LG LG-A230 User manual

Internal Use Only
Service Manual
LG-A230
Date: May, 2011 / Issue 1.0

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Table Of Contents
1. INTRODUCTION...................................................................3
1.1 Purpose .....................................................................................................3
1.2 Regulatory Information ......................................................................3
1.3 Abbreviations..........................................................................................5
2. PERFORMANCE....................................................................7
2.1 H/W Features...........................................................................................7
2.2 Technical Specification........................................................................9
3. TECHNICAL BRIEF..............................................................13
3.1 Digital Main Processor...................................................................... 13
3.2 Power Management ......................................................................... 18
3.3 FEM with integrated Power Amplifier Module
(SKY77550, U500)............................................................................... 31
3.4 Crystal(26 MHz, X100) ...................................................................... 33
3.5 RF Subsystem (U101)........................................................................ 35
3.6 MEMORY(H8BCS0QG0MMR, U100)............................................ 40
3.7 BT module............................................................................................. 42
3.8 SIM Card Interface.............................................................................. 44
3.9 LCD Interface........................................................................................ 45
3.10 Battery Charger Interface............................................................. 48
3.11 Audio Interface................................................................................. 49
3.12 Camera Interface(1.3M Fixed Focus Camera)....................... 55
4. TROUBLE SHOOTING ........................................................57
4.1 RF Component .................................................................................... 57
4.2 RX Trouble ............................................................................................. 58
4.3 TX Trouble.............................................................................................. 64
4.4 Power On Trouble............................................................................... 70
4.5 Charging Trouble................................................................................ 73
4.6 Vibrator Trouble .................................................................................. 76
4.7 LCD Trouble .......................................................................................... 79
4.8 Camera Trouble................................................................................... 83
4.9 Speaker / Receiver Trouble............................................................. 87
4.10 Earphone Trouble ............................................................................ 90
4.11 Microphone Trouble....................................................................... 93
4.12 SIM Card Interface Trouble........................................................... 96
4.13 Micro SD (uSD) Trouble ................................................................. 99
4.14 Bluetooth Trouble..........................................................................102
4.15 FM Radio Trouble...........................................................................105
4.16 Wireless FM Radio Trouble .........................................................107
5. DOWNLOAD.....................................................................110
6. BLOCK DIAGRAM.............................................................123
7. CIRCUIT DIAGRAM ..........................................................124
8. BGA PIN MAP ..................................................................129
9. PCB LAYOUT.....................................................................131
10.ENGINEERING MODE .....................................................133
11. STAND ALONE TEST ......................................................134
11.1 Introduction.....................................................................................134
11.2 Setting Method ..............................................................................134
11.3 Tx Test .................................................................................................137
11.4 Rx Test.................................................................................................139
12. AUTO CALIBRATION......................................................141
12.1 Overview...........................................................................................141
12.2 Directory structure of Tachyon.................................................141
12.3 Description of Folder & File........................................................142
12.4 Procedure..........................................................................................143
12.5 Tachyon Main UI.............................................................................144
12.6 AGC......................................................................................................145
12.7 APC ......................................................................................................145
12.8 ADC......................................................................................................145
12.9 Target Power....................................................................................145
13. EXPLODED VIEW & REPLACEMENT PART LIST ..........146
13.1 EXPLODED VIEW.............................................................................146
13.2 Replacement Parts ........................................................................147
13.3 Accessory ..........................................................................................163

1. INTRODUCTION
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services. System
users are responsible for the security of own system. There are may be risks of toll fraud associated with your
telecommunications system. System users are responsible for programming and configuring the equipment
to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the
above case but will prevent unauthorized use of common-carrier telecommunication service of facilities
accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
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1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also
grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

1. INTRODUCTION
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
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1. INTRODUCTION
Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM

2. PERFORMANCE
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Standard Battery Lithium-Ion, 3.7V 950mAh
Stand by TIME Up to 605 hrs : Paging Period 5, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 389 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power GSM, EGSM: 32.3dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
SIM card type 3V / 1.8V
Display MAIN : 1.77” QVGA 160 Ý128 pixel
Status Indicator Send Key, End Key, Navi Key (Up,Down,Left,Right)
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
GPRS compatibility Class 10
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Travel Adapter Yes
Speaker/Receiver
MIDI SW MIDI (Mono SPK)
Camera 1.3M FF
Bluetooth / FM Radio Bluetooth version 2.1 / 76~108MHz supported
18x12ȰSpeaker/ Receiver
Approx 3.5hours

