LG Flatron L1510M User manual

담 당 관리자
Model Description
MODEL BRAND
Printing Specification
1. Trim Size (Format) : 215mm x 280 mm
2. Printing Colors
•Cover : LG COLORS
•Inside : Black
3. Stock (Paper)
•Cover : Snow White 150 g/㎡
•Inside : Snow White 100 g/㎡
4. Printing Method :
5. Bindery : Saddle stitch
6. Language : English
7. Number of pages : 32 (Including blank 3pages)
Part No.
1.
2.
Service Guide Specification
Service Guide Specification
Changes
4.
REV.
NO. MM/DD/YY SIGNATURE CHANGE NO. CHANGE CONTENTS
1
2
3
4
5
7
6
SUFFIX
LEE H.J
05.04.22
L1510MN LG 3828TSL082U
KIM J.O
05.04.22
(1) Origin Notification
* LGEDI : Printed in Indonesia * LGEWA : Printed in U.K.
* LGESP : Printed in Brazil * LGEMX : Printed in Mexico
* LGENT : Printed in China * LGEIL : Printed in India
8
Special Instructions3.
Product Name
ALUSG FLATRON L1510M

Pagination sheet
Pagination sheet P/NO.3828TSL082U
Total pages :32pages
Cover English
2
English
3
English
4
English
….
English
…..
Rear
Cover
Front cover
Inside
blank
English
….
English
26
English
27
English
28
English
blank
Rear cover
Inside
blank

COLOR MONITOR
SERVICE MANUAL
Website:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.html
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : CL-66
MODEL: L1510M (L1510MN.AL**G)
( ) **Same model for Service
*To apply the Genesis ZAN3SL Chip.

Blank Page1

-2 -
CONTENTS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
TIMING CHART ....................................................... 7
DISASSEMBLY ....................................................... 8
BLOCK DIAGRAM .................................................. 9
DESCRIPTION OF BLOCK DIAGRAM...................10
ADJUSTMENT ...................................................... 12
SERVICE OSD ...................................................... 13
TROUBLESHOOTING GUIDE .............................. 14
WIRING DIAGRAM ............................................... 18
EXPLODED VIEW...................................................19
REPLACEMENT PARTS LIST ...............................21
SCHEMATIC DIAGRAM......................................... 24
SPECIFICATIONS
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module
Size : 326.5(H) x 253.5(V) x 11.2(D)
Pixel Pitch : 0.297mm x 0.297mm
Color Depth : 6bits(with FRC)/ 16M colors
Active Video Area : 15.0inch
(304.128 x 228.096) diagonal
Surface Treatment : Anti-Glare, Hard Coating (3H)
Backlight Unit : 2CCFL
Opraating Mode : Transmissive mode, Normally white
Electrical Interface : LVDS interface
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥10
Left : 55° min. 65° typ. Right: 55° min. 65° typ.
Top : 40° min. 45° typ. Bottom: 50° min. 55° typ.
2-2. Luminance :
200(min.), 250(typ.) (Full white pattern, 0.73V)
2-3. Contrast Ratio : 300(min.), 400(typ.)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
1) Type : Separate Sync. (Horizontal & Vertical)
2) Input Voltage Level: Low=0~0.8V, High=2.1~5.5V
3) Sync Polarity : Positive or Negative
3-2. Video Input Signal
1) Type : R, G, B Analog
2) Voltage Level : 0~0.7 V
a) Color 0, 0 : 0 Vp-p
b) Color 7, 0 : 0.35 Vp-p
c) Color 15, 0 : 0.7 Vp-p
3) Input Impedance : 75 Ω
3-3. Operating Frequency
Horizontal : 30 ~ 63kHz
Vertical : 56 ~ 75Hz
4. MAX. RESOLUTION
D-sub Analog : 1024 x 768@75Hz
5. POWER SUPPLY
5-1. Power
100-240V~, 50/60Hz 0.6A
5-2. Power Consumption
6. ENVIRONMENT
6-1. Operating Temperature: 10°C~35°C (50°F~95°F)
6-2. Operating Humidity : 10%~80%
6-3. MTBF : 50,000 HRS (Min.)
Lamp Life : 40,000 Hours (Min.)
7. DIMENSIONS (with TILT/SWIVEL)
Width : 360 mm (14.17'')
Depth : 153 mm (6.02'')
Height : 359.8 mm (14.17'')
8. WEIGHT (with TILT/SWIVEL)
Net. Weight : 4.1 kg (9.04 lbs)
Gross Weight : 5.45 kg (12.02 lbs)
MODE
POWER ON (NORMAL)
STAND-BY
SUSPEND
DPM OFF
POWER S/W OFF
H/V SYNC
ON/ON
OFF/ON
ON/OFF
OFF
-
POWER CONSUMPTION
less than 28 W
less than 2 W
less than 2 W
less than 2 W
less than 2 W
LED COLOR
GREEN
AMBER
AMBER
AMBER
OFF
VIDEO
ACTIVE
OFF
OFF
OFF
-

-3 -
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter

-4 -
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

-5 -
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500。F to 600。F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.

