LG LG-S367 User manual

Internal Use Only
Service Manual
LG-S367
Date: September, 2011 / Issue 1.0

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Table Of Contents
1. INTRODUCTION...................................................................3
1.1 Purpose .....................................................................................................3
1.2 Regulatory Information ......................................................................3
1.3 Abbreviations..........................................................................................5
2. PERFORMANCE....................................................................7
2.1 H/W Features...........................................................................................7
2.2 Technical Specification........................................................................9
3. TECHNICAL BRIEF..............................................................14
3.1 Digital Main Processor...................................................................... 14
3.2 Power Management ......................................................................... 19
3.3 FEM with integrated Power Amplifier Module
(SKY77550, U400)............................................................................... 32
3.4 Crystal(26 MHz, X100) ...................................................................... 34
3.5 RF Subsystem (U100)........................................................................ 36
3.6 MEMORY(H8BCS0QG0MMR, U101)............................................ 41
3.7 BT module............................................................................................. 43
3.8 Dual SIM Card Interface................................................................... 45
3.9 LCD Interface........................................................................................ 46
3.10 Battery Charger Interface............................................................. 49
3.11 Keypad Interface............................................................................. 50
3.12 Audio Front-End............................................................................... 52
3.13 Camera Interface(2M Fixed Focus Camera) .......................... 59
3.14 KEY BACLKLIGHT LED Interface ................................................. 61
3.15 Vibrator Interface............................................................................. 62
4. TROUBLE SHOOTING ........................................................63
4.1 RF Component .................................................................................... 63
4.2 RX Trouble ............................................................................................. 64
4.3 TX Trouble.............................................................................................. 70
4.4 Power On Trouble............................................................................... 76
4.5 Charging Trouble................................................................................ 79
4.6 Vibrator Trouble .................................................................................. 82
4.7 LCD Trouble .......................................................................................... 85
4.8 Camera Trouble................................................................................... 89
4.9 Speaker Trouble .................................................................................. 93
4.10 Earphone Trouble ............................................................................ 96
4.11 Receiver Trouble............................................................................... 99
4.12 Microphone Trouble.....................................................................102
4.13 SIM Card Interface Trouble.........................................................105
4.14 KEY backlight Trouble..................................................................108
4.15 Micro SD (uSD) Trouble ...............................................................111
4.16 Bluetooth Trouble..........................................................................114
4.17 FM Radio Trouble...........................................................................116
5. DOWNLOAD.....................................................................119
6. BLOCK DIAGRAM.............................................................132
7. CIRCUIT DIAGRAM ..........................................................133
8. BGA PIN MAP ..................................................................138
9. PCB LAYOUT.....................................................................144
10. ENGINEERING MODE ....................................................148
11. STAND ALONE TEST ......................................................149
11.1 Introduction.....................................................................................149
11.2 Setting Method ..............................................................................149
11.3 Tx Test .................................................................................................152
11.4 Rx Test.................................................................................................154
12. AUTO CALIBRATION......................................................155
12.1 Overview...........................................................................................155
12.2 Configurationof Tachyon............................................................155
12.3 Description of Folder & File........................................................156
12.4 Procedure..........................................................................................157
12.5 Tachyon Main UI.............................................................................158
12.6 AGC......................................................................................................159
12.7 APC ......................................................................................................159
12.8 ADC......................................................................................................159
12.9 Target Power....................................................................................159
13. EXPLODED VIEW & REPLACEMENT PART LIST ..........160
13.1 EXPLODED VIEW.............................................................................160
13.2 Replacement Parts ........................................................................161
13.3 Accessory ..........................................................................................177

1. INTRODUCTION
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons
other than your company’s employees, agents, subcontractors, or person working on your company’s behalf)
can result in substantial additional charges for your telecommunications services. System users are responsible
for the security of own system. There are may be risks of toll fraud associated with your telecommunications
system. System users are responsible for programming and configuring the equipment to prevent
unauthorized use. The manufacturer does not warrant that this product is immune from the above case but
will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or
connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the this phone or compatibility with the network, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note
that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also
grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

1. INTRODUCTION
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC