LG 19LG31 Series User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LA85C
MODEL : 19LG30 19LG30-UA
MODEL : 19LG31 19LG31-UB
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 8
TROUBLE SHOOTING ........................................................................... 11
BLOCK DIAGRAM.................................................................................. 15
EXPLODED VIEW .................................................................................. 22
SVC. SHEET ...............................................................................................

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 6 -
1. Application range
This specification is applied to the 19”/ 22” Wide LCD TV used
LA85C chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 20±5ºC
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No Item Specification Option Remark
1 Receivable System ATSC/64 & 256 QAM/ NTSC-M USA only
2 Available Channel VHF : 02 ~ 13
UHF : 14 ~ 69
DTV : 02 ~ 69
CATV : 01 ~ 135
CADTV : 01 ~ 135
3 Input Voltage 100-240V~, 50/60Hz
4 Market North America
5 Screen Size 19/22 Inch
6 Aspect Ratio 16:9
7 Tuning System FS
8 LCD Module LM190WX1 (1440*900) Wide, LPL Not applied.
M190A1-L07 (1440*900) Wide, CHI MEI 19LG30-UA (07.11.05)
LM220WE1 (1680*1050) Wide, LPL 22LG30-UA
M220Z1-L01 (1680*1050) Wide, CHI MEI Not applied.
9 Operating Environment Temp : 0 ~ 40 deg
Humidity : ~ 80 %
10 Storage Environment Temp : -20 ~ 60 deg
Humidity : 0 ~ 85 %
Model Market Appliance
19LG30-UA North America Safety : UL1492, CSA C22.2.No.1
22LG30-UA EMC : FCC Class B, IEC Class B

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 7 -
5. Component Video Input (Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Proposed
1 720*480 15.73 59.94 SDTV, DVD 480I(525I)
2 720*480 15.73 60.00 SDTV, DVD 480I(525I)
3 720*480 31.47 59.94 SDTV 480P
4 720*480 31.50 60.00 SDTV 480P
5 1280*720 44.96 59.94 HDTV 720P
6 1280*720 45.00 60.00 HDTV 720P
7 1920*1080 33.72 59.94 HDTV 1080I
8 1920*1080 33.75 60.00 HDTV 1080I
9 1920*1080 27 24 HDTV 1080P
10 1920*1080 33.75 30 HDTV 1080P
11 1920*1080 67.43 59.94 HDTV 1080P
12 1920*1080 67.5 60 HDTV 1080P
6. RGB Input (PC)
7. HDMI input (DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark Proposed
PC DDC
1 640*480 31.469 59.94 25.17 VESA(VGA) O
2 800*600 37.879 60.31 40.00 VESA(SVGA) O
3 1024*768 48.363 60.00 65.00 VESA(XGA) O
4 1280*768 47.776 59.87 79.50 CVT(WXGA) O
5 1360*768 47.720 59.799 84.75 CVT(WXGA) O
6 1440*900 55.5 59.90 88.750 19/22LG30-UA only WXGA
7 1400*1050 64.744 59.948 101.00 22LG30-UA only WSXGA
8 1680*1050 65.290 59.954 146.25 22LG30-UA only WSXGA
DTV
1 720*480 31.469 59.94 27.00 SDTV 480P
2 720*480 31.500 60.00 27.03 SDTV 480P
3 1280*720 44.96 59.94 74.17 HDTV 720P
4 1280*720 45.00 60.00 74.25 HDTV 720P
5 1920*1080 33.72 59.94 74.17 HDTV 1080I
6 1920*1080 33.75 60.00 74.25 HDTV 1080I
7 1920*1080 27 24.00 74.25 HDTV 1080P
8 1920*1080 33.75 30.00 74.25 HDTV 1080P
9 1920*1080 67.43 59.94 148.35 HDTV 1080P
10 1920*1080 67.5 60.00 148.50 HDTV 1080P
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark Proposed
PC DDC
1 640*350 31.469 70.08 25.17 DOS
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1280*768 47.776 59.87 79.50 VESA(WXGA) O
7 1360*768 47.712 60.01 85.50 VESA(WXGA) O
8 1440*900 55.5 59.90 88.750 WXGA
9 1400*1050 64.744 59.948 101.00 22LG30-UA only WSXGA
10 1680*1050 62.290 59.954 146.25 22LG30-UA only WSXGA

