LG LGV909DW User manual

Internal Use Only
Service Manual
LG-V909DW
Date: March, 2011 / Issue 1.0

Table Of Contents
1. INTRODUCTION..................................................................... 3
1.1 Purpose ........................................................................................................3
1.2 Regulatory Information.........................................................................3
1.3 Abbreviations.............................................................................................5
2. PERFORMANCE...................................................................... 7
2.1 Product Name............................................................................................7
2.2 Supporting Standard..............................................................................7
2.3 Main Parts : GSM Solution.....................................................................7
2.4 HW Features ...............................................................................................8
2.5 SW Features............................................................................................. 11
2.6 HW SPEC. ................................................................................................. 14
2.7 V909DW Figures..................................................................................... 23
3. TECHNICAL BRIEF................................................................ 24
3.1 GENERAL DESCRIPTION...................................................................... 24
3.2 GSM MODE .............................................................................................. 27
3.3 UMTS MODE ........................................................................................... 29
3.4 GPS RECEIVER.......................................................................................... 32
3.5 LO GENERATION and DISTRIBUTION CIRCUIT............................ 33
3.6 OFF-CHIP RF COMPONENTS............................................................. 35
3.7 Hardware Architecture........................................................................ 36
3.8 Subsystem(MDM6200) ....................................................................... 37
3.9 Power Block ............................................................................................. 40
3.10 External memory interface............................................................. 42
3.11. Audio and sound ............................................................................... 43
3.12 Main (5M pixels dual) & Front (2M pixels) Camera................ 48
3.13 Display..................................................................................................... 50
3.14 HDMI........................................................................................................ 51
3.15 Compass Sensor.................................................................................. 52
3.16 Motion Sensor...................................................................................... 53
3.17 Gyro Sensor........................................................................................... 55
3.18 Illumination Sensor............................................................................ 56
3.19 Touch Module ...................................................................................... 57
3.20 Main Features....................................................................................... 58
4. TROUBLE SHOOTING .......................................................... 59
4.1 MODEM PICTURE .................................................................................. 59
4.2 Signal Path ............................................................................................... 61
4.3 Power On Trouble shooting.............................................................. 63
4.4 WCDMA Transmit block...................................................................... 71
4.5 GSM Receiver Block.............................................................................. 76
4.6 WCDMA Receiver Block ...................................................................... 79
4.7 WIFI/BT RF components ..................................................................... 82
4.8 WIFI/BT RF components ..................................................................... 83
4.9 Power ON Troubleshooting............................................................... 84
4.10 Charger troubleshooting................................................................. 85
4.11 USB Trouble shooting ....................................................................... 86
4.12 Audio troubleshooting..................................................................... 89
4.13 Camera Troubleshooting................................................................. 97
4.14 Main LCD trouble..............................................................................102
4.15 GPS Troubleshooting ......................................................................104
4.16 Key troubleshooting........................................................................107
4.17 HDMI trouble......................................................................................108
4.18 Motion sensor troubleshooting..................................................109
4.19 Gyro/Compass sensor troubleshooting..................................111
4.20 Illumination Sensor on/off trouble............................................114
4.21 Touch trouble .....................................................................................116
5. DOWNLOAD.......................................................................118
6. BLOCK DIAGRAM...............................................................137
7. CIRCUIT DIAGRAM ............................................................151
8. BGA Pin Map......................................................................175
9. PCB LAYOUT.......................................................................183
10. Calibration & RF Auto Test Program (Tachyon)............205
11. Hidden Menu...................................................................210
12. EXPLODED VIEW & REPLACEMENT PART LIST .............226
12.1 EXPLODED VIEW................................................................................226
12.2 Replacement Parts ...........................................................................227
12.3 Accessory .............................................................................................271
- 2 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

- 3 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is
not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION

- 4 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION

- 5 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION