LUMILEDS LUXEON HR30 User manual

ILLUMINATION
AB217 LUXEON HR30 Application Brief ©2016 Lumileds Holding B.V. All rights reserved.
LUXEON HR30
Assembly and Handling Information
Introduction
This application brief addresses the recommended assembly and handling
guidelines for LUXEON HR30 emitter. This emitter is specically designed and tested
for use in the most demanding environments and conditions. This emitter delivers
high ecacy and quality of light for distributed light source applications in a compact
3.0mm x 3.0mm package. Proper assembly, handling, and thermal management, as
outlined in this application brief, ensure high optical output and reliability of these
emitters.
Scope
The assembly and handling guidelines in this application brief apply to LUXEON 3030
HR30 with the following part number designation:
L130 – AABBCCHR00000
Where:
AA – designates nominal ANSI CCT (27=2700K, 30=3000K, etc.)
BB – designates minimum CRI (70=70CRI, 80=80CRI, etc.)
CC – designated ESD protection level per JEDEC JS-001-2012 (00=2kV and 0T=8kV)
In the remainder of this document the term LUXEON emitter refers to any product in
the LUXEON product series listed above. Any handling requirements that are specic
to a subset of LUXEON emitters will be clearly marked.

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Table of Contents
Introduction ...........................................................................1
Scope.................................................................................1
1. Component ........................................................................3
1.1 Description .........................................................................3
1.2 Optical Center .......................................................................3
1.3 Handling Precautions .................................................................3
1.4 Cleaning ............................................................................4
1.5 Electrical Isolation ....................................................................4
1.6 Mechanical Files......................................................................4
2. PCB Design Guidelines for the LUXEON Emitter .........................................4
2.1 PCB Footprint and Land Pattern .......................................................4
2.2 Surface Finishing .....................................................................5
2.3 Minimum Spacing ....................................................................5
2.4 PCB Substrate Selection and Design ....................................................5
3. Thermal Management ...............................................................7
4. Thermal Measurement Guidelines.....................................................7
5. Assembly Process Guidelines .........................................................8
5.1 Stencil Design........................................................................8
5.2 Solder Paste .........................................................................8
5.3 Solder Reow Prole..................................................................8
5.4 Pick and Place .......................................................................9
5.5 Electrostatic Discharge Protection .....................................................10
5.6 JEDEC Moisture Sensitivity ............................................................10
6. Environmental Corrosion Testing.....................................................10
7. Packaging Considerations — Chemical Compatibility ....................................11

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1. Component
1.1 Description
The LUXEON HR30 emitter (Figure 1) is a SMC (silicone resin molding compound) molded, no-lead, surface mount package
consisting of a symmetrical anode and cathode pads. A small chamfer corner on the top of the package marks the cathode
side of the emitter. The heat generated by the LED chips are being dissipated equally through both electrode pads. The
silicone encapsulant protects the LED chips and the wire bonds against external environment. The lead frame and the pad
nishes are plated with gold. This emitter is available with and without a transient voltage suppressor (TVS) chip.
Figure 1. Package rendering of LUXEON HR30 emitter.
1.2 Optical Center
The optical center coincides with the mechanical center of the LUXEON emitter. Optical rayset data for the LUXEON
emitter are available on the Lumileds website at www.lumileds.com.
1.3 Handling Precautions
The LUXEON emitter is designed to maximize light output and reliability. However, improper handling of the device may
damage the silicone coating and aect the overall performance and reliability. In order to minimize the risk of damage to
the silicone coating during handling, the LUXEON emitter should only be picked up from the side of the package (Figure 2).
Figure 2. Correct handling (left) and incorrect handling (right) of LUXEON emitters.