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
2.2 Technical Specification
Item Description Specification
1 Frequency Band
GSM850 EGSM
TX: 824 ~ 849 MHz TX: 880 ~ 915MHz
RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz
DCS
TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
PCS
TX: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
4 Power Level
Level Power Toler. Level Power Toler.
6 31dBm ·3dB 14 15dBm ·3dB
7 29dBm ·3dB 15 13dBm ·3dB
8 27dBm ·3dB 16 11dBm ·5dB
9 25dBm ·3dB 17 9dBm ·5dB
10 23dBm ·3dB 18 7dBm ·5dB
11 21dBm ·3dB 19 5dBm ·5dB
12 19dBm ·3dB
GSM850/EGSM
5 33dBm ·2dB 13 17dBm ·3dB
Level Power Toler. Level Power Toler.
1 28dBm ·3dB 9 12dBm ·4dB
2 26dBm ·3dB 10 10dBm ·4dB
3 24dBm ·3dB 11 8dBm ·4dB
4 22dBm ·3dB 12 6dBm ·4dB
5 20dBm ·3dB 13 4dBm ·4dB
6 18dBm ·3dB 14 2dBm ·5dB
7 16dBm ·3dB 15 0dBm ·5dB
DCS/PCS
0 30dBm ·2dB 8 14dBm ·3dB

2. PERFORMANCE
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
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5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
DCS/PCS
6
Output RF Spectrum
(due to switching
transient)
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
1,800 -24
Item Description Specification

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
GSM850, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy ·3 dB
10 SLR 12·3 dB
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000 -
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 4·3 dB
DCS/PCS

2. PERFORMANCE
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
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Item Description Specification
13 Receiving Response
300 -7
500 -5
1,000 -5
3,000 -5
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000
3,400 -10
2
*
0
2
-12
0
2
2
14 STMR > 17 dB
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
15 Stability Margin > 6 dB
-20
-10
0
7
dB to ARL (dB) Level Ratio (dB)
-35
-30
10
30.7
33.3
33.7
31.7
17.5
22.5
25.5
16 Distortion
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency
(13 MHz) tolerance ˺2.5 ppm
19 32.768KHz tolerance ˺30 ppm
20 Ringer Volume
At least 55 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 1 m

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2. PERFORMANCE
Item Description Specification
21 Charge Current
Fast Charge : Typ. 400 mA
Slow Charge : Typ. 95mA
Total Charging Time : < 3 hours
2 -> 1
0 -> OFF
Bar Number Power
4 -> 2
-104 ·2
Under -106
-101 ·2
22 Antenna Display
23
Battery Indicator
(SPG:Software Power Gauge)
24 Low Voltage Warning
( Blinking Bar)
5% in 950mA, 1 time (standby)
10% in 950mA, 1 time (standby)
5% in 950mA, 1 time (Call)
10% in 950mA, 1 time (Call)
25 Forced shut down
Voltage 3.35 ·0.05V
27 Battery Type
Lithium-Ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 950mAh
28 Travel Charger
Switching-mode charger
Input: 100 ~ 240V, 50/60 Hz
Output: 4.8V, 400mA
26 Sustain RTC
without battery Over 15 Mins
5
5 -> 4
Over -93
-93 ·2
1 -> 0 -106 ·2
50%Half Battery
100%Full Battery
PercentageBattery Bar display

3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
'LJLWDO0DLQ3URFHVVRU
)LJXUH;*ROGWP+DUGZDUH%ORFN'LDJUDP

3.1 Digital Main Processor
Figure. 3.1.1 X-Gold 215 Hardware Block Diagram

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3. TECHNICAL BRIEF
3.1.1 General
• Technology:
– SoC, Monolithic, 65 nm CMOS
• Package:
– eWLB, 8x8x0.8 mm
– 0.5 mm pitch
– 217 balls / 8-layer PCB
3.1.2 RF Transceiver
• Dual-band direct conversion receiver
• Tri/Quad-band possible with external circuitry
• Fully integrated digital controlled X0
• Additional buffer for 2 external system clocks
• Fully digital RF-Synthesizer incl. ȭȟ-Transmitter
3.1.3 Baseband
• DSP:
– 156 MHz TeakLite™
• MCU:
– ARM1176® @ 208 MHz
• MCU RAM:
– 3.00Mbit
• Memory I/F:
– 512 Mbit
• Modem:
– GPRS class 12, (RX/TX CS1-CS4)
– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)
• Cipher Units:
– A51/2/3
– GEA-1/2/3
• Security:
– OMTP TR0
– Secure Boot
– RSA(ROM)/SHA-1(HW accel.)
– OCDS disabling
– Certificate Management

3. TECHNICAL BRIEF
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
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• Speech Codec:
– FR / HR / EFR / NB-AMR
• Audio Codec (running on ARM1176):
– SP-MIDI
– SB-ADPCM
– MP3
– WB-AMR
– AAC/AAC+/eAAC+
• Others:
– DARP (SAIC)
– TTY
• Customization:
– E-Fuses
3.1.4 External Memory
• External Bus Unit
– 25-bit address bus (512 Mbit)
– 16-bit data bus
– 1.8V & 2.8V support
• Flash / RAM
– NAND Type
– Serial Flash SPI and SPI-4
– Parallel Flash (Page & Burst Mode)
- 16-bit Demultiplexed
- 16-bit AD-multiplexed
- 16-bit AAD-multiplexed
– iNAND Type e.g. oneNAND
• Memory card
– SD/MMC card interface with 1 or 4 data lines
3.1.5 Connectivity
• 3xUSIF (configurable either as SPI or UART), I2C, I2S; Interfaces @ 1.8V
• Direct (U)SIM 1.8/3V
• USB2.0 up to 480 Mbit/s (High Speed) w/ external USB Phy over ULPI interface
• Stereo Headset (Amplifier integrated)
• 3 external analog measurement PIN’s
• Bluetooth

