LG RZ-42LZ30 User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : ML-038C
MODEL : RZ-42LZ30
website:http://biz.LGservice.com
e-mail:http://www.LGEservice.com/techsup.html

- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
SVC REMOCON.......................................................................................11
TROUBLE SHOOTING............................................................................12
BLOCK DIAGRAM...................................................................................16
EXPLODED VIEW .................................................................................. 18
EXPLODED VIEW PARTS LIST..............................................................19
REPLACEMENT PARTS LIST ................................................................20
SVC. SHEET ...............................................................................................

SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Due to high vacuum and large surface area of picture tube,
extreme care should be used in handling the Picture Tube. Do
not lift the Picture tube by it's Neck.
X-RAY Radiation
Warning:
To determine the presence of high voltage, use an accurate high
impedance HV meter.
Adjust brightness, color, contrast controls to minimum.
Measure the high voltage.
The meter reading should indicate
23.5 1.5KV: 14-19 inch, 26 1.5KV: 19-21 inch,
29.0 1.5KV: 25-29 inch, 30.0 1.5KV: 32 inch
If the meter indication is out of tolerance, immediate service and
correction is required to prevent the possibility of premature
component failure.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
The source of X-RAY RADIATION in this TV receiver is the High
Voltage Section and the Picture Tube.
For continued X-RAY RADIATION protection, the replacement
tube must be the same type tube as specified in the
Replacement Parts List.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF

- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first connecting
one end of an insulated clip lead to the degaussing or kine
aquadag grounding system shield at the point where the picture
tube socket ground lead is connected, and then (b) touch the
other end of the insulated clip lead to the picture tube anode
button, using an insulating handle to avoid personal contact with
high voltage.
4. Do not spray chemicals on or near this receiver or any of its
assemblies.
5. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
7. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
8. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
SERVICING PRECAUTIONS

- 5 -
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -
1. Application range
This specification is applied to ML-038C chassis.
2. Requirement for Test
Testing for standard of each part must be followed in below
condition.
(1) Temperature: 25°C ± 5°C
(2) Humidity: 65% ± 10%
(3) Power: Standard input voltage (AC 100-240V, 50/60Hz)
(4) Measurement must be performed after heat-run more than
15min.
(5) Adjusting standard for this chassis is followed a special
standard.
3. Test and Inspection method
(1) Capacity: Follow LG electronics TV Testing Standard.
(2) Another Required Standard
EMI: Following CE Standard(EN55020)
SAFETY: Following CB Standard(EN55013)
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4.General Specification
1
2
3
4
5
6
7
8
9
10
12
13
14
Video input applicable system
AV input system
Available channel
PC Signal Input
(RGB Input)
Input Voltage
Active Display Size
Operating Temperature
Operating Humidity
Storage Temperature
Storage Humidity
LCD Panel
Lamp
Speaker
1)PAL/SECAM BG
2)PAL/SECAM DK
3)PAL I/I
4)SECAM L/L’
1)PAL
2)SECAM
3)NTSC 3.58/4.43
1)VHF : E2 ~ E12
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21 ~ S41
2)L/L’ VHF: B,C,D
VGA
SVGA
XGA (1024 x 768)
AC 230V/ 50Hz,60HZ
42.02"
Temp : 0 ~ 40 deg
Humidity: 85%
Temp : -20 ~ 60 deg
Humidity : 85%
LC420W02
TFT Active Matrix LCD Panel
1006(H) x 610(V) x 59(D) mm
16:9
1366 x 768
0.227 x 0.681 x RGB
12kg
CCFL(Cold Cathode Fluorescent Lamp)
20EA
50,000Hrs
4
Item Specification Remark
No.
Humidity: 50%(Temp: 40 C)
Life Time: Until brightness of lamp
goes to half of its initial brightness.
(condition: continuous operating
at 25 2C)
Model Name
Feature
Outline Dimension
Aspect Ratio
Resolution
Pixel Pitch
Weight
Backlight System
Quantity
Power Consumption
Life Time
Impedance

- 7 -
5.Feature and Function
1
2
3
4
5
6
7
8
9
10
11
12
Remocon Code
Local Key
OSD Language
Motion Detection
Stereo Sound
Dual Sound
Teletext
DW(Double Window) Mode
Multi Picture Display Mode
Progressive Scan
User Control
PSM
CSM
Picture
CVBS,YC,480ISub - PIP
CVBS,YC, 480I
RGB, DVI ARC
Zoom
Step
Display
mode
- Main
LG Code Only
MENU, ,PR ,VOL ,TV · AV, OK, 0/I
Colour Temperature
Contrast
Brightness
Colour
Tint
Sharpness
Dynamic / Standard / Mild /User
Normal / Cool / Warm / User
(FLI2300)
FM Stereo / Nicam Stereo
FM Stereo / Nicam Stereo
TOP, FLOP, LIST, 128 Page
O
1 PIP
O
16:9(FULL), 4:3, 14:9, Zoom(Letter Box)
Auto ARC
16:9(FULL), 4:3
0 - 50
16:9(FULL), 4:3
English/French/Deutsch/Spanish/Italian
Item Specification Remark
No.
EU
8 Key
Tint (NTSC Signal Only)
9,350 K / 13,500 K / 8,000K
Classified receiving broadcasting form
EU
Flexible Window Size & Position

- 8 -
NO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Resoluton
PC
640 350
640 350
720 400
720 400
640 480
640 480
640 480
800 600
800 600
800 600
800 600
800 600
800 600
1024 768
1024 768
1024 768
1024 768
1360 768
1366 768
832 624
H-freq(kHz)
31.468
37.861
31.469
37.927
31.469
37.861
37.500
35.156
37.879
48.077
46.875
53.674
64.016
48.363
56.476
60.023
68.677
47.7
60.15
49.725
V-freq(kHz)
70.09
85.08
70.08
85.03
59.94
72.80
75.00
56.25
60.31
72.18
75.00
85.06
100.00
60.00
70.06
75.02
84.99
60.00
75.00
74.55
Proposed Remark
EGA
EGA
DOS
DOS
VESA(VGA)
VESA(VGA)
VESA(VGA)
VESA(SVGA)
VESA(SVGA)
VESA(SVGA)
VESA(SVGA)
VESA(SVGA)
VESA(SVGA)
VESA(XGA)
VESA(XGA)
VESA(XGA)
VESA(XGA)
GTF.(WXGA)
GTF.(WXGA)
Macintosh(16")
RGB 1 Only
Pixel clock
25.17
31.50
28.32
35.50
25.17
31.50
31.50
36.00
40.00
50.00
49.50
56.25
69.65
65.00
75.00
78.75
94.50
80.14
102.90
57.28
6. RGB 1 and RGB 2 Input Mode
Vertical Frequency: Standard 0.5Hz
Vertical Lines: Standard 7Lines

