M-TI M200-RS Installation manual

Revision 1.4
Copyright © 2020, Microelectronics Technology, Inc. Indy and
Impinj are either registered trademarks or trademarks of Impinj,
Inc. For more information, contact [e-mail]
MTI M200-RS
Hardware User’s Guide
MTI M200-RS Overview, 100% RS2000 Compatible
The MTI M200-RS module is pin-to-pin, 100% compatible with
Impinj®Indy® RS2000, a surface mount module that comprises a
completely integrated reader solution for EPC Gen2 / ISO18000-63
(formerly 18000-6C) applications. The module was developed to
make embedding a high performance reader easy. The MTI M200-
RS module based on Impinj’s Indy and R2000 builds on market-
leading Indy reader chip technology and integrates all of the
necessary components into a small package. Just provide power,
UART connection from a host, an antenna, and start reading tags.
It is fully tested and is certified for modular operation under FCC
and IC regulations. The M200-RS comes in a surface mount
package designed towork as aSMT (surfacemount technology) component in astandard
PCB manufacturing process.
This document provides hardware developers technical guidance to ensure optimal
performance when using the M200-RS.
Air Interface
Protocol
RAIN RFID
EPCglobal UHF Class 1 Gen2 / ISO 18000-63 (formerly 18000-6C)
Supports dense reader mode (DRM)
Tx Output Power
Range: +10 to +31.5 dBm (+30 dBm maximum in Japan)
Default: +30 dBm
Antenna Ports
4 antenna ports total:
•2 connectorized ports
•2 surface mount ports
Dimensions
38 mm by 52 mm by 4 mm
Package Type
35 pin surface mount package (SMT compatible)
Rx Sensitivity
-74 dBm (1% packet error rate). Assumes a 15 dB antenna return loss at
31.5 dBm output power.
DC Power Supply
3.2 to 5.25 Volts
Supported
Regions
Worldwide regional support. All major regions supported. See the device
datasheet for a complete list.
Compliance
Certified: FCC and Canada modular operation, RoHS compliant
For technical support, please contact [email protected]om

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 2
1 Table of Contents
INDY® M200-RS OVERVIEW .................................................................................................................1
1TABLE OF CONTENTS....................................................................................................................2
1.1 FIGURES ......................................................................................................................................3
1.2 TABLES........................................................................................................................................3
2M200-RS HARDWARE INTERFACE................................................................................................4
2.1 PIN LISTING..................................................................................................................................6
2.2 POWER SUPPLY............................................................................................................................8
2.3 RF CONNECTIONS.........................................................................................................................8
2.4 UART COMMUNICATION ................................................................................................................9
2.5 ENABLE PIN..................................................................................................................................9
2.6 HEALTH AND STATUS PINS ...........................................................................................................10
2.6.1 Health Pin Behavior............................................................................................................10
2.6.2 Status Pin Behavior ............................................................................................................11
2.7GPIO PINS.................................................................................................................................11
2.8 WAKEUP PIN ..............................................................................................................................12
3M200-RS LAYOUT AND COMPONENTS.......................................................................................12
3.1 PCB LAYOUT FOR RF..................................................................................................................12
3.1.1 50 Ohm Characteristic Impedance......................................................................................12
3.1.2 PCB Layout for Minimizing Interference ..............................................................................14
3.2 RF CABLING...............................................................................................................................14
3.2.1 U.FL Connectors.................................................................................................................14
3.2.2 Using All 4 Antenna Ports with Uniform Connectors............................................................15
3.3 LEDS FOR HEALTH,STATUS,GPIOS............................................................................................15
3.4 M200-RS READER THERMAL DESIGN ...........................................................................................16
4M200-RS OPERATING MODES .....................................................................................................18
4.1 STARTUP BEHAVIOR ....................................................................................................................20
4.2 LOW POWER OPERATION.............................................................................................................20
5M200-RS DEVELOPMENT KIT.......................................................................................................21
5.1 M200-RS DEVELOPMENT BOARD OVERVIEW.................................................................................21
5.2 M200-RS DEVELOPMENT BOARD KEY COMPONENTS .....................................................................22
5.2.1 Key IC Descriptions ............................................................................................................23
5.2.2 Connector Descriptions.......................................................................................................24
5.3 M200-RS DEVELOPMENT BOARD DEFAULT CONFIGURATION...........................................................26
5.4 M200-RS DEVELOPMENT BOARD ALTERNATE POWER OPTIONS......................................................26
5.5 M200-RS DEVELOPMENT BOARD USB-UART DETAILS ..................................................................27
5.6 M200-RS DEVELOPMENT BOARD SCHEMATIC ...............................................................................27
5.7 M200-RS DEVELOPMENT BOARD LAYOUT.....................................................................................28
5.8 M200-RS DEVELOPMENT BOARD BILL OF MATERIALS (BOM) .........................................................30
6REGULATORY GUIDELINES.........................................................................................................30
6.1 PRODUCT LABELLING...................................................................................................................31
6.2 PRODUCT MANUALS ....................................................................................................................32
6.3 US REQUIREMENTS.....................................................................................................................32
6.4 CANADIAN REQUIREMENTS...........................................................................................................33
6.4.1 Industry Canada Statement.................................................................................................33
6.4.2 Radiation Exposure Statement............................................................................................33
6.4.3 Déclaration d'exposition aux radiations ...............................................................................33
6.4.4 Labeling Requirements.......................................................................................................33
6.5 ANTENNA REQUIREMENTS............................................................................................................34

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 3
6.6 MAXIMUM POWER EXPOSURE (MPE) AND USAGE LIMITATIONS........................................................35
7RELATED DOCUMENTATION.......................................................................................................36
8DOCUMENT CHANGE LOG...........................................................................................................36
9NOTICES........................................................................................................................................37
1.1 Figures
FIGURE 1–EXAMPLE M200-RS BLOCK DIAGRAM.........................................................................................4
FIGURE 2–INDY M200-RS PIN LISTING ......................................................................................................6
FIGURE 3–M200-RS RF CONNECTION NUMBERING ....................................................................................9
FIGURE 4–M200-RS ENABLE PIN CIRCUIT DIAGRAM .................................................................................10
FIGURE 5–PCB TRANSMISSION LINE TYPES .............................................................................................13
FIGURE 6–HIROSE U.FL-R-SMT-1 CONNECTOR.......................................................................................15
FIGURE 7–M200-RS LAYOUT AND CABLING FOR CONNECTOR UNIFORMITY .................................................15
FIGURE 8–HEAT CONDUCTION FROM M200-RS INTO A HEAT SINK .............................................................16
FIGURE 9–M200-RS MODULE THERMAL CUTAWAY VIEW...........................................................................16
FIGURE 10 –M200-RS PASTEMASK PATTERN ...........................................................................................17
FIGURE 11 –M200-RS MODULE THERMAL MOUNTING OPTIONS..................................................................18
FIGURE 12 –M200-RS OPERATING MODE STATE DIAGRAM........................................................................20
FIGURE 13 –M200-RS DEVELOPMENT BOARD BLOCK DIAGRAM..................................................................22
FIGURE 14 –M200-RS DEVELOPMENT BOARD COMPONENT AND CONNECTOR LOCATIONS ............................23
FIGURE 15 –JP200 AND JP204: M200-RS I/O JUMPERS ...........................................................................25
FIGURE 16 –JP207-JP210: UART SELECTION JUMPERS ...........................................................................25
FIGURE 17 –M200-RS DEVELOPMENT BOARD SCHEMATIC.........................................................................28
FIGURE 18 –M200-RS DEVELOPMENT BOARD LAYOUT:TOP SIDE...............................................................29
FIGURE 19 –M200-RS DEVELOPMENT BOARD LAYOUT:BOTTOM SIDE ........................................................30
1.2 Tables
TABLE 2-1 –INDY M200-RS PIN LISTING AND SIGNAL DEFINITIONS ................................................................7
TABLE 2-2 –M200-RS ANTENNA LISTING AND IRI CONSTANTS......................................................................9
TABLE 2-3 –HEALTH PIN BEHAVIOR ..........................................................................................................11
TABLE 2-4 –STATUS PIN BEHAVIOR ..........................................................................................................11
TABLE 3-1 –M200-RS DEVELOPMENT KIT LED SELECTION........................................................................16
TABLE 4-1 –M200-RS OPERATING MODES ...............................................................................................19
TABLE 7-1 –RELATED DOCUMENTATION ....................................................................................................36
TABLE 8-1 –DOCUMENT CHANGE LOG ......................................................................................................36