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1.4 Cleaning
The LUXEON emitter should not be exposed to dust and debris. Excessive dust and debris may cause a drastic decrease
in optical output. In the event that a LUXEON emitter requires cleaning, rst try a gentle swabbing using a lint-free swab.
If needed, a lint-free swab and isopropyl alcohol (IPA) can be used to gently remove dirt from the silicone coating. Do not
use other solvents as they may adversely react with the package of the LUXEON emitter. For more information regarding
chemical compatibility, see Section 6.
1.5 Electrical Isolation
The LUXEON emitter contains two electrode pads on the package. It is important to keep sucient distance between the
LUXEON emitter package and any other objects or neighboring LUXEON emitters to prevent any accidental shorts.
In order to avoid any electrical shocks, ashover and/or damage to the LUXEON emitter, each design needs to comply with
the appropriate standards of safety and isolation distances, known as clearance and creepage distances, respectively (e.g.
IEC60950, clause 2.10.4).
1.6 Mechanical Files
Mechanical les for the LUXEON emitter are available on the Lumileds website at www.lumileds.com.
2. PCB Design Guidelines for the LUXEON Emitter
The LUXEON emitter is designed to be soldered onto a Printed Circuit Board (PCB). To ensure optimal operation, the PCB
should be designed to minimize the overall thermal resistance between the LED package and the heatsink.
2.1 PCB Footprint and Land Pattern
The recommended PCB footprint design for the LUXEON emitter is shown in Figure 3. In order to ensure proper heat
dissipation from the emitter electrodes to the PCB, it is best to extend the top copper layer of the PCB beyond the
perimeter of the LUXEON emitter (see 2.4).
Solder mask
Stencil
Top copper
Package geometric center
Package outline
2.50
1.00
2.40
0.90
0.50
0.15
Figure 3. Recommended PCB footprint design for the LUXEON emitter. Dimensions are in mm.

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2.2 Surface Finishing
Lumileds recommends using a high temperature organic solderability preservative (OSP) or electroless nickel immersion
gold (ENIG) plating on the exposed copper pads.
2.3 Minimum Spacing
Lumileds recommends a minimum edge to edge spacing between LUXEON emitters of 0.5 mm. Placing multiple LUXEON
emitters too close to each other may adversely impact the ability of the PCB to dissipate the heat from the emitters.
2.4 PCB Substrate Selection and Design
Table 1 provides a summary of various relevant performance characteristics of common PCB substrates to aid material
selection. Specic PCB design considerations for each substrate material are summarized below.
Table 1: General PCB substrate characteristics for consideration when designing a PCB for LUXEON HR30 emitter.
FR-4/CEM-3 MCPCB
Cost Low to medium Medium
PCB thermal conductivity performance Low to high (FR4 with lled and capped
vias but with increase cost) High
LED assembly packing density (thermal
resistance consideration)
Generally suitable for low density
application with a large spacing between
LEDs and/or low operating currents
Suitable for high density application with
close spacing between emitters
Dielectric withstand voltage (top copper
to bottom of substrate) Extremely high (>20kV/mm)
Depends on dielectric material thickness
and its property. Typically 4kV for 100um
thick.
Metal Core PCB
The most common MCPCB construction consists of the following layers (Figure 4):
• A metal substrate, typically aluminum.
• Epoxy dielectric layer. This is the most important layer in the MCPCB construction as it aects the thermal
performance and electrical breakdown strength. The typical thermal conductivity of the dielectric layer on a MCPCB
is around 2Wm-1K-1. A higher value is better for good thermal performance. A thinner dielectric layer is better for
thermal performance but can negatively impact the ability of the MCPCB to withstand electrical insulation test to meet
minimum electrical safety standards as required in certain lighting markets. The typical dielectric thickness layer is
about 100µm.
• Top copper layer. A thicker copper layer improves heat spreading into the PCB but may pose challenges for PCB
manufacturers when fabricating narrow traces or spaces. A thickness of 1oz (35µm) or 2oz (70µm) is common. For
optimum thermal performance on both 1oz and 2oz copper design, the copper area should extend at least 4mm
away from the package outline.
• Use of white solder mask.
Figure 4. MCPCB typical cross section of the three-pad openings with aluminum substrate.

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FR-4/CEM-3 PCB
FR-4/CEM-3 board construction consists of the following layers (Figure 5):
• FR-4 (woven ber glass fabrics reinforced epoxy laminate, Figure 6 ) sheet or CEM-3 (composite epoxy material
constructed from both woven and non-woven ber glass fabrics, Figure 6). These two materials have excellent
electrical insulation properties but have very poor thermal conductivity. Between these two, CEM-3 thermal
conductivity is generally better than FR-4. For detail specications of PCB, refer to a standard generated by Association
Connecting Electronics Industries, (www.ipc.org), IPC-4101C “Specication for Base Materials for Rigid and Multilayer
Printed Boards” standard.
• Top and bottom copper layers. To improve thermal performance, adding thermal vias will help but may require an
electrically insulting thermal interface material (TIM) between an FR-4 and the heat-sink to ensure that the PCB system
can meet a minimum high potential (hipot – electrical insulation barrier) test and to prevent potential device shorting
over time due to breakdown of the TIM material. Two common approaches include:
– (i) Open vias with plated through holes (Figure 5)
– (ii) Filled and capped thermal vias (Figure 5).
The lled and capped design gives better thermal performance than open via design but at a much higher
manufacturing cost and require good surface co-planarity for small package. The diameter of the via, position and
the quantity need to be studied to nd optimum thermal performance at acceptable cost.
• Use of white solder mask.
Figure 5. Left picture shows a cross section of an open via with plated through hole design with one pad opening where the
LED pad is soldered onto. Right picture shows a cross section of a lled and cap via design with one pad opening. One of the
LED pads is then soldered on top of the ush area where the lled and capped vias are underneath it to create direct thermal
path connection between LED and bottom of PCB.
Figure 6. Cross section of a FR-4 and CEM-3 PCBs. Not drawn to scale; for illustration purposes only.

