LG 32SE3B-BE User manual

North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO :
CHASSIS :
MODEL :
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
SERVICE MANUAL
MFL67237428 (1502-REV00)
32SE3B 32SE3B-BE
LW57A
MONITOR SIGNAGE

- 2 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION........................................................................................... 3
SERVICING PRECAUTIONS.................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
BLOCK DIAGRAM.................................................................................. 15
EXPLODED VIEW .................................................................................. 16
SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer' s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly or
electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person' s body are grounded
through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight or inverter
circuit, must disconnect the AC adapter because high
voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
• Replaceable batteries
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS.
REPLACE ONLY WITH THE SAME OR EQUIVALENT
TYPE.
PRECAUTION
1.5 Kohm/10W
0.15µF
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
ADVARSEL
Lithiumbatteri - Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri af samme
fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.

- 4 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

- 5 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
SPECIFICATION
1. Application range
This specication is applied to the LW57A chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F),
CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specication and performance of each parts are followed
each drawing and specication by part number in accord-
ance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE Monitor test method followed.
2) Demanded other specication
- Safety : CE, IEC specication
- EMC : CE, IEC
4. General Specication
No. Item Content Remark
1 HDMI Input (1EA) HDMI Side / support D-TV&PC
resolution
2 DVI Input (1EA) DVI
3 RGB Input(1EA) RGB-PC Analog (D-SUB 15Pin)
4 Audio Input (1EA) RGB/DVI Audio Analog L/R Input
5 Audio Output (1EA) Line out audio Analog L/R Output
6 Speaker Output ( 1EA) Compatible with Signage speaker 10W*2Ch Output@6ohms
7 IR Sensor Input (1EA) IR Sensor Detachable Type
8 External USB (2EA) Picture, Music, Movie, SVC, WiFi Device : USB Memory Stick,
WiFi Dongle
9 RS-232C Input/Output
(1EA)
Display Control 3.5ø 4pin phone Jack
10 LAN(1EA) RJ45, 100BASE-T Network Connection for Super-
Sign W/C
11 Local Key Input, MENU, ˄, ˅, <, >, AUTO/SET,Φ(Power) 8 keys
4.1. General Specication
No. Item Specication Remarks
1Supported Sync. Type Separate Sync., Digital
2 Operating Frequency
Analog Horizontal 30 ~ 83 kHz
Vertical 50 ~ 75 Hz
Digital Horizontal 30 ~ 83 kHz
Vertical 50 ~ 60 Hz
3 Operating Frequency Analog/
Digital
Max 1920×1080 @ 60 Hz
Recommend 1920×1080 @ 60 Hz
4.2. DVI-D, HDMI Specication

- 7 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
No. Section Pol. Dot Clock
[MHz]
Frequency
[kHz]/[Hz]
Total
Cycle
(E)
Display
(A)
Front
Porch(B)
Sync.
(D)
Back
Porch(F)
Resolution
1 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400
V(Lines) + 70.8 449 400 12 2 35
2 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) - 59.94 525 480 10 2 33
3 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) + 60.317 628 600 1 4 23
4 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
5 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720
V(Lines) + 59.855 748 720 3 5 20
6 H(Pixels) - 108.0 60 1800 1280 96 112 312 1280 x 960
V(Lines) - 60 1000 960 1 3 36
7 H(Pixels) + 90.5 57.717 1568 1152 64 120 184 1152 X 864
V(Lines) + 59.934 897 864 3 4 26
8 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
9 H(Pixels) + 148.5 67.5 2200 1920 88 44 88 1920 x 1080
V(Lines) + 60 1125 1080 4 5 46
5. Signal Timing (Supporting Resolution)
5.1. RGB (PC Mode)

- 8 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.2. DVI, HDMI (PC Mode)
No. Section Pol. Dot Clock
[MHz]
Frequency
[kHz]/[Hz]
Total
Cycle
(E)
Display
(A)
Front
Porch(B)
Sync.
(D)
Back
Porch(F)
Resolution
1 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) - 59.94 525 480 10 2 33
2 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) + 60.317 628 600 1 4 23
3 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
4 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720
V(Lines) + 59.855 748 720 3 5 20
5 H(Pixels) - 85.86 47.7 1800 1366 72 144 216 1366 x 768
V(Lines) - 60 795 768 1 3 23
6 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
7 H(Pixels) - 146.25 65.290 2240 1680 104 176 280 1680 x 1050
V(Lines) + 59.954 1089 1050 3 6 30
8 H(Pixels) + 148.50 67.5 2200 1920 88 44 88 1920 x 1080
V(Lines) + 60 1125 1080 4 5 46
5.3. HDMI (DTV Mode )
No. Specication Remark
Resolution H-freq(kHz) V-freq(Hz) Proposed
1 480/60P 31.5 60 EDTV 480p
2 576/50P 31.25 50 EDTV 576p
3 720/50P 37.5 50 HDTV 720p
4 720/60P 45 60 HDTV 720p
5 1080/50i 28.1 50 HDTV 1080i 50Hz For Australian
6 1080/60i 33.75 60 HDTV 1080i 60Hz
7 1080/50P 56.25 50 HDTV 1080P 50Hz
8 1080/60P 67.5 60 HDTV 1080P 60Hz

- 9 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
This spec sheet is applied all of the Digital Signage Product
with LW57A/B chassis.
2. Designation
1) The adjustment is according to the order which is designat-
ed and which must be followed, according to the plan which
can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specication Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220V, 60Hz
6) Adjustment equipments : Color Analyzer (CA-210 or CA-
110), DDC Adjustment Jig equipment, SVC remote control-
ler.
7) Push The "IN STOP KEY" – For memory initialization.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot le Download
1) Execute ISP program "Mstar ISP Utility" and then click
"Cong" tab.
2) Set as below, and then click "Auto Detect" and check
"OK" message. If "Error" is displayed, Check connection
between computer, jig, and set.
3) Click "Read" tab, and then load download le (XXXX.bin)
by clicking "Read"
4) Click "Connect" tab. If "Can’t " is displayed, Check connec-
tion between computer, jig, and set.
5) Click "Auto" tab and set as below.
6) Click "Run".
7) After downloading, check "OK" message.
* USB DOWNLOAD(*.epk le download)
1) Put the USB Stick to the USB socket
2) Automatically detecting update le in USB Stick
- If your downloaded program version in USB Stick is Low, it
didn’t work.
- But your downloaded version is High, USB data is automati-
cally detecting
3) Show the message "Copying les from memory"
4) Updating is staring.
5) Updating Completed, The Multi-vision will restart automati-
cally.
6) If your Multi-vision is turned on, check your updated version
and Tool option. (explain the Tool option, next stage)
Case1 : Software version up
1) After downloading S/W by USB , Multi-vision set will reboot
automatically
2) Push "In-stop" key
3) Push "Power on" key
4) Function inspection
5) After function inspection, Push "In-stop" key.
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push "In-
stop" ke y at rst.
2) Push "Power on" key for turning it on.
→ If you push "Power on" key, TV set will recover channel
information by itself.
3) After function inspection, Push "In-stop" key.
(1) (3)
(
2
)
OK
Please Check the Speed :
Use the speed under
200KHz.
(4)
filexxx.bin
(
6
)
(5)
(7) ……….OK
(
5
)

- 10 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
3.1. ADC Process
3.1.1. ADC
· Enter Service Mode by pushing "ADJ" key,
· Enter Internal ADC mode by pushing "►" key at "ADC
Calibration"
* Caution : Using ‘power on’ button of the Adjustment R/C,
power on Multi-vision.
* ADC Calibration Protocol (RS232)
- Adjust Sequence
▪aa 00 00 [Enter Adjust Mode]
▪xb 00 40 [Component1 Input (480i)]
▪ad 00 10 [Adjust 480i Comp1]
▪xb 00 60 [RGB Input (1024*768)]
▪ad 00 10 [Adjust 1024*768 RGB]
▪aa 00 90 End Adjust mode
* Required equipment : Adjustment R/C.
3.2. Function Check
3.2.1. Check display and sound
· Check Input and Signal items. (cf. work instructions)
1) COMPONENT (480i), RGB Shared.
2) RGB (PC : 1024 x 768 @ 60hz)
3) HDMI
4) DVI
5) COMPOSITE (480i), RGB Shared.(Brazil, Not supported)
* Display and Sound check is executed by Remote controller.
* For Brazil, Composite is not supported.
* Caution : Not to push the INSTOP KEY after completion if
the function inspection.
4. Total Assembly line process
4.1. Adjustment Preparation
■ Luminance: 204 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
■ Color coordination according to aging time
1) ROW Direct LED(32”) & EDGE LED(43/49/55”) models (ap-
plied only LGD Module) in LGEKR (GUMI) And LGERS
▪ Luminance: 204 Gray, 80IRE
- Gumi(Mar~Dec)
▪ Standard color coordinate and temperature using CA-
210(CH-14) – by aging time
- 32SE3B
- 43/49/55/65SE3B
NO Enter
Adjust MODE
ADC adjust
Item Adjust ‘Mode In’ ADC Adjust
CMD 1 A A
CMD 2 A D
Data 0 0 1
0 0
When transfer the
‘Mode In’,
Carry the command.
Automatically adjustment
(The use of a internal
pattern)
Aging time
(Min)
Cool Medium Warm
X y xyxy
271 270 286 289 313 329
1 0-2 282 289 297 308 328 354
2 3-5 281 287 296 306 326 349
36-9 279 284 294 303 324 346
4 10-19 277 280 292 299 321 342
5 20-35 275 277 290 296 318 337
6 36-49 274 274 289 293 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9Over 120 271 270 286 289 313 329
Aging time
(Min)
Cool Medium Warm
X y xyxy
271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
36-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9Over 120 271 270 286 289 313 329
Mode Coordinate Temp ∆uv
xy
Cool 0.271±0.002 0.270±0.002 13,000K 0.0000
Medium 0.286±0.002 0.289±0.002 9,300K 0.0000
Warm 0.313±0.002 0.329±0.002 6,500K 0.0000