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ADJUSTMENT INSTRUCTION
1. Application Object
These instructions are applied to all of the MODELS of LCD MONITOR, ML-
038C.
2. Instruction
2-1. Because this is not a hot chassis, it is not necessary to use an isolation
transformer.
However, the use of isolation transformer will help protect test
instrument.
2-2. Adjustment must be done in the correct order.
But it can be changed in consideration of mass production.
2-3. The adjustment must be performed in the circumstance of 25 5C of
temperature and 65 10% of relative humidity if there is no specific
designation.
2-4. The input voltage of the receiver must keep 220V,60Hz in adjusting.
Input voltage is possible from 100V to 264V . Adjustment should be
operated in 220V/60Hz if there is no specific designation.
2-5. The receiver must be operated for about 15 minutes prior to the
adjustment.
After receiving 100% White Pattern(06CH), the receiver must be operate
prior to the adjustment.(Or white condition in HEAT-RUN mode)
Enter into HEAT-RUN MODE
- Select ‘White’ by pressing ‘POWER ON’ key on SVC Communicator .
CAUTION) If you turn on a still screen more than 20 minutes, a afterimage
may be occur in the black level part of the screen
3. Adjustment
Caution) Each PCB Assy must be checked by Check JIG Set before
assembling.
(Be careful about power PCB ASSY which can give a fatal damage to the
LCD Module.)
3-1.White Balance Adjustment
3-1-1. Required Equipment
Color Analyzer ( CA-100 or same production )
3-1-2. Connection Diagram of Equipment for Measuring (Automatic
Adjustment)
- Connect RS-232C to Adjustment Equipment and SET.
- Automatization operating room has in charge of managing and repairing
about adjusting equipment.
- Automatic adjustment equipment decides the value of R-GAIN/G-GAIN/B-
GAIN
by correcting color coordinates/white balance and transmits them into SET
(Use the RS-232C) and finally the set saves data values.
3-1-2. WhiteBalanceAdjustment(ManualAdjustment)
OperateZero Calibrationof CA-100and Sensormust bestick completely
tothe surfaceof LCDmodule.
DivideManual adjustmentinto AV/PCand operateadjustment by
thefollowing sequence.
Manualadjustment isa temporarymethod whenautomatic adjustmentis
notcorrespondent.
(1)
SelectWHITE PATTERNof HEATRUN modeby pressing‘POWER ON’
keyon SVCCommunicator andthen operateHEAT RUNmore than15 minutes.
.
(2)
Supplypattern signalfor WBadjustment inpattern generator.(ExternalINPUT)
(3) LowLight hasno specialadjustment.
(4)
Toadjust HighLight, sticksensor to(2) pattern(White),and afterselect theR-H
G-Hby pressingADJ buttonon SVCCommunicator, pressthe Vol+/- Key
andadjust ituntil colorcoordination becomes
(BGAIN isfixed)
Colorcoordination :X; 0.281 0.025, Y;0.283 0.025
Colortemperature :9,800 K 1,000 K.
(5)Exit adjustmentmode usingEnter button.
3-2.
EDID(The ExtendedDisplay IdentificationData)/DDC(Display DataChannel) Adjustment
3-2-1.This isa functionthat ismade forthe realizationof "Plug andPlay" which
makespossible touse theuser environmentright afterreorganization by
communicatingwith monitorautomatically.
3-2-2.EDID DATAfor DVIof ML-038C(Datafor DDC)
EDIDTable=
3-2-2.EDID DATAfor RGBof ML-038C
EDIDTable=
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 00 FF FF FF FF FF FF 00 1E 6D D7 3A 01 01 01 01
10 33 0E 01 01 1E 5D 34 96 08 B7 FB A1 56 48 98 24
20 13 48 4B AF EF 80 31 40 31 59 3B D9 45 40 45 59
30 61 59 81 40 01 01 BC 34 00 98 51 00 2A 40 10 90
40 13 00 A2 0B 32 00 00 1E F9 15 20 F8 30 58 1F 20
50 20 40 13 00 A2 0B 32 00 00 1E 00 00 00 FD 00 38
60 55 1E 50 0E 00 0A 20 20 20 20 20 20 00 00 00 FC
70 00 52 5A 2D 34 32 4C 5A 33 30 20 20 20 20 00 8F
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 00 FF FF FF FF FF FF 00 1E 6D D7 3A 01 01 01 01
10 33 0E 01 01 81 5D 34 96 08 B7 FB A1 56 48 98 24
20 13 48 4B AF EF 80 31 40 31 59 3B D9 45 40 45 59
30 61 59 81 4F 71 59 30 2A 00 98 51 00 2A 40 30 70
40 13 00 A2 0B 32 00 00 18 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 A2 0B 32 00 00 1E 00 00 00 FD 00 38
60 4B 1E 50 0E 00 0A 20 20 20 20 20 20 00 00 00 FC
70 00 52 5A 2D 34 32 4C 5A 33 30 20 20 20 20 00 DF
<Fig .1> Connection Diagram of Automatic Adjustment
RS-232C
Window
MASTER OR
QUANTUM DATA
High Light
COLOR
ANALYZER
TYPE; CA-100
RGB Signal Input
LCD TV
Model Name ML-038C RZ-42LZ30
Title
115200
Index
R-H Cmd1
j
Cmd2 Data Min.Value
Max.Value
d
G-H je
R-Gain
ja
G-Gain
jb
0100
0100
0100
0100
Protocol
81
NONE
Baud rate Data bit Stop bit Parity bit
RS-232C
Communication