-6 -
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.

TIMING CHART
-7 -
VIDEO
SYNC
B
C
EA
D
H / V
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
H (Pixels)
V (Lines)
Sync
Polarity
+
–
–
+
–
–
–
–
–
–
–
–
+
+
+
+
+
+
+
+
–
–
–
–
–
–
+
+
Frequency
31.468 KHz
70.0 Hz
31.468 KHz
70.0 Hz
31.469 KHz
60.0 Hz
35.00 KHz
66.67 Hz
37.861 KHz
72.8 Hz
37.50 KHz
75.0 Hz
35.156KHz
56.25 Hz
37.879 KHz
60.3 Hz
48.077 KHz
72.188 Hz
46.875 KHz
75.0 Hz
49.725 KHz
74.55 Hz
48.363 KHz
60.0 Hz
56.476 KHz
70.0 Hz
60.023 KHz
75.0 Hz
Resolution
640 x 350
720 x 400
640 x 480
640 x 480
640 x 480
640 x 480
800 x 600
800 x 600
800 x 600
800 x 600
832 x 624
1024 x 768
1024 x 768
1024 x 768
Total
Period
( E )
800
449
900
449
800
525
864
525
832
520
840
500
1024
625
1056
628
1040
666
1056
625
1152
667
1344
806
1328
806
1312
800
Video
Active
Time ( A )
640
350
720
400
640
480
640
480
640
480
640
480
800
600
800
600
800
600
800
600
832
624
1024
768
1024
768
1024
768
Blanking
Time
( B )
160
99
180
49
160
45
224
45
192
40
200
20
224
25
256
28
240
66
256
25
320
43
320
38
304
38
288
32
Sync
Duration
( D )
96
2
108
2
96
2
64
3
40
3
64
3
72
2
128
4
120
6
80
3
64
3
136
6
136
6
96
3
Back
Porch
( F )
48
60
55
34
48
33
96
39
128
28
120
16
128
22
88
23
64
23
160
21
224
39
160
29
144
29
176
28
Front
Porch
( C )
16
37
17
13
16
10
64
3
24
9
16
1
24
1
40
1
56
37
16
1
32
1
24
3
24
3
16
1
MODE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
(MAC)
(TEXT)
Dot
Clock
25.175
28.322
25.175
30.24
31.5
31.5
36.0
40.0
50.0
49.5
57.2832
65
75
78.75

-8 -
DISASSEMBLY
Remove the screws. Remove the screws.
Disassemble Back Cabinet.
Remove the 7 screws from each up of metal frame.
Remove the Back Cabinet by drawing indicated area.
# 1 # 2
# 3 # 4
# 6
Remove the 5 screws from each up of metal frame.
# 5
Jig

-9 -
BLOCK DIAGRAM
5V
LIPS
gmZan3SL BD
ADC Scaling
PLL OSD
LVDS
Transmitter
Panel
MCU EEPROM
(System)
LVDS
Analog(R/G/B)
D-Sub
To Key Control
3.3 V
3.3 V
1.8V
3.3 V 1.8 V
Regulator
Audio
Amp
Regulator Audio
Processor
Audio In
8V
(TDA7449)
(TDA7496)
Mute
SCLSDA
12V
SCL SDA
Mute
Speaker
Left
Speaker
Right
12V
12V

DESCRIPTION OF BLOCK DIAGRAM
-10 -
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal
to the digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 80MHz.
This part consists of the Scaler, ADC and TMDS receiver .
The Scaler gets the video signal converted analog to digital, interpolates input to 1024 X 768 resolution signal
and outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V regulator, and 1.8V regulator to convert power which is provided 5V in Power
board.
3.3V is provided for LCD panel and 5V is provided for Micom.
Also, 5V is converted 3.3V and 1.8V by regulators.
Converted power is provided for IC in the main board.
3. MICOM Part.
This part consists of EEPROM IC which stores control data, Reset IC and the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.