- 11 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
* Connecting picture of the measuring instrument
(On Automatic control)
- Inside PATTERN is used when W/B is controlled. Connect
to auto controller or push Adjustment R/C POWER-ON →
Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions
1) Adjust in the place where the inux of light like oodlight
around is blocked. (Illumination is less than 100Lux).
2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of power
supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
· Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
wb 00 00 White Balance Start
wb 00 ff White Balance End
*Caution
- Color Temperature : COOL, Medium, Warm.
- One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain ar e all C0, it is the FULL Dynamic Range
of Module)
* Manual W/B process using adjusts Remote con-
trol.
· After enter Service Mode by pushing "ADJ" key,
· Enter White Balance by pushing "►" key at "White Balance".
* After You nish all adjustments, Press "In-start" button and
compare Tool option and Area option value with its BOM, if it
is correctly same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug
AC cable.
For correct it to the model’s module from factory JIG model.
* Push The "IN STOP KEY" after completing the function
inspection. And Mechanical Power Switch must be set "ON".
4.2. MAC Address Download
(2)
(1)
(3)
· Com 1,2,3,4 and 115200(Baudrate)
· Port connection button click(1)
· Load button click(2) for MAC Address write.
· Start MAC Address write button(3)
· Check the OK Or NG
RS-232C
COMMAND
[CMD ID DATA]
M
I
N
CENTER
(DEFAULT)
M
A
X
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128

- 12 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.3. LAN (Automatic IP)
4.3.1. Equipment & Condition
· Each other connection to LAN Port of IP Hub and Jig
4.3.2. LAN PORT INSPECTION (PING TEST)
Connect : SET→LAN Port == PC→LAN Port
4.3.2.1 Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
4.3.2.2 LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and conrm OK Message.
4) remove LAN CABLE
4.4. DPM operation conrmation
Section
Sync (H/V)
Video
Wattage
Remark
Sleep Mode
(Set=On, Signal=Of f)
DPM
Off/Of f
Off
0.7W
Deep Sleep Mode
(Set=Off )
Power Off
-
-
0.5W
4.5. DDC EDID Write (RGB 128Byte )
· Connect D-sub Signal Cable to D-Sub Jack.
· Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
· Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
* In case of SKD Ass’y, it is no need to do EDID D/L. Ass’y,
Supplier does that in advance.
4.6. DDC EDID Write (DVI 128Byte)
· Connect DVI Signal Cable to DVI Jack.
· Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
· Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
* In case of SKD Ass’y, it is no need to do EDID D/L. Ass’y,
Supplier does that in advance.
4.7. DDC EDID Write (HDMI 256Byte)
· Connect HDMI Signal Cable to HDMI Jack.
· Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
· Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
* In case of SKD Ass’y, it is no need to do EDID D/L. Ass’y,
Supplier does that in advance.
4.8. EDID DATA
1) All Data : HEXA Value
2) Changeable Data : *: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
- Auto Download
· After enter Service Mode by pushing "ADJ" key,
· Enter EDID D/L mode.
· Enter "START" by pushing "OK" key.
*Caution : Never connect HDMI & D-sub Cable when EDID
downloaded.
* Edid data and Model option download (RS232)
NO Enter
download MODE
EDID data Model
option download
Item download ‘Mode In’ download
CMD 1 A A
CMD 2 A E
Data 0 0 00
0 10
When transfer the ‘Mode In’,
Carry the command.
Automatically download
(The use of a internal pattern)

- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.9 RS232 In/Out INSPECTION
1) Connect RS232 In/Out cable with daisy chain. You can
control several products at one time by connecting them to
a single PC.,
2) Check the RS232 command.
- Manual Download
* Caution
· Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
* Caution
- Never connect HDMI & D-sub Cable at the same time.
- Use the proper cables below for EDID Writing.
- Download HDMI1, HDMI2 separately because HDMI1 is dif-
ferent from HDMI2.
For Analog
EDID
For DVI EDID For HDMI EDID
D-sub to D-
sub
DVI to DVI DVI-D to HDMI
or HDMI to HDMI
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
- RGB EDID data
- DVI EDID data
- HDMI EDID dat
4.10. Outgoing condition Conguration
· When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.11. Internal pressure
- Conrm whether is normal or not when between power
board's ac block and GND is impacted on 1.5kV(dc) or
2.2kV(dc) for one second

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5. Model name & Serial number Download
5.1. Model name & Serial number D/L
· Press "Power on" key of service remocon.(Baud rate :
115200 bps)
· Connect RS232 Signal Cable to RS-232 Jack.
· Write Serial number by use RS-232.
5.2. Signal TABLE
CMD: A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 + … + Data_n
Delay : 20ms
5.3. Command Set
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart,
0, Phase
Data write : Model Name and Serial Number write in EE-
PROM,.
5.4. Method & notice
1) Serial number D/L is using of scan equipment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
* Manual Download (Model Name and Serial Num-
ber)
If the TV set is downloaded By OTA or Service man,
Sometimes model name or serial number is initialized.( Not
always) There is impossible to download by bar code scan,
so It need Manual download.
1) Press the ‘instart’ key of ADJ remote controller.
2) Go to the menu ‘5.Model Number D/L’ like below photo.
3) Input the Factory model name(ex 42LD450-ZA) or Serial
number like photo.
4) Check the model name Instart menu → Factory name
displayed (ex 42LD450-ZA)
CMD LENGTH ADH ADL DATA_1 ... Data_n CS DELAY
No. 1
Adjust mode EEPROM WRITE
CMD(hex) A0h
LENGTH(hex) 84h+n
Description n-bytes Write (n = 1~16)

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
BLOCK DIAGRAM

- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
200
400
540
542
510
LV1
A2
530
541
201
202