- 10 -
EDID ADJUSTMENT
220
IBM
Compatible PC
Video Signal
Generator
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch
(110V/220V)
Control Line
Not used
RS232C
PARALLEL
V-SYNC POWER
ST
VGS MONITOR
E
E
V-Sync On/Off Switch
F
F
A
A
B
B
C
C
1510
5
569
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
Figure 1. Cable Connection
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys”file to
“c:\WINNT\system32\drivers”folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
e) Click Start button.
f) Click Exit button.
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update”button
c) Click “Write”button

- 11 -
SVC REMOCON
1 POWER
2 POWER ON
3 MUTE
4 P-CHECK
5 S-CHECK
6 ARC
7 CAPTION
8 TXT
9 TV/AV
10 TURBO SOUND
11 TURBO PICTURE
12 IN-START
13 ADJ
14 MPX
15 EXIT
16 APC(PSM)
17 ASC(SSM)
18 MULTIMIDIA
19 FRONT-AV
20 CH
21 VOL
22 ENTER
23 PIP CH-(OP1)
24 PIP CH+(OP2)
25 PIP SWAP(OP3)
26 PIP INPUT(OP4)
27 EYE
28 MENU
29 IN-STOP
30 STILL
31 TIME
32 SIZE
33 MULTI PIP
34 POSITION
35 MODE
36 PIP
37 TILT
38 0~9
To turn the TV on or off
To turn the TV on automatically if the power is supplied to the TV. (Use the
POWER key to deactivate): It should be deactivated when delivered.
To activate the mute function.
To check TV screen image easily.
To check TV screen sound easily
To select size of the main screen (Normal, Spectacle, Wide or Zoom)
Switch to closed caption broadcasting
To toggle on/off the teletext mode
To select an external input for the TV screen
To start turbo sound
To start turbo picture
To enter adjustment mode when manufacturing the TV sets.
To adjust the screen voltage (automatic):
In-start mute Adjust AV(Enter into W/B adjustment mode)
W/B adjustment (automatic):
After adjusting the screen W/B adjustment Exit two times (Adjustment completed)
To enter into the adjustment mode. To adjust horizontal line and sub-brightness.
To select the multiple sound mode (Mono, Stereo or Foreign language)
To release the adjustment mode
To easily adjust the screen according to surrounding brightness
To easily adjust sound according to the program type
To check component input
To check the front AV
To move channel up/down or to select a function displayed on the screen.
To adjust the volume or accurately control a specific function.
To set a specific function or complete setting.
To move the channel down in the PIP screen.
To use as a red key in the teletext mode
To move the channel in the PIP screen
To use as a green key in the teletext mode
To switch between the main and sub screens
To use as a yellow key in the teletext mode
To select the input status in the PIP screen
To use as a blue key in the teletext mode
To set a function that will automatically adjust screen status to match
the surrounding brightness so natural color can be displayed.
To select the functions such as video, voice, function or channel.
To set the delivery condition status after manufacturing the TV set.
To halt the main screen in the normal mode, or the sub screen at the PIP screen.
Used as a hold key in the teletext mode (Page updating is stopped.)
Displays the teletext time in the normal mode
Enables to select the sub code in the teletext mode
Used as the size key in the PIP screen in the normal mode
Used as the size key in the teletext mode
Used as the index key in the teletext mode (Top index will be
displayed if it is the top text.)
To select the position of the PIP screen in the normal mode
Used as the update key in the teletext mode (Text will be
displayed if the current page is updated.)
Used as Mode in the teletext mode
To select the simultaneous screen
To adjust screen tilt
To manually select the channel.
Shortcut keys
Shortcut keys
Shortcut keys
Use the AV
key to enter
the screen
W/B
adjustment
mode.
Shortcut keys
Shortcut keys
Shortcut keys

