LG 29LN300B User manual

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Internal Use Only
Printed in KoreaP/NO :
CHASSIS :
MODEL :
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
SERVICE MANUAL
MFL68127226 (1406-REV00)
29LN300B 29LN300B-PC
LL40A
LED TV

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Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SERVICING PRECAUTIONS.................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 8
TROUBLE SHOOTING........................................................................... 12
BLOCK DIAGRAM.................................................................................. 16
EXPLODED VIEW .................................................................................. 17
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
0.15µF
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

- 4 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
1. Application Range
This spec sheet is applied all of the TV used LL40A chassis.
2. Specication
Each part is tested as below without special appointment
1) Temperature : 25 ˚C ± 5 ˚C (77 ˚F ± 9 ˚F),
CST : 40 ˚C ± 5 ˚C
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage : Standard input voltage
(100 V - 240 V ~, 50 / 60 Hz)
· Standard Voltage of each products is marked by mod-
els
4) Specication and performance of each parts are followed
each drawing and specication by part number in accord-
ance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3.Test method
1) Performance : LGE TV test method followed
2) Demanded other specication
- Safety : CE,IEC specication
- EMC : CE,IEC specication
NOTE : Specications and others are subject to change without notice for improvement.
4. General specication
4.1. TV
4.2. Feature and Function
No Item Specication Remarks
1 Market Brazil
2 Receiving System ISDB-T/ PAL-M / PAL-N
3 Receiving system ISDB-T/ PAL-M / PAL-N
4 Interface RF / Composite / Component(CVBS) / HDMI /USB / Audio In
/RGB
No Item Specication Remarks
1 RF Input Analog PAL-M / PAL-N
DTV ISDB-T
2 HDMI Input (Rear) HDMI version 1.4/ support PC, Sup-
port HDCP
Rear : 1EA
3 Component Input
(Rear, 1EA)
Y/Pb/Pr
4 USB (Side, 1EA) For My Media
(Movie/Photo/Music List) or SVC
Software Update + Picture
+ Music + Movie
5 Remocon Code LG code

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Only for training and service purposes
- RGB/HDMI (PC)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720*400 31.468 70.080 28.321
2 640*480 31.469 59.940 25.175
3 640*480 37.500 75.000 31.500
4 800*600 37.879 60.317 40.000
5 800*600 46.875 75.000 49.500
6 1024*768 48.363 60.004 65.000
7 1024*768 60.023 75.029 78.750
8 1280*800 49.702 59.810 83.500
9 1366*768 47.717 59.79 85.5
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720* 480 31.469 / 31.5 59.94 / 60 27.00/ 27.03 SDTV 480P
2 720*576 31.25 50.00 27.864 SDTV 576P
3 1280*720 37.50 50.00 74.250 HDTV 720P
4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P
5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I
6 1920* 1080 28.125 50.00 74.25 HDTV 1080I
7 1920* 1080 27.00 24 74.25 HDTV 1080P
8 1920* 1080 33.75 30.00 74.25 HDTV 1080P
9 1920* 1080 56.250 50 148.5 HDTV 1080P
10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720*480 15.730 59.940 13.500 SDTV, DVD 480I(525I)
2 720*480 15.750 60.000 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.000 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.470 59.940 27.000 SDTV 480P
5 720*480 31.500 60.000 27.027 SDTV 480P
6 720*576 31.250 50.000 27.000 SDTV 576P 50Hz
7 1280*720 44.960 59.940 74.176 HDTV 720P
8 1280*720 45.000 60.000 74.250 HDTV 720P
9 1280*720 37.500 50.000 74.250 HDTV 720P 50Hz
10 1920*1080 33.720 59.940 74.176 HDTV 1080I
11 1920*1080 33.750 60.000 74.250 HDTV 1080I
12 1920*1080 28.125 50.000 74.250 HDTV 1080I 50Hz,
13 1920*1080 56.250 50.000 148.500 HDTV 1080P
14 1920*1080 67.432 59.940 148.350 HDTV 1080P
15 1920*1080 67.500 60.000 148.500 HDTV 1080P
- HDMI (DTV)
- Component
5. External Input Support Format

