LG KM555 User manual
Service Manual Model : KM555
Internal Use Only
Service Manual
KM555
Date: November, 2009 / Issue 1.0
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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. Introduction ...................................................5
1.1 Purpose......................................................................5
1.2 Regulatory Information.................................................5
1.3 Abbreviation................................................................7
2. performance................................................... 9
2.1 Supporting Standard....................................................9
2.2. Main Parts .................................................................9
2.3 H/W features.............................................................10
2.4 HW Spec. .................................................................12
3. BB Circuit Technical brief............................ 18
3.1 Functional Block Diagram ..........................................18
3.2 Baseband Processor Introduction ...............................19
3.3 Power management IC...............................................33
3.4. Power ON/OFF .........................................................40
3.5 SIM Interface.............................................................41
3.6 T - Flash connector....................................................42
3.7 Memory ....................................................................43
3.8 LCD Display ..............................................................44
3.9 keypad back-light illumination ....................................45
3.10 LCD back-light illumination ......................................46
3.11 Battery voltage monitor............................................48
3.12 Audio......................................................................49
3.13 WLAN/Bluetooth/FM (RWFS-B971A).........................52
3.14 5PIN Interface connector..........................................55
4. RF Circuit Technical Brief ............................ 56
4.1 General Description ...................................................56
4.2 GSM Part..................................................................59
4.3 WCDMA Part.............................................................63
4.4 GSM Power Amplifier Module.....................................66
4.5 WCDMA Band1/8 Power Amplifier Module ..................67
4.6 WCDMA Band1/8 Low Noise Amplifier........................68
4.7 WCDMA Band1 Duplexer ...........................................69
4.8 WCDMA Band8 Duplexer ...........................................70
5. Trouble shooting .......................................... 71
5.1. Trouble shooting test setup........................................71
5.2. Power on trouble ......................................................72
5.3 Charging Trouble .......................................................75
5.4 SIM Detect Trouble ....................................................77
5.5 Three-KEY backlight Trouble.......................................80
5.6 Micro SD Trouble.......................................................81
5.7 Audio Trouble ............................................................83
5.8 Microphone Trouble ...................................................89
5.9 3M Camera Trouble ...................................................93
5.10 Main LCD Trouble ....................................................95
5.11 Touch Sensor ..........................................................97
5.12 WiFi /Bluetooth Trouble ............................................99
6. Download & S/W upgrade .........................104
7. Block diagram............................................115
8. Circuit Diagram.......................................... 117
9. BGA Pin Map .............................................. 123
10. PCB Layout............................................... 127
11. RF Calibration .......................................... 129
11.1 Test Equipment Setup ............................................129
11.2 Calibration Step.....................................................129
12. Exploded view & Replacement part list .135
12.1 Exploded view .......................................................135
12.2 Replacement Parts ................................................137
12.3 Accessory .............................................................159
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Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
1. Introduction
1. Introduction
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INTRODUCTION
1.1.Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KM555.
1.2.Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.
There might be risks of toll fraud associated with your telecommunications system. System users are
responsible for programming and configuring the equipment to prevent unauthorized use. LGE does
not warrant that this product is immune from the above case but will prevent unauthorized use of
common carrier telecommunication service of facilities accessed through or connected to it. LGE will
not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KM555 or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
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1. Introduction
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D. Maintenance Limitations
Maintenance limitations on the KM555 must be performed only by the LGE or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
KM555 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following
information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
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1. Introduction
1. Introduction
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1.3. ABBREVIATION
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
1.3 Abbreviation