- 12 -
TROUBLESHOOTING
No Power
(LED Indicator off)
Change IC1305
Change IC901, IC905
Change LED Ass'y
Check SMPS output
Check P201 Connector
Change SMPS Board
Check SMPS
Output
Stby 5V, Stby 3.3V,
18V, 3.3V
Fail
Check in
Input B+
IC901 & IC905
Fail Fail
Pass
Pass Pass
Check IC1305
Check index
STBY 5V
(LED ASS'Y)
Fail
Pass

- 13 -
No Raster
Check LED Status Check inverter
connector
Fail
Pass
Fail
Check invert
connector
Check invert
Pass
Check invert
Pass
Check panel
Link cabel
Pass
Change panel
Link cabel
Pass
Check module
Check the
77, 76 of IC901
Pass
Change module
Fail
Change IC905
Change IC905
Change input source cabel and Jack
Check Output of
IC905
Pass
Pass
Pass
Check IIC ERROR of
IC901
Pass
Check IIC ERROR of
IC901
Fail
A:process

- 14 -
No Raster on AV signal
(Video, S-Video)
Repeat
A:Process Check the out of
TU801
Fail
Pass
Fail
No Raster on TV(RF) signal
Check 5V, 33V of TU801
Re-soldering or
Change the defect part
Check the input
of IC1201
Fail
Pass
Check the C1238, C1240, C1243, C1236
Change the defect part
Check the in/output
of IC1201
Fail
Pass
Re-soldering or
Change the defect part
Check the
in/outputof IC401
Fail
Pass
Re-soldering or
Change the defect part
Check input source cabel and jack

- 15 -
No sound
Check the input
source
Fail
Pass
Change source input
Check the input
of IC1102 Check the pin 56, 57
of IC1102
Fail
Fail
Fail
Pass
Change the Defet part
Check the input
of IC1001, IC1002 Check the output
of IC1102
Pass
Pass
Fail
Pass
Change IC601
Check the R1144,
R1140
Fail
Change R1144, R1140
Check the output
of IC1001, IC1002
Fail
Pass
Change IC1001, IC1002
Check the
speaker
Fail
Pass
Change speaker
Check the speaker wire

BLOCK DIAGRAM
- 16 -
AV1
AV3
AV2
Tuner
DVI-D
PC
RS-232
S-VHS
CXA2089
(Half Scart)
(Half Scart)
(FullScart)
V_V_Out
TV_A R/L_Out
VPC3230
(Video Decoder)
FLI2300
(Deinterlacing
/Enhancer)
OPLUS
YUV 4:2:2
H/V SYNC
YUV 4:2:2
H/V SYNC
SDRAM SDRAM x 3
AD9888
(A/DConvetor)
SDA555
EPROM
SRAM
EEPROM
SIL161
DS232A
(TMDS Receiver)
(Level shfting)
M-COM
Flash
Memory
SRAM
EEPROM
L
V
D
S
LCD
Module
MSM82C55
(Port Extension)
CNTL & IR
Scart R/G/B
DigitalR/G/B24BIT(4:4:4)
R/G/B/H/V
CXA2101
(Component
Processor)
H/V SYNC
MSP3410 MPS7720 SPK(Stereo)

- 17 -
BLOCK DIAGRAM DESCRIPTION
1. Input block
_ It is consist of CVBS, S-Video, RF, Analog RGB, DVI-D signals.
_ The RS-232C jack is used for software-upgrade and white balance adjustment.
_ It is connected with PC for software-upgrade usage
or white balance adjustment equipment in manufacturing process.
2. Video Signal Path
_ CXA2089 is switching IC for AV signals(AV1,AV2,AV3,RF signals).
_ VPC3230 are have functions are
- high performance adaptive 4H Comb-Filter Y/C separator with adjustable vertical peaking.
- multi-standard color decoder PAL/NTSC/SECAM including all sub standards.
_ FLI2300 is Deinterlacer/Line doubler.
- Supports 525/60(NTSC),625/50(PAL/SECAM).
- Accept up to 1100 pixels/line.
_ Scaler input Block.
- Input data format is YUV 4:2:2 plus H,V sync and data clock .
- Deinterlacer IC's output pass through this.

- 18 -
EXPLODED VIEW
123
4
15
17
19
16
18
9
10
8
7
56
13
14
20
21
23
22
11
12

- 19 -
EXPLODED VIEW PARTS LIST
1 3091TKE015F CABINET ASSEMBLY, RZ-42LZ30.APLLKX BRAND 3090V00554 SET
3091TKE015B CABINET ASSEMBLY, RZ-42LZ30.BRAND 3090V00554 SKD
2 6304FLP125A
LCD(LIQUID CRYSTAL DISPLAY), LC420W02-A4K1 LG PHILPS TFT COLOR NORMAL POL,WXGA,20LAMP,500NITS, H-L, W/O AI
3 3809TKE011B BACK COVER ASSEMBLY, RZ-42LZ30 3808V00453 (3850VC0002F)
3809TKE011A BACK COVER ASSEMBLY, RZ-42LZ30 3808V00453 SKD
3809V00433B BACK COVER ASSEMBLY, RZ-42LZ30 NON ML-038B
4 4811V00088A BRACKET ASSEMBLY, STAND DN-42LZ30 NON .
5 3141VSN887A CHASSIS ASSEMBLY, SUB ML038B KEY CONTROL FOR RZ-42LZ30
6 3141VSN888A CHASSIS ASSEMBLY, SUB ML038B PREAMP ASSY FOR RZ-42LZ30
7 6401TZZ051B SPEAKER ASSEMBLY, RZ-42LZ30 ESTEC(LEFT)
6401VD0009B SPEAKER ASSEMBLY, DOME(L). RZ-42LZ30
8 6401TZZ043B SPEAKER ASSEMBLY, RZ-42LZ30 ESTEC(RIGHT)
6401VD0010B SPEAKER ASSEMBLY, DOME(R). RZ-42LZ30
9 4950V00212A METAL, SUPPORTER AL MAIN DIE-CASTING
10 4950V00214A METAL, SUPPORTER EGI SUPPOTER EXTRA DIE-CASTING
11 6871TPT277A PWB(PCB) ASSEMBLY, POWER, DN-42LZ30 POWER TOTAL BRAND INCLUDE D/D
12 6871TPT277B PWB(PCB) ASSEMBLY, POWER, DN-42LZ30 POWER TOTAL BRAND LEFT, NONE D/D
13 3141VSN889A CHASSIS ASSEMBLY, SUB ML038B LED ASSY FOR RZ-42LZ30
14 6871TSH601A PWB(PCB) ASSEMBLY,SUB, RZ-42LZ30 SUB HAND BRAND A/V BOARD
15 4951TKS147B METAL ASSEMBLY, FRAME RZ-42LZ30 4950TKS290B
4951TKS147C METAL ASSEMBLY, FRAME RZ-42LZ30 4950TKS290B C/SKD
16 6871TPT276A
PWB(PCB) ASSEMBLY, POWER, RZ-42LZ30 POWER TOTAL BRAND EMI_FILTER, NON-PHONEJACK
17 3141VMNR70A CHASSIS ASSEMBLY, MAIN ML038B FOR RZ-42LZ30
18 4951TKK175B METAL ASSEMBLY, REAR A/V RZ-42LZ30 4950V00221B
4951TKK175C METAL ASSEMBLY, REAR A/V RZ-42LZ30 4950V00221B C/SKD
19 4951TKK168B METAL ASSEMBLY, SHIELD RZ-42LZ30 4950TKK847A
4951TKK168C METAL ASSEMBLY, SHIELD RZ-42LZ30 4950TKK847A C/SKD
20 3550TKK582A COVER, 42LZ30 REAR A/V SET
3550TKK582B COVER, 42LZ30 REAR A/V C/SKD
21 4950V00213A METAL, BRACKET AL STAND DIE-CASTING
22 4810V00966A BRACKET, STAND DN-42LZ30 AL03HA ABS 3.5T
23 4950V00211A METAL, STAND EGI 5T BASE NCT
No. PART NO. DESCRIPTION