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3. Thermal Management
The overall thermal performance of LUXEON emitter is aected by the following factors:
a. PCB layout, construction and material as described in section 2.4.
b. LEDs spacing (e.g. close packing).
c. Thermal interface materials (TIM) property if assembled PCB is mounted onto a heatsink.
d. Orientation of the LED strips, module or heat sink (e.g. vertical or horizontal mounting and LED facing upwards
or downwards).
e. Presence of air ow or still air.
f. Presence of nearby heat source (e.g. inecient LED driver generates heat during operation).
4. Thermal Measurement Guidelines
The typical thermal resistance Rθj-case between the junction and the solder pads of the LUXEON emitter is provided in the
datasheet. With this information, the junction temperature Tj can be determined according to the following equation:
Tj = Tcase + Rθj-case • Pelectrical
In this equation Tcase is the temperature at the bottom of the solder pads of the LUXEON emitter and Pelectrical is the electrical
power going into the emitter. In typical applications it may be dicult, though, to measure the temperature Tcase directly.
Therefore, a practical way to determine the junction temperature of the LUXEON emitter is by measuring the temperature
Tsof a predetermined sensor pad on the PCB with a thermocouple (TC).
Figure 7. The recommended temperature measurement point Tsis located on the cathode copper layer of the PCB, closest to
the package. The top picture shows the side view. Bottom picture shows the top view of the Tslocation.

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Figure 8. Photo showing representative placement of TC wire secured with thermal conductive epoxy. The thermal epoxy
volume should be kept to minimum as shown.
The recommended location of the sensor pad is right next to the cathode of the LUXEON emitter on the PCB, as shown
in Figure 7 and Figure 8. To ensure accurate reading, the thermocouple tip must make direct contact to the copper of the
PCB onto which the LUXEON emitter cathode pad is soldered, i.e. any solder mask or other masking layer must be rst
removed before mounting the thermocouple onto the PCB. The tip of the TC wire should be placed as close as possible to
the LUXEON emitter package on the exposed cathode copper layer as shown in Figure 7. It is recommended to secure the
tip of TC wire to the exposed copper area with a good thermal conductive epoxy such as Artic Silver™ thermal adhesive.
Note that the Artic Silver™ epoxy is not formulated to conduct electricity. During dispensing of epoxy, avoid ooding the TC
wire with too much epoxy but sucient enough to secure the TC wire for measurement. Putting more epoxy than needed
may change the thermal behavior of the surrounding area.
The thermal resistance Rθj-s between the sensor pad and the LUXEON emitter junction was experimentally determined and
provided here. The junction temperature can then be calculated as follows:
Tj = Ts + Rθj-s • Pelectrical
Lumileds investigated the thermal performance of LUXEON emitters on a 1.0mm thick aluminum MCPCB with 2oz (70μm)
top copper plating with dielectric thermal conductivity of 2W/(mK) and 100um thick. The typical thermal resistance Rθj-s
obtained using this type of PCB is 17 K/W. Note that Rθj-s may vary according to the PCB design.
5. Assembly Process Guidelines
5.1 Stencil Design
The recommended solder stencil thickness is 5mils (127μm). Adjustment may be required to achieve optimum assembly
yield and quality.
5.2 Solder Paste
Lumileds recommends lead-free solder for the LUXEON emitter such as SAC 305 solder paste from Alpha Metals (SAC305-
CVP390-M20 type 3). However, since application environments vary widely, Lumileds recommends that customers perform
their own solder paste evaluation in order to ensure it is suitable for the targeted application.
5.3 Solder Reow Prole
The LUXEON emitter is compatible with standard surface-mount and lead-free reow technologies. This greatly simplies
the manufacturing process by eliminating the need for adhesives and epoxies. The reow step itself is the most critical
step in the reow soldering process and occurs when the boards move through the oven and the solder paste melts,
forming the solder joints. To form good solder joints, the time and temperature prole throughout the reow process
must be well maintained.

