LG GD910 User manual

Service Manual Model : GD910
Internal Use Only
Service Manual
GD910
Date: July, 2009 / Issue 1.0

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION...............................................5
1.1 Purpose......................................................................5
1.2 Regulatory Information.................................................5
1.3 Abbreviations ..............................................................7
2. PERFORMANCE............................................... 9
2.1 Supporting Standard....................................................9
2.2 Main Parts : Solution....................................................9
2.3 H/W features...............................................................9
2.4 HW Spec. .................................................................11
3. BB Circuit Technical brief............................16
3.1 Functional Block Diagram ..........................................16
3.2 Baseband Processor Introduction ...............................17
3.3 Power management IC...............................................30
3.4 Power ON/OFF ..........................................................37
3.5 SIM Interface.............................................................38
3.6 Memory ....................................................................39
3.7 LCD Display ..............................................................40
3.8 LCD back-light illumination ........................................41
3.9 Battery voltage monitor..............................................42
3.10 Audio......................................................................43
3.11 5 PIN Interface connector.........................................44
4. RF Circuit Technical Brief ............................45
4.1 General Description ...................................................45
4.2 GSM Part..................................................................49
4.3 WCDMA Part.............................................................53
4.4 GSM Power Amplifier Module.....................................56
4.5 WCDMA Band1 Power Amplifier Module .....................57
4.6 WCDMA Band1/8 Low Noise Amplifier........................58
4.7 WCDMA Band1 Duplexer ...........................................59
4.8 Bluetooth ..................................................................60
5. Trouble shooting ..........................................62
5.1 Trouble shooting test setup ........................................62
5.2 Power on trouble .......................................................63
5.3 Charging Trouble .......................................................67
5.4 USB Trouble ..............................................................70
5.5 SIM Detect Trouble ....................................................72
5.6 Side Key Trouble........................................................75
5.7 Audio Trouble ............................................................76
5.8 Microphone Trouble ...................................................78
5.9 VGA Camera .............................................................80
5.10 Main LCD Trouble ....................................................82
5.11 Main Clock part.......................................................84
5.12 RF Component ........................................................85
5.13 RF SIGNAL PATH .....................................................86
5.14 Trouble Shooting of GSM Part...................................87
5.15 Trouble Shooting of WCDMA Part..............................96
5.16 Trouble shooting of Bluetooth .................................103
6. Download & S/W upgrade .........................106
6.1 S/W download setup................................................106
6.2 Download program user guide..................................107
7. Block Diagram ........................................... 110
8. CIRCUIT DIAGRAM...................................... 111
9. BGA Pin Map .............................................. 115
10. PCB LAYOUT .............................................119
11. RF Calibration .......................................... 121
11.1 Test Equipment Setup ............................................121
11.2 Calibration Step.....................................................121
12. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................127
12.1 EXPLODED VIEW ...................................................127
12.2 Replacement Parts ................................................129
12.3 Accessory .............................................................145

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Only for training and service purposes

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
1.1.Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the GD910.
1.2.Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.
There might be risks of toll fraud associated with your telecommunications system. System users are
responsible for programming and configuring the equipment to prevent unauthorized use. LGE does
not warrant that this product is immune from the above case but will prevent unauthorized use of
common carrier telecommunication service of facilities accessed through or connected to it. LGE will
not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the GD910 or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the GD910 must be performed only by the LGE or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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1. INTRODUCTION
GD910 service manual
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
GD910 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following
information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
GD910 service manual
1.3. ABBREVIATION
For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB Baseband
BER

Bit Error Ratio
CC

-CV Constant Current – Constant Voltage
CLA

Cigar Lighter Adapter
DAC

Digital to Analog Converter
DCS

Digital Communication System
dBm

dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS

Enhanced General Packet Radio Service

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications
IPUI

International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

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1. INTRODUCTION
GD910 service manual

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory
STMR

Side Tone Masking Rating
TA

Travel Adapter
TDD

Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter
VCO

Voltage Controlled Oscillator
VCTCXO

Voltage Control Temperature Compensated Crystal
Oscillator
WAP

Wireless Application Protocol
8PSK 8 Phase Shift Keying

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. Performance
2. PERFORMANCE
GD910 service manual
2.1 Supporting Standard
2.2 Main Parts : Solution
Item Part name Comment
Digital Baseband PMB8879 (Infineon)
Analog Baseband PMB8879 (Infineon)
RF chip PMB6952 (Infineon)
2.3 H/W features
Item Feature Comment
Form Factor Color LCD – Watch
1)Capacity : Li-Polymer, 510mAh
Battery 2) Packaging Type : Standard
Item Feature Comment
Size 61 × 39 × 13.9mm
Weight 89~92g With Battery
GSM > 190 hours @paging period 5Stand-by
time WCDMA > 170 hours @DRX=7
GSM >110 mins @ Tx level 5
WCDMA >127 mins @Tx=12dBm
Talk time
WCDMA(VT) >50 mins @Tx=12dBm
Item Feature Comment
Supporting Standard WCDMA 2100
GSM EGSM/DCS/PCS with seamless
handover
Phase 2+(include AMR)
SIM Toolkit : Class 1, 2, 3, A-E
Frequency Range EGSM TX : 880 - 915 MHz
EGSM RX : 925 - 960 MHz
DCS TX : 1710 - 1785 MHz
DCS RX : 1805 - 1880 MHz
PCS TX : 1850 - 1910 MHz
PCS RX : 1930 - 1990 MHz
WCDMA2100 TX : 1920 - 1980 MHz
WCDMA2100 RX : 2110 - 2170 MHz
Application Standard WAP 2.0, JAVA 2.0

