LG 39LN51 Series User manual
Printed in KoreaP/NO : MFL67732803 (1304-REV00)
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
CHASSIS : LB35B
MODEL : 39LN51** 39LN51**-T*
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
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Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
BLOCK DIAGRAM .................................................................................. 13
EXPLODED VIEW .................................................................................. 14
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
- 3 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS
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Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
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Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LB35B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
* HDMI 1.4 with Deep Color is only apply for FHD Model
No. Item Specication Remarks
1. Market NON EU
2. Broadcasting system
PAL/SECAM B/G/D/K
PAL-I
NTSC-M
3. Channel Storage
BAND PAL(BG,I) NTSC(M) China(DK)
VHF/UHF 01-C69 2~78 C1~C69
Cable S1~S47 1~71 S1~S47
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC Rear (2EA)
6. Component Input Y/Cb/Cr, Y/Pb/Pr Rear (1EA)
7. USB Input MP3, JPEG,Movie Side(1EA)
8. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)
9. D-SUB INPUT S/W Upgrade Only Rear (1EA)
10. HDMI Input HDMI-DTV, Only PCM MODE Rear (2EA)
11. Audio Input (1EA) AV&Component L/R Input(2EA)
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Only for training and service purposes
5. Component Video Input (Y, PB, PR)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.47 59.94 27.000 SDTV 480P
5. 720*480 31.50 60.00 27.027 SDTV 480P
6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45.00 60.00 74.250 HDTV 720P
9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11. 1920*1080 33.72 59.94 74.176 HDTV 1080I
12. 1920*1080 33.75 60.00 74.25 HDTV 1080I
13. 1920*1080 56.25 50 148.5 HDTV 1080P
14. 1920*1080 67.432 59.94 148.350 HDTV 1080P
15. 1920*1080 67.5 60.00 148.5 HDTV 1080P
6. HDMI Input
6.1. PC Mode
* Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable
* Monitor Range Limits
Min Vertical Freq - 58 Hz / Max Vertical Freq - 63 Hz
Min Horiz. Freq - 28 kHz / Max Horiz. Freq - 68 kHz
Pixel Clock - 150 MHz
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1. 640×480 31.469 59.94 25.17 VESA(VGA)
2. 800×600 37.879 60.317 40.00 VESA(SVGA)
3. 1024×768 48.363 60.004 65.00 VESA(XGA)
4. 1280×768 47.776 59.87 79.5 VESA(WXGA)
5. 1360×768 47.72 59.799 84.62 VESA(WXGA)
6 1366×768 47.7 60.00 84.62 WXGA
7. 1280×1024 63.595 60.00 108.875 SXGA
8. 1920×1080 66.647 59.988 138.625 WUXGA
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Only for training and service purposes
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
Spec. out but display.2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.47 59.94 27 SDTV 480P
5. 720*480 31.5 60.00 27.027 SDTV 480P
6. 720*576 31.25 50.00 27 SDTV 576P
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45 60.00 74.25 HDTV 720P
9. 1280*720 37.5 50.00 74.25 HDTV 720P
10. 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50.00 148.5 HDTV 1080P
14 1920*1080 67.432 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
16 1920*1080 27 24.00 74.25 HDTV 1080P
17 1920*1080 33.75 30.00 74.25 HDTV 1080P
18 1920*1080 26.97 23.97 74.25 HDTV 1080P
19 1920*1080 33.716 29.976 74.25 HDTV 1080P
6.2. DTV Mode
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Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with
LB35B chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100-220 V,
50/60Hz.
(5)
The receiver must be operated for over 5 minutes prior to
the adjustment when module is in the circumstance of
above 15 °C.
► In case of keeping module is in the circumstance of 0
°C, it should be placed in the circumstance of above 15
°C for 2 hours.
► In case of keeping module is in the circumstance of
below -20 °C, it should be placed in the circumstance of
above 15 °C for 3 hours.
* Caution
When a still image is displayed for 20 minutes or longer
(especially where W/B scale is strong. Digital pattern 13ch
and/or Cross hatch pattern 09ch), there can some
afterimage in the black level area.
3. MAIN PCBA Adjustments
3.1. ADC Calibration
3.1.1. Using D/L Jig
- An ADC calibration is automatically adjusted from DFT-Jig
- If it needs to adjust manually, refer to appendix.
* ADC Calibration Protocol (RS232)
Adjust Sequence
▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component1 Input (480i)]
▪ ad 00 10 [Adjust 480i Comp1]
▪ aa 00 90 End Adjust mode
3.2. EDID Download
▪ HD MODEL
▪ 8BIT FHD MODEL
a. White Balance Adjustment
NO Item CMD 1 CMD 2 Data 0
Enter Adjust
MODE
Adjust
‘Mode In’ A A 0 0 When transfer the ‘Mode In’,
Carry the command.
ADC adjust ADC
Adjust A D 1 0 Automatically adjustment
(The use of a internal pattern)
** HDMI 1 : 256Bytes
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 17 01 03 80 A0 5A 78 0A F3 30 A4 54 46 96 26
20 0F 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 ⓐ
80 02 03 28 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 26 11 07 50 09 7F 07 83 01 00 00 68
A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20
B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0
C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14
D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D
E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 ⓐ
** HDMI 1 : 256Bytes
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 17 01 03 80 A0 5A 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 01 01 45 40 61 40 01 01 81 80
30 01 01 D1 C0 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 08 44 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 88 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 ⓐ
80 02 03 28 F1 4F 90 07 01 16 02 03 11 12 13 04 14
90 05 20 22 1F 26 11 07 50 09 7F 07 83 01 00 00 68
A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20
B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0
C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14
D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D
E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 ⓐ
EDID C/S data HD FHD (8Bit)
HDMI HDMI
Check sum
(Hex)
Block 0 A5 C1
Block 1 44(HDMI1) 44 (HDMI1)
34(HDMI2) 34 (HDMI2)
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Only for training and service purposes
4. White Balance Adjustment
4.1. Overview
4.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
1) Surrounding Temperature: 25 °C ± 5 °C
2) Warm-up time: About 5 Min◦
3) Surrounding Humidity: 20% ~ 80%
4) Before White balance adjustment, Keep power on
status, don’t power off
4.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux.
Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer(CA-210) probe should be
within 10 cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
4.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
* Color Analyzer Matrix should be calibrated using CS-1000.
4.3. Equipment connection
4.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
(2) Adjustment Map
4.5. Adjustment method
4.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-Only key(or POWER ON key).
(2) Place optical probe on the center of the display.
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode. (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
4.5.2. LED White balance table
- G-gain should be fixed.
(1) Cool Mode
1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
2) Principle : To adjust the white balance without the
saturation, Fix the G gain to 172 (default data) and
change the others (R/B Gain ).
3) Adjustment mode : mode - Cool
(2) Medium / Warm Mode
1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
2) Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192 (default
data) and decrease the others.
3) Adjustment mode : Two modes - Medium / Warm
Co lo r An alyzer
Co mp ut er
Pat tern Generat or
RS -2 32C
RS-2 32C
RS-2 32C
Probe
Signal Source
* If TV internal pattern is used, not needed
RS-232C COMMAND Explantion
CMD DATA ID
wb 00 00 Begin White Balance adjustment
wb 00 ff End White Balance adjustment
(internal pattern disappears )
Adj. item Command
(lower caseASCII)
Data Range
(Hex.)
Default
(Decimal)
CMD1 CMD2 MIN MAX
Cool
R Gain j g 00 C0
G Gain j h 00 C0
B Gain j i 00 C0
R Cut
G Cut
B Cut
Medium
R Gain j a 00 C0
G Gain j b 00 C0
B Gain j c 00 C0
R Cut
G Cut
B Cut
Warm
R Gain j d 00 C0
G Gain j e 00 C0
B Gain j f 00 C0
R Cut
G Cut
- 11 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.6. Reference(White Balance Adjustment
coordinate and color temperature)
(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using
CS-1000 (over 26 inch)
■ Direct LED & 32” POLA W/B adjust target value
■ 42” POLA LED W/B adjust target value (42LS3450 series)
5. Tool Option setting & Inspection per
countries
(1) Press 'IN START' key at Factory Service remote control.
(2) Select 'Tool Option 1'.
(3) Punch in the number and press 'OK'. (Each of models has
their number)
(4) Correct 'Tool Option2' ~ 'Tool Option5'.
(5) Completed adjusting Tool option.