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RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal
Oscillator
WAP Wireless Application Protocol
8PSK 8 Phase Shift Keying
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2. Performance
2. Performance
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2. PERFORMANCE
2.1. Supporting Standard
Item Feature Comment
Supporting Standard WCDMA 900 / WCDMA
2100/HSDPA
GSM850/EGSM/DCS/PCS1 with
seamless handover
Phase 2+(include AMR)
SIM Toolkit : Class 3
Frequency Range GSM850 TX : 824 - 849MHz
GSM850 RX : 869 - 894MHz
EGSM TX : 880 - 915 MHz
EGSM RX : 925 - 960 MHz
DCS TX : 1710 - 1785 MHz
DCS RX : 1805 - 1880 MHz
PCS TX : 1850 - 1910 MHz
PCS RX : 1930 - 1990 MHz
WCDMA900 TX : 880 - 915 MHz
WCDMA900 RX : 925 - 960 MHz
WCDMA2100 TX : 1920 - 1980 MHz
WCDMA2100 RX : 2110 - 2170 MHz
HSDPA TX : 880 - 915 MHz
1920 - 1980 MHz
HSDPA RX : 925 - 960 MHz
2110 - 2170 MHz
WLAN 802.11g : 2400 – 2483.5 MHz
Application Standard WAP 2.0, JAVA 2.1
2.2. Main Parts : Solution
Item Part name Comment
Digital Baseband PMB8878 (Infineon)
Analog Baseband PMB8878 (Infineon)
RF chip TQ7M5005H (TriQuent))
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2.3. H/W features
Item Feature Comment
Form Factor Color LCD – Bar Type
Battery
1)Capacity
Standard : Li-Ion, 950mAh
2) Packaging Type : Soft Pack
Item Feature Comment
Size 105.9 × 53.4 × 11.95mm
Weight 105g With Battery
Stand-by
time
GSM 227 hours @paging period 5
WCDMA 227hours @DRX=7
Talk
time
GSM 170min @ Power Level 5
WCDMA 170min @Tx=12dBm
Charging time 2hours 20min @power
OFF/1000mAh
Rx sensitivity EGSM900 : -105 dBm
DCS1800 : -105 dBm
PCS1900 : -105 dBm
WCDMA2100 : -106.7 dBm
TX output
power
GSM/
GPRS
EGSM900 : 32 dBm
DCS1800 : 30 dBm
PCS1900 : 29.5 dBm
Class4 (EGSM900)
Class1(DCS)
Class1(PCS)
EDGE EGSM900 : 27 dBm
DCS1800 : 26 dBm
PCS1900 : 26 dBm
E2 (EGSM900)
E2 (DCS)
E2 (PCS)
GPRS compatibility GPRS Class 12
EDGE compatibility EDGE Class 12
Display Main LCD(3”, 480 x 800)/TFT
Built-in Camera 3 Mega pixel
ANT Main : Internal Fixed Type
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System connector 5 Pin
Ear Phone Jack ĭ3.5 4 Pole, Stereo
PC synchronization Yes
Speech coding FR, EFR, HR, AMR
Vibrator Built in Vibrator
Bluetooth V2.1 with A2DP
Voice Recording Yes
Speaker Phone
mode Support
Yes
Travel Adapter Yes
CDROM No
Stereo Headset Yes
Data Cable No
T-Flash Yes Not Equipped
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2.4. HW Spec.
2.4.1 GSM Transmitter/Receiver spec.
Item Specification
Frequency
GSM 850 TX : 824 - 849 MHz RX : 869 - 894 MHz
EGSM TX : 880 - 915 MHz RX : 925 - 960 MHz
DCS TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz
PCS TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz
Phase Error Rms : 5°
Peak : 20 °
Frequency Error GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance) GSM/DCS : < -28dBm
Transmitter Output power and
Burst Timing
GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out
to less than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out
to larger than 1800kHz offset to
the edge of the transmit band
GSM : 1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS : 1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching
transient
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection –
Speech channels ± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)
AM Suppression
TGSM : -31dBm - DCS : -
29dBm
-98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T
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2.4. HW Spec.
2.4.1 GSM Transmitter/Receiver spec.
Item Specification
Frequency
GSM 850 TX : 824 - 849 MHz RX : 869 - 894 MHz
EGSM TX : 880 - 915 MHz RX : 925 - 960 MHz
DCS TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz
PCS TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz
Phase Error Rms : 5°
Peak : 20 °
Frequency Error GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance) GSM/DCS : < -28dBm
Transmitter Output power and
Burst Timing
GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out
to less than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out
to larger than 1800kHz offset to
the edge of the transmit band
GSM : 1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS : 1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching
transient
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection –
Speech channels ± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)
AM Suppression
TGSM : -31dBm - DCS : -
29dBm
-98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T
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2.4.2 WCDMA Transmitter spec.
Item Specification
Transmit Frequency WCDMA900 : 880 – 915MHz
WCDMA2100 : 1920 MHz ~ 1980 MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPM
Open Loop Power Control Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage
Power Ratio (ACLR)
> 33 dB @ ±5 MHz,
> 43 dB @ ±10 MHz
Spurious Emissions
|f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz f < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz f < 12.75 GHz
< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz
< -67 dBm / 100 kHz RW @ 925 MHz f 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz f 1880 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout -20 dBm
Peak Code Domain Error < -15 dB at Pout t -20 dBm
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2.4.3 WCDMA Receiver spec.
Item Specification
Receive Frequency WCDMA900 : 925 MHz ~ 960 MHz
WCDMA2100 : 2110 ~2170 MHz
Reference Sensitivity Level BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz
A
djacent Channel Selectivity
(ACS)
ACS > 33 dB where BER < 0.001 when Îor = -92.7 dBm / 3.84
MHz
& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -44
dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz f 12.75 GHz
Inner Loop Power Control In
Uplink
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24
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2.4.4 HSDPA Transmitter Spec..