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 4
2M200-RS Hardware Interface
An example M200-RS system-level block diagram for an embedded system is shown in
Figure 1. This figure shows the electrical connections that may and must be made to
control the M200-RS. Inthe figure, the required connections are illustrated with solid lines.
Recommended and optional connections are illustrated with different dotted and dashed
line patterns. They are also listed below.
More details for each connection are listed in the following subsections.
Figure 1 –Example M200-RS Block Diagram
Required connections:
•VDC_IN and GND are required to power the M200-RS.
•ANT1, ANT2, UFL1, or UFL2 are required to connect to UHF RFID antennas. Only
one is required for RFID activity, but all four may be used.
•UART1 Tx and Rx are required to communicate with the system host.
•ENABLE is used to enable or disable operation of the part. If this pin is driven low, the
power supplies in the part will be disabled. M200-RS may be reset by toggling this pin.
This pin must be driven high to enable the part.
Recommended connections:
•UART2 Tx and Rx may be used to examine debug information.
•HEALTH toggles to indicate successful operation of the M200-RS. Connection to an
LED provides a visual indication of whether or not an error condition exists.

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 5
•STATUS toggles to provide an indication when the M200-RS is in active mode (for
example, inventorying tags). Connection to an LED provides a visual indicator of the
device’s activity.
Optional connections:
•GPIOs allow interaction with the M200-RS as both digital inputs and outputs. They
may be used to trigger inventory, generate events based on inventory activity, or
provide general-purpose user-controlled digital I/O.
•WKUP provides a mechanism to wake up the M200-RS from the low power modes.
WKUP is also used to force entry into the Impinj firmware bootstrap. If unused, this
pin should be tied to logic low.
No connect:
•CLK_OUT, DTEST0 and DTEST1 connections are reserved for MTI use only.

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 6
2.1 Pin Listing
M200-RS’s pins are shown in Figure 2 and listed inTable 2-1.
Figure 2 –Indy M200-RS Pin Listing

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 7
Table 2-1 –Indy M200-RS Pin Listing and Signal Definitions
Pin #
Pin Name
Pin Type
Description
1
VDC_IN
Power
DC voltage supply (3.2 –5.25 V)
2
GND
Power
Ground
3
UART2-TX
Digital Output
M200-RS Debug UART Tx to host
4
UART2-RX
Digital Input
M200-RS Debug UART Rx from host
5
GND
Power
Ground
6
UART1-TX
Digital Output
M200-RS UART Tx to host
7
UART1-RX
Digital Input
M200-RS UART Rx from host
8
GND
Power
Ground
9
ENABLE
Digital Input
Module enable, active high. Puts M200-RS in
Shutdown mode when logic low.
10
GND
Power
Ground
11
VDC_IN
Power
DC voltage supply (3.2 –5.25 V)
12
GND
Power
Ground
13
GND
Power
Ground
14
GND
Power
Ground
15
GND
Power
Ground
16
GND
Power
Ground
17
WKUP
Digital Input
Wakeup from sleep on rising edge
18
GPIO1
Digital I/O
General purpose I/O
19
GPIO2
Digital I/O
General purpose I/O
20
GPIO3
Digital I/O
General purpose I/O
21
GPIO4
Digital I/O
General purpose I/O
22
STATUS
Digital Output
M200-RS status indication
23
HEALTH
Digital Output
M200-RS health indication
24
GND
Power
Ground
25
CLK_OUT
No Connect
Reserved for Impinj production test
26
DTEST0
No Connect
Reserved for Impinj production test
27
DTEST1
No Connect
Reserved for Impinj production test
28
GND
Power
Ground
29
ANT2
RF
SMT antenna port 2

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 8
Pin #
Pin Name
Pin Type
Description
30
GND
Power
Ground
31
ANT1
RF
SMT antenna port 1
32
GND
Power
Ground
33
GND
Power
Ground
34
GND
Power
Ground
35
GND
Power
Ground
UFL-1
UFL1
RF
UFL antenna port 1
UFL-2
UFL2
RF
UFL antenna port 2
2.2 Power Supply
M200-RS is powered by a voltage applied to the VDC_IN pins (pins 1 and 11) relative to
the GND pins. The supply voltage operating range is 3.2 V to 5.25 V. Average current
consumption varies from about 1600 mA (8 W) to about 1 µA (5 µW) depending on the
operating mode. Peak current consumption can exceed this by up to 50% depending on
the operating mode. The power supply is internally bypassed and regulated, and no
external bypass or bulk storage capacitance is required, as long as the input voltage is
stable.
If M200-RS activity is not required at all times, and power reduction is desired, the
ENABLE input can be driven low to place the part in “shutdown” mode, where the internal
power supplies are disabled, and no activity takes place. Otherwise, ENABLE should be
driven high.
2.3 RF Connections
The M200-RS has four RF antenna ports, which may be connected to 50 Ω antennas via
50 Ω controlled impedance connections. These connections could simply be microstrip
transmission lines to PCB antennas or SMT antennas, or they could include connectors
and coaxial cable. The RF connections are single ended, referenced to ground.
For more information about impedance matching, see section 3.1 - PCB Layout for RF.
Among the four ports, there are two SMT connections on the edge of the M200-RS
module, and two UFL connectors on the top side of the M200-RS module. All four may
be used in a design, allowing up to four antennas with no external switching. The
connectors are numbered in increasing order moving towards the corner of the module
with the cutout in theshield. This isshown in Figure 3. The antenna numbering convention
used in the IRI libraries is shown in Table 2-2.
If more antenna connections are required, external RF switches may be used to increase
the number of connections.