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ADJUSTMENT INSTRUCTION
1. Application Range
This document is applied to LL40A chassis TV which is manu-
factured in TV (or Monitor) Factory or is produced on the basis
of this data.
2. Designation
1) The adjustment is according to the order which is designat-
ed and which must be followed, according to the plan which
can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specication Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments : Color Analyzer (CA-210 or CA-
110), DDC Adjustment Jig equipment, SVC remote control-
ler.
7) Push The "IN STOP KEY" – For memory initialization
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot le Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Cong” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig,
and set.
3) Click “Connect” tab. If display “Can’t ”, Check connect
computer, jig, and set.
4) Click “Read” tab, and then load download le(XXXX.bin) by
clicking “Read”
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
* USB DOWNLOAD(*.epk le download)
1) Make New folder named “LG_DTV” and put ISP le(*.epk)
in the folder.
2) Put the USB Stick to the USB socket.
3) Automatically detecting update le in USB Stick
- If your downloaded program version in USB Stick is
Low, it didn’t work. But your downloaded version is
High, USB data is automatically detecting.
4) Show the message “Copy the le from the Memory…”
5) Updating is starting.
6) Updating Completed, The TV will restart automatically.
7) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV
have, TV can lost all channel data. In this case, you
have to channel recover. if all channel data is cleared,
you didn’t have a DTV/ATV test on production line.
Case1 : Software version up
1) After downloading S/W by USB , Multi-vision set will
reboot automatically
2) Push "In-stop" key
3) Push "Power on" key
4) Function inspection
5) After function inspection, Push "In-stop" key.
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push "In-
stop" ke y at rst.
2) Push "Power on" key for turning it on.
→ If you push "Power on" key, TV set will recover channel
information by itself.
3) After function inspection, Push "In-stop" key.
(1) (3)
(2) OK
Please Check the Speed :
Use the speed under
200KHz.
(4)
filexxx.bin
(
6
)
(5)
(7) ……….OK
(
5
)

- 9 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.1. EDID Process
3.1.1. EDID download
1) Press “Power only” key of service remote controller.
2) Press the “ADJ” Key of service remote controller.
3) Enter EDID D/L mode by pushing “►” key at “EDID D/L”.
4) Select “Start” menu to download EDID data.
5) Check the “OK” message.
6) Press EXIT key on R/C.
→ Caution: - Do not connect HDMI & D-sub Cable when
download EDID.
* Edid data and Model option download (RS232)
→Caution
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
3.1.2. RGB EDID Data
- RGB EDID Data (Rev2, 2012.08.29) – Checksum : B3
3.1.3. HDMI EDID Data
- HDMI1 EDID Data (Rev2, 2012.08.29) – Checksum : 98 CE
3.2. Function Check
3.2.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI(PC : 1366 x 768 @ 60Hz)
* Display and Sound check is executed by Remote controller
* Some models do not support RGB & PC audio in. It depends
on model spec.
→ Caution : Not to push the INSTOP KEY after completion if
the function inspection.
NO Item CMD
1
CMD
2
Data 0
Enter
download
MODE
Download
‘Mode In’
A A 0 0 When transfer the
‘Mode In’,
Carry the command.
EDID data and
Model option
download
Download A E 00 10 Automatically download
(The use of a internal
Data)
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X[UG{GzGzG
X\UGlUGpGhG
X]UGzwrGsGhG
X^UzwkpmGsGhG
G G
G G G
lkpkGkVsG
oktpXGGGGGGGGGGGGvrG G G
G G G
G G G
G
GzG G yG G
G