6. AUDIO output check
6.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
6.2. Specification
7. GND and HI-POT Test
7.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
7.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
7.3. Checkpoint
(1) Test voltage
- GND: 1.5 KV / min at 100 mA
- SIGNAL: 3 KV / min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE &
NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
Target
(Direct
LED)
Cool Medium Warm
x y x y x y
271 276 287 296 315 332
Target
(Direct
LED)
Cool Medium Warm
x y x y x y
274 280 290 300 318 336
Mode Color Temp Color coordinate Remark
Cool
(C50) 13,000 K x = 0.269 (±0.002)
y = 0.273 (±0.002) * Test signal
- Inner pattern for
W/B adjust
- External white
pattern
(80IRE, 204gray)
Medium
(0) 9,300 K x = 0.285 (±0.002)
y = 0.293 (±0.002)
Warm
(W50) 6,500 K x = 0.313 (±0.002)
y = 0.329 (±0.002)
Item Min Typ Max Unit Remark
Audio practical
max Output, L/R
(Distortion=10%
max Output)
4.5 5.0 6.0 W
Vrms
(1) Measurement condition
- EQ/AVL/Clear Voice: Off
(2) Speaker (8Ω Impedance)
- 12 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
8. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work.
Otherwise USB data is automatically detected.
(3) Show the message “Copying files from memory”.
(4) Updating is starting.
(5) Updating Completed, The TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn't
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number.)
9. Optional adjustments
9.1. Manual ADC Calibration
■ Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.
■ Enter Internal ADC calibration mode by pressing ‘’ or ‘OK’
key at ‘7. ADC Calibration’
► Caution : Using ‘P-ONLY’ key of the Factory Service
remote control when turns TV on.
9.2. Manual White balance Adjustment
9.2.1. Adjustment condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
9.2.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer(During auto adj., RS-232C protocol is needed)
(3) Adjust Remot control
(4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)
9.2.3. Adjustment
(1) Set TV in Adj. mode using POWER ON.
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key → EZ adjust using adj. R/C → 6. White-
Balance then press the cursor to the right (Key►). When
Key(►) is pressed 216 Gray internal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
■ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration ►
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L
13. Sub B/C
14. Ext. Input Adjust
ADC Calibration
ADC Comp 480i
ADC Comp 1080p
ADC RGB
Start
NG
NG
NG
Reset
- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
POWER BOARD
Sound AMP
NTP7513
IC301
(
(
(
(
Module
JK101
Y,Pb,Pr In
Audio
Out
MST6841XP
5
9
4
3
10 11
Tuner SDA
Tuner SCL
TUNER
IF_AGC
B+
IR/KEY
40
24Mhz
98
99
44
43
IC502
Serial Flash
8Mbytes
IC503
EEPROM
24C64
IC501
30
LPF
33
18
21
P301
AV2 In
OP-AMP
IC302
x4 Gain
P701 P601/602
Audio L-Out
2 4 1
XXX
39
37 38
Audio R-Out
HDMI
SCL/SDA
48
115
50
51 113 112
Audio_SCL
Audio_SDA
LVDS
Output
P Dim
Inv. ON
RL On
P_ST 3.5V
M_3.3V
TU_3.3V
P_24V
IC701
MP20051
Main_1.2V
A_OUT_12V
10 11
7
8
9
38
I2S_MCLK
I2S_WS
I2S_SCK
I2S_SDO
P400
108
111
117
IR
KEY1
Led_PWR
102 105 101
53
52
45
85
84
EEP SDA
EEP SCL
94
95
97
96
SPI_CLK
SPI_DI
SPI_CZ
SPI_DO
S_AMP_24V
32
40
9
LPF
JK202
USB_5V
110
KEY2
ST_3.5V
5
P_12V
Q710 IC711
1.8V REG
Main_1.8V
Main_3.3V
Q720
AO3407A
Panel_Vcc
IC709
MP1497 Main_5V To USB
USB_DN
USB_DP
IF_P
IF_N
31
35
10 13~15
3
JK203
JK204
IC401
To USB
7
TU_1.8V
19
20
Comp. R/L In
AV1 In
26,33,34 27,35,3622,20,24,33,34
77 62 54
41 30 18
9116 107
100
XXX
IR Board
BLOCK DIAGRAM
- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
A2 A9 A10
900
200
400
540
521
530
500
301
910
120
300
510
123
122
Set + Stand
Stand Base
+
Stand Body
LV1
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT1
MNTROUT
MNTLOUT
COMMONRIN
COMMONLIN
AV2RIN
AV2LIN
AV2_VIN
COMP_PR
COMP_PB
COMMON_VIN
R105
10K
C103
5600pF
50V
R109
12K
TP101
R107
220K
COMMON_RIN
MUTE_AOUT
R106
12K
MUTE_AOUT
R103
75
R108
10K
R104
220K
COMP_PR
MNT_ROUT
C105
5600pF
50V
MNT_LOUT
R110
1K
COMMON_LIN
R101
75
COMP_PB
COMMON_VIN P_12V
MNT_VOUT
R102
75
R111
1K
R123
220
DEBUG
R120
75
DEBUG
AV2_RIN
R116
220K
R114
10K
R117
10K R118
12K
R113
220K R115
12K
AV2_LIN
AV2_VIN
R112
75
C106
10uF
16V
C104
10uF
16V
Q101
MMBT3904(NXP)
EB
C
Q102
MMBT3904(NXP)
READY
EB
C
Q103
MMBT3904(NXP)
EB
C
Q104
MMBT3904(NXP)
READY
EB
C
Q105
MMBT3904(NXP)
DEBUG
EB
C
AV2_VIN R122
0
OPT
R121
33
DEBUG
C101
470pF
50V
C102
470pF
50V
C107
470pF
50V
C108
470pF
50V
JK101
PPJ239-06
6J
7J
4J
8K
5K
8L
5L
5M
4N
6N
7N
7D
5D
8E
5E
8F
6F
4F
5G
4H
6H
7H
ZD110
20V
ZD107
20V
ZD109
20V
ZD105
20V
ZD104
20V
ZD106
20V
ZD108
SD05
ZD100
SD05
ZD102
SD05
ZD101
SD05
D102
READY
D101
READY
D104
READY
D103
READY
D105
READY
D106
READY
D107
READY
D108
READY
1 7
INPUT1
COMPONENT / AV IN / AV AUDIO OUT
2012/11/15
32LN5100
LB35B/LC35B/LL35B
EAX65027101
POP NOISE
POP NOISE
V-OUT Buffer(DEBUG)
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
USB DOWN STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT2
JK202
3AU04S-305-ZC-(LG)