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 9
Figure 3 –M200-RS RF Connection Numbering
Table 2-2 –M200-RS Antenna Listing and IRI Constants
Antenna
Connection
Antenna
Number
Generic Antenna
Constant
M200-RS Specific Antenna
Constant
ANT1
1
E_IPJ_ANTENNA_1
E_IPJ_ANTENNA_RS2000_SMT_1
ANT2
2
E_IPJ_ANTENNA_2
E_IPJ_ANTENNA_ RS2000_SMT_2
UFL1
3
E_IPJ_ANTENNA_3
E_IPJ_ANTENNA_ RS2000_UFL_1
UFL2
4
E_IPJ_ANTENNA_4
E_IPJ_ANTENNA_ RS2000_UFL_2
2.4 UART Communication
The M200-RS has two full-duplex UART interfaces at the pins, accessible using pins
UART1-RX, UART1-TX, UART2-RX, and UART2-TX. UART1 implements the host
communication interface via IRI, and UART2 implements thedebug interface. The Tx pins
are outputs from the M200-RS, and the Rx pins are inputs to the M200-RS. Both UART
interfaces are 115,200 baud, with 8 data bits, 1 stop bit, and no parity bit (8-n-1
configuration).
Each of the UART interfaces signals at 3.3V relative to GND. The TX pins are driven
strong high and low with a sink/source current of about 2 mA. If the load on a pin draws
more than the 2 mA sink and source current, the pin is not guaranteed to meet the VOH
and VOL specs. Excessive current sunk or sourced on the GPIO pins can also cause
electrical damage to the device.
Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should not
be applied to the UART pins. This can cause permanent damage to the device.
Note Tag read rates can be limited by host communication interface baud rate. The
default baud rate of 115,200 Baud will limit the tag read rate to approximately 300 tags
per second.
2.5 Enable Pin
The M200-RS has an ENABLE pin (pin 9) allows an external signal to put the module in
Shutdown mode, which offers the lowest possible current consumption. The Enable pin
can also be used to restart the module.

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 10
The Enable pin has an internal 100 kOhm pull-down resistor. If the signal is above 1.2 V,
the module will be enabled, and if it is below 0.4 V, it will be disabled. This means that
the driving signal needs only source ~12 µA to enable the module. If the host device has
a pull-up drive mode, or a series resistor is used with a strong drive mode, the resistor
value should be selected such that the Enable voltage is above 1.2 V. This arrangement
is shown in Figure 4, and the resistor size requirement is shown in Equation 2-1.
Note Using a series resistor or resistive pull-up drive mode allows the same circuit to be
used to drive the RS500 NRST pin and the M200-RS ENABLE pin.
The module can be reset by toggling the Enable pin low and then back high.
Figure 4 –M200-RS Enable Pin Circuit Diagram
100 kΩ
RS2000
R1
Host Device
VDDIO
> 1.2 VENABLE
Equation 2-1 –M200-RS Enable Pin Pull-Up Resistor Size
󰇧
󰇨
2.6 Health and Status Pins
The M200-RS has two pins that indicate the state of the device through their voltages:
HEALTH (pin 23) and STATUS (pin 22).
Both pins are outputs operating at a logical voltage level of 3.3 V, and can sinkand source
2 mA each. If the load on one of these pins draws more than the 2 mA sink and source
current, the pin is not guaranteed to meet the VOH and VOL specs. Excessive current
sunk or sourced on the pins can also cause electrical damage to the device.
For recommendations on LEDs for observing the Health and Status pins, see section 3.3
-LEDs for Health, Status, GPIOs.
2.6.1 Health Pin Behavior
The HEALTH pin indicates whether the M200-RS is operating in its normal mode, or if
some other condition exists. The pin is cycled high and low in specific patterns to indicate
the state of the M200-RS. Those patterns are as follows:
M200-RS

