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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table of Contents
1. INTRODUCTION..................................................................5
1.1 Purpose............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.3 Abbreviations................................................................................... 7
2. PERFORMANCE...................................................................9
2.1 H/W Features.................................................................................... 9
2.2 Technical Specification...............................................................11
3. TECHNICAL BRIEF.............................................................16
3.1 Baseband Processor Introduction .........................................16
3.2 Power Management....................................................................21
3.3 FEM with integrated Power Amplifier Module
(RF7161, U401)...............................................................................33
FEM with integrated Power Amplifier Module........................34
3.4 Crystal(26 MHz, X100).................................................................35
3.5 RF Subsystem of PMB8810 (U102).........................................36
3.6 MEMORY(PF38F5066M0Y3DE, U101 ).................................41
3.7 BT module .......................................................................................43
3.8 SIM Card Interface........................................................................45
3.9 LCD Interface..................................................................................46
3.10 Battery Charger Interface .......................................................49
3.11 Keypad Interface........................................................................50
3.12 Audio Interface ...........................................................................52
3.13 Camera Interface(2M Fixed Focus Camera).....................58
3.14 Touch Interface ...........................................................................60
3.15 Vibrator Interface .......................................................................61
4. TROUBLE SHOOTING .......................................................63
4.1 RF Component...............................................................................63
4.2 RX Trouble .......................................................................................64
4.3 TX Trouble........................................................................................68
4.4 Power On Trouble.........................................................................72
4.5 Charging Trouble..........................................................................75
4.6 Vibrator Trouble.............................................................................77
4.7 LCD Trouble.....................................................................................80
4.8 Camera Trouble.............................................................................84
4.9 Speaker / Receiver Trouble.......................................................88
4.10 Earphone Trouble ......................................................................91
4.11 Microphone Trouble.................................................................94
4.12 SIM Card Interface Trouble.....................................................96
4.13 Micro SD (uSD) Trouble............................................................98
4.14 Bluetooth Trouble................................................................... 101
4.15 FM Radio Trouble .................................................................... 104
5. DOWNLOAD................................................................... 110
6. BLOCK DIAGRAM........................................................... 123
7. CIRCUIT DIAGRAM ........................................................ 125
8. BGA PIN MAP................................................................. 129
9. PCB LAYOUT................................................................... 131
10.ENGINEERING MODE................................................... 133
11. STAND ALONE TEST .................................................... 134
11.1 Introduction.............................................................................. 134
11.2 Setting Method........................................................................ 134
11.3 Tx Test........................................................................................... 137
11.4 Rx Test.......................................................................................... 138
12.AUTO CALIBRATION..................................................... 139
12.1 Overview .................................................................................... 139
12.2 Configuration of HotKimchi ............................................... 139
12.3 Description of Basic File ....................................................... 140
12.4 Procedure................................................................................... 141
12.5 AGC............................................................................................... 144
12.6 APC ............................................................................................... 144
12.7 ADC............................................................................................... 144
12.8 Target Power ............................................................................. 144
13 EXPLODED VIEW & REPLACEMENT
PART LIST ...................................................................... 145
13.1 EXPLODED VIEW...................................................................... 145
13.2 Replacement Parts.................................................................. 147
13.3 Accessory ................................................................................... 162