MSI Wind Board 330 User manual

i
Wind Board330
MS-7314 (v2.X) Mainboard
G52-73141X6
www.devicemanuals.eu

ii
CopyrightNotice
Thematerialin thisdocumentisthe intellectualpropertyof MICRO-STAR
INTERNATIONAL.Wetakeeverycareinthepreparation ofthisdocument, butno
guarantee isgiven astothecorrectnessof itscontents.Ourproductsareunder
continualimprovementand we reservetheright tomakechangeswithout notice.
Trademarks
Alltrademarksarethe propertiesoftheirrespectiveowners.
NVIDIA, the NVIDIAlogo,DualNet, and nForceareregisteredtrademarksortrade-
marks ofNVIDIACorporationintheUnitedStatesand/orothercountries.
AMD,Athlon ,Athlon XP,Thoroughbred ,andDuron areregisteredtrade-
marks ofAMDCorporation.
Intel®and Pentium®areregisteredtrademarks of IntelCorporation.
PS/2and OS®/2areregisteredtrademarks ofInternationalBusiness Machines
Corporation.
Windows®NT/XP/Vistaareregisteredtrademarks ofMicrosoftCorporation.
Netware® isaregisteredtrademarkof Novell, Inc.
Award®isaregisteredtrademarkof PhoenixTechnologiesLtd.
AMI®isaregistered trademark ofAmericanMegatrendsInc.
Revision History
Revision RevisionHistory Date
V2.0 FirstreleaseforPCB2.X October2008
TechnicalSupport
If aproblemariseswithyoursystemand nosolution canbeobtainedfromtheuser’s
manual,pleasecontactyourplaceofpurchaseorlocaldistributor. Alternatively,
pleasetrythe followinghelpresourcesforfurtherguidance.
VisittheMSIwebsiteforFAQ, technicalguide, BIOSupdates, driverupdates,
andotherinformation: http://global.msi.com.tw/index.php?
func=service
Contactourtechnicalstaff at: http://ocss.msi.com.tw
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iii
SafetyInstructions
CAUTION: Dangerofexplosionifbattery isincorrectlyreplaced.
Replaceonlywiththesameorequivalenttyperecommendedbythe
manufacturer.
1. Alwaysreadthe safetyinstructionscarefully.
2. KeepthisUser’sManualforfuturereference.
3. Keep thisequipmentawayfromhumidity.
4. Laythisequipmenton areliableflatsurfacebeforesettingitup.
5. Theopeningsontheenclosureareforairconvectionhenceprotectstheequip-
mentfromoverheating.DONOTCOVERTHEOPENINGS.
6. Makesurethevoltage ofthepowersourceandadjustproperly110/220Vbe-
foreconnecting theequipmenttothepowerinlet.
7. Placethepowercordsuchawaythatpeoplecannotstep on it.Donotplace
anythingoverthe powercord.
8. AlwaysUnplugthePowerCordbeforeinserting anyadd-oncardormodule.
9. Allcautionsandwarningson the equipment should benoted.
10.Neverpouranyliquidintothe openingthatcoulddamageorcauseelectrical
shock.
11. Ifanyofthefollowingsituationsarises,get theequipmentchecked byservice
personnel:
†Thepowercordorplug isdamaged.
†Liquidhaspenetrated intotheequipment.
†Theequipment hasbeen exposedtomoisture.
†Theequipmentdoesnotworkwelloryou cannotgetit workaccordingto
User’sManual.
†Theequipmenthasdroppedand damaged.
†Theequipment hasobvioussign of breakage.
12.DONOTLEAVETHISEQUIPMENTINANENVIRONMENTUNCONDITIONED,STOR-
AGETEMPERATUREABOVE600 C(1400F), ITMAYDAMAGETHEEQUIPMENT.
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iv
FCC-BRadioFrequencyInterferenceStatement
Thisequipmenthasbeen
testedandfoundtocomply
withthe limitsforaClass B
digitaldevice,pursuanttoPart
15oftheFCCRules.Theselimitsaredesignedtoprovidereasonableprotection
againstharmfulinterferenceinaresidentialinstallation. Thisequipmentgenerates,
usesandcanradiateradio frequency energyand, ifnot installedand usedin accor-
dancewiththeinstructions,maycauseharmful interferencetoradio communications.
However,thereisnoguaranteethatinterferencewill notoccurinaparticular
installation.Ifthisequipmentdoescauseharmful interferencetoradio ortelevision
reception, whichcanbedeterminedbyturning theequipmentoff and on, theuseris
encouraged totrytocorrect theinterferencebyoneormoreofthe measureslisted
below. †Reorientorrelocatethereceivingantenna.
†Increasetheseparation between theequipmentandreceiver.
†Connectthe equipmentintoan outletonacircuitdifferentfromthat to
whichthereceiverisconnected.
†Consult thedealeroranexperiencedradio/televisiontechnician forhelp.
Notice1
Thechangesormodificationsnotexpresslyapprovedbythe partyresponsible for
compliancecouldvoidtheuser’sauthoritytooperatetheequipment.
Notice2
ShieldedinterfacecablesandA.C.powercord,if any,must beused in orderto
complywiththeemissionlimits.
VOIRLANOTICED’ INSTALLATIONAVANTDERACCORDERAURESEAU.
Micro-StarInternational
MS-7314
ThisdevicecomplieswithPart15oftheFCCRules.Operationissubject tothe
followingtwo conditions:
(1)thisdevicemaynotcauseharmfulinterference,and
(2)thisdevicemustacceptanyinterferencereceived,includinginterferencethat
maycauseundesiredoperation.
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v
WEEE (WasteElectricaland ElectronicEquipment) Statement
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vi
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vii
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viii
CONTENTS
CopyrightNotice....................................................................................................ii
Trademarks............................................................................................................ii
Revision History....................................................................................................ii
TechnicalSupport.................................................................................................ii
SafetyInstructions................................................................................................iii
FCC-BRadioFrequency InterferenceStatement...................................................iv
WEEE (WasteElectricaland ElectronicEquipment)Statement................................v
Chapter 1.Getting Started.............................................................................1-1
MainboardSpecifications.............................................................................1-2
MainboardLayout........................................................................................1-4
PackingChecklist.........................................................................................1-5
Chapter2.HardwareSetup............................................................................2-1
QuickComponentsGuide.............................................................................2-2
Memory.......................................................................................................2-3
PowerSupply..............................................................................................2-6
BackPanel...................................................................................................2-9
Connectors................................................................................................2-11
Jumper......................................................................................................2-16
Slot............................................................................................................2-17
Chapter3BIOSSetup......................................................................................3-1
EnteringSetup.............................................................................................3-2
TheMainMenu.............................................................................................3-4
StandardCMOSFeatures............................................................................3-6
AdvancedBIOSFeatures............................................................................3-8
IntegratedPeripherals................................................................................3-11
PowerManagementSetup.........................................................................3-13
H/WMonitor...............................................................................................3-16
BIOSSettingPassword..............................................................................3-17
CellMenu...................................................................................................3-18
LoadFail-Safe/ OptimizedDefaults............................................................3-21
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1-1
GettingStarted
Getting Started
Chapter1
ThankyouforchoosingtheWind Board330(MS-7314
v2.X)Mini-ITXmainboard.TheWind Board330isbased
onIntel brandnew AtomCPUand945GC+ICH7
chipsetsforoptimalsystemefficiency.TheWindBoard
330 delivers ahigh performanceand professionaldesk-
topplatform solution.
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MS-7314Mainboard
1-2
Mainboard Specifications
ProcessorSupport
-Intel ATomCPU330
SupportedFSB
-533MHz
Chipset
-NorthBridge:Intel 945GCchipset
-SouthBridge:Intel ICH7chipset
Memory Support
-DDR2533 SDRAM(2GBMax)
-1DDR2DIMM(240pin/ 1.8V),singlechannel
(Formoreinformationoncompatiblecomponents, pleasevisit
http://global.msi.com.tw/index.php?func=testreport)
LAN
-SupportsRealtek RTL8101E10/100 Mb/s
-SupportsACPI PowerManagement
Audio
-ChipintegratedbyRealtek ALC888,supports5.1-channelaudio-
out
-Supportsvistapremiumcompliance
IDE
-1IDEportbyIntel ICH7
-SupportsUltraDMA66/100mode
-SupportsPIO, BusMasteroperationmode
SATA
-2SATAII portsbyICH7
-Supports2SATAIIdevices
-Supportsstorageand datatransfersatupto3Gb/s
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1-3
GettingStarted
Connectors
Back panel
-1PS/2mouseport
-1PS/2keyboardport
-1serialport(COM1)
-1VGAport
-1parallelportsupportingSPP/EPP/ECPmode
-4USB 2.0Ports
-1RJ-45LANjack
-3flexibleaudiojacks
On-BoardPinheaders/Connectors
-2USB 2.0pinheaders
-1FrontPanelAudiopinheader
-1Chassisintrusionpinheader
-1Speakerpinheader
Slots
-1PCIslot
-Support3.3V/ 5VPCI busInterface
FormFactor
-Mini-ITX(17.0cmX17.0cm)
Mounting
-4mountingholes
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MS-7314Mainboard
1-4
WindBoard 330
(MS-7314v2.X)Mini-ITXMainboard
MainboardLayout
PCI1
JAUD1
ALC888
RTL8101E
Intel
ICH7
I
D
E
1
A
T
X
1
D
I
M
M
1
J
F
P
1
SYS_FAN1
SYS_FAN2
JUSB2
JUSB1
JBAT1
S
A
T
A
1
JBR1
SATA
2
JCI1
JPW1
Top:LAN jack
Bottom:USB ports
USB ports
Top : mouse
Bottom:keyboard
Top:
Parallel Port
Bottom:
COMport
VGAport
T:
M:
B:
Line-In
Line-Out
Mic
Intel
945GC
Intel
Atom330
SIO
BATT
+
Clock
Gen
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1-5
GettingStarted
Packing Checklist
*Thepicturesareforreferenceonlyand mayvary fromthepackingcontentsof the
product youpurchased.
PowerCable
User’sGuide
MSImotherboard MSIDriver/UtilityCD
IDECable
BackIOShield
SATACable
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2-1
HardwareSetup
HardwareSetup
Chapter2
Thischapterprovidesyouwiththeinformationabout
hardwaresetup procedures.Whiledoing theinstallation,
becarefulinholdingthe componentsandfollowthe
installationprocedures.Forsomecomponents, if you
install inthewrong orientation,thecomponentswill not
workproperly.
Useagrounded wriststrapbeforehandlingcomputer
components.Staticelectricitymaydamagethe
components.
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MS-7314Mainboard
2-2
Quick ComponentsGuide
DDR2DIMMs, p.2-3
ATX1, p.2-6
SATA, p.2-12
JUSB1~2,
p.2-15
JAUD1,
p.2-13
PCI,
p.2-17
BackPanel,
p.2-9
JPW1, p.2-6
IDE1, p.2-11
JBAT1,
p.2-16
JFP1, p.2-14
JCI1,p.2-14
SYS_FAN1, p.2-13 SYS_FAN2, p.2-13
JBR1, p.2-12
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2-3
HardwareSetup
Memory
TheDIMM slot isusedforinstalling memorymodule.
Formoreinformationoncompatiblecomponents,pleasevisit http://global.msi.com.
tw/index.php?func=testreport
DDR2
240-pin,1.8V
64x2=128 pin56x2=112 pin
Installing MemoryModules
1.Thememory modulehasonlyone notchonthecenterandwill onlyfit intheright
orientation.
2.Insert thememorymoduleverticallyintotheDIMMslot.Thenpushit in until the
goldenfingeronthememory moduleisdeeplyinsertedintheDIMMslot. Theplastic
clipateachsideoftheDIMM slot will automaticallyclosewhenthememory module
isproperlyseated.
3.Manuallycheck if the memory modulehasbeenlockedin placebytheDIMM slot
clipsat the sides.
Important
Youcanbarelysee the golden fingerifthememory moduleisproperlyinserted
in theDIMMslot.
Volt Notch
Important
-DDR2memorymoduleisnotinterchangeablewithDDRandtheDDR2stan-
dardisnotbackwardscompatible.YoushouldalwaysinstallDDR2memory
module intheDDR2DIMMslot.
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MS-7314Mainboard
2-4
CompatibleDDR2 533 memorylist
Pleaserefertothefollowinglist tofindtheavailableDDR2memorymodules.
Important
1.Formoreinformation oncompatible components,pleasevisithttp://global.
msi.com.tw/index.php?func=testreport.
2.Due tothe CPUlimitation, theinstalled 667 MHzmemorywillbedroppedto
533MHzforsystemstability.
Vendor Model Size
HYNIX HYMP532U646-C4(HYNIXHY5PS121621F-C4) 256MB
Kingston KVR533D2N4/256 (ELPIDA) 256MB
SAMSUNG M378T3253FG0-CD5DS(SAMSUNGK4T56083F-GCD5) 256MB
SAMSUNG M378T3253FG0-CD5(SAMSUNGK4T56083QF-GCD5) 256MB
AENEON AET660UD00-370B97X(AENEONAET93R370B) 512MB
Kingmax KLBC28F-A8KB4[EGES] (KingmaxKKEA88B4IAUG-37DA) 512MB
Micron MT4HTF6464AY-53EE1(Micron D9HNV) 512MB
AENEON AET760UD00-370B97X(AENEONAET93R370B) 1GB
Kingston KVR533D2N4/1G(HynixHY5PS12821CFP-Y5) 1GB
Micron MT8HTF12864AY-53EE1(Micron D9HNH) 1GB
TakeMS TMS1GB264C081-534AP(TakeMSMS18T51280-3.7) 1GB
KINGSTON KVR533D2N4/2G(ELPIDAE1108AB-6E-E) 2GB
CompatibleDDR2 667 memorylist
Pleaserefertothefollowinglist tofindtheavailableDDR2memorymodules.
Vendor Model Size
Micron MT4HTF3264AY-667D3(MICROND9GMG) 256MB
SAMSUNG M378T3253FZ3-CE6(SAMSUNG K4T56083QF-ZCE6) 256MB
AENEON AET660UD00-30DB97X(AENEONAET93R30DB) 512MB
Apacer 78.91G92.9K5(ApacerAM4B5708JQJS7E) 512MB
Geil GX21GB5300LDC ( 殼)512MB
HYNIX HYMP564U64CP8-Y5(HYNIXHY5PS12821CFP-Y5) 512MB
KINGMAX KLCC28F-A8KB5[FGES] (KINGMAXKKEA88B4LAUG-29DX) 512MB
KINGMAX KLCC28F-A8KI5[EGES] (KINGMAXKKA8FEIBF-HJK-30A) 512MB
Micron MT4HTF6464AY-667E1(Micron D9HNZ) 512MB
OCZ OCZ2667512 (OCZX42P120840G-3) 512MB
ProMOS V916764K24QBFW-F5(ProMOSV59C1512804QBF3) 512MB
PSC AL6E8E63B-6EA1T(PSCA3R12E3GEF-G6EA) 512MB
Qimonda HYS64T6400EU-3S-B2(QimondaHYB18T512800B2F3S) 512MB
SAMSUNG M378T6553CZ3-CE6(SAMSUNG K4T51083QC-ZCE6) 512MB
ADATA ADQPE1A08(AdataAD20908A8A-3EC) 1GB
AENEON AET760UD00-30DB97X(AENEONAET93R30DB) 1GB
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2-5
HardwareSetup
Vendor Model Size
Apacer 78.01G9O.9K5(ApacerAM4B5808CQJS7E) 1GB
Bufaullo D2U667C-1GMDJ(Micron D9GNH) 1GB
CORSAIR VALUESELECT VS1GB667D2(CORSAIR64M8CFEG) 1GB
Crucial BL12864AA663.16FD4( 殼
)
1GB
Geil GX22GB5300LDC ( 殼
)
1GB
GOODRAM GR667D264L5/1G(GoodramGE5108GC-JN) 1GB
HYNIX HYMP112U64CP8-Y5(HYNIXHY5PS1G831CFP-Y5) 1GB
HYNIX HYMP512U64CP8-Y5(HYNIXHY5PA12821CFP-Y5) 1GB
KINGBOX UP1GD2667PS (KINGBOXULD264082200P-4) 1GB
KINGMAXKLCD48F-A8KB5[FHES] (KINGMAXKKEA88B4LAUG-29DX) 1GB
KINGMAX KLCD48F-A8KI5[EHES] (KINGMAXKKA8FEIBF-HJK-30A) 1GB
KINGSTON
KVR667D2N5/1G(HYNIXHY5PS12821CFP-Y5)
1GB
KINGSTON KVR667D2N5/1G(Elpida E5108AJBG-8E-E) 1GB
Micron MT8HTF12864AY-667E1(MICROND9HNL) 1GB
NANYA NT1GT64U88B0JY-3C(NANYA NT5TU128M8BJ-3C) 1GB
OCI 04701G16CX5S1G(Infinity64M8PC5300) 1GB
OCZ OCZ26671024 (AutoRun DDRII800)(OCZ X42P120840A-3) 1GB
ProMOS
V916765K24QBFW-F5(ProMOSV59C1512804QBF3)
1GB
PSC AL7E8E63B-6EA1T (PSCA3R12E3GEF-G6EA) 1GB
Qimonda HYS64T128020EU-3S-B2(Qimonda HYB18T512800B2F3S) 1GB
SAMSUNG M378T2863DZS-CE6(SAMSUNGK4T1G084QD-ZCE6) 1GB
SAMSUNG M378T2863QZS-CE6(SAMSUNGK4T1G084QQ-HCE6) 1GB
SAMSUNG M378T2953CZ3-CE6(SAMSUNGK4T51083QC-ZCE6) 1GB
Supertalent T667UB1GC(SAMSUNGK4T51083QE-ZCE6) 1GB
TakeMS
TMS1GB264C081-665QI (TakeMSMS18T51280-3)
1GB
UMAX D46701GP3-63BJU(UMAX U2S12D30TP-6E) 1GB
ADATA ADQPE1B16 (AdataAD20908A8A-3EC) 2GB
AENEON AET860UD00-30DB08X(AENEONAET03F30DB) 2GB
Apacer 78.A1G9O.9K4(ApacerAM4B5808CQJS7E) 2GB
Buffalo
Select D2U667C-2GMEJ(Micron D9HNL) 2GB
CORSAIR VALUESELECTVS2GB667D2(MicroD9HNL) 2GB
Crucial
CT25664AA667.16FA(Micron D9FTB)
2GB
GOODRAM GR667D264L5/2G(Elpida E1108ACBG-6E-E) 2GB
HYNIX HYMP125U64CP8-Y5(HYNIXHY5PS1G831CFP-Y5) 2GB
Kingston KVR667D2N5/2G(Elpida E1108ACBG-6E-E) 2GB
Micron (Micron D9HNL) 2GB
NANYA NT2GT64U8HB0JY-3C(NANYA NT5TU128M8BJ-3C) 2GB
Qimonda HYS64T256020EU-3S-B (Qimonda HYB18T1G800BF-3S) 2GB
Qimonda
HYS64T256020EU-3S-C2(Qimonda HYB18T1G800C2F-3S)
2GB
SAMSUNG M378T5663QZ3-CE6(SAMSUNGK4T1G084QQ-HCE6) 2GB
Supertalent T667UB2G/S(SAMSUNGK4T1G084QD-ZCE6) 2GB
TakeMS TMS2GB264D081-665UY(ELPIDAE1108AB-6E-E) 2GB
UMAX D46702GP0-73BCU(UMAX U2S24D30TP-6E) 2GB
Hynix HYMP564U72CP8-Y5(HynixHY5PS12821CFP-Y5)ECC 512MB
Hynix HYMP512U72CP8-Y5(HynixHY5PS12821CFP-Y5)ECC 1GB
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MS-7314Mainboard
2-6
Power Supply
ATX20-Pin Power Connector:ATX1
Thisconnectorallowsyoutoconnect toanATXpowersupply.Toconnect totheATX
powersupply,makesurethe plugofthe powersupplyisinserted in the proper
orientationand thepinsarealigned.Then pushdownthepowersupplyfirmlyintothe
connector.
ATX4-pinPower Connector:JPW1
Thispowerconnectorisusedtoprovidepowertothe CPU.
PIN SIGNAL
1GND
2 GND
312V
4 12V
PinDefinition
JPW1
PIN SIGNAL
11 3.3V
12 -12V
13 GND
14 PS_ON
15 GND
16 GND
17 GND
18 -5V
19 5V
20 5V
PIN SIGNAL
1 3.3V
2 3.3V
3GND
45V
5GND
65V
7GND
8PW_OK
9 5V_SB
10 12V
ATX1PinDefinition
ATX1
10
1
20
11
Important
Makesurethat all the connectorsareconnected toproperATXpowersupplies
toensurestable operation ofthemainboard.
13
42
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2-7
HardwareSetup
CompatiblePower Supplylist
Pleaserefertothefollowing list tofindtheavailable powersupplies.
Vendor Model Spec.
Afocus WIN-300XPX-X 20+4pin;300W
ANTEC TP3-550 20+4pin;550W
Coolermaster RS-430-PCAP 20+4pin,430W
Coolermaster R7133C-400-C 20+4pin,300W
CWT KMG-4000LPPC 20+4pin;400W
FSP AX500-A 20+4pin;500W
Goldenfield 霸ATX-S650 20+4pin;650W
GreatWall BTX-500SP 20+4pin;500W
Hechuan 金剛戰神ST-ATX340 20+4pin;340W
Hechuan 皇家騎士ST-ATX340 20+4pin;400W
HUNTKEY 多核
DH6
20+4pin;400W
Hunkey HK560-11PEP 20+4pin;560W
Huntkey 磐石500 20+4pin;500W
Huntkey HK500-52SP 20+4pin;500W
NESO TA400F-AT80 20+4pin;350W
R-Senda SD-550WS 20+4pin;550W
R-senda
SD-JL580S
20+4pin;500W
R-senda SD-JL680S 20+4pin;600W
R-senda SD-760EPS 20+4pin;760W
Segotep SG-530PQB 20+4pin;300W
Seventeam
ST-420BKP-02F
20+4pin;420W
Seventeam
ST-550EAG-05F
20+4pin;550W
Seventeam
ST-580PAF-05F
20+4pin;580W
Seventeam
ST-620PAF-05F
20+4pin;620W
Seventeam
ST-450PAF-05F
20+4pin;450W
Seventeam
ST-1000E-AD
20+4pin;1000W
世紀之星
ST-ATX330
20+4pin;500W
Thermaltake
BTX-450
20+4pin;450W
Thermaltake
PurePower460W
20+4pin;460W
Thermaltake
XP550 PP
20+4pin;550W
Thermaltake
PurePowe-680APD
20+4pin;680W
Thermaltake
KK 400
20+4pin,400W
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