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 11
Table 2-3 –Health Pin Behavior
Mode
HEALTH Pin Behavior
Reset
HEALTH pin is held low
Idle (no reads occurring)
1 second high, 1 second low
Active(reads occurring)
250 ms high, 750 ms low
Watchdog reset has occurred
HEALTH pin is held low
Recovery
Blink alternate pattern with STATUS LED
2.6.2 Status Pin Behavior
The STATUS pin indicates whether the M200-RS is operating in its active mode, or if
some other condition exists. The pin is cycled high and low in specific patterns to indicate
the state of the M200-RS. Those patterns are as follows:
Table 2-4 –Status Pin Behavior
Mode
STATUS Pin Behavior
Reset
STATUS pin is held low
Idle (no reads occurring)
STATUS pin is held low
Active(reads occurring)
During inventory, the high time is between
150ms and 750ms based on the number of
tags in the field. The low time is 1000ms
minus the high time. If there are no tags in
the field the pin remains low.
Watchdog reset has occurred
Alternate high and low
Recovery
Toggle with a pattern of logical NOT of the
HEALTH pin status
2.7 GPIO Pins
The M200-RS’s GPIOs can be controlled using the IRI interface. Their drive mode,
direction, and state are all controllable via IRI. There are two directions: input and output.
In both input and output directions, there are three possible pin states: high, low, and
float. For more details on using IRI to control the GPIOs, see the IRI Toolkit (ITK)
documentation.
In the output direction, the GPIOs are driven strong high and low with a source and sink
current of 2 mA, and in float mode the pin is not driven either high or low, leaving the pin
floating, also known as “high impedance” or “high-Z”. The pins are driven to 3.3 V
nominally. If the load on a pin draws more than the 2 mA sink and source current, the pin

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 12
is not guaranteed to meet the VOH and VOL specs listed in the device datasheet.
Excessive current sunk or sourced on the GPIO pins can also cause electrical damage
to the device.
In the input direction, the high and low states apply a pull-up or pull-down resistor, and in
float mode the pin is not pulled either high or low, leaving the pin floating, also known as
“high impedance” or “high-Z”. The pull-up and pull-down resistors are about 100 kΩ
nominal. See the device datasheet for more specific ratings. The inputs logic levels are
proportional to 3.3V. Specific VIH and VIL specs may be found in the device datasheet.
Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should not
be applied to the pins, no matter their configuration. This can cause permanent damage
to the device.
2.8 Wakeup Pin
The WKUP pin is used to wake the device when it is in the Standby operating mode. This
pin is edge sensitive, and will wake the device on a rising edge. The WKUP pin must be
logic low in order for the device to re-enter low power modes after a wakeup, so it should
only be pulsed high to wake up the part.
The WKUP pin is also used to force the part into the Impinj bootstrap. The pin is polled at
startup, and while it remains high, the device stays in the bootstrap. This allows
bootloading of the part even if the bootloadable application code is corrupted.
The WKUP pin operates at a 3.3 V logic level. It has a 10 kΩ typical pull-down resistor
inside the M200-RS. Voltages outside of the maximum IO operating voltage range of -0.3
to 4.0 V should not be applied to the WKUP pin. This can cause permanent damage to
the device.
If the WKUP pin is not used, it should be left floating or tied to logic low (ground). This will
prevent accidental entry into the Impinj bootstrap.
3M200-RS Layout and Components
This section describes hardware aspects of embedded RAIN RFID readers based on the
M200-RSmodule. Fordetailson the dimensions, recommended PCB footprint, andreflow
profile for M200-RS, see the device datasheet.
3.1 PCB Layout for RF
3.1.1 50 Ohm Characteristic Impedance
As discussed in section 2.3, a properly matched RF connection is critical to achieving
high performance with M200-RS. An improperly matched RF connection will reduce
performance in multiple ways, by both reducing the transmitted RF power, and also
increasing the reflected power that interferes with M200-RS’s receive circuitry. M200-
RS’s receiver has Self Jammer Cancellation (SJC) technology that is designed to
minimize the impact of reflected transmit signal, but reducing the amplitude of this signal
is still important to maintaining optimal performance.

