Mitsubishi Electric melsec q00ujcpu User manual

Programmable Controller
User's Manual
(Function Explanation,
Program Fundamentals)
QnUCPU
INDUSTRIAL AUTOMATION
MITSUBISHI ELECTRIC
MITSUBISHI ELECTRIC
01 12 2008
SH(NA)-080807ENG
Version A

A-1
SAFETY PRECAUTIONS
(Read these precautions before using this product.)
Before using this product, please read this manual and the relevant manuals carefully and pay full
attention to safety to handle the product correctly.
In this manual, the safety precautions are classified into two levels: " DANGER" and " CAUTION".
Under some circumstances, failure to observe the precautions given under " CAUTION" may lead to
serious consequences.
Make sure that the end users read this manual and then keep the manual in a safe place for future
reference.
DANGER
CAUTION
Indicates that incorrect handling may cause hazardous conditions,
resulting in death or severe injury.
Indicates that incorrect handling may cause hazardous conditions,
resulting in minor or moderate injury or property damage.

A-2
[Design Precautions]
DANGER
Configure safety circuits external to the programmable controller to ensure that the entire system
operates safely even when a fault occurs in the external power supply or the programmable
controller. Failure to do so may result in an accident due to an incorrect output or malfunction.
(1) Configure external safety circuits, such as an emergency stop circuit, protection circuit, and
protective interlock circuit for forward/reverse operation or upper/lower limit positioning.
(2) The programmable controller stops its operation upon detection of the following status, and the
output status of the system will be as shown below.
All outputs may turn on when an error occurs in the part, such as I/O control part, where the CPU
module cannot detect any error. To ensure safety operation in such a case, provide a safety
mechanism or a fail-safe circuit external to the programmable controller. For a fail-safe circuit
example, refer to Chapter 10 LOADING AND INSTALLATION in the QCPU User's Manual
(Hardware Design, Maintenance and Inspection).
(3) Outputs may remain on or off due to a failure of an output module relay or transistor. Configure
an external circuit for monitoring output signals that could cause a serious accident.
Output
All outputs are turned off.
All outputs are held or turned off according to
the parameter setting.
Overcurrent or overvoltage protection of the power supply module
is activated.
The CPU module detects an error such as a watchdog timer error
by the self-diagnostic function.
Status

A-3
[Design Precautions]
DANGER
In an output module, when a load current exceeding the rated current or an overcurrent caused by a
load short-circuit flows for a long time, it may cause smoke and fire. To prevent this, configure an
external safety circuit, such as a fuse.
Configure a circuit so that the programmable controller is turned on first and then the external power
supply.
If the external power supply is turned on first, an accident may occur due to an incorrect output or
malfunction.
For the operating status of each station after a communication failure, refer to relevant manuals for
the network.
Incorrect output or malfunction due to a communication failure may result in an accident.
When changing data of the running programmable controller from a peripheral connected to the
CPU module or from a personal computer connected to an intelligent function module, configure an
interlock circuit in the sequence program to ensure that the entire system will always operate safely.
For program modification and operating status change, read relevant manuals carefully and ensure
the safety before operation.
Especially, in the case of a control from an external device to a remote programmable controller,
immediate action cannot be taken for a problem on the programmable controller due to a
communication failure.
To prevent this, configure an interlock circuit in the sequence program, and determine corrective
actions to be taken between the external device and CPU module in case of a communication
failure.
CAUTION
Do not install the control lines or communication cables together with the main circuit lines or power
cables.
Keep a distance of 100mm (3.94 inches) or more between them.
Failure to do so may result in malfunction due to noise.
When a device such as a lamp, heater, or solenoid valve is controlled through an output module, a
large current (approximately ten times greater than normal) may flow when the output is turned from
off to on.
Take measures such as replacing the module with one having a sufficient current rating.