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_SoC
LS33B 14/10/09
PCM_A[1]
PCM_A[2]
PCM_A[3]
PCM_A[4]
PCM_A[5]
PCM_A[6]
PCM_A[7]
PCM_A[0]
R37 1K
R8 0
R24 100
OPT
R221 0
R222 0
R31 100
OPT
R34 1K
READY
R22
1M
R223 10 READY
R290
4.7K
R83
240
1%
R9 0
READY
R76 68
R224 10 READY
R289
4.7K
R81 33
R17 22
R44 22
R27 100
OPT
R61 10 READY
R10 0
R52 1K
R32 1K
READY
R225 0
READY
R226
4.7K
R62 10 READY
R40 1K
READY
R11 0
R48 1K
R28 100
OPT
R280 22
R63 22
OPT
R18 22
R43 1K
READY
R207
4.7K
R281 22
R45 22
R39 1K
R206
4.7K
R65 0
OPT
R29 100
OPT
R30 100
OPT
R80 68
R47 1K
READY
R21 33
R16 0
R204 0
R54 1K
R15 0
R205 0
R38 1K
READY
R13 0
R193 0
R75 68
R33 1K
R194 0
R35 1K
R195 0
R196 0
R79 33
R51 1K
READY
R197 0
R42 1K
R20 33
R198 0
R14 0
R87 0
READY
R199 0
R77 33
R60
0
ARC_ENABLE
R25 100
OPT
R23
10K
OPT
R200 0
R12 0
R26 100
OPT
R201 0
R297 0
R55 1K
READY
R19 33
R202 0
R7 0
R78 68
R5 22
READY
R6 22
READY
R530 0
R7118 0
R7119 0
R7121 0
READY
R7120 0
READY
R9014 1K
R9015 1K
R9016 200K
R9017 200K
R9020
0
R9021
0
R9024 33
R9025 22
R9028 22
R9029 22
R9031 22
A-MDQU7
T0XCN
SPI_SDI
A-MA5
A-MRASB
A-MDQL0
EPHY_REFCLK
A-MDQL5
T0X1P
A-MDQL2
A-MDQSL
A-MA12
A-MA8
T0X2P
/RTL8201_INT
A-MDQU0
EPHY_CRS_DV
A-MDQL6
IR
DSUB_G
A-MA7
A-MA3
A-MDQL7
A-MA14
A-MA13
A-MDQL3
DSUB_B
A-MBA1
/RTL8201_INT
EEPROM_SCL
A-MCKB
DSUB_R
A-MCKE
A-MBA0
A/B_DDR3_CS
USB1_OCD
MST_NEC_RX
A-MDQU1
A-MA1
A-MA4
A-MDQSLB
A-MA2
A-MBA2
A-MDQU5
A-MWEB
/RTL8201_PMEB
A-MA11
A-MA10
A-MDML
A-MDQL4
A-MDQL1
A-MRESETB
A-MDQU6
A-MDMU
A-MDQU4
A-MCK
A-MDQU2
A-MDQSUB
A-MA0
URSA/VCOM_SDA
A-MA6
T0XCP
EPHY_RXD1
A-MA9
T0X0P
A-MDQU3
RS232_RX
DSUB_DET
A-MDQSU
T0X2N
A-MCASB
T0X1N
EPHY_RXD0 SOC_RESET
T0X0N
A-MODT
USB2_OCD
USB2_OCD
UART1_TX
AUDIO_R_IN
AUDIO_L_IN
AVDD_DMPLL
+1.10V_VDDC
AVDD_AU33
+3.3V_NORMAL
AVDD_NODIE
VDD33
+3.5V_ST
AVDD_NODIE
+3.3V_NORMAL
+3.5V_ST
+1.5V_DDR
+1.10V_VDDC
AVDD_NODIE
VDD33
+1.10V_VDDC
VDD33
AVDD_NODIE
RXBCK-
PF_ALE
RXBCK+
RXB4-
EPHY_TXD0
/PF_WE
RXB1-
/PF_CE1
RXB3-
SPI_SCK
RS232_TX
EPHY_TXD1
I2C_SCL
PM_LED
URSA/VCOM_SCL
RXB4+
/PF_WP
POWER_DET
USB1_CTL
DSUB_VSYNC
I2C_PM_SCL
EPHY_MDC
RXB1+
EPHY_EN
/RTL8201_RESET
RXB0-
DSUB_HSYNC
RXB2+
/FLASH_WP
MST_NEC_TX
RXB3+
RXA0-
/PF_CE0
RXB0+
RXA0+
SPI_SDO
RXB2-
RXA1+
/F_RB
HDMI_SCL
RXA1-
RXACK+
HDMI0_ARC
RXACK-
/SPI_CS
RXA3-
RXA2+
RXA3+
RXA2-
/PF_OE
RXA4-
RGB_DDC_SCL
RXA4+
HPD2
PWM2
AMP_SCL
AUD_LRCK
AUD_MASTER_CLK
AUD_SCK
AUD_LRCH
USB2_CTL
USB2_CTL
UART1_RX
AUDIO_OUT_L_AMP
AUDIO_OUT_R_AMP
AUDIO_OUT_MUTE
C56 0.047uF
C38
27pF
50V
C52
4.7uF
10V
OPT
C55 0.047uF
C36
27pF
50V
C46
8pF
OPT
C45
0.1uF
C59
0.047uF
25V
C50
1uF
10V
ARC_ENABLE
C57 0.047uF
C54 0.047uF
C44
8pF
OPT
C58 0.047uF
C71
1uF
10V
C53 0.047uF
C51
1uF
6.3V
C2293
15pF
50V
OPT
C8009
3300pF
50V
C8010
3300pF
50V
TMDS_DEMUX_SCL
MODEL_OPT_4
AUVRM
MODEL_OPT_5
TMDS_DEMUX_SDA
MODEL_OPT_2
SIDE_USB1_DP
MODEL_OPT_2
MODEL_OPT_0
PCM_A[0-7]
MODEL_OPT_4
MODEL_OPT_7
MODEL_OPT_7
EEPROM_SDA
MODEL_OPT_5
MODEL_OPT_6
MODEL_OPT_0
MODEL_OPT_3
UART1_RX
I2C_PM_SDA
PM_MODEL_OPT_0
UART1_TX
MODEL_OPT_3
MODEL_OPT_1
SIDE_USB1_DM
I2C_SDA
AUVRM
CEC_REMOTE_M1A
HDMI_SDA
MODEL_OPT_6
MODEL_OPT_1
EPHY_MDIO RGB_DDC_SDA
AMP_SDA
SIDE_USB2_DP
SIDE_USB2_DM
P4
SMW200-04
1
2
3
4
X1
24MHz
IC101
LGE2134(256M)
ARC0
M4
RXC0N
W7
RXC0P
Y8
RXC1N
W8
RXC1P
Y9
RXC2N
AA9
RXC2P
W9
RXCCKN
AA7
RXCCKP
Y7
CEC/GPIO6
N2
DDCDA_CK/GPIO27
E3
DDCDA_DA/GPIO28
E2
DDCDC_CK/GPIO31
W6
DDCDC_DA/GPIO32
AA6
HOTPLUGA/GPIO23
L4
HOTPLUGC/GPIO25
Y6
RXA0N
F1
RXA0P
G3
RXA1N
G1
RXA1P
G2
RXA2N
H3
RXA2P
H2
RXACKN
F3
RXACKP
F2
EAR_OUTL
U4
EAR_OUTR
T4
AUL1
P2
AUL2
R2
AUL3
T1
AUR1
R3
AUR2
R1
AUR3
T3
AUOUTL0
U2
AUOUTR0
V3
AUVAG
T2
CVBSOUT1 T6
CVBS0 V5
CVBS1 U5
CVBS2 T5
VCOM V4
I2S_OUT_BCK/GPIO165 E4
I2S_OUT_MCK/GPIO163 F4
I2S_OUT_SD/GPIO166 F7
I2S_OUT_WS/GPIO164 F5
USB0_DM C4
USB1_DM Y12
USB0_DP B4
USB1_DP AA12
BIN0M J2
BIN0P J3
GIN0M K3
GIN0P J1
RIN0M K2
RIN0P K1
HSYNC0 M6
VSYNC0 L6
BIN1M L2
BIN1P L3
GIN1M M1
GIN1P M2
RIN1M N1
RIN1P N3
SOGIN1 M3
IC101-*1
LGE2133(128M)
DPMS
GPIO78
Y1
GPIO79
W4
I2C_SCKM3/I2C_DDCR_CK/GPIO77
K17
I2C_SDAM3/I2C_DDCR_DA/GPIO76
J15
SDAM2/GPIO55
U8
SCKM2/GPIO56
T7
SCKM0/GPIO58
U7
SDAM0/GPIO59
V7
I2S_IN_BCK/GPIO159
F6
I2S_IN_SD/GPIO160
G6
I2C_SCKM1/GPIO80
AA4
I2C_SDAM1/GPIO81
Y4
ET_TXD[0]/GPIO62
J6
EXT_TX_CLK/GPIO64
K6
I2S_IN_WS/GPIO158
G7
ET_COL/GPIO60
J4
ET_TXD[1]/GPIO61
J5
LCK/GPIO194
H19
LDE/GPIO195
G20
LHSYNC/GPIO196
G19
LVSYNC/GPIO197
G21
UART2_RX/GPIO69
J17
UART2_TX/GPIO70
J16
UART3_TX/GPIO52
E8
UART3_RX/GPIO53
D7
GPIO46[CTS]
U6
GPIO47[RTS]
V6
UART1_TX/GPIO48
K15
UART1_RX/GPIO49
L16
ET_TX_EN/GPIO63
H5
ET_RXD[0]/GPIO65
K5
ET_MDC/GPIO66
K4
ET_MDIO/GPIO67
H6
ET_RXD[1]/GPIO68
L5
PCMADR[0]/NF_AD[0]/GPIO130
U17
PCMADR[1]/NF_AD[1]/GPIO129
R18
PCMADR[2]/NF_AD[2]/GPIO127
V17
PCMADR[3]/NF_AD[3]/GPIO126
R16
PCMADR[4]/NF_AD[4]/GPIO104
U16
PCMADR[5]/NF_AD[5]/GPIO106
T17
PCMADR[6]/NF_AD[6]/GPIO107
W18
PCMADR[7]/NF_AD[7]/GPIO108
U20
PCMADR[8]/GPIO113
Y19
PCMADR[9]/GPIO115
AA19
PCMADR[10]/GPIO119
AA20
PCMADR[11]/GPIO117
W21
PCMADR[12]/GPIO109
V20