1234
5
+5V_USB
ZD221
30V
READY
ZD220
30V
READY USB_DP
USB_DN
C220
10uF
10V
OPT
C221
22uF
10V
L220
120
R204
0
W/O UART IC
C203
0.1uF
With UART IC
IC201
MAX3232CDR
EAN41348201
With UART IC
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7DOUT2
8RIN2
9
ROUT2
10
DIN2
11
DIN1
12
ROUT1
13
RIN1
14
DOUT1
15
GND
16
VCC
R205
0
W/O UART IC
R206
0
W/O UART IC
JK201
KJA-PH-1-0177
3 M3_DETECT
4 M4
5 M5_GND
1 M1
6 M6
C205
0.1uF
With UART IC
+3.5V_ST
C202
0.1uF
With UART IC
R202
100
With UART IC
+3.5V_ST
DSUB_SCL
C201
0.1uF
P201
12505WS-04A00
DEBUG
1
2
3
4
5
P202
12507WS-04L
1
VCC
2
PM_RXD
3
GND
4
RM_TXD
5
GND
DSUB_SDA
R201
100
With UART IC
C204
0.1uF
With UART IC
HDMI1_D0-
JK203
14 NC
13 CEC
5DATA1_SHIELD
20
SHIELD
12 CLK-
11 CLK_SHIELD
2DATA2_SHIELD
19 HPD
18 +5V_POWER
10 CLK+
4DATA1+
1DATA2+
17 DDC/CEC_GND
9DATA0-
8DATA0_SHIELD
3DATA2-
16 SDA
7DATA0+
6DATA1-
15 SCL HDMI1_SCL
HDMI1_DET
Q230
MMBT3904(NXP)
E
B
C
R230
10K
D230
BAT54C
A2
C
A1
HDMI1_CK+
R233
2.7K
+5V_USB
R232
2.7K
HDMI1_D1-
R235
10K
R234
4.7K
HDMI1_D2+
HDMI1_D0+
HDMI1_CK-
HDMI1_SDA
HDMI1_D2-
HDMI1_HPD
R231
1K
HDMI1_D1+
D240
BAT54C
A2
C
A1
HDMI2_CK+
HDMI2_HPD
HDMI2_SCL
+5V_USB
HDMI2_D1-
HDMI2_CK-
Q240
MMBT3904(NXP)
E
B
C
R242
1K
R241
10K
HDMI2_D0-
HDMI2_D2-
HDMI2_D1+
R246
10K
JK204
14 NC
13 CEC
5DATA1_SHIELD
20
SHIELD
12 CLK-
11 CLK_SHIELD
2DATA2_SHIELD
19 HPD
18 +5V_POWER
10 CLK+
4DATA1+
1DATA2+
17 DDC/CEC_GND
9DATA0-
8DATA0_SHIELD
3DATA2-
16 SDA
7DATA0+
6DATA1-
15 SCL HDMI2_SDA
R245
4.7K
HDMI2_DET
R243
2.7K R244
2.7K
HDMI2_D2+
HDMI2_D0+
ZD230
READY
ZD231
READY
ZD232
READY
ZD233
READY
R236
100
R237
100
ZD240
READY
ZD241
READY
ZD242
READY
ZD243
READY
R247
100
R248
100
2 7
INPUT2
2012/11/1532LN5100
LB35B/LC35B/LL35B
EAX65027101
Close to SIDE_USB
USB(SIDE)
I2C Control HDMI(REAR)
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUDIO
R357
6.8K
MNT_ROUT
Q351
MMBT3904(NXP)
EB
C
R353
6.8K
R358 1K
C356
6800pF
50V
P_12V
MNT_R_AMP
MNT_L_AMP
R356 10K
C352 33pF 50V
IC302
AS324MTR-E1
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8OUT3
9INPUT3-
10INPUT3+
11GND
12INPUT4+
13INPUT4-
14OUT4
R354 5.6K
Q350
MMBT3904(NXP)
EB
C
P_12V
C351
6800pF
50V
R359
4.7K
P_12V
R350
4.7K
C350
0.1uF
16V
C354 33pF 50V
MNT_LOUT
C355
0.1uF
16V
R352 10K
R355 5.6K
SPK_L+
SPK_R-
JP302
JP301
SPK_L-
JP304
SPK_R+
P301
SMAW250-H04R
1
.
2
3
4
JP303
SPK_R+
SPK_L-
C329
0.47uF
50V
R324
4.7K
R323
4.7K
0.1uF
C334
50V
0.1uF
C331
50V
R322
4.7K
C333
0.47uF
50V
SPK_R-
R325
4.7K
0.1uF
C330
50V
SPK_L+
0.1uF
C335
50V
R351 1K
C353
0.1uF
16V
R316
12
C306
33pF
50V
R307 100
C319
