LG KE 770 User manual

Service Manual Model : KE770
Service Manual
KE770
Date: April, 2007 / Issue 1.0

- 3 -
The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to
equipment design as advances in engineering and manufacturing methods warrant.
This manual provides the information necessary to install, program, operate and maintain the KE770 .
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
K.M.J 2007/01/10 0.1
K.M.J 2007/03/20 0.2

- 4 -

- 5 -
1. INTRODUCTION ...............................7
1.1 Purpose .................................................. 7
1.2 Regulatory Information............................ 7
1.3 ABBREVIATION ..................................... 9
2. PERFORMANCE .............................11
2.1 H/W Features.........................................11
2.2 Technical specification...........................12
3. TECHNICAL BRIEF ........................19
3.1 KE770 Component Block diagram.........20
3.2 Baseband Processor (BBP)
Introduction ............................................21
3.3. Power management IC .........................32
3.4. Power ON/OFF .....................................38
3.5. SIM interface.........................................39
3.6. Memory .................................................40
3.7. LCD Display ..........................................41
3.8. Keypad Switching & Scanning..............42
3.9. Keypad back-light illumination ..............43
3.10. LCD back light illumination..................43
3.11 Battery current consumption monitor ...45
3.12 JTAG & ETM interface connector ........45
3.13. Audio...................................................46
3.14. Battery charging/ USB charging circuit49
3.15. BLUETOOTH ......................................50
3.16. Micro SD external memory card slot...55
3.17. 18pin Multi Media Interface connector 57
3.18. General Description ............................59
3.19. Receiver part.......................................61
3.20. Transmitter part...................................62
3.21. RF synthesizer ....................................63
3.22. VCTCXO .............................................63
3.23. Front End Module control....................64
3.24. Power Amplifier Module ......................65
4. PCB layout......................................66
4.1 Main & Sub PCB component
placement ..............................................66
5. Trouble shooting............................68
5.1 Trouble shooting test setup....................68
5.2 Power on Trouble...................................69
5.3 Charging trouble ....................................72
5.4 LCD display trouble................................75
5.5 Camera Trouble .....................................76
5.6 Receiver & Speaker trouble ...................78
5.7 Microphone trouble ................................80
5.8 Vibrator trouble ......................................82
5.9 Keypad back light trouble.......................84
5.10 SIM card trouble...................................85
5.11 MicroSD trouble ...................................87
5.12 RF PART TROUBLESHOOTING ........89
6. Download & S/W upgrade.................98
6.1 S/W download setup..............................98
6.2 Download program user guide...............99
7. CIRCUIT DIAGRAM ......................107
8. PCB LAYOUT ................................112
9. RF Calibration...............................117
9.1 Test Equipment Setup .........................117
9.2 Calibration Steps..................................117
10. Stand-alone Test ........................121
10.1 Test Program Setting .........................121
11. ENGINEERING MODE ................124
12. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 125
12.1 Exploded View .................................. 125
12.2 Replacement Parts ............................127
12.3 Accessory ......................................... 143
Table Of Contents

- 6 -

1. INTRODUCTION
- 7 -
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KE770
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system. There are may be risks of toll
fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that
this product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. LGE will not be
responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KE770 or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the KE770 must be performed only at the LGE or its authorized agents.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION

1. INTRODUCTION
- 8 -
E. Notice of Radiated Emissions
The KE770 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
The KE770 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference
from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.

1. INTRODUCTION
- 9 -
1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm abbreviation for the power ratio in dB of the measured power referenced to one milliwatt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output

1. INTRODUCTION
- 10 -
LED Light Emitting Diode
LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
8PSK 8 Phase Shift Keying

2. PERFORMANCE
- 11 -
2.1 H/W Features
2. PERFORMANCE
Item Feature Comment
Standard Battery Li-Ion, 800mAh
AVG TCVR Current 270mA @PL5
Standby Current 2.3mA @PP9
Talk time 3hours (GSM TX Level 7)
Standby time 300 hours (Paging Period:5, RSSI: -85dBm)
Charging time 2.5 hours
RX Sensitivity GSM900 : -105dBm, DCS/PCS : -105dBm
TX output power GSM900: 32dBm (Level 5)
DCS/PCS: 29dBm (Level 0)
GPRS compatibility Class 10
SIM card type 3V Plug in Type
Display 176 x 220 pixels, 265K color, TFT
Soft icons
Key Pad
Status Indicator 0 ~ 9, #, *, Navigation Key,
Clear Key / Volume key
END/PWR Key, Camera key
ANT Built in antenna
EAR Phone Jack 18pin multi port Ear_jack with Remote controller
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Hand Strap / Ear phone