- 10 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. Total Assembly line process
4.1. Tool option & ADC Check
1) Press “Power on” key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Check the 'Tool Option' (Refer to the BOM Comments or
Adjustment spec)
4) Check the ‘ADC’ is ok.
4.2. Model name & Serial number Down-
load
4.2.1. Model name & Serial number D/L
1) Press “Power on” key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Write Model Name & Serial Number by use RS-232.
4) Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
4.2.2. Method & notice
1) Model Name & Serial Number D/L is using of scan equip-
ment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
* Manual Download (Model Name and Serial
Number)
If the TV set is downloaded By OTA or Service man, Some-
times model name or serial number is initialized.( Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the 'Instart' key of ADJ remote controller.
2) Go to the menu 'Model Number D/L' like below photo.
3) Input the Factory model name (ex 24LN4500) or Serial
number like photo.
4) Check the model name Instart menu →Factory name
displayed (ex 24MT55D)
5) Check the Diagnostics (DTV country only) →Buyer model
displayed (ex 24MT45D-PZP)
4.3. Function Check
4.3.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI(PC : 1366 x 768 @ 60Hz)
* Display and Sound check is executed by Remote controller
* Some models do not support RGB & PC audio in. It depends
on model spec.
→ Caution : Not to push the INSTOP KEY after completion if
the function inspection.
4.3.2. PIP Check
1) Press "Power on" key of service remote control.
2) Input RGB & TV(ATV or DTV) signal.
3) Set Input mode to RGB.
4) Press ‘PIP" key of ADJ remote controller
5) Check TV Video & Audio signal of Sub picture.

- 11 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.4. White balance adjustment
-Equipment
1) Color Analyzer: CA-210 (LED Module : CH 14)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
*RGB Gains are xed data for each model.
Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
→ Total Assembly line should be check whether the color
coordinate(x,y) data refer to below table were meet or not.
*Note : x,y coordinates are drifted about 0.007 after 30 mins
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
*Note : Manual W/B process using adjusts Remote control.
1) After enter Service Mode by pushing "ADJ" key,
2) Enter "White Balance" by pushing "►" key at "White Bal-
ance".
* When doing Adjustment, Please make circumstance as
below.
4.5. DPM Operation check
■ Measurement Condition: 100~240V@ 50/60Hz
1) Set Input to RGB-PC and connect D-sub cable to set –
RGB Mode
Set Input to HDMI (with Input Label set to PC) and connect
HDMI cable to set – HDMI Mode
2) Cut off H sync or V sync of signal.
3) Check DPM operation refer to the below table.
4.6. Model Name & SW Version & Adjust check.
* Press the ‘Instart’ key of ADJ remote controller
4.6.1. Model Name& SW Version Check
1) Check ‘Model Name’.
2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)
4.6.2. Adjust Check
1) Check ‘Country Group’
2) Check ‘Area Option’
3) Check ‘Tool Option’ (Refer to the BOM Comments)
4) Check ‘EDID[RGB&HDMI]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote controller
to go out SVC menu.
Operating Condition Sync
(H/V)
Video LED
(SET)
Wattage
(W)
Power S/W On Sleep mode -
RGB,HDMI
Off/Off Off Amber 1
G
WUG{GvXGG G
XUG{GvYG G G
YUG{GvZG G G
ZUG{Gv[G G G
[UG{Gv\G
\UG{Gv]G
G G
]UGjGnG G G
^UGhGvG
_UGhkjGjGGGGGGGGG
G G
`UG~GiG G G G G G G G G G ඖG G G
XWUGXWGwG~iG G G G
XXUG{GwG G G G G
XYUGlkpkGkVsGGGGGGGGGGGGGG G G
XZUGzGiVjG
X[UG{GzGzG
X\GlUGpGhG
G G
G G G
~GiG
jG{UG ඔG jG ඖG
yTnG G XWWG G
nTnG G XW[G G
iTnG G X`YG G
yTjG G ][G G
nTjG G ][G G
iTjG G ][G G
{TwG G vuG G
iG G XWWG G
yG G {GzG G
Color
Temperature
Cool 13,000 °K X=0.276 (±0.04)
Y=0.275 (±0.04)
<Test Signal>
Inner pattern
(204gray,80IRE)
Medium 9,300 °K X=0.290 (±0.04)
Y=0.298 (±0.04)
Warm 6,500 °K X=0.318 (±0.04)
Y=0.334 (±0.04)
Luminance
(cd/m²)
Cool Min : 80 Typ : 110 <Test Signal>
Inner pattern
(204gray,80IRE)
Medium Min : 80 Typ : 110
Warm Min : 70 Typ : 110