22000pF
50V
I2S_SCK
C315
22000pF
50V
C326
390pF
50V
R317
12
R314
12
R315
12
C312
1uF
10V
C302
0.1uF
16V
OPT
1uF
C303
10V
SW_RESET
AUAMP_SDA
0.1uF
C309
50V
C313
1uF
10V
0.1uF
C318
50V
+24V_AMP
C327
390pF
50V
I2S_WS
R306 100
C325
390pF
50V
C305
33pF
50V
R320
12
C301
0.1uF
16V
R318
12
C311
22000pF
50V
R311
100
C314
1uF
10V
C308
22000pF
50V
R319
12
+24V_AMP
I2S_SDO
C328
390pF
50V
R313
12
I2S_MCLK
AUAMP_SCL
C320
1000pF
50V
R308
4.7K R309
4.7K
+3.3V_M
0.1uF
C322
16V
R301 100
R302 100
R303 100
L301
BLM18PG121SN1D
+3.3V_M
R304 100
C321
10uF
6.3V
L304
10uH
L305
10uH
L303
10uH
L306
10uH
POWER_DET
IC301
NTP7513
3
DGND_PLL 2
VDD_PLL
4
GND
1
AGND_PLL
6
DVDD 5
DGND
7
SDATA
8
WCK
9
BCK
10
SDA
11
SCL
12
FAULT
13
MONITOR_0
14
MONITOR_1
15
MONITOR_2
16
BST2B
17
PGND2B
18
OUT2B
19
PVDD2B
20
PVDD2A
21 OUT2A
22 PGND2A
23 BST2A
24 VDR2
25 AGND
26 VCC5
27 VDR1
28 BST1B
29 PGND1B
30 OUT1B
31 PVDD1B
32 PVDD1A
33 OUT1A
34 PGND1A
35 BST1A
36 RESET
37 AD
38 CLK_I
39 GND_IO
40 VDD_IO
41
[EP]GND
C317
10uF
35V
C310
10uF
35V
AUDIO 3 7
LB35B/LC35B/LL35B
32LN5100 2012/11/15
EAX65027101
AUDIO_OUT AMP : GAIN X 4
SPK_R+
SPK_L-
SPK_L+
SPK_R-
SPEAKER_R
SPEAKER_L
0x54
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER & IR
IF_N
C402
47pF
50V
C403
47pF
50V
IF_P
R403
100
C401
0.1uF
16V
TUNER_RESET
R404
100K
+3.3V_TU
C410
0.1uF
16V
IF_AGC
R412
100
R410
1
1/10W
+3.3V_M
R409
1
1/10W
IC401
AP1117E18G-13
2
OUT
3
IN
1
ADJ/GND
C409
100pF
50V
C408
0.1uF
16V
C405
0.1uF
16V C411
0.1uF
16V
+3.3V_TU
+3.3V_TU
L421
BLM18PG121SN1D
IR
+3.5V_ST
C423
0.1uF
16V
KEY1
KEY2
C425
0.1uF
16V
OPT
C422
0.1uF
OPT
C421
0.1uF
OPT
C426
100pF
50V
+3.5V_ST
C424
1000pF
50V LED
C407
10uF
6.3V
C404
22uF
6.3V
100pF
C406
50V
R423
4.7K
OPT
TUNER_SCL
TUNER_SDA
L401
BLM18PG121SN1D
R421
10K R422
10K
R407
2.2K R408
2.2K
R405
33
R406
33
C412
10uF
6.3V
P421
12507WR-08L
1
2
3
4
5
6
7
8
9
R411
1
R413
10
PAL
R414
10
PAL
R413-*1
0
NTSC
R414-*1
0
NTSC
TU401
TDSH-G501D(B)
PAL
5+B1[3.3V]
11 DIF[N]
2RESET
10 DIF[P]
4SDA
1NC
9IF_AGC
8CVBS
3SCL
7+B2[1.8V]
6SIF
A1 A1
B1
B1
A2
A2
B2
B2
TU402
TDSS-H501F(B)
NTSC
5+B1[3.3V]
11 DIF[N]
2RESET
10 DIF[P]
4SDA
1NC_1
9IF_AGC
8NC_3
3SCL
7+B2[1.8]
6NC_2
12
SHIELD
A1 A1
B1
X
ZD401
SD05
ZD402
SD05
C430
0.1uF
250V
READY
C431
0.1uF
250V
READY
R401
0
NTSC
TUNER & IR 4 8
LB35B/LC35B/LL35B
32LN5100 2012/11/15
EAX65027101
Near the pin
IR
IF
should be guarded by ground
Size change,0929
Close to the tuner
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN SOC
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
R572
100
R507
68
C512
0.047uF
IF_AGC