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3. TECHNICAL BRIEF
3.1.6 Mixed Signal
• Improved audio performance
• Loudspeaker Audio Class D Amplifier, 700 mW@8 ȳmono for hands-free and ringing
• Stereo Headset 2x30 mW@16 ȳw/o coupling C
• Mono Earpiece 100 mW@16 ȳ
• Digital microphone supported
• Differential microphone inputs
3.1.7 FM Radio
• Integrated FM radio
– FM Stereo RDS Receiver
– Sensitivity 2 ɆV EMF
– Support for US & EU bands
– Stereo recording
3.1.8 Power Management
• Direct-to-Battery Connection
– LDOs (incl. capless)
– DC/DC step-down converter
– DC/DC step-up for white LED supply
• Battery Type
– Li-Polymer
• Charging control
– Battery temperature
– Watchdog protection
– Start-up on flat battery
• External Charger
– Switch mode
• USB battery charging
– USB charging spec 1.0 compliant
• Backlight
– Up to 4 serial white LEDs (integrated LDO)

3. TECHNICAL BRIEF
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
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3.1.9 Main LCD Display
• Type
– 128x160, 65k color (serial)
– QQVGA, 262k color (parallel)
• Interface
– Parallel 8/9bit MIPI-DBI Type B
– Serial MIPI-DBI Type C
– Interf. voltage at 1.8V or 2.8V
• gRacr - Display Controller (Hardware)
– 30 fps Display update without DMA (up to 60 fps) (full or partial)
– Video post processing Scaling, Rotation (90¶steps), Mirroring
– Overlay with alpha blending
– Color conversion YUV -> RGB
– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmapfonts)
3.1.10 Camera
• 2 Mpx YUV parallel interface
• HW JPEG encoder (39 Mpx/sec)
• 39 MHz Pixel Rate
• 15 fps@ 2 Mpx full resolution
3.1.11 Video Capabilities
• Video Decoding MPEG-4/H.263
– QCIF@30 fps
– QVGA@15 fps
• Video Encoding MPEG-4/H.263
– QCIF@15 fps
3.1.12 Audio Capabilities
• Polyphonic ring tones
– 64 voices MIDI, SP-MIDI
– FM synthesizer
• AMR-WB
• True ring tones (MP3)
• MP3, eAAC+
• G.722 SB-ADPCM encoding/decoding

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3. TECHNICAL BRIEF
3.2 Power Management
A mobile platform requires different power supplies for different functions. These power supplies are
generated in the integrated Power Management Unit (PMU). The PMU is designed to deliver the power for a
typical standard phone. For advanced features additional off chip power supplies might be necessary.
Figure. 3-2-1 Block Figure of the PMU Modules X-GOLD™ 215
DC/DC Step Down Converter for 1.8V (SD1)
The DC/DC converter generates a 1.8 V supply rail. This voltage rail is used to supply main parts of the system,
like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the RF macro
and the external memory if a 1.8 V memory is used. The efficiency of the DC/DC converter is optimized for an
average load current of 100 mA. That is the load current estimated for the GSM talk mode.

3. TECHNICAL BRIEF
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Linear voltage Regulators (low dropout) LDOs
The LDOs are used to generate the supply for the different supply domains not directly supplied out of the
DC/DC converter.
LCORE
The LCORE LDO provides the VCORE supply used for most of the digital parts of the chip. ip
LPMU
The LPMU provides VPMU used for the PMU supply, e.g. for the startup statemachine and analog parts like
ADC, sense amplifier etc.
LUSB
The LUSB LDO generates the supply for the USB transceiver (output driver and input). If no USB interface is
required, LUSB can be used as general purpose LDO.
LAUX
The LAUX generates VAUX. It is a general purpose LDO and can be used for different functions depending on
the phone application, e.g. for the display or camera.
LMMC
The LMMC generates VMMC. It is a general purpose LDO and can be used e.g. for memory cards.
LSIM
The LSIM LDO generates the VSIM supply for the SIM card and interface. It is designed to supply Standard SIM
cards according ETSI TS 102 221.
Other LDOs
• The RF module has implemented several LDO’s for different RF power domains.
• The mixed signal module has some LDO’s for the audio driver and microphone supply
• The FM receiver has an internal LDO for sensitive RF circuits.

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3. TECHNICAL BRIEF
Table. 3-2-1 Power supply Domains (without RF)