configuration of HotKimchi ............................................... 132
11.3 Description of Basic File .......................................................133
11.4 Procedure................................................................................... 134
11.5 AGC............................................................................................... 137
11.6 APC ............................................................................................... 137
11.7 ADC............................................................................................... 137
11.8 Target Power ............................................................................. 137
12. EXPLODED VIEW & REPLACEMENT
PART LIST ....................................................139
12.1 EXPLODED VIEW...................................................................... 139
12.2 Replacement Parts.................................................................. 141
12.3 Accessory ................................................................................... 158

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common-carrier telecommunication service of
facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is not
done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and
may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION

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1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such
as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system
boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
2. INTRODUCTION

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Only for training and service purposes
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1. INTRODUCTION
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION

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1. INTRODUCTION
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Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION

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Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
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2.1 H/W Features
Item Feature Comment
Standard Battery Lithium-Polymer, 3.7V 800mAh
Stand by TIME Up to 350 hrs : Paging Period 5, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 350 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 2.5 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power GSM, EGSM: 32.3dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
SIM card type 3V / 1.8V
Display MAIN : 2.0” TFT 176 Ý220 pixel 262K Color
SUB : 23x5 Red LEDs Module
Status Indicator
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Left/Right OK Key
Send Key, PWR Key ,Soft Key(Left/Right), Camera, Music Key
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
2. SYSTEM SPECIFICATION
GPRS compatibility Class 10
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
2. PERFORMANCE1

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2. PERFORMANCE
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2. SYSTEM SPECIFICATION
Travel Adapter Yes
Speaker/Receiver 18x12ȰSpeaker/ Receiver
MIDI SW MIDI (Mono SPK)
Item Feature Comment
Camera 2.0M FF
Bluetooth / FM Radio Bluetooth version 2.1 / 76~108MHz supported
18x12ȰSpeaker/ Receiver

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2. PERFORMANCE
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2.2 Technical Specification
Item Description Specification
1 Frequency Band
GSM850 EGSM
TX: 824 ~ 849 MHz TX: 880 ~ 915MHz
RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz
DCS
TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
PCS
TX: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
4 Power Level
Level Power Toler. Level Power Toler.
6 31dBm ·3dB 14 15dBm ·3dB
7 29dBm ·3dB 15 13dBm ·3dB
8 27dBm ·3dB 16 11dBm ·5dB
9 25dBm ·3dB 17 9dBm ·5dB
10 23dBm ·3dB 18 7dBm ·5dB
11 21dBm ·3dB 19 5dBm ·5dB
12 19dBm ·3dB
GSM850/EGSM
5 33dBm ·2dB 13 17dBm ·3dB
Level Power Toler. Level Power Toler.
1 28dBm ·3dB 9 12dBm ·4dB
2 26dBm ·3dB 10 10dBm ·4dB
3 24dBm ·3dB 11 8dBm ·4dB
4 22dBm ·3dB 12 6dBm ·4dB
5 20dBm ·3dB 13 4dBm ·4dB
6 18dBm ·3dB 14 2dBm ·5dB
7 16dBm ·3dB 15 0dBm ·5dB
DCS/PCS
0 30dBm ·2dB 8 14dBm ·3dB
2. SYSTEM SPECIFICATION

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2. PERFORMANCE
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5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
DCS/PCS
6
Output RF Spectrum
(due to switching
transient)
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
1,800 -24
Item Description Specification
2. SYSTEM SPECIFICATION

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2. PERFORMANCE
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Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
GSM850, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy ·3 dB
10 SLR 11·3 dB
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000 -
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 4·3 dB (middle volume)
DCS/PCS
2. SYSTEM SPECIFICATION

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Item Description Specification
13 Receiving Response
300 -7
500 -5
1,000 -5
3,000 -5
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000
3,400 -10
2
*
0
2
-12
0
2
2
14 STMR > 17 dB
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
15 Stability Margin > 6 dB
-20
-10
0
7
dB to ARL (dB) Level Ratio (dB)
-35
-30
10
30.7
33.3
33.7
31.7
17.5
22.5
25.5
16 Distortion
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency
(13 MHz) tolerance ˺2.5 ppm
19 32.768KHz tolerance ˺30 ppm
20 Ringer Volume
At least 55 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 1 m
2. SYSTEM SPECIFICATION

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2. SYSTEM SPECIFICATION
Item Description Specification
21 Charge Current
Fast Charge : Typ. 430 mA
Slow Charge : Typ. 80mA
Total Charging Time : < 3 hours
2 -> 1
0 -> OFF
Bar Number Power
4 -> 2
-104 ·2
-106 㢨䚌
-98 ·2
-101 ·2
22 Antenna Display
2 -> 1
1 -> 0
Battery Bar Number Voltage
3
3 -> 2 3.75 ·0.05 V
23 Battery Indicator
24 Low Voltage Warning
( Blinking Bar)
˺3.61 ·0.05V (Call), 1 time per 1 minute (Receiver)
˺3.61 ·0.05V (Standby), 1 time per 3 minutes(Speaker)
25 Forced shut down
Voltage 3.35 ·0.05V
27 Battery Type
Lithium-Polymer Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
28 Travel Charger
Switching-mode charger
Input: 100 ~ 240V, 50/60 Hz
Output: 5.1V, 700mA
˻3.75·0.05 V
26 Sustain RTC
without battery Over 50 hours
3.68 ·0.05 V
3.61 ·0.05 V
7
7 -> 5
5 -> 4
-93 㢨ㇵ
-93 ·2
1 -> 0 -106 ·2
≤
≥