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 8 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied for all of the LCD TV with
LA85C chassis.
2. Specification
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment : 100-240V~, 50/60Hz
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote control
3. Main PCB check process
* APC - After Manual-Insult, executing APC
3.1. Software download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig,
and set.
3) Click “Connect” tab. If display “Can’t”, Check connect
computer, jig, and set.
4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”.
5) Click “Auto” tab and set as below
6) click “Run”.
7) After downloading, check “OK” message.
3.2. ADC Process
3.2.1. PC input ADC
(1) Auto RGB Gain/Offset Adjustment
1) Convert to PC in Input-source
I2C COMMAND:0xF4(SELECT INPUT) 0x00 0x60(RGB)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),
0x60(RGB), 0x90(HDMI)
2) Signal equipment displays
Output Voltage : 700 mVp-p
Impress Resolution XGA (1024x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 Series)
[gray pattern that left & right is black and center is
white signal (Refer below picture)].
3) Adjust by commanding AUTO_COLOR _ADJUST
(0xF1) 0x00 0x02 instruction.
(2) Confirmation
1) We confirm whether “0xB6”address of EEPROM
“0xA2” is “0xAA” or not.
2) If “0xB6(RGB)” address of EEPROM “0xB2” isn’t
“0xAA”, we adjust once more.
3) We can confirm the ADC values from “0xB0~0xB5
(RGB)” addresses in a page “0xA2”
* Manual ADC process using Service Remote control. After
enter Service Mode by pushing “ADJ” key, execute “Auto-
adjust” by pushing “G” key at “0. ADC CALIBRATION”.
(1) (3)
(2) OK
Please Check Speed :
To us speed between from 200 KHz
to 400 KHz
(4)
filexxx.bin
(5)
(7) ........ OK
(6)
filexxx.bin
<Adjustment pattern (PC)>
EZ ADJUST
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN : OFF
5. 2HOUR OFF : ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MODE : ON
9. DEBUG MODE : OFF
0. ADC CALIBRATION : RGB