PCMADR[13]/GPIO112
Y17
PCMADR[14]/GPIO111
V18
PCMCD_N/GPIO135
V19
PCMCE_N/GPIO120
W19
PCMDATA[0]/GPIO131
U18
PCMDATA[1]/GPIO132
V16
PCMDATA[2]/GPIO133
W17
PCMDATA[3]/GPIO125
Y20
PCMDATA[4]/GPIO124
R15
PCMDATA[5]/GPIO123
AA18
PCMDATA[6]/GPIO122
T15
PCMDATA[7]/GPIO121
Y21
PCMIORD_N/GPIO116
W20
PCMIOWR_N/GPIO114
V21
PCMIRQA_N/GPIO110
Y18
PCMOE_N/GPIO118
T16
PCMREG_N/GPIO128
R17
PCM_RESET/GPIO134
T18
PCMWAIT_N/GPIO105
W16
PCMWE_N/GPIO198
U15
TS0CLK/GPIO92 V10
TS0DATA[0]/GPIO82 T14
TS0DATA[1]/GPIO83 T13
TS0DATA[2]/GPIO84 U13
TS0DATA[3]/GPIO85 V15
TS0DATA[4]/GPIO86 U12
TS0DATA[5]/GPIO87 V13
TS0DATA[6]/GPIO88 U14
TS0DATA[7]/GPIO89 T11
TS0SYNC/GPIO91 T12
TS0VALID/GPIO90 V12
TS1CLK/GPIO103 Y14
TS1DATA[0]/GPIO93 Y16
TS1DATA[1]/GPIO94 AA15
TS1DATA[2]/GPIO95 Y13
TS1DATA[3]/GPIO96 AA16
TS1DATA[4]/GPIO97 W12
TS1DATA[5]/GPIO98 AA13
TS1DATA[6]/GPIO99 W14
TS1DATA[7]/GPIO100 W13
TS1SYNC/GPIO102 Y15
TS1VALID/GPIO101 W15
PM_SPI_SCZ1/GPIO_PM[6]/GPIO13 B3
PM_SPI_SCK/GPIO1 A3
PM_SPI_SCZ0/GPIO0 A4
PM_SPI_SDI/GPIO2 C3
PM_SPI_SDO/GPIO3 A2
RP B1
TN C2
TP C1
RN B2
SPDIF_IN/GPIO161 D2
SPDIF_OUT/GPIO162 D1
HWRESET D8
IRIN/GPIO5 E5
DDCA_CK/UART0_RX G4
DDCA_DA/UART0_TX G5
PWM0/GPIO71 J18
PWM1/GPIO72 K18
PWM2/GPIO73 K16
PWM3/GPIO74 L18
PWM4/GPIO75 L17
NF_ALE/GPIO146 T8
NF_CEZ/GPIO142 T9
NF_CLE/GPIO141 U9
NF_RBZ/GPIO147 U11
NF_REZ/GPIO144 V9
NF_WEZ/GPIO145 U10
NF_WPZ/GPIO199 T10
IF_AGC W2
SIFM W1
SIFP W3
IM V2
IP V1
XIN AA2
XOUT Y2
IC101
LGE2134(256M)
NON_DPMS
GPIO78
Y1
GPIO79
W4
I2C_SCKM3/I2C_DDCR_CK/GPIO77
K17
I2C_SDAM3/I2C_DDCR_DA/GPIO76
J15
SDAM2/GPIO55
U8
SCKM2/GPIO56
T7
SCKM0/GPIO58
U7
SDAM0/GPIO59
V7
I2S_IN_BCK/GPIO159
F6
I2S_IN_SD/GPIO160
G6
I2C_SCKM1/GPIO80
AA4
I2C_SDAM1/GPIO81
Y4
ET_TXD[0]/GPIO62
J6
EXT_TX_CLK/GPIO64
K6
I2S_IN_WS/GPIO158
G7
ET_COL/GPIO60
J4
ET_TXD[1]/GPIO61
J5
LCK/GPIO194
H19
LDE/GPIO195
G20
LHSYNC/GPIO196
G19
LVSYNC/GPIO197
G21
UART2_RX/GPIO69
J17
UART2_TX/GPIO70
J16
UART3_TX/GPIO52
E8
UART3_RX/GPIO53
D7
GPIO46[CTS]
U6
GPIO47[RTS]
V6
UART1_TX/GPIO48
K15
UART1_RX/GPIO49
L16
ET_TX_EN/GPIO63
H5
ET_RXD[0]/GPIO65
K5
ET_MDC/GPIO66
K4
ET_MDIO/GPIO67
H6
ET_RXD[1]/GPIO68
L5
PCMADR[0]/NF_AD[0]/GPIO130
U17
PCMADR[1]/NF_AD[1]/GPIO129
R18
PCMADR[2]/NF_AD[2]/GPIO127
V17
PCMADR[3]/NF_AD[3]/GPIO126
R16
PCMADR[4]/NF_AD[4]/GPIO104
U16
PCMADR[5]/NF_AD[5]/GPIO106
T17
PCMADR[6]/NF_AD[6]/GPIO107
W18
PCMADR[7]/NF_AD[7]/GPIO108
U20
PCMADR[8]/GPIO113
Y19
PCMADR[9]/GPIO115
AA19
PCMADR[10]/GPIO119
AA20
PCMADR[11]/GPIO117
W21
PCMADR[12]/GPIO109
V20
PCMADR[13]/GPIO112
Y17
PCMADR[14]/GPIO111
V18
PCMCD_N/GPIO135
V19
PCMCE_N/GPIO120
W19
PCMDATA[0]/GPIO131
U18
PCMDATA[1]/GPIO132
V16
PCMDATA[2]/GPIO133
W17
PCMDATA[3]/GPIO125
Y20
PCMDATA[4]/GPIO124
R15
PCMDATA[5]/GPIO123
AA18
PCMDATA[6]/GPIO122
T15
PCMDATA[7]/GPIO121
Y21
PCMIORD_N/GPIO116
W20
PCMIOWR_N/GPIO114
V21
PCMIRQA_N/GPIO110
Y18
PCMOE_N/GPIO118
T16
PCMREG_N/GPIO128
R17
PCM_RESET/GPIO134
T18
PCMWAIT_N/GPIO105
W16
PCMWE_N/GPIO198
U15
TS0CLK/GPIO92 V10
TS0DATA[0]/GPIO82 T14
TS0DATA[1]/GPIO83 T13
TS0DATA[2]/GPIO84 U13
TS0DATA[3]/GPIO85 V15
TS0DATA[4]/GPIO86 U12
TS0DATA[5]/GPIO87 V13
TS0DATA[6]/GPIO88 U14
TS0DATA[7]/GPIO89 T11
TS0SYNC/GPIO91 T12
TS0VALID/GPIO90 V12
TS1CLK/GPIO103 Y14
TS1DATA[0]/GPIO93 Y16
TS1DATA[1]/GPIO94 AA15
TS1DATA[2]/GPIO95 Y13
TS1DATA[3]/GPIO96 AA16
TS1DATA[4]/GPIO97 W12
TS1DATA[5]/GPIO98 AA13
TS1DATA[6]/GPIO99 W14
TS1DATA[7]/GPIO100 W13
TS1SYNC/GPIO102 Y15
TS1VALID/GPIO101 W15
PM_SPI_SCZ1/GPIO_PM[6]/GPIO13 B3
PM_SPI_SCK/GPIO1 A3
PM_SPI_SCZ0/GPIO0 A4
PM_SPI_SDI/GPIO2 C3
PM_SPI_SDO/GPIO3 A2
RP B1
TN C2
TP C1
RN B2
SPDIF_IN/GPIO161 D2
SPDIF_OUT/GPIO162 D1
HWRESET D8
IRIN/GPIO5 E5
DDCA_CK/UART0_RX G4
DDCA_DA/UART0_TX G5
PWM0/GPIO71 J18
PWM1/GPIO72 K18
PWM2/GPIO73 K16
PWM3/GPIO74 L18
PWM4/GPIO75 L17
NF_ALE/GPIO146 T8
NF_CEZ/GPIO142 T9
NF_CLE/GPIO141 U9
NF_RBZ/GPIO147 U11
NF_REZ/GPIO144 V9
NF_WEZ/GPIO145 U10
NF_WPZ/GPIO199 T10
IF_AGC W2
SIFM W1
SIFP W3
IM V2
IP V1
XIN AA2
XOUT Y2
IC101
LGE2134(256M)
AUVRM U3
GND_1 A6
GND_2 A13
GND_3 A15
GND_4 A18
GND_5 B12
GND_6 B14
GND_7 B16
GND_8 B17
GND_9 B19
GND_10 B20
GND_11 C9
GND_12 C10
GND_13 C21
GND_14 D9
GND_15 E20
GND_16 F9
GND_17 F11
GND_18 F13
GND_19 F15
GND_20 F17
GND_21 F19
GND_22 F21
GND_23 G8
GND_24 G9
GND_25 G10
GND_26 G11
GND_27 G12
GND_28 G13
GND_29 G14
GND_30 G15
GND_31 G16
GND_32 G17
GND_33 G18
GND_34 H7
GND_35 H8
GND_36 H9
GND_37 H10
GND_38 H11
GND_39 H12
GND_40 H13
GND_41 H14
GND_42 H15
GND_43 H16
GND_44 H17
GND_45 H18
GND_46 J7
GND_47 J8
GND_48 J9
GND_49 J10
GND_50 J11
GND_51 J12
GND_52 J13
GND_53 J14
GND_54 K8
GND_55 K10
GND_56 K11
GND_57 L10
GND_58 M5
GND_59 M7
GND_60 M8
GND_61 M9
GND_62 M10
GND_63 N4
GND_64 N5
GND_65 N6
GND_66 N7
GND_67 N8
GND_68 N9
GND_69 N10
GND_70 P4
GND_71 P5
GND_72 P6
GND_73 P7
GND_74 P9
GND_75 P10
GND_76 P15
GND_77 P16
GND_78 P17
GND_79 P18
GND_80 R10
GND_81 R11
GND_82 R12
GND_83 R13
GND_84 R14
GND_EFUSE K7
AVDD_AU33
R4
AVDD_DDR0_CLK
L11
AVDD_DDR1_CLK
L13
AVDD_DDR0_CMD
M11
AVDD_DDR1_CMD
K13
AVDD_DDR0_D_1