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 13
When impedance is improperly matched across a node, a signal’s reflection coefficient
will be proportional to the difference between the characteristic impedances on both sides
of the node divided by their sum, as shown in Equation 3-1. In this equation, ZLrepresents
the characteristic impedance of the transmission line, and Z0represents the characteristic
impedance of M200-RS, 50 Ohms. For example, if a 40 Ohm transmission line is used,
the reflection coefficient will be = 10 / 90 = 11.1%, thus 11.1% of it will be reflected back
into the M200-RS, and only 88.9% of the power will be transmitted.
Equation 3-1 –Reflection Coefficient of a Load


M200-RS is designed to connect to a 50-Ohm characteristic impedance load. The
connection between the M200-RS module and its antennas should all be designed for a
50 Ohm characteristic impedance. If using PCB connections, this means carefully
designing the PCB layout.
PCB trace characteristic impedance dependson quite a few variables,only some of which
can easily be controlled by the PCB designer. The two main categories of variables are
the PCB geometry, andmaterial properties.PCBgeometry includes both the transmission
line type, be it microstrip, stripline, or others, and also the specific dimensions of the
forward and return paths and the adjacent dielectrics. Transmission line styles are shown
in Figure 5. Material properties to note include the dielectric constant of the dielectrics in
the PCB, and the conductivity of the conductor used.
Figure 5 –PCB Transmission Line Types
Microstrip Embedded
Microstrip
Stripline Dual
Stripline
In most PCB designs, many of the parameters of the PCB are already set, such as
dielectric thickness and constant, trace conductivity and weight, etc. Usually the only
variables that can be easily modified are the style of transmission line, and its dimensions.
The most common, and recommended PCB transmission line scheme is to use a
microstrip on the top or bottom layer of the PCB, with a ground plane on the layer
immediately adjacent as a return path. The width of this microstrip can then be varied to
achieve the desired characteristic impedance. Care should be taken to ensure that the
microstrip trace has enough current carrying capacity. This requires designing a trace that
is heavy enough to withstand the heat generated by power losses due to the resistance
of the trace.
There are many online resources and tools designed to assist in designing PCB
transmission lines with the correct characteristic impedances. For example, the TXLine

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 14
tool from National Instruments is very useful for performing these calculations
automatically. There is also an online calculator here on eeweb.com. These tools will
require information about the PCB layout and also PCB characteristics, which should be
obtained from the PCB manufacturer.
3.1.2 PCB Layout for Minimizing Interference
If, as recommended above, a microstrip trace is used as the RF transmission line, there
are additional guidelines that can be applied to minimize interference with other signals
on the PCB. Most notable are clearance between the RF traces and other nearby traces,
and via stitching to connect ground fills to one another. This section provides a bit of
detail.
Any conductor carrying electrical current can potentially act as an antenna, both radiating
and absorbing electromagnetic signals. On a PCB, this means that signals on traces
influence one another, especially if they are high power or high frequency. In order to
minimize interference between traces, they should be adequately spaced. Ideally, all RF
traces should be surrounded on the same layer by ground fill, at a distance of at least
three times the microstrip trace width.
Unused PCB areas on the outer layers of the PCB are often filled with copper, which is
connected to the ground plane. Copper pours can serve any of several useful functions
including shielding of sensitive or noisy traces and reduced PCB warpage. Careless
copper pours can result in undesired effects so it is important to follow some basic
guidelines. Ground planes are usually “stitched” together using multi-layer vias. The
typical rule of thumb is to place these stitching vias at a distance of the wavelength λ
divided by 10, or less. In 900 MHz UHF RFID applications, λ / 10 ~= 3.3 cm.
Note The M200-RS development board PCB can be used as a reference for RF layout
best practices.
3.2 RF Cabling
In addition to PCB traces, connectorized co-axial cables can also be used to connect
M200-RS to antennas. Two of the ports on the M200-RS have connectors, in addition to
the two surface mount connections.
3.2.1 U.FL Connectors
The surface mount connections on the M200-RS module use the Hirose U.FL-R-SMT-1
male U.FL connector, shown in Figure 6. This connector was chosen because it is very
small, and allows for product miniaturization. There are multiple mating connectors
available that can be used to build cables, such as the Hirose U.FL-LP-040 and U.FL-LP-
066. Complete cables can also be used, such as the Taoglas CAB.011 and
TE Connectivity 2032440-1.