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 9 -
3.2.2. COMPONENT input ADC
(1) Component Gain/Offset Adjustment
1) Convert to Component in Input-source
I
2
C command : 0xF4(Select input) 0x00 0x40(Component)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),
0x60(RGB), 0x90(HDMI)
2) Signal equipment displays
Impress Resolution 480i
MODEL : 209 in Pattern Generator(480i Mode)
PATTERN : 08 in Pattern Generator(MSPG-925 Series)
3) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction.
4) Signal equipment display
-Impress Resolution : 1080i
- MODEL: 223 in Pattern Generator(1080i Mode)
- PATTERN: 08 in Pattern generator(MAPG-925 series)
5) Adjust by commanding AUTO_COLOR ADJUST(0xF1)
0x00 0x02 instruction.
* Manual ADC process using Service Remote control. After
enter Service Mode by pushing “ADJ” key, execute “Auto-
adjust” by pushing “G” key at “0. ADC CALIBRATION”.
(2) Confirmation
1) We confirm whether “0xBF(480i)/0xC8(1080i)” address
of EEPROM “0xA2” is “0xAA” or not.
2) If “0xBF(480i)/0xC8(1080i)” address of EEPROM “0xA2”
isn’t “0xAA”, we adjust once more.
3) We can confirm the ADC values from “0xB9~0xBE(480i)/
0xC2~(1080i)” addresses in a page “0xA2”.
* Manual ADC Confirmation using Service Remocon. After
enter Service Mode by pushing “INSTART” key.
3.3. Function Check
3.3.1. Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (CVBS/ S-Video)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In and H/P Out
* Display and Sound check is executed by Remote control.
4. Total Assembly line process
4.1. Adjustment Preparation
1) Heat-run above 30 minutes in RF no signal.
2) 15 Pin D-sub jack is connected to the auto W/B equipment.
4.2. Adjust color coordinate of Cool
1) Set Input to RGB.
2) Set Temperature : Cool
3) Adjust x=0.285±0.005, y=0.293±0.005 (9300ºK±1000ºK) or
not.
4.3. Adjust color coordinate of Medium
1) Set Input to RGB.
2) Set Temperature : Medium
3) Adjust x=0.295±0.005, y=0.305±0.005 (8000ºK±1000ºK) or
not.
4.4.
Adjust color coordinate of Warm
1) Set Input to RGB.
2) Set Temperature : Warm
3) Adjust x=0.313±0.005, y=0.329±0.005 (8000ºK±1000ºK) or
not.
* Manual ADC Confirmation using Service Remocon. After
enter Service Mode by pushing “INSTART” key.
* Adjust “R/G/B - GAIN” by pushing “F”, “G” key at “Cool”
* Adjust “R/G/B - GAIN” by pushing “F”, “G” key at “Medium”
* Adjust “R/G/B - GAIN” by pushing “F”, “G” key at “Warm”
<Adjustment pattern (COMPONENT)>
EZ ADJUST
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN : OFF
5. 2HOUR OFF : ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MODE : ON
9. DEBUG MODE : OFF
0. ADC CALIBRATION : COMPONENT
EZ ADJUST
0. ADC CALIBRATION : RGB
1. ADC ADJUST
2. SUB B/C ADJUST
4. WHITE PATTERN : OFF
5. 2HOUR OFF : ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MOD : ON
9. DEBUG MODE : OFF
3. W/B ADJUST
MODEL : 22LG30_UA_UA/LPL_LM220WT7
S/W VER : 3.00.1
UTT : 6
ADC CAL.
RGB : OK
YPbPr(SD) : OK
YPbPr(HD) : OK
1. SYNC LEVEL
2. DTV SNR
3. SCREEN MUTE
4. POWER OFF HISTORY
0. STEREO DETECT

- 10 -
4.5. DDC EDID WRITE
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Connect HDMI Signal Cable to HDMI Jack.
3) Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
4) Check whether written EDID data is correct or not. (Refer to
Product spec).
5) Remark : A week manufacture in address 0x10 can be
changed. And thus Checksum (Address: 0x7F)
can be also changed.
4.5.1. 19LG30 EDID DATA
(1) ANALOG DATA 128Byte
- Remark: A week manufacture in address 0x10 can be
changed. And thus Checksum (Address: 0x7F)
can be also changed.
(2) DIGITAL DATA 256Byte
- Remark: A week manufacture in address 0x10 can be
changed. And thus Checksum (Address: 0x7F)
can be also changed.
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
4.6. HDCP setting
(High-Bandwidth Digital Contents Protection)
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Input HDCP key with HDCP-key- in-program.
3) HDCP Key value is stored on EEPROM(AT24C512) which
is 80~A1 addresses of 0xA0~0xA2 page
4) AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925
5) HDCP Key value is different among the sets.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
W/B ADJUST
0. MODE : RGB
1. WHITE PATTERN : White
2. TEMPERATURE : Cool
4. G - GAIN : 128
5. B - GAIN : 128
6. R – OFFSET : 128
7. G – OFFSET : 128
8. B – OFFSET : 128
9. RESET
3. R - GAIN : 128

1. No Power (LED indicator off)
- 11 -
TROUBLE SHOOTING
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check 15V or
5V of P701.
Check short
of Main board or
change LIPS.
Fail
Pass
Pass
Change IC705.
Pass Check output
of Q701.
Fail
Change Q701.
Start check
Change LED Assy.
Check Output
of IC705.
Pass
Check LED Assy.
Pass
Check P304 & Connector.
Fail
Fail