C5
AVDD_DDR0_D_2
K12
AVDD_DDR0_D_3
L12
AVDD_DDR1_D_1
C6
AVDD_DDR1_D_2
K14
AVDD_DDR1_D_3
L14
AVDD_DRAM_1
B5
AVDD_DRAM_2
B6
AVDD_DVI_USB_MPLL_1
R8
AVDD_DVI_USB_MPLL_2
R9
AVDD_MOD_1
L7
AVDD_MOD_2
L8
AVDD_NODIE
P8
AVDD_PLL
K9
AVDD3P3_DMPLL
R5
AVDDL_MOD
P11
DVDD_DDR_1
C7
DVDD_DDR_2
M13
DVDD_NODIE
R6
DVDD_RX_1_1
A7
DVDD_RX_1_2
M12
DVDD_RX_2_1
B7
DVDD_RX_2_2
M14
VDDC_1
N11
VDDC_2
N12
VDDC_3
N13
VDDC_4
N14
VDDC_5
N15
VDDC_6
P12
VDDC_7
P13
VDDC_8
P14
VDDP
L9
AVDD5V_MHL
AA10
IC101
LGE2134(256M)
B_DDR3_A[0]
E11
B_DDR3_A[1]
F12
B_DDR3_A[2]
D10
B_DDR3_A[3]
B10
B_DDR3_A[4]
E15
B_DDR3_A[5]
B11
B_DDR3_A[6]
F14
B_DDR3_A[7]
C11
B_DDR3_A[8]
D14
B_DDR3_A[9]
A12
B_DDR3_A[10]
F16
B_DDR3_A[11]
D13
B_DDR3_A[12]
D15
B_DDR3_A[13]
C12
B_DDR3_A[14]
E13
B_DDR3_BA[0]
A9
B_DDR3_BA[1]
D16
B_DDR3_BA[2]
A10
B_DDR3_MCLK
C13
B_DDR3_MCLKZ
B13
B_DDR3_MCLKE
E17
B_DDR3_ODT
B8
B_DDR3_RASZ
C8
B_DDR3_CASZ
B9
B_DDR3_WEZ
D11
B_RESET
F10
B_DDR3_CS0
D12
B_DDR3_DQSL
A19
B_DDR3_DQSU
B18
B_DDR3_DQML
C16
B_DDR3_DQMU
D21
B_DDR3_DQSBL
C18
B_DDR3_DQSBU
C17
B_DDR3_DQL[0]
A20
B_DDR3_DQL[1]
A16
B_DDR3_DQL[2]
C19
B_DDR3_DQL[3]
C15
B_DDR3_DQL[4]
C20
B_DDR3_DQL[5]
C14
B_DDR3_DQL[6]
B21
B_DDR3_DQL[7]
B15
B_DDR3_DQU[0]
F18
B_DDR3_DQU[1]
D19
B_DDR3_DQU[2]
D17
B_DDR3_DQU[3]
E21
B_DDR3_DQU[4]
E19
B_DDR3_DQU[5]
D20
B_DDR3_DQU[6]
D18
B_DDR3_DQU[7]
F20
ZQ
E9
IC101
LGE2134(256M)
LVA4P/TTL_B[0]/HCONV/GPIO170
U19
LVA4M/TTL_B[1]/E_O/GPIO171
T20
LVA3P/TTL_B[2]/FB/GPIO172
T21
LVA3M/TTL_B[3]/OPT_P/GPIO173
T19
LVACKP/TTL_B[4]/MCLK/GPIO174
R21
LVACKM/TTL_B[5]/GCLK/GPIO175
R20
LVA2P/TTL_B[6]/GST/GPIO176
R19
LVA2M/TTL_B[7]/POL/GPIO177
P20
LVA1P/TTL_G[0]/EPI0+/GPIO178
P19
LVA1M/TTL_G[1]/EPI0-/GPIO179
N20
LVA0P/TTL_G[2]/EPI1+/GPIO180
N21
LVA0M/TTL_G[3]/EPI1-/GPIO181
N19
LVB4P/TTL_G[4]/EPI2+/GPIO182
M21
LVB4M/TTL_G[5]/EPI2-/GPIO183
M20
LVB3P/TTL_G[6]/EPI3+/GPIO184
M19
LVB3M/TTL_G[7]/EPI3-/GPIO185
L20
LVBCKP/TTL_R[0]/EPI4+/GPIO186
L19
LVBCKM/TTL_R[1]/EPI4-/GPIO187
K20
LVB2P/TTL_R[2]/EPI5+/GPIO188
K21
LVB2M/TTL_R[3]/EPI5-/GPIO189
K19
LVB1P/TTL_R[4]/EPI6+/GPIO190
J21
LVB1M/TTL_R[5]/EPI6-/GPIO191
J20
LVB0P/TTL_R[6]/EPI7+/GPIO192
J19
LVB0M/TTL_R[7]/EPI7-/GPIO193
H20
SAR0/GPIO35 D5
SAR1/GPIO36 F8
SAR2/GPIO37 E7
SAR3/GPIO38 E6
SAR4/GPIO39 D6
GPIO_PM[13]/GPIO20 W10
GPIO_PM[14]/GPIO21 Y10
PM_LED/GPIO4 P3
GPIO_PM[0]/GPIO7 Y3
PM_SPI_SCZ2/GPIO_PM[10]/GPIO17 Y5
GPIO_PM[15]/GPIO22 W11
GPIO_PM[4]/GPIO11 D3
GPIO_PM[7]/GPIO14 AA3
GPIO_PM[8]/GPIO15 W5
PWM_PM/GPIO200 D4
PM_UART_TX/GPIO_PM[1]/GPIO8 L15
PM_UART_RX/GPIO_PM[5]/GPIO12 Y11
L7
BLM18PG121SN1D
IC2-*1
AT24C256C-SSHL-T
NVRAM_ATMEL
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
IC2
BR24G256FJ-3
EAN62389502
NVRAM_ROHM
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
C8007
2.2uF
10V
C8008
2.2uF
10V
PWM1
R9040 0
R9046 1K
READY
R9047 1K
READY
MO_S/W_AJ
MODEL_OPT_0
SOC_PW
0
128M Only MODEL_OPT_4
MODEL_OPT_7
INT+EXT
0
MO_DVB_T2/C/S2
NVRAM
128M+128M
K5
0
0
G19
G20
L5
MO_S/W_TW
1
MO_M120
Auto
Det
PIN NAME
MO_DUALSTREAM_NON
0
0
MO_DVB_T/C
MO_128M+128M_NON
0
MODEL_OPT_2
(EEPROM)
U6
HIGH
MO_128M+256M_NON
Memory OPTION
128M+256M
Memory
PM_GPIO
MODEL_OPT_3
MODEL OPTION
A0’h
SIDE USB
MO_FHD
MODEL_OPT_1
HDMI
K4
1
LOW
MODEL_OPT_4
MO_HD
MODEL_OPT_5 MO_S/W_EU/AJ
0
MODEL_OPT_6
MO_DUALSTREAM
256M Only
PIN NO.
MO_128+128M
M1A
MO_S/W_NON_AJ
0
* Dual Stream is only Korea 3D spec
J5
MO_128M+256M
MODEL_OPT_6
H19
UART DEBUG 4PIN
MODEL OPTION
1
MO_M120_NON
I2S_I/F
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LS33B 14/10/09
DDR & System
PCM_A[4]
PCM_A[5]
PCM_A[6]
PCM_A[7]
PCM_A[1]
PCM_A[0]
PCM_A[2]
PCM_A[3] PM_LED
A-MODT
+3.3V_NORMAL
EEPROM_SCL
A-MA4
A-MVREFCA
A-MDQSU
C61 0.1uF
DDR_EXT
R49
1K
A-MA1
+1.10V_VDDC
C11 0.1uF
AR4
22
+3.5V_ST
A-MVREFCA
A-MA10
C20 0.1uF
A-MA3
A-MDQU5
A-MCKE
10uF
10V
C41
+1.10V_VDDC
A/B_DDR3_CS
+3.5V_ST
C14 1000pF
DDR_EXT
R4 1K1%
DDR_EXT
R170
0
OPT
VDD33
C21
0.1uF
OPT
IC3-*2
H27U2G8F2DTR-BD
NAND_FLASH_2G_NEW_SKHYNIX
26 NC_17
27 NC_18
28 NC_19
29 I/O0
30 I/O1
31 I/O2
32 I/O3
33 NC_20
34 NC_21
35 NC_22
36 VSS_2
37 VCC_2
38 NC_23
39 NC_24
40 NC_25
41 I/O4
42 I/O5
43 I/O6
44 I/O7
45 NC_26
46 NC_27
47 NC_28
48 NC_29
17
ALE
3
NC_3
6
NC_6
16
CLE
15
NC_10
14
NC_9
13
VSS_1
12
VCC_1
11
NC_8
10
NC_7
9
CE
8
RE
7
R/B
4
NC_4
5
NC_5
25 NC_16 24
NC_15
23
NC_14
2
NC_2
22
NC_13
21
NC_12
1
NC_1
20
NC_11
19
WP
18
WE
C24 0.1uF
A-MDQL2
/PF_WP
R57
10K
PDP
A-MCKB
C67 0.1uF
DDR_EXT
R1 1K1%
DDR_EXT
A-MA5
R172
0
C5
0.1uF
C32 1uF
OPT
+1.5V_DDR
PCM_A[0-7]
10uF 10V
C15
H5TQ2G63DFR-PBC
IC5-*1
DDR_1600_2G_HYNIX
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA M8
VREFDQ H1
ZQ L8
VDD_1 B2
VDD_2 D9
VDD_3 G7
VDD_4 K2
VDD_5 K8
VDD_6 N1
VDD_7 N9
VDD_8 R1
VDD_9 R9
VDDQ_1 A1
VDDQ_2 A8
VDDQ_3 C1
VDDQ_4 C9
VDDQ_5 D2
VDDQ_6 E9
VDDQ_7 F1
VDDQ_8 H2
VDDQ_9 H9
NC_1 J1
NC_2 J9
NC_3 L1
NC_4 L9
NC_6 T7
VSS_1 A9
VSS_2 B3
VSS_3 E1
VSS_4 G8
VSS_5 J2
VSS_6 J8
VSS_7 M1
VSS_8 M9
VSS_9 P1
VSS_10 P9
VSS_11 T1
VSS_12 T9
VSSQ_1 B1
VSSQ_2 B9
VSSQ_3 D1
VSSQ_4 D8
VSSQ_5 E2
VSSQ_6 E8
VSSQ_7 F9
VSSQ_8 G1