A-4
[Installation Precautions]
CAUTION
Use the programmable controller in an environment that meets the general specifications in the
QCPU User's Manual (Hardware Design, Maintenance and Inspection).
Failure to do so may result in electric shock, fire, malfunction, or damage to or deterioration of the
product.
To mount the module, while pressing the module mounting lever located in the lower part of the
module, fully insert the module fixing projection(s) into the hole(s) in the base unit and press the
module until it snaps into place.
Incorrect mounting may cause malfunction, failure or drop of the module.
When using the programmable controller in an environment of frequent vibrations, fix the module
with a screw.
Tighten the screw within the specified torque range.
Undertightening can cause drop of the screw, short circuit or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.
When using an extension cable, connect it to the extension cable connector of the base unit securely.
Check the connection for looseness.
Poor contact may cause incorrect input or output.
When using a memory card, fully insert it into the memory card slot.
Check that it is inserted completely.
Poor contact may cause malfunction.
Shut off the external power supply for the system in all phases before mounting or removing the
module. Failure to do so may result in damage to the product.
A module can be replaced online (while power is on) on any MELSECNET/H remote I/O station or in
the system where a CPU module supporting the online module change function is used.
Note that there are restrictions on the modules that can be replaced online, and each module has its
predetermined replacement procedure.
For details, refer to the relevant sections in the QCPU User's Manual (Hardware Design,
Maintenance and Inspection) and in the manual for the corresponding module.
Do not directly touch any conductive part of the module.
Doing so can cause malfunction or failure of the module.
When using a Motion CPU module and modules designed for motion control, check that the
combinations of these modules are correct before applying power.
The modules may be damaged if the combination is incorrect.
For details, refer to the user's manual for the Motion CPU module.

A-5
[Wiring Precautions]
DANGER
Shut off the external power supply for the system in all phases before wiring.
Failure to do so may result in electric shock or damage to the product.
After wiring, attach the included terminal cover to the module before turning it on for operation.
Failure to do so may result in electric shock.
CAUTION
Ground the FG and LG terminals to the protective ground conductor dedicated to the programmable
controller.
Failure to do so may result in electric shock or malfunction.
Use applicable solderless terminals and tighten them within the specified torque range. If any spade
solderless terminal is used, it may be disconnected when the terminal screw comes loose, resulting
in failure.
Check the rated voltage and terminal layout before wiring to the module, and connect the cables
correctly.
Connecting a power supply with a different voltage rating or incorrect wiring may cause a fire or
failure.
Connectors for external connection must be crimped or pressed with the tool specified by the
manufacturer, or must be correctly soldered.
Incomplete connections could result in short circuit, fire, or malfunction.
Tighten the terminal screw within the specified torque range.
Undertightening can cause short circuit, fire, or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.
Prevent foreign matter such as dust or wire chips from entering the module.
Such foreign matter can cause a fire, failure, or malfunction.

A-6
[Wiring Precautions]
[Startup and Maintenance Precautions]
DANGER
A protective film is attached to the top of the module to prevent foreign matter, such as wire chips,
from entering the module during wiring.
Do not remove the film during wiring.
Remove it for heat dissipation before system operation.
Mitsubishi programmable controllers must be installed in control panels.
Connect the main power supply to the power supply module in the control panel through a relay
terminal block.
Wiring and replacement of a power supply module must be performed by maintenance personnel
who is familiar with protection against electric shock. (For wiring methods, refer to the QCPU User's
Manual (Hardware Design, Maintenance and Inspection)).
DANGER
Do not touch any terminal while power is on.
Doing so will cause electric shock.
Correctly connect the battery connector.
Do not charge, disassemble, heat, short-circuit, solder, or throw the battery into the fire.
Doing so will cause the battery to produce heat, explode, or ignite, resulting in injury and fire.
Shut off the external power supply for the system in all phases before cleaning the module or
retightening the terminal screws or module fixing screws.
Failure to do so may result in electric shock.
Undertightening the terminal screws can cause short circuit or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.