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 12 -
2. No RASTER
Check LED status
On Display Unit.
Fail
Pass
Repeat No power (1) PROCESS.
Check
IC700, IC702,
IC703, IC704, IC705, IC706,
IC708, IC709,
IC710.
Pass
Fail Change IC700, IC702, IC703, IC704,
IC705, IC706, IC708, IC709, IC710.
Check input/output
of IC00.
Fail
Change IC100
Pass
Change LVDS cable or module.
Check the
inverter connector or
inverter.
Pass
Check LVDS cable
or module.
Pass
Check input source cable & jack.
Fail
Fail
Change inverter connector or inverter
Start check

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 13 -
3-1. No Raster on AV signal (AV/ COMPONENT/ S-VIDEO RGB-PC)
3-2. NO Raster on RF signal (TV)
Start Check 3-1 Start Check 3-2
Check input source cable and jack.
Repeat No power(1)
process.
Fail Check output
of TU400.
Pass Pass
Fail Check 5V of TU400.
Re-Soldering or change
the defect part.
Check
the signal of R622,
R623, R681, R615, R616,
R617, R640,R641,
R642.
Fail
Change signal of
R622, R623, R681,
R615, R616, R617,
R640,R641,R642.
Pass
Check input/output
of IC100.
Pass
Fail Re-soldering or change defect part.
Check X100.
Pass Pass

- 14 -
4. No sound
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check the input
Source.
Fail
Pass
Change source input.
Check input/Output
of IC100.
Fail
Pass
Re-soldering or change the defect part.
Check the X100.
Check the input/
output of IC500.
Fail Re-soldering or change
the defect part.
Pass
Check the Speaker.
Pass
Check the Speaker wire.
Start Check
Fail
Change the speaker.

Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 15 -
Rear AV_1 V, LR
Rear S_1 YC
IN1
IN1
Video/Audio SW
Comp_1 YPbPr/LR
CABLEAIR
ATSC/NTSC Tuner
(TDVF-H051F)
LG Innotek
LGE1854C
MSTAR
EAN37156404
VSB/QAM
Receiver
(LGDT3304)
0ICTMLG019C
D-AMP
(YDA148-EZ)
EAN40130001
HY5DU561622F
256M (DDR)
HY5DU561622F
256M (DDR)
CLK_25MHz
6212AB2872A
IF-P IF-N
LVDS(8Bit)
X100
12MHz
CVBS(ATV)
TP DATA[0-7]
Audio_L Audio_R
SIF
2
Comp1
Air : 8VSB Cable : 256/64QAM •RGB/YPbYr*2 •CVBS*3 •YC*2 •L/R-IN*3 •SIF •CVBS OUT*1 •HDMI*1
R OUT L OUT
Head Phone
PC Audio IN
PC(VGA)
RS232C(SVC only)
PC IN
L
C D
USB(SVC only)
1.0Vp-p 96dBuV
5V
CVBS0[44]
Buffer
SIFM0 SIFP0
SIFM0[50] SIFP0[51]
Buffer
1.2V3.3V
IFP[3] IFN[4]
[3]
[16] [15]
[N:11] [P:10]
IN[55] OUT[54]
2
[20,22,24,26, 27,28,29,31]
TS0-7[86,87,88,89,90,91,92,93]
SCL[38] SDA[36]
IF_AGC IFAGC[22]
MSCL MSDA
SCLM1[127] SDAM1[126]
TPCLK[33] TPSOP[34]
TPVALID[19]
TPERR[17]
TSCLK[96] TSSYNC[95] TSVALID[94]
IN[255]OUT[254]
2
3.3V1.25V
OUT_P_R[8]
OUT_N_R[14]
OUT_P_L[35]
OUT_N_L[29]
IN_L[38] IN_R[5]
HP_DET[37]
MUTE[6]
12V
AUOUTR0[73]
AUOUTL0[72] GPIO12[79]
1CH LVDS[137-146] 2CH LVDS[137-146, 150-159] RXE/RXO
BIN[21]SOGIN[22]GIN[23]RIN[24] VS_RGB[17] HS_RGB[16] RGB_SW[80] SCL/RX[117] SDA/TX[116]
AUR_IN[59] AUL_IN[58]
PB_IN[26] SOY[29] Y_IN[28] PR_IN[31] AUL_IN1[56] AUR_IN1[57] COMP_SW[112]
CVBS1[42] AUL_IN0[54] AUR_IN[55] AV1_SW[111] SV_C0[38] SV_Y0[39] S_SW[82]
6630G70016A
6630G00001A
6612F00001D
6612F00099A
EAG31022001
EAG35541101
EAG35541101
6612J10031C
Tx/Rx
MAX3232CDR
EAN41348201
ST-5V
Tx_Out
Rx_In
R232C_Tx
R232C_Rx
EEPROM
EAN35989901
DDC_SDA/UART_TX
DDC_SCL/UART_RX
IR_RX[114]
SAR0[118] SAR1[119] SAR2[120] SAR3[121]
EEPROM(512K)
24C512
EEPROM(512K)
24C512
0IMMRAL025A
SCL_EEPROM[136] SDA_EEPROM[135] 3.3V
Flash (64M)
S25FL064A
Flash (64M)
S25FL064A
SPI_CK[129]
SPI_DI[130]
SPI_DO[131]
SPI_CZ[132]
3.3V
KEY_CTL[1,2]
Power/LIPS
Power 15V/ST-5V
[12]
SCL_TU[11]
SDA_TU[13]
SDA[7]SCL[8]
VCOM0[45]
TUNER_CVBS
VCOM0
6612B00015C
HDMI
USB_DM[251] USB_DP[252] USB_OCD_N[83]
B_TX0-[4] B_TX0+[5] G_TX1-[7] G_TX1[8] R_TX2-[10] R_TX2+[11]
TXCLK-[2] TXCLK+[3]
HPDCTRL[12]
DDCDA_SDA[14] DDCDA_SCL[15]
POWER_HDMI[110]
3.3V AVDD_DVI
2.5V VDD_DDR
G-5V
19”/22 ”
ST-5V
OP-AMP
TPA6110A20 HP_L/r[70,71] EAN42961201
6612B00015C
EEPROM
EAN35989901
5V
BLOCK DIAGRAM
1. Main

- 16 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC500
Sound Amp (YDA148)
From LIPs
IC100
LGE1854C
AVDD_ADC, AVDD_SIF AVDD_AU , AVDD_MemPLL AVDD_MPLL, AVDD_LPLL AVDD_DVI, AVDD_XTAL AVDD_DVI VDDC
IC400
LGDT3304
VDD AVDD
VDD33 AVDD33
1 2 3 4 5 6 7 8 9
10 11
15V 15V GND
ST5V
NC
INV_CTL
DIM
INV_BR
GND
ST5V
GND
IC702
MP2305DS
12V
IC700
KIA7809F
(19”,22”W)
IC103 / IC105 Flash Memory
IC200 / IC201
SDRAM *2
HY57V641620ETP
IR receiver
Pannel
19”, 22”
Q704
FET
(SI49258)
TU400
TUNER (TDVF-H051F)
9V IC701
KIA7805F
5V
IC706
AZ1117H-3.3
IC709
AZ1085S-ADJ
IC703
AZ1085S-3.3
IC710
AZ1085S-ADJ
ST2.6V
ST3.3V ST1.25V
ST3.3V
VDD_DDR VDDP AVDD_OTG
IC501
HP Amp (TPA6110A)
IC705
AZ1085S-ADJ
ST3.3V
IC102
AT24C512W
IC104
MC74LCX140I
IC601
MAX3232CDR
IC704
AZ1085S-3.3
IC708
SC4215ISTRT
IC800
CAT24C02WI
IC600
CAT24C02WI
ST5V
ST15V
5V 3.3V
3.3V
1.2V
2. POWER