Sub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz
Maximum Output Power
3GPP Not Complete
Error Vector Magnitude
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ ·5 MHz
> 43 dB @ ·10 MHz
Adjacent Channel
Leakage
Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Spectrum Emission
Mask
G
G
G
G
G
G
G
G
G
G
G
HS-DPCCH
880 MHz ~ 915 MHz 1920MHz ~ 1980 MHzTransmit Frequency
SpecificationItem
+/- 2.35End of CQI4
+/- 0.60Middle of CQI3
+/- 0.61Start of CQI2
+/- 2.36Start of Ack/Nack1
5
Transmitter
power step
tolerance
[dB]
Power
step
size, P
[dB]
Power step slot
boundary
Power
step
Sub-
test in
table
C.10.1.
1 MHz-49dBc8.5 ~ 12.5 MHz
1 MHz
-35-10Ý(ଠf-7.5)dBc
7.5 ~ 8.5 MHz
1 MHz
-35-1Ý(ଠf-3.5)dBc
3.5 ~ 7.5 MHz
30 kHz
-35-15Ý(ଠf-2.5)dBc
2.5 ~ 3.5 MHz
Measurement
Bandwidth
Minimum requirementFrequency offset from
carrier ଠf
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2.4.4 HSDPA Transmitter Spec..
Sub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz
Maximum Output Power
3GPP Not Complete
Error Vector Magnitude
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ ·5 MHz
> 43 dB @ ·10 MHz
Adjacent Channel
Leakage
Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Spectrum Emission
Mask
G
G
G
G
G
G
G
G
G
G
G
HS-DPCCH
880 MHz ~ 915 MHz 1920MHz ~ 1980 MHzTransmit Frequency
SpecificationItem
+/- 2.35End of CQI4
+/- 0.60Middle of CQI3
+/- 0.61Start of CQI2
+/- 2.36Start of Ack/Nack1
5
Transmitter
power step
tolerance
[dB]
Power
step
size, P
[dB]
Power step slot
boundary
Power
step
Sub-
test in
table
C.10.1.
1 MHz-49dBc8.5 ~ 12.5 MHz
1 MHz
-35-10Ý(ଠf-7.5)dBc
7.5 ~ 8.5 MHz
1 MHz
-35-1Ý(ଠf-3.5)dBc
3.5 ~ 7.5 MHz
30 kHz
-35-15Ý(ଠf-2.5)dBc
2.5 ~ 3.5 MHz
Measurement
Bandwidth
Minimum requirementFrequency offset from
carrier ଠf
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2.4.5 HSDPA Receiver Spec..
2.4.6 WLAN 802.11g Transmitter and Receiver Spec.
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps
Maximum Input Level
(BLER or R), 16QAM Only
925 MHz ~ 960 MHz 2110 MHz ~2170 MHzReceive Frequency
S
p
ecificationItem
within ·25 PPM
Chip clock Frequency
Tolerance
˺G 20dBm under (Europe), ˺30dBm under (USA)
Tx Power Level
wlyG ˺G XWLSG
ACR ˻16dB@6Mbps, ACR ˻15dB@9Mbps,
ACR ˻13dB@12Mbps, ACR ˻11dB@18Mbps,
ACR ˻8dB@24Mbps, ACR ˻4dB@36Mbps
ACR ˻0dB@48Mbps, ACR ˻-1dB@54Mbps
hjyGGGGGGGGNGG
ZGiGGGTG
GGGGGG
Rx Adjacent Channel
Rejection
˻-20dBm
(
6,9,12,18,24,36,48,54Mb
p
s
) @
PER ˺10%
Rx Max in
p
ut Sensitivit
y
PER ˺10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Min input Sensitivity
< -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHzG
Spurious Emissions
˺-5dBTransmitter constellation error
(rms EVM)
˺-20 @ ·11MHz offset (9Mhz ~ 11MHz)
˺-28 @ ·20MHz offset (11MHz ~ 20Mhz)
˺-40 @ ·30MHz offset (20MHz ~ 30Mhz)
Spectrum Mask
within ·25 PPM
Frequency Tolerance
2400 MHz ~ 2483.5 MHz ( CH1~CH13 )Transmit Frequency
SpecificationItem
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2.4.5 HSDPA Receiver Spec..