VSSQ_9 G9
C10
0.1uF
C33
0.1uF
OPT
+3.3V_NORMAL
PM_MODEL_OPT_0
A-MCK
A-MRASB
A-MVREFDQ
R86 56 1%
DDR_EXT
+3.5V_ST
10uF 10V
C34
IC3-*1
H27U2G8F2CTR
NAND_FLASH_2G_HYNIX
26 NC_17
27 NC_18
28 NC_19
29 I/O0
30 I/O1
31 I/O2
32 I/O3
33 NC_20
34 NC_21
35 NC_22
36 VSS_2
37 VCC_2
38 NC_23
39 NC_24
40 NC_25
41 I/O4
42 I/O5
43 I/O6
44 I/O7
45 NC_26
46 NC_27
47 NC_28
48 NC_29
17
ALE
3
NC_3
6
NC_6
16
CLE
15
NC_10
14
NC_9
13
VSS_1
12
VCC_1
11
NC_8
10
NC_7
9
CE
8
RE
7
R/B
4
NC_4
5
NC_5
25 NC_16 24
NC_15
23
NC_14
2
NC_2
22
NC_13
21
NC_12
1
NC_1
20
NC_11
19
WP
18
WE
A-MDQSLB
C12 0.1uF
DDR_EXT
10uF 10V
C16
+1.5V_DDR
R68 4.7K
A-MDQU7
C29 1uF
OPT
A-MDQL5
C95
0.1uF
C42
0.1uF
C48
10uF
10V
A-MDML
R50
1K
OPT A-MDQL1
A-MA7
A-MBA0
+3.3V_NORMAL
C43
0.1uF
A-MDQU6
C70
0.01uF
50V
DDR_EXT
+1.5V_DDR
A-MDQSL
AR3
22
R85 56 1%
DDR_EXT
A-MA11
C65 0.1uF
DDR_EXT
R167
10K
OPT
+3.3V_NORMAL
+1.5V_DDR
C4 1000pF
DDR_EXT
P2
SMW200-04
MSTAR_DEBUG_4P
1
NC
2
GND
3
SCL
4
SDA
+1.5V_DDR
R41
1K
OPT
+1.5V_DDR
A-MDQL6
A-MDQU0
+3.5V_ST
R73 2.7K
A-MA2
C60 10uF
10V
DDR_EXT
R82
240
1%
DDR_EXT
A-MA13
SPI_SCK
C3
0.1uF
+3.5V_ST
SPI_SDI A-MDQU3
C66 0.1uF
DDR_EXT
CLOCK_SDA
A-MDQSUB
RGB_DDC_SCL
R2 1K1%
DDR_EXT
PF_ALE
10uF
C2
C37 1uF
IC3
H27U1G8F2CTR-BC
EAN35669103
NAND_FLASH_1G_HYNIX
26 NC_17
27 NC_18
28 NC_19
29 I/O0
30 I/O1
31 I/O2
32 I/O3
33 NC_20
34 NC_21
35 NC_22
36 VSS_2
37 VCC_2
38 NC_23
39 NC_24
40 NC_25
41 I/O4
42 I/O5
43 I/O6
44 I/O7
45 NC_26
46 NC_27
47 NC_28
48 NC_29
17
ALE
3
NC_3
6
NC_6
16
CLE
15
NC_10
14
NC_9
13
VSS_1
12
VCC_1
11
NC_8
10
NC_7
9
CE
8
RE
7
R/B
4
NC_4
5
NC_5
25 NC_16 24
NC_15
23
NC_14
2
NC_2
22
NC_13
21
NC_12
1
NC_1
20
NC_11
19
WP
18
WE
R227
10K
READY
A-MRESETB
C19
10uF 10V
OPT
CLOCK_SCL
L4
BLM18PG121SN1D
RGB_DDC_SDA
C64 0.1uF
DDR_EXT
LED_R/BUZZ
R56
10K
LCD
A-MBA2
A-MBA1
SPI_SDI
+3.3V_NORMAL
L2
BLM18PG121SN1D
OPT
C49
0.1uF
16V
A-MA0
AVDD_NODIE
R165
4.7K
OPT
R84
10K
DDR_EXT
/PF_OE
C62 0.1uF
DDR_EXT
A-MCASB
/SPI_CS
L3
BLM18PG121SN1D
AVDD_DMPLL
AR1
22
A-MA8
A-MA12
R164
4.7K
OPT
A-MA9
R36
3.3K
A-MDQU1
+3.5V_ST
L1
BLM18PG121SN1D
/PF_CE1
A-MDQL4
10uF
10V
C25
+3.5V_ST
A-MDMU
A-MDQL7
R70 4.7K
C68 0.1uF
DDR_EXT
R3 1K1%
DDR_EXT
L5
BLM18PG121SN1D
10uF
C6
C23 1uF
OPT
C8
0.1uF
C69 0.1uF
DDR_EXT
C63 0.1uF
DDR_EXT
/FLASH_WP
+1.5V_DDR
AVDD_AU33
/PF_CE0
R278
1K
R59 2.2K
A-MVREFDQ
C9
0.1uF
H5TQ1G63EFR-PBC
IC5
DDR_1600_1G_HYNIX
EAN61829003
A0 N3
A1 P7
A2 P3
A3 N2
A4 P8
A5 P2
A6 R8
A7 R2
A8 T8
A9 R3
A10/AP L7
A11 R7
A12/BC N7
NC_7 T3
NC_5 M7
BA0 M2
BA1 N8
BA2 M3
CK J7
CK K7
CKE K9
CS L2
ODT K1
RAS J3
CAS K3
WE L3
RESET T2
DQSL F3
DQSL G3
DQSU C7
DQSU B7
DML E7
DMU D3
DQL0 E3
DQL1 F7
DQL2 F2
DQL3 F8
DQL4 H3
DQL5 H8
DQL6 G2
DQL7 H7
DQU0 D7
DQU1 C3
DQU2 C8
DQU3 C2
DQU4 A7
DQU5 A2
DQU6 B8
DQU7 A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
NC_6
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
R67 4.7K
OPT
IC14
MX25L8006EM2I-12G
SPI_FLASH_MACRONIX
3
WP#
2
SO/SIO1
4
GND
1
CS#
5SI/SIO0
6SCLK
7HOLD#
8VCC
10uF 10V
C35
R74 2.7K
OPT
R279
1K
R58 2.2K
A-MA14
+1.10V_VDDC
A-MDQL0
/F_RB
R168
4.7K
OPT
C40 0.1uF
C13 0.1uF
R46
1K
+3.5V_ST
10uF
C7
A-MDQU2
R53
3.9K
A-MDQU4
SPI_SDO
L6
BLM18PG121SN1D
C17 0.1uF
+3.3V_NORMAL
EEPROM_SDA
C26 1uF
OPT
A-MA6
C31 1uF
OPT
C28 0.1uF
AR2
22
R169
33
+1.10V_VDDC
C47
0.1uF
C39 1uF
A-MDQL3
A-MWEB
R69 4.7K
OPT
C30 1uF C27 0.1uF
/PF_WE
C1 0.1uF
DDR_EXT
C22
0.1uF
OPT
C18 0.1uF
H5TQ2G63FFR-RDC
IC5-*2
DDR_1600_2G_SKHYNIX
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA M8
VREFDQ H1
ZQ L8
VDD_1 B2
VDD_2 D9
VDD_3 G7
VDD_4 K2
VDD_5 K8
VDD_6 N1
VDD_7 N9
VDD_8 R1
VDD_9 R9
VDDQ_1 A1
VDDQ_2 A8
VDDQ_3 C1
VDDQ_4 C9
VDDQ_5 D2
VDDQ_6 E9
VDDQ_7 F1
VDDQ_8 H2
VDDQ_9 H9
NC_1 J1
NC_2 J9
NC_3 L1
NC_4 L9
A14
T7
VSS_1 A9
VSS_2 B3
VSS_3 E1
VSS_4 G8
VSS_5 J2
VSS_6 J8
VSS_7 M1
VSS_8 M9
VSS_9 P1
VSS_10 P9
VSS_11 T1
VSS_12 T9
VSSQ_1 B1
VSSQ_2 B9
VSSQ_3 D1
VSSQ_4 D8
VSSQ_5 E2
VSSQ_6 E8
VSSQ_7 F9
VSSQ_8 G1
VSSQ_9 G9
K4B2G1646Q-BCMA
IC5-*3
DDR_SSE
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA M8
VREFDQ H1
ZQ L8
VDD_1 B2
VDD_2 D9
VDD_3 G7
VDD_4 K2
VDD_5 K8
VDD_6 N1
VDD_7 N9
VDD_8 R1
VDD_9 R9
VDDQ_1 A1
VDDQ_2 A8
VDDQ_3 C1
VDDQ_4 C9
VDDQ_5 D2
VDDQ_6 E9
VDDQ_7 F1
VDDQ_8 H2
VDDQ_9 H9
NC_1 J1
NC_2 J9
NC_3 L1
NC_4 L9
NC_6 T7
VSS_1 A9
VSS_2 B3
VSS_3 E1
VSS_4 G8
VSS_5 J2
VSS_6 J8
VSS_7 M1
VSS_8 M9
VSS_9 P1
VSS_10 P9
VSS_11 T1
VSS_12 T9
VSSQ_1 B1
VSSQ_2 B9
VSSQ_3 D1
VSSQ_4 D8
VSSQ_5 E2
VSSQ_6 E8
VSSQ_7 F9
VSSQ_8 G1
VSSQ_9 G9
CLose to M1A IC
NAND FLASH MEMORY
Parts No.1~300
PM_MODEL_OPT_0
- HIGH : LCD
- LOW :: PDP
PM_MODEL_OPT_1
- Not Use (Ready)
VDDC 1.05V
AVDD_DDR0:55mA
Normal Power 3.3V
AVDD_DDR1:55mA
MSTAR DEBUG 4PIN
Normal 2.5V
STby 3.5V PM MODEL OPTION
M1A 2.5V inbeded
SPI Boot DDR
VDDC : 2026mA
I2C
<CHIP Config>
(SPI_SDI, PM_LED, PWM_PM)
NAND
DDR3 1.5V
SK HYNIX 2G DEFAULT
LG-NonOS SB51_ExtSPI 3’b000 51boot from SPI
LG-OS HEMCU_ExtSPI 3’b001 MIPS boot from SPI
CLose to DDR3
System & DDR
Option : Ripple Check !!!
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