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 15
Figure 6 –Hirose U.FL-R-SMT-1 Connector
3.2.2 Using All 4 Antenna Ports with Uniform Connectors
As previously stated, M200-RS’s 4 antenna ports are split between 2 connection
methods, with 2 ports accesible using surface mount contacts on the edge of the module,
and 2 accesible using the male U.FL connectors on the module itself. See Figure 3 for
more details. In most reader designs, a single method of antenna interface is preferable,
whether it is a specific type of cable or surface mount connection. For this reason, in most
4 port readers based on the M200-RS, 2 of the 4 antenna ports of the M200-RS will need
to be converted to match the other type.
Figure 7 shows two methods of converting all 4 antenna ports to the same connection
method. On the left, 2 U.FL connectors are mounted on the reader motherboard, and
connected to the surface mount connections on the module. This way, all 4 antenna ports
are accessible via U.FL connectors. On the right, 2 U.FL connectors are mounted on the
reader motherboard, and connected via U.FL-U.FL cables to the U.FL antenna ports on
the module. This way, all 4 antenna ports are accessible via surface mount traces on the
reader motherboard.
Figure 7 –M200-RS Layout and Cabling for Connector Uniformity
Indy
RS2000
SiP
Indy
RS2000
SiP
3.3 LEDs for Health, Status, GPIOs
The M200-RS’s Health, Status, and GPIO pins can be used to indicate the operating
conditions of the module. In designs where current consumption is not a concern, LEDs
can be connected to these signals to allow visual observation of them. Each of these pins
drive 2 mA at ~3.3 Volts.
The LEDs used in the M200-RS Development Kit are shown in Table 3-1. These LEDs
are intended to operate at about a 2 mA sink, which creates a ~1.4 V drop across the
680 Ohm resistors. This leaves a 1.9 V drop across the LEDs themselves.
These LEDs and resistors could be replaced but the circuit’s quiescent current and
voltage drop should be kept the same, at 2 mA and 3.3 V, respectively.

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 16
Table 3-1 –M200-RS Development Kit LED Selection
LED Color
LED MFG
LED Part Number
Resistor Value
Resistor Part Number
Green
Kingbright
APH1608SGD
680 Ohms
Walsin WR04X6800FTL
Yellow
Lite-On
LTST-C190TBKT
680 Ohms
Walsin WR04X6800FTL
Red
Kingbright
APH1608HD
680 Ohms
Walsin WR04X6800FTL
When LEDs are not connected to the Health, Status, and GPIO pins, they should be
connected to test points, so they can be observed if necessary.
3.4 M200-RS Reader Thermal Design
As a high power RFID Reader module, M200-RS has the potential to produce significant
heat during operation. In order to reduce the heat of the module, heat sinking can be
implemented in a few different ways. As described in the M200-RS device datasheet, the
backside of the module has an exposed pad that conducts heat directly away from the
power amplifier inside the module, which generates a majority of the heat. A good thermal
design will conduct heat away from this thermal pad into a larger thermal mass, such as
the motherboard PCB, a heat sink, or a chassis. This heat conduction is shown in Figure
8. Inside the module’s shield, which improves RF performance, there is a mechanical
standoff which allows a screw to be installed to secure the module to a heat sink or
chassis. This standoff accommodates a machine screw up to metric size M2.5, or SAE
size #2. A cutaway view of the module is shown in Figure 9.
Figure 8 –Heat Conduction From M200-RS Into a Heat Sink
RS2000 Module Shield
RS2000 Module PCB
Host PCB
Heat Sink
Screw
Screw & Nut
Exposed Conductor
and Vias
Heat Conduction
Figure 9 –M200-RS Module Thermal Cutaway View
Screw
Screw & Nut
Standoff RF PA