R505
33
SPI_DO
+3.5V_ST
LED
C518 2.2uF
R577
4.7K
R578
22
IR
SPI_DI
HDMI1_D2+
HDMI1_SCL
EEP_SDA
+3.5V_ST
HDMI1_D0+
IC503
AT24C64D-SSHM-T
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
KEY2
VDDC
R504
33
R536
22
R542
100
HW_RESET
KEY1
HDMI1_SDA
C563
0.1uF
16V
C519 2.2uF
R546
100
IF_N
MNT_R_AMP
R571
100
COMMON_LIN
SPI_DI
HDMI1_D0-
+1.2V_VDDC
DSUB_SCL
IF_P
R569
4.7K
R575
100
+3.3V_M
USB_DN
I2S_MCLK
+1.8V_M
EEP_SCL
HW_RESET
SPI_CZ
HDMI1_D2-
USB_DP
SPI_CLK
COMMON_VIN
HDMI1_HPD
SPI_DO
SPI_CZ
C514
0.047uF
HDMI1_CK-
R512
1M
HDMI1_CK+
R541
100
R579
22
AVDD_DDR
COMP_PR
R537
22
DSUB_SDA
COMMON_RIN
HDMI1_D1+
VDDC_3.3
MNT_L_AMP
C550
0.047uF
HDMI1_D1-
MNT_VOUT
SPI_CLK
AUAMP_SDA
100
R543
100
R544
AUAMP_SCL
SW_RESET
EEP_SDA
EEP_SCL
RL_ON
PWM_DIM
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
+3.5V_ST
R538
4.7K
R539
4.7K
R517
10K
R510
220K
R511
220K
C522
220pF
C523
220pF
R508
100
R509
100
C508
0.047uF
R501
33
COMP_PB
C511
0.047uF
R503
68
C510
0.047uF
C509
1000pF
R502
33
R530
100 FLASH_WP
PANEL_ON
POWER_SW
R528
100
INV_ON
R535 1K
R534
1K
AVDD33_DEMOD
HDMI2_D1+
HDMI2_D0-
HDMI2_SDA
HDMI2_CK-
HDMI2_D2-
HDMI2_D2+
HDMI2_SCL
HDMI2_D1-
HDMI2_HPD
HDMI2_D0+
HDMI2_CK+
R533
0
AV2_VIN
C513
0.047uF
R506
33
C517
0.1uF
C516
10uF
AV2_RIN
C520 2.2uF
AV2_LIN
C521 2.2uF
HW_OPT1
C501
10uF
6.3V
VDDC
C547
0.1uF
VDDC
C544
0.1uF
VDDC C506
0.1uF
C502
10uF
6.3V
C549
0.1uF
AVDD_DDR
C504
10uF
6.3V
VDDC_3.3
C548
0.1uF
AU_3.3V
3.3V_DMPLL
AU_3.3V C515
0.1uF
C505
0.1uF
VDDC_3.3
C507
0.1uF
VDDC_3.3
C546
0.1uF
VDDC_3.3
VDDC_3.3
C545
0.1uF
C543
0.1uF
VDDC_3.3
AVDD33_DEMOD
3.3V_DMPLL
C532
0.1uF C533
0.1uF
FLASH_WP
RXB3-
RXB3+
RXBCK-
RXBCK+
RXB2+
RXB2-
RXB0-
RXB0+
RXB1-
RXB1+
C573
22pF
READY
C574
22pF
READY
C503
4.7uF
C562
4.7uF
10V
0.1uF
C535
0.1uF
C534
R550
4.7K
FHD
R551
4.7K
HD
+3.3V_M
HW_OPT1
R545
100
L500
120-ohm
L503
120-ohm
L505
120-ohm
L504
120-ohm
L501
120-ohm
L502
120-ohm
L506
120-ohm
R519
4.7K
+3.5V_ST
R518
100
MUTE_AOUT
TUNER_SDA
100
R520
TUNER_SCL
100
R521
I2S_SCK
I2S_SDO
I2S_WS
C542
0.1uF
AVDD_DDR
TUNER_RESET
HDMI1_DET
HDMI2_DET
R547
10K
R548
10K
C572
0.1uF
16V
R574
100
R523
33
0
R524
+3.5V_ST
C551
220pF
OPT
50V
L521
100NH
OPT
R513
100 R514
100
C541
22000pF
50V
R531
10K
IC504
APX803D29
1
GND
3
VCC 2RESET
+3.5V_ST
0.1uF
C560
R561
10K
POWER_DET
C561
4.7uF
10V
R562
470
POWER_DET
R549
100
R527
10K
R540
1K
IC501
LGE6841 (ATV_13)
1
DDCDD_CK
2
RX2N_D
3
RX2P_D
4
HOTPLUG_A
5
RXCKN_A
6
RXCKP_A
7
RX0N_A
8
RX0P_A
9
AVDD_MOD_1
10
RX1N_A
11
RX1P_A
12
DDCDA_DA
13
RX2N_A
14
RX2P_A
15
DDCDA_CK
16
ARC
17
VDD
18
AVDD3P3_ADC
19