THERMAL
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Power Block
14/10/09LS33B
+3.3V_NORMAL
Q509
AO3435
G
D S
C535
2.2uF
10V
C531
0.039uF
50V
10uF
C505
10V
R557
10K
C528
0.1uF
16V
+3.3V_NORMAL
R518
200
1/16W
1%
+13V
Q507
MMBT3904(NXP)
E
B
C
R544
20K
1%
+3.3V_NORMAL
C523
10uF
10V
OPT
ZD504
2.5V
+5V_NORMAL
R516
4.7K
OPT
PANEL_CTL
IC505
TPS5432DDAR
3
PH
2
VIN
4
GND
1
BOOT
5VSENSE
6COMP
7EN
8SS
9
[EP]GND
R558
22K
10uF
C508
10V
R551
10K
+13V
R519
4.7K
C538
22uF
10V
USB1_CTL
+3.3V_NORMAL
Q508
MMBT3904(NXP)
E
B
C
R522
10K
R549
4.7K
OPT
L508
CB2012PK501T
R563
5.6K
C533
0.33uF
16V
C524
22uF
10V C525
270pF
50V
R542
100K
+1.5V_DDR C537
0.1uF
16V
C515
10uF
10V
R556
10K
+5V_USB1
C517
82pF
50V
R545
47K
1%
POWER_ON/OFF_1
L505
CB2012PK501T
USB1_OCD
+3.5V_ST
C530
0.01uF
IC503-*1
APX803D29
RESET_IC_DIODES
1
GND
3
VCC 2RESET
R523
0
L507
4.7uH
C506
100pF
50V
OPT
R552
10K
C526
10uF
10V
+13V
+3.3V_NORMAL
C520
0.1uF
16V
OPT
+3.5V_ST
C536
10uF
16V
READY
R517
1K
1/16W
1%
POWER_DET
IC503
BD48K28G
RESET_IC_ROHM
1
GND
2VOUT 3
VDD
C522
22uF
10V
+3.5V_ST
R555
10K
L502
BLM18PG121SN1D
C527
0.1uF
16V
R547 100
C534
0.1uF
25V
OPT
+1.10V_VDDC
ZD503
2.5V
R532
18K
1%
TPS65282REGR
IC502
1
EN
3
SS
7
FAULT2
9
SW_OUT2
10
RLIM
11
AGND
12
SW_OUT1
13 SW_IN_1
14 SW_IN_2
15 FB
16 LX_1
17 LX_2
18 BST
19 PGND_1 20 PGND_2 21 VIN_1 22 VIN_2 23 PGOOD 24 V7V
5
EN_SW2
8
FAULT1
6
EN_SW1
4
ROSC
2
COMP 25
[EP]GND
R550
2.7K
1%
C507
4700pF
50V
PANEL_VCC
L510
UBW2012-121F
120OHM
R521
100K
OPT
C529
0.1uF
16V
C532
390pF
50V
IC501
EAN62868801
ADJ/GND
OUTIN
R520
0
OPT
L511
BLM18PG121SN1D
C521
0.1uF
16V
L509
3.6uH
R526
15K
5%
R559
2.2K
C514
0.047uF
25V
R533
3.3K
1%
C519
22uF
10V
+3.5V_ST
P2300
SMAW200-H12S5K(BK)(LTR)
9
GND
4D13V
8A13V
3
GND
12 PDIM1
7
A13V
2PDIM2
11
DRV_ON
6D13V
1
PWR_ON
10 GND
5
D13V
13
.
C6001
0.1uF
50V
R7003
100
C8006
0.1uF
50V
+3.3V_NORMAL
R7002
1K
R7108 100
L6001
UBW2012-121F
Q2300-*1
MMBT3906(NXP)
NXP_RL_ON_TR
E
B
C
PWM1
L6002
UBW2012-121F
RL_ON
+13V_A R7107 100
+13V
INV_CTL
R2301
10K
VA8011
20V
VA7004
20V
PWM2
R536
14K
1%
R537
5.1K
1%
C516
0.1uF
25V
+3.5V_POWER_DET
R540
0
OPT
USB2_OCD
R528
10K
+5V_USB2
USB2_CTL
R529
4.7K
OPT
+13V
R7114
51K
1%
R7117
33K
1%
C7046
10pF
50V
+3.5V_ST
C7038
0.1uF
25V
IC7003
TPS563200
3
VIN
2
SW
4VFB
1
GND 6VBST
5EN
L7006
BLM18PG121SN1D
R7116
150K
1%
C7039
22uF
10V
C7040
22uF
10V
C7044
0.1uF 16V
C7037
10uF
25V
R7109
10K
R9022 3.9K
R9023 3.9K
Q2300
2N3906S-RTK
KEC_RL_ON_TR
E
B
C
R9036 10K
R9037
10K Q2302
MMBT3904(NXP)
E
B
C
+3.5V_ST
+3.5V_POWER_DET
R9038 0
Q510
SSM3J332R
S
G
D
C511
10uF
25V
10uF
25V
C509
R9039
10K
POWER_ON/OFF_1
VA8012
ADMC 5M 02 200L
Q2303
MMBT3904(NXP)
E
B
C
R9042
10K
R9043
10K
R9044
10K
OPT
R9032 4.7K
+3.5V_ST
R9045 33K
OPT
L7008
2.2uH
VLS5045EXT-2R2N
ZD505
5.6V
C809
10uF
25V
OPT
Q501
MMBT3904(NXP)
E
B
CC502
10uF
16V
R560
100K
C501
2.2uF
16V
R561
27K
R501
4.7K C503
10uF
16V
READY R562
5.6K
R2
+5V_Normal & +5V_USB with OCP
R2
4A
R1
Vout=1.25*(1+R2/R1)+Iadj*R2
1.3A
Vout=0.8*(1+R1/R2)
3A
PANEL_VCC
+1.10V_VDDC
R1
+3.3V_Normal
Power_DET
+1.5V_DDR
Vout=0.808*(1+R1/R2)
R2
R1
Parts No.501~600
L14 POWER BlOCK
Now apply DIODES
’15 FHD POWER
R1
+3.5V_ST
3A
R2
Vout=0.765*(1+R1/R2)
TO IMPROVE DEEP OF PANEL_VCC
TO IMPROVE RISING TIME OF PANEL_VCC
20141224
20141224
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HDMI_Switch
LS33B 14/10/09
R1X1P
R1XCP
R1X0P
R1X1N
R1X0N
R1XCN
R1X2P
R1X2N
R2XCP R2XCN
R2X0P
R2X1P
R2X2P
R2X0N
R2X1N
R2X2N
R2X2P
R2X2N
R2X1P
R2X1N
R2X0P
R2X0N
R2XCP
R2XCN
R1X0N
R1X0P
R1XCP
R1XCN
R1X2N
R1X1P
R1X2P
R1X1N
R759
100K
EPA6.0
HDMI_SCL
R716 15
DIGITAL_DPM_CTRL1
VA703
R719 15
R713
0
RGB_DDC_SDA
D703
6.5VTO11.0V
RCLAMP0544T.TCT
1 8
2 7
3 6
4 5
9
C744
0.1uF
C707 10uF
DDC5VD C752
0.1uF
L701
BLM18SG121TN1D
RGB_DDC_SCL
SII9489_SCL
5V_HDMI_2
C711 10uF
VDD_33_S
DVI_DDC_SDA
5V_DVI_HPD
L705
BLM18SG121TN1D
R727
0
C746
1uF
T0X1N
C712 10uF
R745
5.1K
5V_HDMI_2
DVI_DDC_SCL
D706
KDS184
A2
C
A1
VDDT_12A_S
L706
BLM18SG121TN1D
R732 10
READY
R750 10
READY
C716
10uF
+3.5V_ST
C735
0.1uF
RESET_9489
R735
5.1K
R703 3.3K
R708
22
HDMI_SDA
C717
10uF
VDDA_33_S
VDD_12_S
5V_HDMI_2
R724 3.3
R740
10
C720 10uF
R711 470
VDDA_33_S
R757
4.7K
C722 10uF
HDMI_HPD
VA701