2.4.6 WLAN 802.11g Transmitter and Receiver Spec.
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps
Maximum Input Level
(BLER or R), 16QAM Only
925 MHz ~ 960 MHz 2110 MHz ~2170 MHzReceive Frequency
S
p
ecificationItem
within ·25 PPM
Chip clock Frequency
Tolerance
˺G 20dBm under (Europe), ˺30dBm under (USA)
Tx Power Level
wlyG ˺G XWLSG
ACR ˻16dB@6Mbps, ACR ˻15dB@9Mbps,
ACR ˻13dB@12Mbps, ACR ˻11dB@18Mbps,
ACR ˻8dB@24Mbps, ACR ˻4dB@36Mbps
ACR ˻0dB@48Mbps, ACR ˻-1dB@54Mbps
hjyGGGGGGGGNGG
ZGiGGGTG
GGGGGG
Rx Adjacent Channel
Rejection
˻-20dBm
(
6,9,12,18,24,36,48,54Mb
p
s
) @
PER ˺10%
Rx Max in
p
ut Sensitivit
y
PER ˺10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Min input Sensitivity
< -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHzG
Spurious Emissions
˺-5dBTransmitter constellation error
(rms EVM)
˺-20 @ ·11MHz offset (9Mhz ~ 11MHz)
˺-28 @ ·20MHz offset (11MHz ~ 20Mhz)
˺-40 @ ·30MHz offset (20MHz ~ 30Mhz)
Spectrum Mask
within ·25 PPM
Frequency Tolerance
2400 MHz ~ 2483.5 MHz ( CH1~CH13 )Transmit Frequency
SpecificationItem
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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. BB Circuit Technical brief
3. BB Circuit Technical brief
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3.1 Functional Block Diagram
[Figure 3.1] Functional Block Diagram
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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. BB Circuit Technical brief
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Copyright གྷ2008 LG Electronics. Inc. All right reserved.
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3.2 Baseband Processor Introduction
[Figure 3.2] Top level block diagram of S-GOLD®3H(PMB8878)
- 20 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. BB Circuit Technical brief
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Copyright གྷ2008 LG Electronics. Inc. All right reserved.
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3.2.1 General description
S-GOLD®3H is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a
mixed signal baseband IC combined with a 3G coprocessor IC, providing all analog and digital
functionality for a dual mode mobile phone in a single chip.
Both ICs building up the S-GOLD®3H SiP are manufactured in infineon Technologies` 1.35V 90nm
CMOS technology to meet the ever increasing demands of the market for feature rich and high
performance terminals at low costs.
The chip will support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD®3H support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external
hardware.
3.2.2. Block Description
zProcessing core
- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate
Motion Estimation algorithms with based video encoding schemes..
- TEAKLite DSP core
zARM9-Memory
- 32k Byte Boot ROM on the AHB
- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 32k Byte Instruction Cache
- 32k Byte Data Cache
- 8k Byte Instruction Tightly coupled Memory (I-TCM)
- 8k Byte Data tightly coupled memory (D-TCM)
zTEAKLite®-Memory
- 120k x 16bit Program ROM
- 8k x 16bit Program RAM
- 72k x 16bit Data ROM
- 48k x 16bit Data XRAM
- 5k x 16bit Data YRAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
- 21 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. BB Circuit Technical brief
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Copyright གྷ2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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zShared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite®.
zController Bus system
The processor cores and their peripherals are connected by powerful buses.
- Multi-layer AHB for connecting the ARM and the other master capable building blocks with the
internal and external memories and with the peripheral buses.
- An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.
- A controller FPI bus for connecting the low performance controller peripherals such as keypad
etc. called hereafter fPI2 bus.
- FPI2 and FPI3 are connected asynchronously to the AHB buses. 1 DMA controller with
8channels offloads the controller from data transfers.
- 2 AHB Lite buses for connecting multi-media and high performance peripherals, called
AHB_PER1 and AHB_PER2 hereafter. These peripheral buses are connected to the multi-layer
AHB ‘backbone’ by asynchronous, burst capable AHB2AHB bridges which are shared between
accessing masters.
- The DMA controller is enabled to access AHB_PER1 by use of its first master interface and
AHB_PER2 by its second master interface.
zTEAKLite® Bus System
- 1 TEAKLite® data bus for connecting the TEAKLite® data memory and the TEAKLite® peripherals.
Also the data bus is connected into the controller system via shared RAMs to the FPI3 bus.
- 1 TEAKLite® program bus for connecting the TEAKLite® program memory to the TEAKLite®.
zClock system
The clock system allows widely independent selection of frequencies for the essential parts of the S-
GOLD®3H. Thus power consumption and performance can be optimized for each application.
zFunctional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with four additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
· GMSK Modulator: gauss-filter with B*T=0.3
· EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
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