- 20 -
DATE: 2004. 06. 10.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
C001 0CE107DF618 100UF STD 16V M FL TP5
C004 0CE107DF618 100UF STD 16V M FL TP5
C005 0CE107DF618 100UF STD 16V M FL TP5
C007 0CE105DK618 1UF STD 50V M FL TP5
C012 0CE107DF618 100UF STD 16V M FL TP5
C019 0CE107DF618 100UF STD 16V M FL TP5
C022 0CE107DF618 100UF STD 16V M FL TP5
C024 0CE107DF618 100UF STD 16V M FL TP5
C027 0CE107DF618 100UF STD 16V M FL TP5
C032 0CE107DF618 100UF STD 16V M FL TP5
C034 0CE107DF618 100UF STD 16V M FL TP5
C1000 0CE108DJ618 1000UF STD 35V M FL TP5
C1001 0CE108DJ618 1000UF STD 35V M FL TP5
C1008 0CE107DK618 100UF STD 50V M FL TP5
C1009 0CE107DK618 100UF STD 50V M FL TP5
C1012 0CE476DF618 47UF STD 16V M FL TP5
C1013 0CE476DF618 47UF STD 16V M FL TP5
C1018 0CE476DK618 47UF STD 50V M FL TP5
C1105 0CE106DF618 10UF STD 16V M FL TP5
C1106 0CE106DF618 10UF STD 16V M FL TP5
C1108 0CE107DF618 100UF STD 16V M FL TP5
C1110 0CE107DF618 100UF STD 16V M FL TP5
C1111 0CE106DF618 10UF STD 16V M FL TP5
C1117 0CE107DF618 100UF STD 16V M FL TP5
C1124 0CE107DF618 100UF STD 16V M FL TP5
C113 0CE107DF618 100UF STD 16V M FL TP5
C1137 0CE476DF618 47UF STD 16V M FL TP5
C1138 0CE106DF618 10UF STD 16V M FL TP5
C1146 0CE476DF618 47UF STD 16V M FL TP5
C1159 0CE106DK618 10UF STD 50V M FL TP5
C116 0CE107DF618 100UF STD 16V M FL TP5
C1223 0CE106DF618 10UF STD 16V M FL TP5
C1225 0CE106DF618 10UF STD 16V M FL TP5
C1226 0CE476DF618 47UF STD 16V M FL TP5
C1227 0CE106DF618 10UF STD 16V M FL TP5
C1228 0CE106DF618 10UF STD 16V M FL TP5
C1245 0CE106DF618 10UF STD 16V M FL TP5
C1246 0CE107DF618 100UF STD 16V M FL TP5
C1248 0CE107DF618 100UF STD 16V M FL TP5
C1251 0CE107DF618 100UF STD 16V M FL TP5
C129 0CE105DK618 1UF STD 50V M FL TP5
C1304 0CE107DF618 100UF STD 16V M FL TP5
C1305 0CE476DK618 47UF STD 50V M FL TP5
C131 0CE107DF618 100UF STD 16V M FL TP5
C132 0CE107DF618 100UF STD 16V M FL TP5
C1321 0CE107DF618 100UF STD 16V M FL TP5
C1325 0CE107DF618 100UF STD 16V M FL TP5
C1326 0CE107DF618 100UF STD 16V M FL TP5
C1331 0CE107DF618 100UF STD 16V M FL TP5
C1337 0CE476DF618 47UF STD 16V M FL TP5
C137 0CE107DF618 100UF STD 16V M FL TP5
C144 0CE106DF618 10UF STD 16V M FL TP5
C148 0CE106DF618 10UF STD 16V M FL TP5
C162 0CE476DF618 47UF STD 16V M FL TP5
DATE: 2004. 06. 10.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
C163 0CE107DF618 100UF STD 16V M FL TP5
C167 0CE107DF618 100UF STD 16V M FL TP5