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3. TECHNICAL BRIEF
3.1 Baseband Processor Introduction
Figure. 3.1.1 X-Gold tm 213 Hardware Block Diagram
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X\VX[W
3. TECHNICAL BRIEF
3.1 Baseband Processor Introduction
Figure. 3.1.1 X-Gold tm 213 Hardware Block Diagram
3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
3.1.1 General
• Technology:
– SoC, Monolithic, 65 nm CMOS
• Package:
– eWLB, 8x8x0.8 mm
– 0.5 mm pitch
– 217 balls / 8-layer PCB
3.1.2 RF Transceiver
• Dual-band direct conversion receiver
• Tri/Quad-band possible with external circuitry
• Fully integrated digital controlled X0
• Additional buffer for 2 external system clocks
• Fully digital RF-Synthesizer incl. ȭȟ-Transmitter
3.1.3 Baseband
• DSP:
– 156 MHz TeakLite™
• MCU:
– ARM1176® @ 208 MHz
• MCU RAM:
– 3.00Mbit
• Memory I/F:
– 512 Mbit
• Modem:
– GPRS class 12, (RX/TX CS1-CS4)
– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)
• Cipher Units:
– A51/2/3
– GEA-1/2/3
• Security:
– OMTP TR0
– Secure Boot
– RSA(ROM)/SHA-1(HW accel.)
– OCDS disabling
– Certificate Management

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3. TECHNICAL BRIEF
• Speech Codec:
– FR / HR / EFR / NB-AMR
• Audio Codec (running on ARM1176):
– SP-MIDI
– SB-ADPCM
– MP3
– WB-AMR
– AAC/AAC+/eAAC+
• Others:
– DARP (SAIC)
– TTY
• Customization:
– E-Fuses
3.1.4 External Memory
• External Bus Unit
– 25-bit address bus (512 Mbit)
– 16-bit data bus
– 1.8V & 2.8V support
• Flash / RAM
– NOR Type
– Serial Flash SPI and SPI-4
– Parallel Flash (Page & Burst Mode)
- 16-bit Demultiplexed
- 16-bit AD-multiplexed
- 16-bit AAD-multiplexed
– iNAND Type e.g. oneNAND
• Memory card
– SD/MMC card interface with 1 or 4 data lines
3.1.5 Connectivity
• 3xUSIF (configurable either as SPI or UART), I2C, I2S; Interfaces @ 1.8V
• Direct (U)SIM 1.8/3V
• USB2.0 up to 480 Mbit/s (High Speed) w/ external USB Phy over ULPI interface
• Stereo Headset (Amplifier integrated)
• 3 external analog measurement PIN’s
• Bluetooth

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3. TECHNICAL BRIEF
3.1.6 Mixed Signal
• Improved audio performance
• Loudspeaker Audio Class D Amplifier, 700 mW@8 ȳmono for hands-free and ringing
• Stereo Headset 2x30 mW@16 ȳw/o coupling C
• Mono Earpiece 100 mW@16 ȳ
• Digital microphone supported
• Differential microphone inputs
3.1.7 FM Radio
• Integrated FM radio
– FM Stereo RDS Receiver
– Sensitivity 2 ɆV EMF
– Support for US & EU bands
– Stereo recording
3.1.8 Power Management
• Direct-to-Battery Connection
– LDOs (incl. capless)
– DC/DC step-down converter
– DC/DC step-up for white LED supply
• Battery Type
– Li-Polymer
• Charging control
– Battery temperature
– Watchdog protection
– Start-up on flat battery
• External Charger
– Switch mode
• USB battery charging
– USB charging spec 1.0 compliant
• Backlight
– Up to 4 serial white LEDs (integrated LDO)
3.1.9 Sub Display
• LED Module Display
– 115 LEDs (5x23 LEDs)
– RED Color
– Display Surface : 7.5 mm x 27.9 mm

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3. TECHNICAL BRIEF
3.1.10 Main LCD Display
• Type
– 176*220, QCIF, 262k color (parallel)
• Interface
– Parallel 8bit MIPI-DBI Type B
– Serial MIPI-DBI Type C
– Interf. voltage at 1.8V or 2.8V
• gRacr - Display Controller (Hardware)
– 30 fps Display update without DMA (up to 60 fps) (full or partial)
– Video post processing Scaling, Rotation (90¶steps), Mirroring
– Overlay with alpha blending
– Color conversion YUV -> RGB
– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmap fonts)
3.1.11 Camera
• 2.0 Mpxls, FF
• Frame Rate : 15@UXGA, 30@SVGA
• 39 MHz Pixel Rate
• 15 [email protected] Mpx full resolution
3.1.12 Video Capabilities
• Video Decoding MPEG-4/H.263
– QCIF@30 fps
– QVGA@15fps
• Video Encoding MPEG-4/H.263
– QCIF@15 fps
3.1.13 Audio Capabilities
• Polyphonic ring tones
– 64 voices MIDI, SP-MIDI
– FM synthesizer
• AMR-WB
• True ring tones (MP3)
• MP3, eAAC+
• G.722 SB-ADPCM encoding/decoding
Up to 350 hrs : Paging Period 5, RSSI 85dB
m

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3.2 Power Management
A mobile platform requires power supplies for different functions. These power supplies are generated in
the integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical
standard phone.
Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 213
3. TECHNICAL BRIEF
DC/DC Step Down Converter for 1.8V (SD1)
The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the
system, like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the
RF macro and the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter is
optimized for an average load current of 100mA. That is the load current estimated for the GSM talk mode.