- 12 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
TROUBLE SHOOTING
1. No Power
Replace X100
N
Check C400
Voltage Level (19V)
Check Power connector
OK ? Replace Adapter
Y
N Y
Check IC401 Output
Voltage Level (3.3V)
Replace IC401 &
Recheck
Y
N
Check X100 Clock
24MHz
Replace IC100 Flash
Memory
Y
Check IC403 Output
Voltage Level (5V)
Replace IC403 &
Recheck
Y
N
Check IC402 Output
Voltage Level (1.15V)
Replace IC402 &
Recheck
N
Y

- 13 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. No Picture
Replace Cable
N
Module Back Light On?
Check IC1001 & Q1002
Replace LED Driver IC or FET
Y
N
N
Check Panel Power 12V (P600 #30)
Check IC400 Output 12V
Replace IC400 &
Recheck
Y
N
Check Panel input Clock
P601(#9, #10)
Check IC101
Repair Main B/D
Y
N
Check FFC Cable for Damage or
Open Conductors
Check LED Driver Output
(C1024)
Replace T-Con Board or Module
Y
Check IC101
Replace Main SOC
N
Check WLED_ENABLE High?
Y

- 14 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. No Video - Digital TV
Check RF Cable
Y
1. Check RF IC(L2606) Power (3.3V)
2. Check IC401 Output voltage(3.3V)
Replace IC401 &
Recheck
Y
N
Check SCL/SDA Line(TU2603 #4, #5) Replace TU2603 or IC101
N

- 15 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. No Video - HDMI
Replace Main Scaler (IC101)
Check input signal format
Is it supported?
Check JK801 for proper
connection or Damage Replace Connector
Y
N
Check I2C Signal
(JK801) Re Download EDID Data
Y
N
Y
Check HDMI Cable for Damage or
Open Connector
Y

- 16 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
BLOCK DIAGRAM

- 17 - LGE Internal Use Only
Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
300 200
120
900
400
910
540
800
810
510
301
302
511
LV1
A2
535
820

