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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION...............................................9
1.1 Purpose......................................................................9
1.2 Regulatory Information.................................................9
2. PERFORMANCE............................................. 11
2.1 H/W Feature..............................................................11
2.2 Technical specification ...............................................13
3. TECHNICAL BRIEF......................................... 19
3.1 KC560 Functional Block diagram ...............................19
3.2 Baseband Processor (BBP) Introduction ......................20
3.3 Power management IC...............................................29
3.4 Power ON/OFF ..........................................................34
3.5 SIM & uSD interface ..................................................35
3.6 Memory ....................................................................37
3.7 LCD Display ..............................................................38
3.8 Keypad Switching & Scanning ....................................39
3.9 Keypad back-light illumination....................................40
3.10 LCD back-light illumination ......................................41
3.11 ALC ........................................................................42
3.12 Battery current consumption monitor ........................43
3.13 JTAG & ETM interface connector ..............................43
3.14 Audio......................................................................44
3.15 charging circuit .......................................................45
3.16 FM radio & BLUETOOTH...........................................46
3.17 18pin Multi Media Interface connector......................49
3.18 General Description .................................................50
3.19 Receiver part...........................................................52
3.20 Transmitter part.......................................................52
3.21 RF synthesizer.........................................................53
3.22 DCXO .....................................................................53
3.23 Front End Module control.........................................54
3.24 Power Amplifier Module ...........................................54
3.25 Mode Selection .......................................................55
3.26 PAM Schematic.......................................................56
4. PCB layout.................................................... 57
4.1 Main & Sub PCB component placement......................57
5. TROUBLE SHOOTING..................................... 61
5.1 Trouble shooting test setup ........................................61
5.2 Power on Trouble.......................................................62
5.3 Charging trouble........................................................65
5.4 LCD display trouble ...................................................67
5.5 Camera Trouble.........................................................69
5.6 Receiver & Speaker trouble........................................71
5.7 Microphone trouble ...................................................73
5.8 Vibrator trouble..........................................................74
5.9 Keypad back light trouble...........................................75
5.10 SIM & uSD trouble...................................................76
5.11 Photo sensor trouble................................................79
5.12 RGB LED trouble......................................................80
5.13 Trouble Shooting of Receiver Part .............................81
5.14 Trouble Shooting of Transmitter Part .........................87
6. Multi-Download ........................................... 96
7. BLOCK DIAGRAM........................................100
8. CIRCUIT DIAGRAM...................................... 101
9. BGA Pin Map ..............................................109
10. PCB LAYOUT .............................................111
11. RF Calibration .......................................... 121
11.1 Test Equipment Setup ............................................121
11.2 Calibration Step.....................................................121
12. STAND-ALONE TEST ................................. 126
12.1 Test Program Setting .............................................126
12.2 Tx Test..................................................................128
12.3 Rx Test..................................................................129
13. ENGINEERING MODE................................. 131
14. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................. 133
14.1 EXPLODED VIEW ...................................................133
14.2 Replacement Parts ................................................135
14.3 Accessory .............................................................157