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2. PERFORMANCE
GD910 service manual
Charging
time
3 hours @power OFF/950mAh
Rx sensitivity EGSM900 : < -105 dBm
DCS1800 : < -105 dBm
PCS1900 : < -105 dBm
WCDMA 900/2100 : < -106.7 dBm
GSM/
GPRS
EGSM900 : 32.5 dBm
DCS1800 : 30 dBm
PCS1900 : 30 dBm
Class4 (EGSM900)
Class1(DCS)
Class1(PCS)
TX output
power
EDGE EGSM900 : 26 dBm
DCS1800 : 26 dBm
PCS1900 : 26 dBm
E2 (EGSM900)
E2 (DCS)
E2 (PCS)
GPRS compatibility GPRS Class 12
EDGE compatibility EDGE Class 12
Display Main LCD(1.43’, 128 x 160)
Built-in Camera VGA
ANT Main & Sub : Internal Fixed Type
System connector 5 Pin
Ear Phone Jack N/A
PC synchronization Yes
Speech coding FR, EFR, HR, AMR
Vibrator Built in Vibrator
Blue Tooth V2.1 with A2DP
Voice Recording Yes
Speaker Phone mode
Support
Yes
Travel Adapter Yes
CDROM Yes
Stereo Headset No
Data Cable Yes
T-Flash No Not Equipped

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
GD910 service manual
2.4 HW Spec.
GSM Transmitter/Receiver spec.
Item Specification
Frequency
EGSM TX : 880 - 915 MHz RX : 925 - 960 MHz
DCS TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz
PCS TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz
Phase Error Rms : 5°
Peak : 20 °
Frequency Error GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance) GSM/DCS : < -28dBm
T
ransmitter Output power and Burst
Timing
GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out to
less than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out to
larger than 1800kHz offset to the
edge of the transmit band
GSM : 1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS : 1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient 400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection – Speech
channels ± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)
AM Suppression
GSM : -31dBm - DCS : -
29dBm
-98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T

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2. PERFORMANCE
GD910 service manual
WCDMA Transmitter spec.
Item Specification
Transmit Frequency WCDMA2100 : 1920 ~1980 MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPM
Open Loop Power Control Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage
Power Ratio (ACLR)
> 33 dB @ ±5 MHz,
> 43 dB @ ±10 MHz
Spurious Emissions
|f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz
< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz
< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
Peak Code Domain Error < -15 dB at Pout t-20 dBm

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2. PERFORMANCE
GD910 service manual
WCDMA Receiver spec.
Item Specification
Receive Frequency WCDMA2100 : 2110 ~2170 MHz
Reference Sensitivity Level BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity (ACS) ACS > 33 dB where BER < 0.001
when Îor = -92.7 dBm / 3.84 MHz &
Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm /
3.84 MHz & Iblocking = -44 dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
Inner Loop Power Control In Uplink Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24

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2. PERFORMANCE
GD910 service manual
HSDPA Tx Frequency spec.
Sub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm/3.84MHz
Maximum Output
Power
3GPP Not Complete
Error Vector Magnitude
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ 5 MHz
> 43 dB @ 10 MHz
Adjacent Channel
Leakage
Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Spectrum Emission
Mask
HS-DPCCH
1920MHz ~ 1980 MHzTransmit Frequency
SpecificationItem
+
/
-
2.3
5
End of CQI
4
+
/
-
0.6
0
Middle of CQI
3
+
/
-
0.6
1
StartofCQI
2
+
/
-
2.3
6
Start of Ack/Nack
1
5
Transmitter
power step
tolerance
[dB]
Power
step
size, P
[dB]
Power step slot
boundary
Power
step
Sub-
test in
table
C101
1MHz
-
49dBc
8.5
~
12.5 MHz
1MHz
-
35
-
10
×
(
△
f
-
7.5)dBc
7.5
~
8.5 MHz
1MHz
-
35
-
1
×
(
△
f
-
3.5)dBc
3.5
~
7.5 MHz
30 kHz
-
35
-
15
×
(
△
f
-
2.5)dBc
2.5
~
3.5 MHz
Measurement
Bd
idth
Minimum requirement
Frequency offset from
i
f

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
GD910 service manual
HSDPA Tx Frequency spec.
Item Specification
Receive Frequency 2110 MHz ~2170 MHz
Maximum Input Level
(BLER or R), 16QAM Only
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps

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3. BB Circuit Technical brief
3. BB Circuit Technical brief
GD910 service manual
3.1 Functional Block Diagram
[Figure 3.1] Functional Block Diagram
GSM900/1800/1900
UMTS Band1(WCDMA2100)