A-7
[Startup and Maintenance Precautions]
CAUTION
Before performing online operations (especially, program modification, forced output, and operation
status change) for the running CPU module from the peripheral connected, read relevant manuals
carefully and ensure the safety.
Improper operation may damage machines or cause accidents.
Do not disassemble or modify the modules.
Doing so may cause failure, malfunction, injury, or a fire.
Use any radio communication device such as a cellular phone or PHS (Personal Handy-phone
System) more than 25cm (9.85 inches) away in all directions from the programmable controller.
Failure to do so may cause malfunction.
Shut off the external power supply for the system in all phases before mounting or removing the
module. Failure to do so may cause the module to fail or malfunction.
A module can be replaced online (while power is on) on any MELSECNET/H remote I/O station or in
the system where a CPU module supporting the online module change function is used.
Note that there are restrictions on the modules that can be replaced online, and each module has its
predetermined replacement procedure.
For details, refer to the relevant sections in the QCPU User's Manual (Hardware Design,
Maintenance and Inspection) and in the manual for the corresponding module.
After the first use of the product, do not mount/remove the module to/from the base unit, and the
terminal block to/from the module more than 50 times (IEC 61131-2 compliant) respectively.
Exceeding the limit of 50 times may cause malfunction.
Do not drop or apply shock to the battery to be installed in the module.
Doing so may damage the battery, causing the battery fluid to leak inside the battery.
If the battery is dropped or any shock is applied to it, dispose of it without using.
Before handling the module, touch a grounded metal object to discharge the static electricity from
the human body.
Failure to do so may cause the module to fail or malfunction.

A-8
[Disposal Precautions]
[Transportation Precautions]
CAUTION
When disposing of this product, treat it as industrial waste.
When disposing of batteries, separate them from other wastes according to the local regulations.
(For details of the Battery Directive in EU countries, refer to the QCPU User's Manual (Hardware
Design, Maintenance and Inspection).)
CAUTION
When transporting lithium batteries, follow the transportation regulations.
(For details of the regulated models, refer to the QCPU User's Manual (Hardware Design,
Maintenance and Inspection).)

A-9
REVISIONS
*The manual number is given on the bottom left of the back cover.
Japanese manual version SH-080802-A
2008 MITSUBISHI ELECTRIC CORPORATION
Print date Manual number Revision
Dec., 2008 SH(NA)-080807ENG-A First edition
This manual confers no industrial property rights or any rights of any other kind, nor does it confer any patent licenses. Mit-
subishi Electric Corporation cannot be held responsible for any problems involving industrial property rights which may occur
as a result of using the contents noted in this manual.
C

A-10
Memo

A-11
INTRODUCTION
This manual describes the memory maps, functions, programs, I/O number assignment, and devices of the Universal model
QCPU.
Before using this product, please read this manual and the relevant manuals carefully and develop familiarity with the
functions and performance of the Q series programmable controller to handle the product correctly.
Relevant CPU module
Remark
This manual does not describe the specifications of the power supply modules, base units, extension cables, memory
cards, and batteries.
For details of the specifications, refer to the following.
QCPU User's Manual (Hardware Design, Maintenance and Inspection)
For multiple CPU systems, refer to the following.
QCPU User's Manual (Multiple CPU System)
CPU module Model
Universal model QCPU
Q00UJCPU, Q00UCPU, Q01UCPU, Q02UCPU, Q03UD(E)CPU,
Q04UD(E)HCPU, Q06UD(E)HCPU, Q10UD(E)HCPU,
Q13UD(E)HCPU, Q20UD(E)HCPU, Q26UD(E)HCPU