- 17 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LGE1854C
[MSTAR]
DDC_I2C
E2PROM_I2C E2PROM
EDID / ISP
TDVF- H051F
IF_P IF_N
SIF
TUNER_CVBS
IF_AGC
Buffer
LPF
LGDT3304
[8VSB,QAM]
TS[0-7]
TS_CLK
TS_SYNC
TS_VALID
I2C MSCL / MSDA
MAIN I2C CVBS_0
SIF
TS_DATA
B+[3]
IF1[11]
IF1[10]
IF_AGC[12]
SIF[15]
CVBS[16]
SDA[7] SCL[8]
AS[9]
TU_SDA[13] TU_SCL[11] IF_AGC[15]
MSDA[36] MSCL[38]
IF_N[4] IF_P[3]
TS[20,22,24,26, 27,28,29,31]
TS_CLK[33] TS_SYNC[34] TS_VALID[19]
64Kbyte
3. TUNER + VSB

- 18 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Video path
AV
S-Video
AT_TU_V
Y/Cb/Cr_IN
Y/C IN
CVBS1
CVBS0
CVBS1
LGE1854C
(From Tuner)
SVIDEO ( Y/C ) Component ( Y/Cb/Cr )
RGB
RGB_IN
Component
RGB
LGDT3304 TS Data
DTV_IN
YAMAHA CLASS-D AMP [YDA148]
LGE1854C SPEAKER
Output
SIF
TS_DATA
AU_OUT0_ L/R
AV1_L/R
COMPONENT_L/R
DSUB RGB_L/R
Audio path
Head Phone AMP [TPA6110A]
Head Phone Output
HDMI HDMI_DATA HDMI
HDMI_DATA
4. VIDEO, AUDIO

- 19 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TU400
TUNER
IC100
LGE1854C
IC400
LGDT3304
SDA_TU
SCL_TU
SDA[7] SCL[8]
MSDA MSCL
SDA [36] SCL [38]
DDCA_SC [116] DDCA_DA [117]
DDC_SCL DDC_SDA
IC102
24C512
SCK [129] SDI [130] SDO [131] SCZ [132]
JK605
D-SUB
IC600
24C02
[EDID]
IC200
SDRAM
IC201
SDRAM
CKE MCLK
AR[0:12] MDATA[0:15] DQM0/1
CKE MCLK
AR[0:12] MDATA[16:31] DQM0/1
JK606
RS232C
IC601
MAX3232CDR
RS232C_TXD RS232C_RXD
IC103/IC105
Flash Memory
IC800
24C02
[EDID]
J800
HDMI
SCL_HDMI SDA_HDMI
DDCDA_SDA DDCDA_SCL
DDCR_DA [126] DDCR_CK [127]
SCL_EEPROM [136] SDA_EEPROM [135]
UART_TX1 [196] UART_RX1 [195]
DDCDA_DA [14] DDCDA_CK [15]
SPI_CK SPI_DI SPI_DO SPI_CZ
SCL SDA
5. CONTROL

- 20 -
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC100
[LGE1854C]
LGDT3304 TUNER
MSCL/MSDA I2C_5V
5VST
EEPROM (EDID)
IC102, IC600,IC800
EEPROM (EDID)
IC102, IC600,IC800
I2C Address
0xC2
0x1C
IC100 [LGE1854C] S25PFL064A
or MX25L64050MI [Serial Flash]
SCK SDI SDO
CSZ
SPI_CK SPI_DI SPI_DO
SPI_CSZ
SCLK
SI
SO CS#
ST3.3V /5V
DDC_ROM SCL/SDA 0xA0
6. I2C