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3. BB Circuit Technical brief
GD910 service manual
3.2 Baseband Processor Introduction
[Figure 3.2] Top level block diagram of S-GOLD®3H(PMB8878)

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3. BB Circuit Technical brief
GD910 service manual
3.2.1 General description
S-GOLD®3H is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a mixed signal
baseband IC combined with a 3G coprocessor IC, providing all analog and digital functionality for a dual
mode mobile phone in a single chip.
Both ICs building up the S-GOLD®3H SiP are manufactured in infineon Technologies` 1.35V 90nm CMOS
technology to meet the ever increasing demands of the market for feature rich and high performance
terminals at low costs.
The chip will support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD®3H support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external hardware.
3.2.2. Block Description
zProcessing core
- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the
Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate Motion Estimation
algorithms with based video encoding schemes..
- TEAKLite DSP core
zARM9-Memory
- 32k Byte Boot ROM on the AHB
- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 32k Byte Instruction Cache
- 32k Byte Data Cache
- 8k Byte Instruction Tightly coupled Memory (I-TCM)
- 8k Byte Data tightly coupled memory (D-TCM)
zTEAKLite®-Memory
- 120k x 16bit Program ROM
- 8k x 16bit Program RAM
- 72k x 16bit Data ROM
- 48k x 16bit Data XRAM
- 5k x 16bit Data YRAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit

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3. BB Circuit Technical brief
GD910 service manual
zShared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite®.
zController Bus system
The processor cores and their peripherals are connected by powerful buses.
- Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal
and external memories and with the peripheral buses.
- An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.
- A controller FPI bus for connecting the low performance controller peripherals such as keypad
etc. called hereafter fPI2 bus.
- FPI2 and FPI3 are connected asynchronously to the AHB buses. 1 DMA controller with 8channels
offloads the controller from data transfers.
- 2 AHB Lite buses for connecting multi-media and high performance peripherals, called AHB_PER1 and
AHB_PER2 hereafter. These peripheral buses are connected to the multi-layer AHB ‘backbone’ by
asynchronous, burst capable AHB2AHB bridges which are shared between accessing masters.
- The DMA controller is enabled to access AHB_PER1 by use of its first master interface and AHB_PER2 by
its second master interface.
zTEAKLite® Bus System
- 1 TEAKLite® data bus for connecting the TEAKLite® data memory and the TEAKLite® peripherals. Also the
data bus is connected into the controller system via shared RAMs to the FPI3 bus.
- 1 TEAKLite® program bus for connecting the TEAKLite® program memory to the TEAKLite®.
zClock system
The clock system allows widely independent selection of frequencies for the essential parts of the S-
GOLD®3H. Thus power consumption and performance can be optimized for each application.
zFunctional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with four additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
· GMSK Modulator: gauss-filter with B*T=0.3
· EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

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3. BB Circuit Technical brief
GD910 service manual
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- f8 and f9 Cipher unit
- Advanced static and dynamic power management features including TDMA-Frame
synchronous low-power mode and enhanced CPU modes(idle and sleep modes)
- 2D engine for support of image processing and 2D graphics applications. The 2D engine is tightly
coupled to the display interface. The resulting building block consisting of 2D engine and Display
interface is called Display Content Controller (DCC)
- Security crypto box supporting
· AES, DES, 3 DES
· Hash function
·RSAacceleration
· Secret Root Key (e-fuse) and Key Management
· True Random Number Generator
- Sample Rate Converter (SRC) for audio up-sampling
- Comprehensive static and dynamic Power Management
· Various frequency options during operation mode
· 32 kHz clock in standby mode
· Sleep control in standby mode
· RAMs and ROMs in power save mode during standby mode
· Additional leakage current reduction in standby mode possible by switching off for the TEAKLitre®
subsystem.
- Extensive debug support for the controller and the DSP system
· OCDS level 2+ (run control, non-intrusive program flow trace and limited data flow trace) for ARM
· OCDS level 1+ (run control, limited program flow trace) for the TEAKLite®
· Multi-core debug support
· 4 Monitor pins for important internal signals and most pad signals
· Cerberus debugging unit
- 2 General Purpose Timers with 3 32-bit timers
- Serial number
- A real time clock with alarm functions
- 2 capture/compare units with 16 channels. One channel active during sleep mode.

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3. BB Circuit Technical brief
GD910 service manual
z3G Coprocessor Subsystem
- ARM7 TRMI-S
· 240 kByte Instruction RAM
· 64 kByte Data RAM
· 8 kByte Boot ROM
- 20kByte Communication RAM
- HW accelerators for
· Transmit Path
· Inner and Outer Receiver for Release5 incl. HSDPA
3.2.3 RF Interface(T_OUT)
S-Gold® 3H uses this interface to control RF IC and Peripherals.
[Table 3.2.3-1] RF Interface Spec.
T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 -
T_OUT2 ANT_SEL1
T_OUT3
T_OUT4 FEM control
T_OUT5 FEM control
T_OUT6 PA_MODE PAMModeselect
T_OUT7 ANT_SEL2
T_OUT8 ANT_SEL3
T_OUT9
T_OUT10