-11 -
EMI
COMPONENTS
LINE
100 ~ 240V
INPUT RECTIFIER
AND FILTER
ENERGY
TRANSFER
OUTPUT RECTIFIER
AND FILTER
12V
5V
GND
SIGNAL
COLLENT-
ION
PHOTO-COUPLER
ISOLATION
PWM
CONTROL
CIRCUIT
HVDC 100KHz
PRIMARY SECONDARY
50 ~ 60Hz
Operation description_LIPS
LIPS Board Block Diagram
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR,
the circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch,to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the dc output changing status through a photo transistor to primary controller to
achieve the stabilized dc output voltage.
6. Signal collection.
This part function is to collect the any change from the dc output and feed back to the primary through photo
transistor

-12 -
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys”file to
“c:\WINNT\system32\drivers”folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
e) Click Start button.
f) Click Exit button.
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update”button
c) Click “Write”button

-13 -
Figure 1. Cable Connection
220
IBM
Compatible PC
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch
(110V/220V)
Control Line
Not used
RS232C
PARALLEL
V-SYNC POWER
ST
VGS MONITOR
E
E
V-Sync On/Off Switch
(Switch must be ON.)
F
F
A
A
B
B
C
C
1510
5
569
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
Video Signal
Generator
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) Auto Color : W/B balance and Automatically sets the gain and offset value.
b) NVRAM INIT : EEPROM initialize.(24C08)
c) CLEAR ETI : To initialize using time.
d) AGING : Select Aging mode(on/off).
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
i) PANEL : To select applied module.

-14 -
TROUBLESHOOTING GUIDE
1. NO POWER
CHECK U801
CHECK
U801 PIN 1& U803
PIN 3 VOLTAGE
(5V) ?
NO
NO POWER
(POWER INDICATOR OFF)
CHECK POWER BOARD,
AND FIND OUT A SHORT
POINT AS OPENING
EACH POWER LINE
CHECK J707 VOLTAGE
PIN5, PIN6 (5V)?
NO
CHECK 5VR LINE
(OPEN CHECK)
CHECK
Q803 PIN 3(3.3V) &
U803 PIN 4 (1.8V)? NO
CHECK IIC LINE
CONNECTION (U501, U502) CHECK U201 VCC, XTAL,
RESET
IS U201
PIN88
VOLTAGE REPEATED
AS PULSE
SHAPE ?
NO
YES
YES
YES NO PROBLEM
YES
CHECK KEY CONTROL
CONNECTOR ROUTINE
1
11
12
2
Waveforms
J707-#5, 6 / U801-#1/U803-#3 U201-#88

-15 -
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
CHECK MICOM INV
ON/OFF PORT.
(U501 PIN9)
J707 PIN2
2.5V?
NO
NO RASTER
(OSD IS NOT DISPLAYED)
CHECK LIPS
J707
PIN5, PIN 6
5V?
NO
1. CONFIRM BRIGHTNESS
OSD CONTRL STATE.
2. CHECK MICOM DIM-ADJ
PORT(U501 PIN41)
J707 PIN1
5V?
NO
LIPS
CHECK
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL.
(CONTACT PROBE TO
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
SCOPE?
NO
REPLACE CCFL LAMP
IN THE LCD MODULE
YES
YES
YES
YES
3 4
Waveforms
J707-#2 J707-#2
1
3
4
Inverter Off
Micom Port check
J705 Inverter output
Inverter On
Micom Port check
J705 Inverter output
1J707-#5, 6 / U801-#1/U803-#3

-16 -
1. CHECK PIN88
SOLDERING CONDITION
2. CHECK X501
3. TROUBLE IN U201
U201
POWER PINS
3.3V? NO CHECK U803, U801
U201
PIN88
OSCILLATE AS
12MHZ?
CHECK CONNECTION LINE
FROM U201 TO U501
TROUBLE IN CABLE
OR LCD MODULE
CHECK 5VR LINE
U501 PIN8
5V?
YES
YES
YES
YES
3. NO RASTER (OSD IS NOT DISPLAYED) – gmZAN3SL
NO RASTER
(OSD IS NOT DISPLAYED)
U501
PIN43 IS 48KHz H-SYNC?
PIN44 IS 60Hz V-SYNC?
IS PULSE APPEARED
AT SIGNAL PINS?
NO
NO
NO
2
2
6
Waveforms
U201-#88 6U501-#43, 44

-17 -
CHECK U803, U801
U201
POWER PIN99(1.8V)
PIN33(3.3V) ?
NO
1. CHECK PC
2. CHECK SIGNAL CABLE
& D-SUB CONNECTOR
LINE
CHECK
R,G,B INPUT?
U201 PIN 70,74,77
NO
CHECK H-SYNC LINE
(D-SUB→U501 →U201
PIN95)
CHECK
H-SYNC INPUT
U201 PIN 95?
NO
YES
YES
YES
CHECK V-SYNC LINE
(D-SUB→U501 →U201
PIN96)
CHECK
V-SYNC INPUT
U201 PIN 96?
NO
YES
NO RASTER
(OSD IS DISPLAYED)
4. NO RASTER (OSD IS DISPLAYED) – gmZAN3SL
TROUBLE IN
LCD MODULE
YES