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
POWER
2013/08/08
1 12
MT45
R425
0
5%
R423
10K
1%
HD(12V Panel)
C414
0.1uF
50V
R409
10K
HD(12V Panel)
C406
0.1uF
50V
HD(12V Panel)
C417
0.1uF
16V
HD(12V Panel)
R419
33K
R402
47K
OPT
PANEL_CTL
L401
10uH
C422
10uF
16V
OPT
IC401
MP2315GJ
3
SW
2
IN
4
GND
1
AAM
5BST
6EN/SYNC
7VCC
8FB
C401
10uF
25V
OPT
MULTI_ON
R422
100K
1%
HD(12V Panel)
C408
0.1uF
50V
C412
0.1uF
50V
HD(12V Panel)
R440
22K
C407
0.1uF
50V
C413
0.1uF
50V
C402
10uF
25V
OPT
+3.3V_ST
C426
10uF
10V
OPT
C423
22uF
6.3V
R434
100K
IC400
MP2315GJ
HD(12V Panel)
3
SW
2
IN
4
GND
1
AAM
5BST
6EN/SYNC
7VCC
8FB
+12V_Normal
R404
47K
OPT
Q402
PMV48XP
G
D
S
+1.15V_VDDC
JP401
C429
0.1uF
16V
L402
10uH
HD(12V Panel)
R427
5.1K
1%
C438
0.1uF
16V
R429
10K
1%
C434
1uF
10V
OPT
C419
0.1uF
16V
JK400
KJA-DC-1-0032
1
2
4
R410
2K
OPT
R439
10K
R413
2K
OPT
C418
0.1uF
16V
R438
100
C400
47uF
25V
+12V_Normal
+12V_PANEL_POWER
+3.3V_Normal
POWER_ON/OFF1
C421
22uF
6.3V
R418
33K
HD(12V Panel)
R403
47K
+3.3V_ST
C425
10uF
10V
OPT
+3.3V_Normal
R412
20K
Q403
AO3407A
G
D
S
C424
10uF
16V
HD(12V Panel)
Q400
MMBT3904(NXP)
E
B
C
C430
0.1uF
16V
JP400
+19V
R426
10K
1%
R428
27K
1%
R424
4.7K
1%
R421
43K
1%
HD(12V Panel)
IC402
MP2315GJ
3
SW
2
IN
4
GND
1
AAM
5BST
6EN/SYNC
7VCC
8FB
Q401
MMBT3904(NXP)
E
B
C
R411
100K
C428
0.1uF
16V
HD(12V Panel)
R437
0
HD(12V Panel)
+5V_Normal
R446
0
HD(12V Panel)
+5V_PANEL_POWER
R420
33K
R405
47K
OPT
MULTI_ON
C427
10uF
10V
OPT
C431
10uF
10V
C432
0.1uF
16V
IC403
MP2315GJ
3
SW
2
IN
4
GND
1
AAM
5BST
6EN/SYNC
7VCC
8FB
C416
0.1uF
50V
L403
10uH
+5V_Normal
C420
0.1uF
16V
C411
0.1uF
50V
C410
0.47uF
16V
OPT
C439
4.7uF
10V
C436
1uF
16V
+3.3V_ST
R449
10K
R417
2K
OPT
C415
0.1uF
16V
R436
4.7K
C440
4.7uF
16V
R415
68
R406
68
HD(12V Panel)
R407
68
R408
68
R416
75K
1%
R441
100K
R442
10K
FHD(5V Panel)
C403
2.2uF
25V
C409
2.2uF
25V
C404
2.2uF
25V
HD(12V Panel)
C405
2.2uF
25V
R414
10K
R400
10K
R430
39K
1%
R431
15K
1%
R432
10K
1%
R447
0
FHD(5V Panel)
R435
0
FHD(5V Panel)
Q404
MMBT3904(NXP)
OPT
E
B
C
R453 1K
OPT
R454
0
OPT
C442
0.01uF
25V
EMI
C441
1000pF
50V
EMI
C443
0.1uF
16V
EMI
C444
0.1uF
16V
EMI
C445
0.1uF
16V
EMI
R442-*1
4.7K
HD(12V Panel)
L404
BLM18PG121SN1D
EMI
+5V_Normal_Connect
C451
1uF
6.3V
EMI
C499
0.1uF
16V
OPT
L400
4.7uH
ZD400
2.5V
OPT
C435
10uF
10V
C433
10uF
10V
R443 1K 1/16W 1%
IC404
AZ1117EH-ADJTRG1
ADJ/GND
OUTIN
+3.3V_Normal
R444 200 1/16W 1%
+1.5V_DDR
R445 0 1/16W 5%
NEW
PANEL POWER CONTROL
19V to 1.15V (M1 Core)
NEW
6604->6601
11.11.07
3A
3A
Check the Ripple
3A
NEW
19V TO 5V DCDC CONVERTER
3A
NEW
19V to 12V (For HD Panel)
13.06.28
For Module Power Sequence