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A temperature prole consists of three primary phases:
1. Preheat: the board enters the reow oven and is warmed up to a temperature lower than the melting point of the
solder alloy.
2. Reow: the board is heated to a peak temperature above the melting point of the solder, but below the temperature
that would damage the components or the board.
3. Cool down: the board is cooled down rapidly, allowing the solder to freeze, before the board exits the oven.
As a point of reference, the melting temperature for SAC 305 is 217°C, and the minimum peak reow temperature is
235°C.
5.4 Pick and Place
The LUXEON emitter is packaged and shipped in tape-and-reel which is compatible with standard automated pick-and-
place equipment to ensure the best placement accuracy. Note that pick and place nozzles are customer specic and are
typically machined to t specic pick and place tools.
In selecting a suitable nozzle size for picking up these LUXEON emitters, there are two important factors to consider:
1. The nozzle outer diameter should not be larger than the opening of the reel pocket tape otherwise it may interfere
with the pocket tape cavity during the pick-up process.
2. The nozzle outer diameter should also not be smaller than the silicone encapsulant surface (Figure 1) otherwise this
may allow the nozzle tip to be in full contact with the silicone-lled area and may cause damage to the surface or
cause pick-up/release issues.
See Figure 9 for the best nozzle outer diameter. There is no constraint on the nozzle inner diameter as long as there is
sucient vacuum to hold the LED emitter during pick and place process.
Figure 9. LUXEON emitter in a pocket tape. Dimensions in mm. Best to use nozzle with outer diameter between
2.7mm and 3.3mm to avoid interfering with the pocket tape cavity or picking solely from the silicones.

AB217 LUXEON HR30 Application Brief 20160504 ©2016 Lumileds Holding B.V. All rights reserved. 10
An example of a nozzle from Yamaha that is suitable for pick and place the LUXEON emitter is shown in Figure 10.
Figure 10. Example of a nozzle that ts Yamaha i-PULSE series pick and place machine.
Lumileds advises customer to take the following general pick and place guidelines into account:
a. The nozzle tip should be clean and free of any particles.
b. During setup and the rst initial production runs, it is a good practice to inspect the top surface of the
LUXEON emitters under a microscope to ensure that the emitters are not accidentally damaged by the pick
and place nozzle.
5.5 Electrostatic Discharge Protection
For the part number without transient voltage suppressor (TVS) chip to protect against electrostatic discharges (ESD),
Lumileds recommends observing the following precautions when handling the LUXEON emitter:
• During manual handling always use a conductive wrist band or ankle straps when positioned on a grounded
conductive mat.
• All equipment, machinery, work tables, and storage racks that may get in contact with the LUXEON emitter should be
properly grounded.
• Use an ion blower to neutralize the static discharge that may build up on the surface and lens of the plastic housing of
the LUXEON emitter during storage and handling.
LUXEON emitters which are damaged by ESD may not light up at low currents and/or may exhibit abnormal performance
characteristics such as a high reverse leakage current, and a low forward voltage (leaky diode). It is also important to take
note that ESD can also cause latent failure, i.e. failure or symptoms as described above may not show up immediately but
until after use. Hence continuous ESD protection is needed during assembly.
5.6 JEDEC Moisture Sensitivity
The JEDEC (J-STD-020D) MSL (moisture sensitivity level) of the LUXEON emitter has unlimited oor life (MSL Level 1) when
stored under this condition: ≤30°C at 85% relative humidity.
6. Environmental Corrosion Testing
Corrosive environment can negatively aects LED performance over time. Hydrogen sulde (H2S) is well known to react
with silver (tarnish) and leads to drop in light output and potentially weaken the wire bond adhesion strength over time.
To test the robustness of LUXEON HR30 emitter susceptibility to corrosive environment, two test setups were evaluated:
1. H2S exposure test per IEC 60068-2-43. Environmental condition: 40°C, H2S 15ppm, 80% RH (relative humidity) up
to 21 days.