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 17
In all cases where heat is conducted away from one object to another, the interface
between the two objects should be considered. Air is a poor conductor of heat, and any
gap between two objects, for example a PCB and an aluminum heat sink, will result in
poor thermal performance. Air gaps should befilled using some material, such as thermal
paste or thermal gapfiller. Wider gaps can be filled with thermal blocks, forexample using
rectangular extruded or machined aluminum, as shown in the third option in Figure 11.
At the interface between a module like the M200-RS and a PCB, reflowed solder can be
used as a very effective heat conductor. To achieve the best heat conduction with
reflowed solder, it is important that the solder form a contiguous bond between both
objects. With certain patterns of paste mask, solder voids(filled with gas, not solder) can
form, impeding thermal conduction. This is why Impinj’s recommendation for M200-RS
pastemask uses 6 circles of paste under the M200-RS’s exposed pad rather than a single
contiguous rectangle of paste, as shown in Figure 10. For more details on PCB layout,
see the M200-RS Datasheet.
Figure 10 –M200-RS Pastemask Pattern
There are multiple ways to absorb the heat that is conducted away from the M200-RS
module. They vary in terms of effectiveness and impact on the reader form factor. Adding
more thermal mass will improve thermal performance, but increase the size and weight
of the reader. Four options are shown in Figure 11, listed in order of increasing
effectiveness and weight.
The first option shows the M200-RS module mounted to a PCB with no heat sink. This
approach would be sufficient for a very small reader with low transmit power and duty
cycle requirements.

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 18
The second option shows the module mounted to a PCB with a heat sink on the backside
and a screw for additional mechanical stability. This approach is ideal for medium to high
transmit power and duty cycle requirements.
The last two options show the module mounted to a metal chassis with a screw for
additional mechanical stability. These approaches are ideal for maximum transmit power,
high duty cycle applications.
Figure 11 –M200-RS Module Thermal Mounting Options
Indy RS2000 module mounted with Heat Sink
Indy RS2000 module mounted with no Heat Sink
Indy RS2000 module mounted with Machined Chassis
Indy RS2000 module mounted with Sheet Metal Chassis and Thermal Block
4M200-RS Operating Modes
M200-RS has five operating modes, a startup mode, and a shutdown mode. The modes
and their capabilities are listed in Table 4-1, and the transitions between these modes are
shown in Figure 12.
Table 4-1 shows the operating modes of the M200-RS in order of decreasing supply
current and activity. Capabilities and estimated supply current are listed for each mode.
Figure 12 shows a state diagram of the operating modes and the transitions between
them. Transitions are shown in two categories: IRI activity and non-IRI activity. IRI activity
shows transitions that are caused by commands communicated over IRI. Non-IRI activity

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 19
shows transitions that are caused by inputs to the part such as WKUP, ENABLE, and
GPIOs, and power supply conditions such as power supply ramps.
More details on startup behaviour and low power modes are given in the following
subsections.
Table 4-1 –M200-RS Operating Modes
WKUP Pin
Wakeup
GPIO
Wakeup
IRI
communication
Reading
tags
Active N/A N/A Yes Yes 2500*
Low Latency
Idle
N/A N/A Yes No 900
Standard
Idle
N/A N/A Yes No 30
Startup/
Bootloading
N/A N/A Yes No 30
Standby Yes Yes No No 20
Sleep Yes No No No 10
Shutdown No No No No 0.0005
Operating
Mode
Capabilities
*Varies with configuration, maximum shown
Supply
Current
(mA)

MTI M200-RS Hardware User’s Guide
Revision 1.3, Copyright © 2020, Impinj, Inc.
Revision 1.4, Copyright © 2020, Microelectronics Technology, Inc. 20
Figure 12 –M200-RS Operating Mode State Diagram
Power Up
or Reset
WKUP
pin low
WKUP
event
WKUP
or GPIO
event
WKUP
pin high
IRI Activity
Non-IRI Activity
Key
Startup
Impinj
Bootstrap
Idle
Active
StandbySleep
EN pin
low
EN pin
high Shutdown
4.1 Startup Behavior
Upon reset or power up, the M200-RS configures itself in the Startup mode. It
automatically begins code execution in the Impinj bootstrap, which can be used to update
the version of the M200-RS firmware in the device via IRI communication. It stays in this
operating mode as long as the WKUP pin is held high, which allows a host to
communicate with the Impinj Bootstrap via IRI. When the WKUP pin goes low, firmware
execution transitions to the Idle operating mode.
4.2 Low Power Operation
The M200-RS has a number of different operating modes that enable reduced power
consumption. The operating modes are Active, Idle, Standby, and Shutdown. The M200-
RS can only perform RFID reads while in Active mode. The IRI interface is only available
in Active and Idle modes. While in Idle mode, the M200-RS is ready to quickly return to
Active mode and start performing RFID reads. In Standby mode, a GPIO or WKUP pin
event is required to return to active mode. Shutdown mode is a hardware power supply
mode, in which the regulators in the part are disabled using the ENABLE signal.
Specifications for current consumption and wakeup time in each mode are given in the
device datasheet.