R441 : 22k --> 100k
R442 : 1k --> 10k
MT45_BR,KR,US,AJ
19V to 3.3V Ground should be separated
19V to 1,15V Ground should be separated
EMI Solution
3,3V to 1,5V Ground should be separated
R1
R2
Vout = 1.25*(1+R2/R1) + Iadj*R2
3.3V TO 1.5V LDO(DDR Power)
CI
CI
CI
CI
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
IR/CONTROL/MODULE
2013/05/23
2
MA55
Q601
MMBT3904(NXP)
E
B
C
R614
3.3K
JP605
JP612
R600
10K
JP609
R602
10K
KEY_SDA
Q600
MMBT3904(NXP)
E
B
C
JP606
JP608
R613
3.3K
JP602
C601
1000pF 50V
+3.3V_ST
+3.3V_ST
JP607
R609
200
+3.3V_ST
KEY1
LED_AMBER
JP603
+3.3V_ST
IR
KEY_SCL
KEY2
R603
10K
OPT
R611
100
JP611
JP610
VA600 20V
JP604
R612
100
LED_RED
R601
10K
OPT
P601
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
JP601
Q603
MMBT3904(NXP)
(OPT)IR_OUT
E
B
C
R619
0
OPT
R620
10K
(OPT)IR_OUT
+3.3V_ST
R617
22
(OPT)IR_OUT
R621
10K
(OPT)IR_OUT
IR_OUT
Q602
MMBT3904(NXP)
(OPT)IR_OUT E
B
C
IR
R622
47K
(OPT)IR_OUT
C603
1000pF
50V
(OPT)IR_OUT
+3.3V_ST
R618
10K
(OPT)IR_OUT
RXA1+
RXB0-
RXB1+
RXB0+
RXACK-
+12V_PANEL_POWER
RXBCK-
R616
5.6K
FHD(5V Panel)
RXACK+
R605
5.6K
HD(12V Panel)
RXBCK+
R604
5.6K
HD(12V Panel)
RXACK-
JP614
FHD(5V Panel)
RXA0-
R608
0
23.6"(LVDS)
RXA2+
JP600
C600
0.1uF
16V
HD(12V Panel)
RXA0+
RXA0-
+5V_PANEL_POWER
RXACK+
P602
10031HR-30
FHD(5V Panel)_Connector
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
RXA0+
RXA1-
C602
0.1uF
16V
FHD(5V Panel)
RXB3+
RXA2+
RXA1+
JP613
RXA3+
RXB3-
RXB2-
R607
0
21.6"/26"/27.5"(LVDS)
RXA3+
RXA3-
RXA1-
RXB1-
RXA3-
RXB2+
RXA2-
P600
10031HR-30
HD(12V Panel)_Connector
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
RXA2-
R615
5.6K
FHD(5V Panel)
R623
22
TOUCH KEY
R624
22
TOUCH KEY
R626
100
OPT R627
0
FHD(5V Panel)
R625
4.7K
OPT
INTERLACE_CTRL
+3.3V_Normal
C604
1uF
6.3V
C605
1uF
6.3V
R610-*1
330
1/10W
1%
touch_key
R606-*1
270
1/10W
1%
touch_key
R610-*2
680
1/10W
5%
LB_joy_stick
R606-*2
150
1/10W
1%
LB_joy_stick
R610 270
1/10W
1%
MT_joy_stick
R606 150
1/10W
1%
MT_joy_stick
D411
30V CDS3C30GTH
ESD
D410
30V
CDS3C30GTH
ESD
IR/LED and Control
121118
Red LED(Non M75):4.8mA
(IR Port protection against ESD)
0424
121018
100ohm->200ohm
R604,R610
2012->1608
Amber LED(Non M75):5.9mA
12.07.17
Change D601~3
Red LED(M75) : 5.9mA
Amber LED(M75) : 16mA
IR_OUT(Ready)
Module(HD) Module(FHD)
4.7K/10W*4ea 5.6/10W*2ea
111116
100uF Ecap
Deletion
EAE38362801
Close to Wafer
For Interlace Mode
High : Interlace Mode
Low : Normal Mode
2013.07.15
PIN22 (23.6")
JEDIA2.7~3.3V
21.6
NC
JEDIA
PIN22
VESA
VESA
0~0.7V
ALL panel
GND
0~0.7V
PIN21
2.7~3.3V
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