CONTENTS
A-12
CONTENTS
SAFETY PRECAUTIONS......................................................................................................................A - 1
REVISIONS ........................................................................................................................................... A - 9
INTRODUCTION ...................................................................................................................................A - 11
MANUALS .............................................................................................................................................A - 18
MANUAL PAGE ORGANIZATION.........................................................................................................A - 20
GENERIC TERMS AND ABBREVIATIONS ..........................................................................................A - 21
CHAPTER1 OVERVIEW 1-1 to 1-14
1.1 Processing Order in the CPU Module....................................................................................1 - 1
1.2 Storing and Executing Programs ........................................................................................... 1 - 2
1.3 Structured Programming ........................................................................................................ 1 - 3
1.4 Devices and Instructions Useful for Programming................................................................. 1 - 6
1.5 Features................................................................................................................................. 1 - 11
1.6 Checking Serial Number and Function Version ..................................................................... 1 - 13
CHAPTER2 SEQUENCE PROGRAMS 2-1 to 2-43
2.1 Sequence Program Overview ................................................................................................ 2 - 1
2.2 Sequence Program Configuration.......................................................................................... 2 - 3
2.2.1 Main routine program ........................................................................................................2 - 4
2.2.2 Subroutine program ..........................................................................................................2 - 5
2.2.3 Interrupt program ..............................................................................................................2 - 6
2.3 Settings When Program is Divided ........................................................................................2 - 13
2.3.1 Initial execution type program ...........................................................................................2 - 17
2.3.2 Scan execution type program ...........................................................................................2 - 20
2.3.3 Stand-by type program......................................................................................................2 - 21
2.3.4 Fixed scan execution type program ..................................................................................2 - 26
2.3.5 Changing the program execution type ..............................................................................2 - 30
2.4 Data Used in Sequence Programs ........................................................................................2 - 32
2.4.1 BIN (Binary Code) .............................................................................................................2 - 35
2.4.2 HEX (Hexadecimal)...........................................................................................................2 - 37
2.4.3 BCD (Binary-coded Decimal) ............................................................................................2 - 38
2.4.4 Real number (Floating-point data).....................................................................................2 - 39
2.4.5 Character string data.........................................................................................................2 - 43
CHAPTER3 CPU MODULE OPERATION 3-1 to 3-14
3.1 Initial Processing.................................................................................................................... 3 - 1
3.2 I/O Refresh (Refresh Processing with Input/Output Modules)............................................... 3 - 2
3.3 Program Operation ................................................................................................................ 3 - 2
3.4 END Processing..................................................................................................................... 3 - 2
3.5 Operation Processing in the RUN,STOP, or PAUSE Status .................................................. 3 - 3
3.6 Operation Processing during Momentary Power Failure ....................................................... 3 - 5
3.7 Data Clear Processing ........................................................................................................... 3 - 6
3.8 I/O Processing and Response Delay.....................................................................................3 - 8

A-13
3.8.1 Refresh mode....................................................................................................................3 - 9
3.8.2 Direct mode.......................................................................................................................3 - 12
CHAPTER4 ASSIGNMENT OF BASE UNIT AND I/O NUMBER 4-1 to 4-17
4.1 Base Unit Assignment............................................................................................................ 4 - 1
4.1.1 Base mode ........................................................................................................................4 - 1
4.1.2 Base unit assignment setting ............................................................................................4 - 2
4.2 I/O Number Assignment......................................................................................................... 4 - 4
4.2.1 Concept of I/O number assignment ..................................................................................4 - 5
4.2.2 Setting I/O numbers ..........................................................................................................4 - 8
4.2.3 I/O number setting example ..............................................................................................4 - 13
4.2.4 Checking I/O numbers ......................................................................................................4 - 17
CHAPTER5 MEMORIES AND FILES USED FOR CPU MODULE 5-1 to 5-38
5.1 Memories Used for CPU Module ........................................................................................... 5 - 1
5.1.1 Memory composition and storable data ............................................................................5 - 1
5.1.2 Program memory ..............................................................................................................5 - 5
5.1.3 Program cache memory....................................................................................................5 - 8
5.1.4 Standard ROM ..................................................................................................................5 - 11
5.1.5 Standard RAM...................................................................................................................5 - 12
5.1.6 Memory card .....................................................................................................................5 - 14
5.1.7 Writing to the Flash card by GX Developer .......................................................................5 - 18
5.1.8 Operating the program in the memory card (boot operation)............................................5 - 23
5.1.9 Details of written files ........................................................................................................5 - 27
5.1.10 Specifying valid parameters (parameter-valid drive setting)..............................................5 - 28
5.2 Program File Structure ........................................................................................................... 5 - 30
5.3 File Operations by GX Developer and Handling Precautions................................................5 - 32
5.3.1 File operations...................................................................................................................5 - 32
5.3.2 Precautions for handling files ............................................................................................5 - 33
5.3.3 File size .............................................................................................................................5 - 34
5.3.4 Units of file sizes ...............................................................................................................5 - 36
CHAPTER6 FUNCTIONS 6-1 to 6-160
6.1 Function List........................................................................................................................... 6 - 1
6.2 Constant Scan ....................................................................................................................... 6 - 4
6.3 Latch Function ....................................................................................................................... 6 - 7
6.4 Output Mode at Operating Status Change (STOP to RUN)...................................................6 - 10
6.5 Clock Function ....................................................................................................................... 6 - 13
6.6 Remote Operation.................................................................................................................. 6 - 17
6.6.1 Remote RUN/STOP ..........................................................................................................6 - 17
6.6.2 Remote PAUSE.................................................................................................................6 - 20
6.6.3 Remote RESET.................................................................................................................6 - 22
6.6.4 Remote latch clear ............................................................................................................6 - 24

A-14
6.6.5 Relationship between remote operation and RUN/STOP status of the CPU module .......6 - 25
6.7 Q Series-compatible Module Input Response Time Selection (I/O Response Time) ............ 6 - 26
6.8 Error Time Output Mode Setting ............................................................................................6 - 28
6.9 H/W Error Time PLC Operation Mode Setting ....................................................................... 6 - 29
6.10 Intelligent Function Module Switch Setting ............................................................................ 6 - 30
6.11 Monitor Function .................................................................................................................... 6 - 32
6.11.1 Monitor condition setting ...................................................................................................6 - 33
6.11.2 Local device monitor/test ..................................................................................................6 - 39
6.11.3 External input/output forced on/off ....................................................................................6 - 42
6.11.4 Executional conditioned device test ..................................................................................6 - 47
6.12 Writing Programs While CPU Module is in RUN Status......................................................... 6 - 58
6.12.1 Online change (ladder mode)............................................................................................6 - 58
6.12.2 Online change (files) .........................................................................................................6 - 61
6.12.3 Precautions for online change...........................................................................................6 - 63
6.13 Execution Time Measurement ............................................................................................... 6 - 69
6.13.1 Program monitor list ..........................................................................................................6 - 69
6.13.2 Interrupt program monitor list ............................................................................................6 - 72
6.13.3 Scan time measurement ...................................................................................................6 - 73
6.14 Sampling Trace Function ....................................................................................................... 6 - 77
6.15 Debug Funct(ion from Multiple GX Developers .....................................................................6 - 91
6.15.1 Simultaneous monitoring from multiple GX Developers function ......................................6 - 91
6.15.2 Write during RUN function from multiple GX Developers..................................................6 - 93
6.16 Watchdog Timer (WDT) ......................................................................................................... 6 - 95
6.17 Self-diagnostic Function......................................................................................................... 6 - 97
6.17.1 LEDs indicating errors.......................................................................................................6 - 104
6.17.2 Error clear .........................................................................................................................6 - 104
6.18 Error History........................................................................................................................... 6 - 105
6.19 System Protection.................................................................................................................. 6 - 106
6.19.1 Password registration........................................................................................................6 - 106
6.19.2 Remote password .............................................................................................................6 - 108
6.20 System Display of CPU Module with GX Developer.............................................................. 6 - 113
6.21 LED Indication........................................................................................................................ 6 - 116
6.21.1 Methods for turning off the LEDs.......................................................................................6 - 116
6.21.2 LED indication priority .......................................................................................................6 - 117
6.22 Interrupt from Intelligent Function Module .............................................................................6 - 119
6.23 Serial Communication Function ............................................................................................. 6 - 120
6.24 Service Processing ................................................................................................................ 6 - 128
6.24.1 Service processing setting ................................................................................................6 - 128
6.25 Initial Device Value................................................................................................................. 6 - 135
6.26 Battery Life-prolonging Function............................................................................................6 - 139
6.27 Memory Check Function ........................................................................................................ 6 - 140
6.28 Latch Data Backup to Standard ROM Function.....................................................................6 - 141
6.29 Writing/Reading Device Data to/from Standard ROM............................................................6 - 146
6.30 CPU Module Change Function with Memory Card ................................................................ 6 - 147
6.30.1 Backup function to memory card.......................................................................................6 - 149
6.30.2 Backup data restoration function.......................................................................................6 - 157

A-15
CHAPTER7 COMMUNICATIONS WITH INTELLIGENT FUNCTION MODULE
7-1 to 7-9
7.1 Communications between CPU Module and Intelligent Function Module ............................. 7 - 1
7.1.1 Initial setting and auto refresh setting by GX Configurator................................................7 - 2
7.1.2 Initial setting by initial device value ...................................................................................7 - 5
7.1.3 Communications with the FROM and TO instructions ......................................................7 - 5
7.1.4 Communications using the intelligent function module device..........................................7 - 6
7.1.5 Communications using the intelligent function module dedicated instruction ...................7 - 8
CHAPTER8 PARAMETERS 8-1 to 8-25
8.1 PLC Parameters .................................................................................................................... 8 - 2
8.2 Network Parameters .............................................................................................................. 8 - 20
8.3 Remote Password.................................................................................................................. 8 - 25
CHAPTER9 DEVICES 9-1 to 9-94
9.1 Device List ............................................................................................................................. 9 - 1
9.2 Internal User Device .............................................................................................................. 9 - 3
9.2.1 Input (X) ............................................................................................................................9 - 6
9.2.2 Output (Y)..........................................................................................................................9 - 8
9.2.3 Internal relay (M) ...............................................................................................................9 - 9
9.2.4 Latch relay (L) ...................................................................................................................9 - 10
9.2.5 Annunciator (F) .................................................................................................................9 - 11
9.2.6 Edge relay (V) ...................................................................................................................9 - 15
9.2.7 Link relay (B) .....................................................................................................................9 - 16
9.2.8 Link special relay (SB) ......................................................................................................9 - 18
9.2.9 Step relay (S) ....................................................................................................................9 - 19
9.2.10 Timer (T)............................................................................................................................9 - 20
9.2.11 Counter (C) .......................................................................................................................9 - 27
9.2.12 Data register (D)................................................................................................................9 - 31
9.2.13 Link register (W)................................................................................................................9 - 32
9.2.14 Link special register (SW) .................................................................................................9 - 34
9.3 Internal System Devices ........................................................................................................ 9 - 35
9.3.1 Function devices (FX, FY, FD) ..........................................................................................9 - 35
9.3.2 Special relay (SM) .............................................................................................................9 - 38
9.3.3 Special register (SD) .........................................................................................................9 - 39
9.4 Link Direct Device (J\)............................................................................................................ 9 - 40
9.5 Module Access Devices......................................................................................................... 9 - 43
9.5.1 Intelligent function module device (U\G) ...........................................................................9 - 43
9.5.2 Cyclic transmission area device (U3En\G)........................................................................9 - 45
9.6 Index Register (Z)/Standard Device Resister (Z)...................................................................9 - 46
9.6.1 Index register (Z)...............................................................................................................9 - 46
9.6.2 Standard device register (Z)..............................................................................................9 - 48

A-16
9.6.3 Switching from the scan execution type program to the interrupt/fixed scan execution
type program....................................................................................................9 - 49
9.7 File Register (R)..................................................................................................................... 9 - 53
9.7.1 File register data storage location .....................................................................................9 - 54
9.7.2 File register size ................................................................................................................9 - 54
9.7.3 Differences in available accesses by storage memory .....................................................9 - 55
9.7.4 Registration procedure for the file register ........................................................................9 - 56
9.7.5 Specification methods of the file register...........................................................................9 - 61
9.7.6 Precautions for using the file register................................................................................9 - 62
9.8 Extended Data Register (D) and Extended Link Register (W)...............................................9 - 64
9.9 Nesting (N)............................................................................................................................ 9 - 70
9.10 Pointer (P).............................................................................................................................. 9 - 71
9.10.1 Local pointer.....................................................................................................................9 - 72
9.10.2 Common pointer................................................................................................................9 - 74
9.11 Interrupt Pointer(I).................................................................................................................. 9 - 76
9.11.1 List of interrupt pointer numbers and interrupt factors ......................................................9 - 77
9.12 Other Devices ........................................................................................................................ 9 - 78
9.12.1 SFC block device (BL) ......................................................................................................9 - 78
9.12.2 Network No. specification device (J) .................................................................................9 - 78
9.12.3 I/O No. specification device (U).........................................................................................9 - 79
9.12.4 Macro instruction argument device (VD)...........................................................................9 - 80
9.13 Constants............................................................................................................................... 9 - 81
9.13.1 Decimal constant (K).........................................................................................................9 - 81
9.13.2 Hexadecimal constant (H).................................................................................................9 - 81
9.13.3 Real number (E)................................................................................................................9 - 82
9.13.4 Character string (" ")..........................................................................................................9 - 83
9.14 Convenient Usage of Devices................................................................................................ 9 - 84
9.14.1 Global device ....................................................................................................................9 - 84
9.14.2 Local device ......................................................................................................................9 - 85
CHAPTER10 CPU MODULE PROCESSING TIME 10-1 to 10-17
10.1 Scan Time.............................................................................................................................. 10 - 1
10.1.1 Scan time structure ...........................................................................................................10 - 1
10.1.2 Time required for each processing included in scan time .................................................10 - 2
10.1.3 Factors that increase the scan time ..................................................................................10 - 11
CHAPTER11 PROCEDURES FOR WRITING PROGRAM TO CPU MODULE11-1 to 11-10
11.1 Items to be Considered for Creating Programs ..................................................................... 11 - 1
11.2 Hardware Check .................................................................................................................... 11 - 3
11.3 Procedure for Writing One Program ...................................................................................... 11 - 5
11.4 Procedure for Writing Multiple Programs ............................................................................... 11 - 7
11.5 Procedure for Boot Operation................................................................................................11 - 10

A-17
CHAPTER12 SPECIAL RELAY LIST AND SPECIAL REGISTER LIST 12-1 to 12-78
12.1 SPECIAL RELAY LIST........................................................................................................... 12 - 1
12.2 SPECIAL REGISTER LIST....................................................................................................12 - 27
APPENDICES App-1 to App-69
Appendix 1 List of Parameter Numbers ......................................................................................... App- 1
Appendix 2 Functions Added or Changed by Version Upgrade.....................................................App- 6
Appendix 3 Method of Replacing Basic Model QCPU or High Performance Model QCPU with
Universal Model QCPU...............................................................................................App- 8
Appendix 3.1 Precautions for Replacement.......................................................................App- 8
Appendix 3.1.1 Replacing Basic model QCPU with Universal model QCPU .......................App- 8
Appendix 3.1.2 Replacing High Performance model QCPU with Universal model QCPU ...... App- 12
Appendix 3.2 Applicable devices and software ..................................................................App- 19
Appendix 3.3 Instructions ..............................................................................................App- 23
Appendix 3.3.1 Instructions not supported in the Universal model QCPU and replacing
methods ...................................................................................................App- 23
Appendix 3.3.2 Replacing programs using multiple CPU transmission dedicated instructions
......................................................................................................App- 25
Appendix 3.3.3 Program replacement examples ...........................................................App- 26
Appendix 3.4 Functions.................................................................................................App- 40
Appendix 3.4.1 Floating-point operation instructions ......................................................App- 40
Appendix 3.4.2 Error check processing for floating-point data comparison instructions .........App- 48
Appendix 3.4.3 Device latch function ..........................................................................App- 52
Appendix 3.4.4 File usability setting............................................................................ App- 54
Appendix 3.4.5 Parameter-valid drive and boot file setting ..............................................App- 57
Appendix 3.4.6 External input/output forced on/off function .............................................App- 60
Appendix 3.5 Special Relay and Special Register...............................................................App- 64
Appendix 3.5.1 Special relay list ................................................................................App- 64
Appendix 3.5.2 Special register list.............................................................................App- 67
Appendix 4 Device Point Assignment Sheet.................................................................................. App- 69
INDEX Index-1 to Index-4