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2. Flowing mixed gas corrosion test per IEC 60068-2-60, Method 4. Environmental condition: H2S 10ppb, NO2200ppb,
Cl210ppb, SO2 200ppb, all at 25°C 75% RH up to 21 days.
LUXEON HR30 performs exceptionally well with average light output change of less than 10% and color shift of less than
0.006 points in delta u’v’ after 21 days in both test conditions. Please contact your regional sales representatives for further
information.
7. Packaging Considerations — Chemical Compatibility
The LUXEON emitter package contains a silicone overcoat to protect the LED chip and extract the maximum amount of
light. As with most silicones used in LED optics, care must be taken to prevent any incompatible chemicals from directly or
indirectly reacting with the silicone.
The silicone overcoat used in the LUXEON emitter is gas permeable. Consequently, oxygen and volatile organic compound
(VOC) gas molecules can diuse into the silicone overcoat. VOCs may originate from adhesives, solder uxes, conformal
coating materials, potting materials and even some of the inks that are used to print the PCBs.
Some VOCs and chemicals react with silicone and produce discoloration and surface damage. Other VOCs do not
chemically react with the silicone material directly but diuse into the silicone and breakdown during the presence of heat
or light. Regardless of the physical mechanism, both cases may aect the total LED light output. Since silicone permeability
increases with temperature, more VOCs may diuse into and/or evaporate out from the silicone.
Careful consideration must be given to whether LUXEON emitters are enclosed in an “air tight” environment or not. In
an “air tight” environment, some VOCs that were introduced during assembly may permeate and remain in the silicone.
Under heat and exposing to blue light, some VOCs can breakdown inside the silicone and may cause appearance of
silicone discoloration, particularly on the surface of the LED where the ux energy is the highest. In an air rich or “open”
air environment, VOCs have a chance to leave the area (driven by the normal air ow). Transferring the devices which
were discolored in the enclosed environment back to “open” air may allow the VOCs to diuse out of the silicone and may
restore the original optical properties of the LED.
Table 2 provides a list of commonly used chemicals that should be avoided as some react with the silicone material. Note
that Lumileds does not warrant that this list is exhaustive since it is impossible to determine all chemicals that may aect
LED performance. Determining suitable threshold limits for the presence of chemical/VOCs is very dicult since these
limits depend on the type of enclosure used to house the LEDs and the operating temperatures.
The chemicals in Table 2 are typically not directly used in the nal products that are built around LUXEON emitters.
However, some of these chemicals may be used in intermediate manufacturing steps (e.g. cleaning agents). Consequently,
trace amounts of these chemicals may remain on (sub) components, such heat sinks. Lumileds, therefore, recommends
the following precautions when designing your application:
• When designing secondary lenses to be used over an LED, provide a suciently large air-pocket and allow for
“ventilation” of this air away from the immediate vicinity of the LED.
• Use mechanical means of attaching lenses and circuit boards as much as possible. When using adhesives, potting
compounds and coatings, carefully analyze its material composition and do thorough testing of the entire xture
under High Temperature over Life (HTOL) conditions.

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Table 2: List of commonly used chemicals that will damage the silicone overcoat of the LUXEON emitter.
Avoid using any of these chemicals in the housing that contains the LED package or in direct contact with the silicone.
CHEMICAL NAME NORMALLY USED AS
Acetic Acid Acid
Hydrochloric Acid Acid
Nitric Acid Acid
Sulfuric Acid Acid
Ammonia Alkali
Potassium Hydroxide Alkali
Sodium Hydroxide Alkali
Acetone Solvent
Benzene Solvent
Dichloromethane Solvent
Gasoline Solvent
MEK (Methyl Ethyl Ketone) Solvent
MIBK (Methyl Isobutyl Ketone) Solvent
Mineral Spirits (turpentine) Solvent
Tetracholorometane Solvent
Toluene Solvent
Xylene Solvent
Castor Oil Oil
Lard Oil
Linseed Oil Oil
Petroleum Oil
Silicone Oil Oil
Halogenated Hydrocarbons
(containing F, Cl, Br elements) Misc.
Rosin Flux Solder Flux
Acrylic Tape Adhesive
Cyanoacrylate Adhesive
RoHS
COMPLIANT

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AB217 LUXEON HR30
Application Brief 20160504
©2016 Lumileds Holding B.V. All rights reserved.
LUXEON is a registered trademark of the Lumileds Holding B.V.
in the United States and other countries.
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About Lumileds
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LEDs and automotive lighting products that shatter the status quo and help customers gain and maintain a competitive edge.
With a rich history of industry “rsts,” Lumileds is uniquely positioned to deliver lighting advancements well into the future by
maintaining an unwavering focus on quality, innovation and reliability.
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