USB DOWN STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2013/05/23
INTERFACE 7
MA55
VA716
20V
USB_DM 1:AL8
JP712
JP713
JP711
JK701
3AU04S-305-ZC-(LG)
1234
5
USB_DP 1:AL7
VA712
20V
Q700
MMBT3904(NXP)
DSUB
E
B
C
DSUB_VSYNC
R705
10K
DSUB
VA700
20V
DSUB
R713 47K
DSUB
JP705
JP704
R711
10K
DSUB
DSUB_G+
VA707
20V
DSUB
P700
SPG09-DB-010
DSUB
1RED 2GREEN 3BLUE 4GND_1 5DDC_GND
6RED_GND
7GREEN_GND
8BLUE_GND
9NC
10 SYNC_GND
11 GND_2
12 DDC_DATA
13 H_SYNC
14 V_SYNC
15 DDC_CLOCK
16 SHILED
JP709
D700
MMBD6100
DSUB
A2
C
A1
VA701
20V
DSUB
DSUB
VA710
20V
DSUB
+5V_Normal_Connect
+3.3V_ST
DSUB_DET
RGB_DDC_SDA
R701
75
DSUB
VA711
20V
DSUB
JP703
RGB_DDC_SCL
R708
10K
DSUB
DSUB_B+
VA703
5.5V
DSUB
JP700
DSUB
DSUB_R+
VA706
5.5V
DSUB
JP701
DSUB
R710
47K
DSUB
DSUB_HSYNC
R702
75
DSUB
VA705
5.5V
DSUB
R700
75
DSUB
JP707
JP710
PM_TXD
VA708
20V
VA704
20V
OPT
JP708
+3.3V_ST
IC700
MAX3232CDR
Hotel_Model(RS232C apply)
3C1- 2V+ 4C2+
1C1+
6V- 5C2-
7DOUT2 8RIN2
9
ROUT2
10
DIN2
11
DIN1
12
ROUT1
13
RIN1
14
DOUT1
15
GND
16
VCC
C704
0.1uF
16V
Hotel_Model(RS232C apply)
VA702
20V
OPT
JP706
R704
0
NON_Hotel_Model(RS232C Bypass)
C701
0.33uF
16V
Hotel_Model(RS232C apply)
R703
0
NON_Hotel_Model(RS232C Bypass)
C700
0.33uF
16V
Hotel_Model(RS232C apply)
+3.3V_ST
R706
100
IR_OUT
C702
0.33uF
16V
Hotel_Model(RS232C apply)
R709
0
(OPT)IR_OUT
JK700
KJA-PH-1-0177
Hotel_Model(RS232C apply)
3 M3_DETECT 4 M4 5 M5_GND 1 M1 6 M6
R707
100
C703
0.1uF
16V
Hotel_Model(RS232C apply)
JP702
VA709
20V
PM_RXD P701
12507WS-04L
1
2
3
4
5
R718
470K
OPT
C707
220pF
50V
AUDIO_IN
R719
15K
AUDIO_IN
R717
470K
OPT
JP715
PC_L_IN
+3.3V_Normal
PC_AUDIO_DET
VA715
20V
OPT
R723
10K
AUDIO_IN
R720
15K
AUDIO_IN
R721
470K
AUDIO_IN
C706
220pF
50V
AUDIO_IN
R724
1K
AUDIO_IN
JP716
VA713
20V
AUDIO_IN
R722
10K
AUDIO_IN
JK702
KJA-PH-1-0177
AUDIO_IN
3 M3_DETECT
4 M4
5 M5_GND
1 M1
6 M6 PC_R_IN
JP718
JP717 VA714
20V
AUDIO_IN
JP719 JP721JP720JP714
MGJ63348202
M700-*1
JackShield(for CKD)
MGJ63348201
M700
JackShield(for NonCKD)
C710
100pF
50V
EMI
R712
33
DSUB
R714
33
DSUB
C709
100pF
50V
EMI
R715
100
DSUB
C711
1uF
6.3V
EMI
C715
1uF
6.3V
EMI
L3455
BLM15BD121SN1
EMI
L3456
BLM15BD121SN1
EMI
C717
22uF
10V
OPT
R726
4.7K
/USB_OCD
+3.3V_Normal
C716
10uF
10V
C708
0.1uF
16V
ZD700
5V
OPT
R727
14K
+5V_Normal
USB_CTL
IC701
BD2242G
3EN
2GND
4
OC
1VIN 6
VOUT
5
ILIM
R3466
10K
L3455-*1
0
1/16W
5%
NON_EMI(BR)
L3456-*1
0
1/16W
5%
NON_EMI(BR)
121128
ESD improve
OPT->APPLY
121128
ESD improve
OPT->APPLY
120103
ESD diode addition
EAF61530301 2EA
USB(SIDE)
111026
ESD diode deletion
EAH39491601 2EA
DSUB RGB
121128
ESD improve
OPT->APPLY
11.10.27
To Improve Ringing issue
LOW capacitance Part apply
11.10.31
121128
ESD improve
OPT->APPLY
121128
ESD improve
OPT->APPLY
To Improve EMI
121128
ESD improve
OPT->APPLY
121128
ESD improve
OPT->APPLY
RS232C(SIDE)
12.08.10
47K->470K
PC AUDIO(SIDE)
120918
JIG GND Point addition
Jack Shield (HDMI1, HDMI2, RGB)
4.7K(2.97V)
MAX 1.5A(USB 2.0)
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Only for training and service purposes
LGE Internal Use Only