HSYNC1
20
BIN1P
21
SOGIN1
22
GIN1P
23
GIN1M
24
RIN1P
25
VSYNC1
26
CVBS1
27
CVBS0
28
VCOM
29
CVBSOUT1
30
AVDD_AU33
31
AUREF
32
VAG
33
LINEIN_L1
34
LINEIN_R1
35
LINEIN_L3
36
LINEIN_R3
37
LINEOUTL3
38
LINEOUTR3
39
XTALO
40
XTALI
41
AVDD3P3_DMPLL
42
AVDD3P3_DADC
43
VIFP
44
VIFM
45
IFAGC
46
VSS
47
AVDD_DDR
48
GPIO55/I2S_OUT_WS
49
GPIO56
50
GPIO57/I2S_OUT_BCK
51
GPIO58/I2S_OUT_SD
52
GPIO60
53
GPIO61
54
VDDP
55
VDDC_1
56
LVA4P
57
LVA4M
58
LVA3P
59
LVA3M
60
LVACLKP
61
LVACLKM
62
AVDD_MOD_2
63
LVA2P
64
LVA2M
65 LVA1P
66 LVA1M
67 LVA0P
68 LVA0M
69 LVB4P
70 LVB4M
71 LVB3P
72 LVB3M
73 LVBCKP
74 LVBCKM
75 LVB2P
76 LVB2M
77
AVDD_MOD_3
78 LVB1P
79 LVB1M
80 LVB0P
81 LVB0M
82 VDDC_2
83
INT/GPIO65
84 GPIO7
85 GPIO6
86 GPIO5
87 GPIO4
88 GPIO3
89 GPIO2
90 GPIO1
91 GPIO0
92
PWM2/GPIO24
93
PWM3/GPIO25
94 SPI_CK
95 SPI_DI
96 SPI_DO
97 SPI_CZ
98 USB0_DM
99 USB0_DP
100
AVDD_MOD_4
101 GPIO63
102 GPIO64
103 TESTPIN
104
PWM0/GPIO26
105
PWM1/GPIO25
106 DDCA_CK
107 DDCA_DA
108 GPIO67
109
AVDD_DDR_2
110
SAR0/GPIO75
111
SAR1/GPIO74
112
SAR2/GPIO73
113
SAR3/GPIO72
114 GPIO68
115
GPIO69/I2S_OUT_MCK
116 GPIO70
117 IRIN
118 CEC
119 HWRESET
120 GND
121 HOTPLUG_D
122 RXCKN_D
123 RXCKP_D
124 RX0N_D
125 RX0P_D
126 DDCDD_DA
127 RX1N_D
128 RX1P_D
129
[EP]
C536
33pF
50V
C537
33pF
R564
10
R563
62K
IC502
W25Q64FVSSIG
3
WP[IO2]
2
DO[IO1]
4
GND
1
CS
5DI[IO0]
6CLK
7%HOLD[IO3]
8VCC
R573
100
R570
10K
C570
0.1uF
16V
C571
0.1uF
16V
READY
X501
24MHz
C530
15pF C531
15pF
MAIN SOC 5 7
LB35B/LC35B/LL35B
32LN5100 2012/11/15
EAX65027101
SERIAL FLASH(2MB)
EEPROM(64K)
*H/W OPTION
Close to MSTAR
H/W RESET
MSTAR Vcc
ST 1.26V
DDR 1.8V
Close to MSTAR
ST 3.3V
HD FHD
LOW HIGHHW_OPT
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LVDS
P601
FF10001-30
HD
1[30]
2[29]
3[28]
4[27]
5[26]
6[25]
7[24]
8[23]
9[22]
10 [21]
11 [20]
12 [19]
13 [18]
14 [17]
15 [16]
16 [15]
17 [14]
18 [13]
19 [12]
20 [11]
21 [10]
22 [09]
23 [08]
24 [07]
25 [06]
26 [05]
27 [04]
28 [03]
29 [02]
30 [01]
31
.
RXA2-
RXA3-
RXACK-
P602
FI-RE51S-HF-J-R1500
FHD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
RXBCK-
RXB0-
RXBCK+
RXA0+
RXB3+
RXB1+
RXA1-
RXB0+
RXACK+
RXB2-
PANEL_VCC
RXB3-
RXA2+
RXB1-
RXA1+
RXA0-
RXA3+
RXB2+
C602
1000pF
50V
OPT
C603
0.1uF
16V
HD
L601
120
HD
C601
10uF
16V
OPT
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
PANEL_VCC
C604
10uF
16V
OPT
C605
1000pF
50V
OPT
C606
0.1uF
16V
FHD
L602
120
FHD
LVDS 6 7
LB35B/LC35B/LL35B
32LN5100 2012/11/15
EAX65027101
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
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