+3.5V_ST
R726 3.3
IC701
AZ1117BH-1.2TRE1
1
GND/ADJ
2OUT 3
IN
C701
100pF
+5V_ST
HDMI_SDA
C705
0.1uF
C724 10uF
T0X0N
D702
IP4294CZ10-TBR
1
8
2
7
3
6
4
5
9
10
D704
6.5VTO11.0V
RCLAMP0544T.TCT
18
2 7
3 6
4 5
9
D708
30V
MMBD301LT1G
HDMI_SDA
R753
10
READY
VDDA_12_S
C725 10uF
R737 10
DDC5VD
DVI_DDC_SDA
R720
1.8K
R710
33
CEC_REMOTE_NEC
CEC_REMOTE_M1A
C726 10uF
VDDT_12B_S
R751 10
OPT
C736
0.1uF
C731
1uF
25V
VDDA_12_S
JK701
RSD-105156-100
EAG62611201
14 RESERVED
13 CEC
5TMDS_DATA1_SHIELD
20
BODY_SHIELD
12 TMDS_CLK-
11
TMDS_CLK_SHIELD
2TMDS_DATA2_SHIELD
19 HOT_PLUG_DETECT
18 VDD[+5V]
10
TMDS_CLK+
4TMDS_DATA1+
1TMDS_DATA2+
17 DDC/CEC_GND
9TMDS_DATA0-
8TMDS_DATA0_SHIELD
3TMDS_DATA2-
16 SDA
7TMDS_DATA0+
6TMDS_DATA1-
15 SCL
HDMI_CEC
+3.5V_ST
C732 10uF
DDC5VD
VDDA_33_S
R712 22
C713
0.1uF
C739
0.1uF
R764
10K
JP704
R741
10 READY
R723
100K
T0X1P
C733 10uF
R701
1.8K
R731
4.7K
R748
10
DVI_DDC_SCL
C703
0.1uF
R729
4.7K
C740 10uF
5V_DVI_HPD
HDMI_SCL
R742 10
VDDT_12A_S
R718 15
VDDA_12_S
T0XCN
C743
10uF
10V
C723
0.1uF
R760
470K
EPA6.0
DDC5VD
D701
30V
JP701
C721
0.1uF
T0X2N
R756
4.7K
VDDA_12_S
Q705
MMBT3904(NXP)
READY
E
B
C
R707
18K
R709
33
Q702
MMBT3904(NXP)
E
B
C
C727
0.1uF
VDDA_33_S
VDD_33_S
C715
0.1uF
T0X0P
R752 10
OPT
/DIGITAL_DPM_CTRL
C719
0.1uF
DVI_DDC_SCL
R770
10K
READY
R714 15
R721
3.3K
C708
22uF
READY
C714
0.1uF
BSS83
Q704
S B D
G
R704
10K
R715 15
C742
1uF
C729
0.1uF
R722
470K
VA704
READY
C710
1uF
R725 3.3
HDMI_HPD
C749
0.1uF
16V
HPD2
VDD_12_S
DET_DVI
C750
22uF
10V
L707
BLM18SG121TN1D
NON_EPA6.0
VDDA_33_S
SII9489_SDA
R766
68K
R771
10K
READY
C734
0.1uF
C745
1uF
R717 15
C751
22uF
10V
R728
1
IC702
SII9489ACTUC
1
AVDD33_1
2
R1XCN
3
R1XCP
4
R1X0N
5
R1X0P
6
R1X1N
7
R1X1P
8
R1X2N
9
R1X2P
10
AVDD33_2
11
R2XCN
12
R2XCP
13
R2X0N
14
R2X0P
15
R2X1N
16
R2X1P
17
R2X2N
18
R2X2P
19
AVDD12_1
20
DVDD12_1
21
R3XCN
22
R3XCP
23
R3X0N
24
R3X0P
25
R3X1N
26
R3X1P
27
R3X2N
28
R3X2P
29
AVDD12_2
30
AVDD33_3
31
R4XCN
32
R4XCP
33
R4X0N
34
R4X0P
35
R4X1N
36
R4X1P
37
R4X2N
38
R4X2P
39
DVDD12_2
40
ARC4
41
ARC3
42
ARC2
43
ARC1
44
ARC0
45
SPDIF_IN
46
ETH_RXP
47
ETH_RXN
48
HEACP
49
HEACN
50
ETH_TXP
51
ETH_TXN
52
EPWR33
53
DSDA4
54
DSCL4
55
CBUS_HPD4
56
R4PWR5V
57
DSDA3
58
DSCL3
59
CBUS_HPD3
60
R3PWR5V
61
SPDIF_OUT
62
GPIO10
63
GPIO9
64
GPIO8
65 DSDA2
66 DSCL2
67 CBUS_HPD2
68 R2PWR5V
69 GPIO7
70 GPIO6
71 GPIO5
72 GPIO4
73 MICOM_VCC33
74 RSVDL_1
75 CEC_A0
76 CEC_A1
77 RESETB
78 GPIO2
79 GPIO1
80 DSDA1
81 DSCL1
82 CBUS_HPD1
83 R1PWR5V
84 DSDA0
85 DSCL0
86 CBUS_HPD0
87 R0PWR5V
88 DSDA5[VGA]
89 DSCL5[VGA]
90 R5PWR5V[VGA]
91 CSDA
92 CSCL
93 SBVCC5
94 TX1_HPD
95 RSVDL_2
96 INT
97 TX1DSDA 98 TX1DSCL 99 TPWR_CI2CA
100 T1X2P 101 T1X2N 102 T1X1P 103 T1X1N 104 T1X0P 105 T1X0N 106 T1XCP 107 T1XCN 108 TCVDD12 109 TPVDD12 110 T0X2P 111 T0X2N 112 T0X1P 113 T0X1N 114 T0X0P 115 T0X0N 116 T0XCP 117 T0XCN 118 DVDD12_3 119 AVDD33_4 120 R0XCN 121 R0XCP 122 R0X0N 123 R0X0P 124 R0X1N 125 R0X1P 126 R0X2N 127 R0X2P 128 AVDD12_3
129
[EP]GND
R734 10
VDDT_12B_S
D705
30V
MMBD301LT1G
READY
D709
KDS184
A2
C
A1
HDMI0_ARC
+3.5V_ST
R730
4.7K
C730
0.1uF
DVI_DDC_SDA
+5V_ST
L702
BLM18SG121TN1D
C718
0.1uF
R736 10
R768
0DVI_EEPROM_EDID
R739
0
R743 10
VDD_12_S
HDMI_CEC
R761
100
+5V_ST
C709
0.1uF
DVI_EDID_WP
5V_DET_HDMI_2 D710
C741
0.1uF
DVI_DET
D707
IP4294CZ10-TBR
1
8
2
7
3
6
4
5
9
10
R758
4.7K
IC703
AT24C02C-SSHM-T
DVI_EEPROM_EDID
3
2
4
1
5
6
7
8
C702
100pF
R747
5.1K
READY
R763
68K
R746 10
R706
18K
VDD_12_S
CEC_ON/OFF
VA702
R769
18K
DVI_EEPROM_EDID
DDC5VD
R738
0
R702
1K
OPT
R744 10
R733 10
P701
QH11121-DB54-4F
@optio
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
JP703
L703
BLM18SG121TN1D
T0X2P T0XCP
C738
0.1uF
C737
0.1uF
R767
0DVI_EEPROM_EDID
JP702
R749
10
READY
5V_DVI_HPD
HDMI_SCL
R705
100
L704
BLM18SG121TN1D
22uF
C728
C704
2.2uF
10V
C706
2.2uF
10V
C748
2.2uF
10V
C747
2.2uF
10V
C753
18pF
50V
DVI_EEPROM_EDID
C754
18pF
50V
DVI_EEPROM_EDID
ZD702 5.6V ZD703
5.6V
ZD701
5.6V
Q701
AO3407B
G
D S
Q703
AO3407B
EPA6.0
G
D S
JP705
JP706
JP707
AR5
5.1
1/16W
AR6
5.1
1/16W
T1X1P
DVI
T1X0P
DP
T1X1N T1X0N T1X2N
HDMI SWITCH
Parts No.701~800
HDMI
HDMI
CEC
T1XCP T1X2P T1XCN
DVI IN
DVI EDID
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only