C170 0CE107DK618 100UF STD 50V M FL TP5
C236 0CE106DF618 10UF STD 16V M FL TP5
C238 0CE106DF618 10UF STD 16V M FL TP5
C239 0CE476DF618 47UF STD 16V M FL TP5
C240 0CE106DF618 10UF STD 16V M FL TP5
C249 0CE476DF618 47UF STD 16V M FL TP5
C253 0CE107DF618 100UF STD 16V M FL TP5
C257 0CE107DF618 100UF STD 16V M FL TP5
C258 0CE107DF618 100UF STD 16V M FL TP5
C261 0CE476DF618 47UF STD 16V M FL TP5
C313 0CE476DF618 47UF STD 16V M FL TP5
C317 0CE476DF618 47UF STD 16V M FL TP5
C318 0CE476DF618 47UF STD 16V M FL TP5
C321 0CE476DF618 47UF STD 16V M FL TP5
C322 0CE476DF618 47UF STD 16V M FL TP5
C323 0CE476DF618 47UF STD 16V M FL TP5
C325 0CE476DF618 47UF STD 16V M FL TP5
C409 0CE107DF618 100UF STD 16V M FL TP5
C415 0CE107DF618 100UF STD 16V M FL TP5
C419 0CE476DF618 47UF STD 16V M FL TP5
C422 0CE476DF618 47UF STD 16V M FL TP5
C453 0CE476DF618 47UF STD 16V M FL TP5
C457 0CE107DF618 100UF STD 16V M FL TP5
C552 0CE476DF618 47UF STD 16V M FL TP5
C554 0CE476DF618 47UF STD 16V M FL TP5
C556 0CE476DF618 47UF STD 16V M FL TP5
C558 0CE476DF618 47UF STD 16V M FL TP5
C560 0CE476DF618 47UF STD 16V M FL TP5
C563 0CE107DF618 100UF STD 16V M FL TP5
C565 0CE107DF618 100UF STD 16V M FL TP5
C569 0CE107DF618 100UF STD 16V M FL TP5
C631 0CE107DF618 100UF STD 16V M FL TP5
C633 0CE107DF618 100UF STD 16V M FL TP5
C634 0CE107DF618 100UF STD 16V M FL TP5
C636 0CE107DF618 100UF STD 16V M FL TP5
C734 0CE107DF618 100UF STD 16V M FL TP5
C736 0CE107DF618 100UF STD 16V M FL TP5
C737 0CE107DF618 100UF STD 16V M FL TP5
C801 0CE105DK618 1UF STD 50V M FL TP5
C802 0CE227DF618 220UF STD 16V M FL TP5
C806 0CE107DF618 100UF STD 16V M FL TP5
C807 0CE105DK618 1UF STD 50V M FL TP5
C808 0CE107DF618 100UF STD 16V M FL TP5
C812 0CE107DF618 100UF STD 16V M FL TP5
C925 0CE105DK618 1UF STD 50V M FL TP5
C936 0CE476DF618 47UF STD 16V M FL TP5
C937 0CE476DF618 47UF STD 16V M FL TP5
C939 0CE476DF618 47UF STD 16V M FL TP5
C942 0CE476DF618 47UF STD 16V M FL TP5
C948 0CE476DF618 47UF STD 16V M FL TP5
C957 0CE476DF618 47UF STD 16V M FL TP5
C1129 0CH3472K516 4700PF 50V K B 2012 R/TP
REPLACEMENT PARTS LIST
MAIN BOARD
CAPACITOR
For Capacitor & Resistors, the
charactors at 2nd and 3rd digit in the
P/No. means as follows;
CC, CX, CK, CN, CH : Ceramic
CQ : Polyestor
CE : Electrolytic
CF : Fixed Film
RD : Carbon Film
RS : Metal Oxide Film
RN : Metal Film
RH : CHIP, Metal Glazed(Chip)
RR : Drawing
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