2. PERFORMANCE
- 12 -
2.2 Technical specification
Item Description Specification
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124)
EGSM
TX: 890 + 0.2 x (n-1024) MHz
1Frequency Band RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
2Phase Error RMS < 5 degrees
Peak < 20 degrees
3Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
533 dBm 2dB 13 17 dBm 3dB
631 dBm 3dB 14 15 dBm 3dB
729 dBm 3dB 15 13 dBm 3dB
827 dBm 3dB 16 11 dBm 5dB
925 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4Power Level 12 19 dBm 3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
030 dBm 2dB 8 14 dBm 3dB
128 dBm 3dB 9 12 dBm 4dB
226 dBm 3dB 10 10 dBm 4dB
324 dBm 3dB 11 8 dBm 4dB
422 dBm 3dB 12 6 dBm 4dB
520 dBm 3dB 13 4 dBm 4dB
618 dBm 3dB 14 2 dBm 5dB
716 dBm 3dB 15 0 dBm 5dB

2. PERFORMANCE
- 13 -
Item Description Specification
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5Output RF Spectrum 6,000 -71
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM850
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6(due to switching transient) 600 -21
1,200 -21
1,800 -24

2. PERFORMANCE
- 14 -
Item Description Specification
DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6(due to switching transient) 600 -24
1,200 -24
1,800 -27
7Spurious Emissions Conduction, Emission Status
GSM850
8Bit Error Ratio BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9Rx Level Report accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 *-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.

2. PERFORMANCE
- 15 -
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion -10 33.3
033.7
731.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18 <Change> System frequency 2.5ppm
(26 MHz) tolerance
19 <Change>32.768KHz tolerance 30ppm
Standby
20 Power consumption - Normal 5.2mA(Max. power)
21 Talk Time GSM900/Lvl 7 (Battery Capacity 800mA):240 min
GSM900/Lvl 12(Battery Capacity 800mA):420 min
Under conditions, at least 300 hours:
1. Brand new and full 800mAh battery
22 Standby Time 2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Current Fast Charge : < 450 mA
Slow Charge: < 55mA
Antenna Bar Number Power
5-85 dBm ~
4-90 dBm ~ -86 dBm
25 Antenna Display 3 -95 dBm ~ -91 dBm
2-100 dBm ~ -96 dBm
1-105 dBm ~ -101 dBm
0~-105 dBm

2. PERFORMANCE
- 16 -
Item Description Specification
Battery Bar Number Voltage( 0.05V)
43.86V~4.2V
26 Battery Indicator 3 3.75V~3.85V
23.75V~3.69V
13.69V~3.62V
03.62V~
27 Low Voltage Warning 3.58V↓0.05V (Call)
3.50V↓0.05V (Standby)
28 Forced shut down Voltage 3.4 0.05 V
Li-ion Battery
29 Battery Type Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
30 Travel Charger Input: 100 ~ 240 V, 50/60Hz
Out put: 4.8V , 0.9A

* EDGE RF Specification (Option: KG99 is not serviced for ”EDGE mode”)
2. PERFORMANCE
- 17 -
Item Description Specification
1RMS EVM 9%
2Peak EVM 30%
395
th Percentile EVM 15%
4Origin Offset Suppression ≥ 30dB
EGSM
Level Power Toler. Level Power Toler.
527dBm 3dB 13 17dBm 3dB
627dBm 3dB 14 15dBm 3dB
727dBm 3dB 15 13dBm 3dB
827dBm 3dB 16 11dBm 5dB
925dBm 3dB 17 9dBm 5dB
10 23dBm 3dB 18 7dBm 5dB
11 21dBm 3dB 19 5dBm 5dB
5Power Level 12 19dBm 3dB
DCS1800, PCS1900
Level Power Toler. Level Power Toler.
026dBm 3dB 8 14 dBm 3dB
126dBm 3dB 9 12 dBm 4dB
226dBm 3dB 10 10 dBm 4dB
324 dBm 3dB 11 8 dBm 4dB
422 dBm 3dB 12 6 dBm 4dB
520 dBm 3dB 13 4 dBm 4dB
618 dBm 3dB 14 2 dBm 5dB
716 dBm 3dB 15 0 dBm 5dB
6Output RF Spectrum EGSM
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6,000 -71

2. PERFORMANCE
- 18 -
Item Description Specification
6Output RF Spectrum DCS1800, PCS1900
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6,000 -71
7Output RF Spectrum EGSM
(due to switching transient) Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 --30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30

3. TECHNICAL BRIEF
- 19 -
Baseband circuit
3.1 KE770 Component Block diagram.
3. TECHNICAL BRIEF
Figure 1 KE770 Functional block diagram

3. TECHNICAL BRIEF
- 20 -
3.2 Baseband Processor (BBP) Introduction
3.2.1 General Description
S-GOLD2TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD2TM Provides multimedia extensions such as
camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and
mixed signal portions of the base band in 0.13um, 1.5V technology.
The chip will fully support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD2TM support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12) and EGPRS (up to class 12) without additional external hardware.
Figure 2. Top level block diagram of the S-GOLD2TM (PMB8876)

3. TECHNICAL BRIEF
- 21 -
3.2.2 Block Description
• Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for
connecting the ARM and the other master capable building blocks with the internal and external
memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD2. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission