MTX M2M MTX-DIN Series User manual

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MTX M2M® by MATRIX ELECTRONICA S.L.U
MTX-DIN Family
User Manual

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MTX M2M® by MATRIX ELECTRONICA S.L.U
General Notes
Product is deemed accepted by recipient and is provided without interface to recipient’s products. The documentation
and/or product are provided for testing, evaluation, integration and information purposes. The documentation and/or
product are provided on an “as is” basis only and may contain deficiencies or inadequacies. The documentation and/or
product are provided without warranty of any kind, express or implied. To the maximum extent permitted by applicable
law, Matrix Electronica S.L.U. further disclaims all warranties; including without limitation any implied warranties of
merchantability, completeness, fitness for a particular purpose and non-infringement of third-party rights. The entire risk
arising out of the use or performance of the product and documentation remains with recipient. This product is not
intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be
expected to result in personal injury. Applications incorporating the described product must be designed to be in
accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required
procedures can result in malfunctions or serious discrepancies in results.
Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also
apply to cellular phones, must be followed. Matrix Electronica S.L.U. or its suppliers shall, regardless of any legal theory
upon which the claim is based, not be liable for any consequential, incidental, direct, indirect, punitive or other damages
whatever (including, without limitation, damages for loss of business profits, business interruption, loss of business
information or data, or other pecuniary loss) arising out the use of or inability to use the documentation and/or product,
even if Matrix Electronica S.L.U. has been advised of the possibility of such damages. The foregoing limitations of liability
shall not apply in case of mandatory liability, e.g. under the Spanish Product Liability Act, in case of intent, gross negligence,
injury of life, body or health, or breach of a condition which goes to the root of the contract. However, claims for damages
arising from a breach of a condition, which goes to the root of the contract, shall be limited to the foreseeable damage,
which is intrinsic to the contract, unless caused by intent or gross negligence or based on liability for injury of life, body or
health. The above provision does not imply a change on the burden of proof to the detriment of the recipient. Subject to
change without notice at any time. The interpretation of this general note shall be governed and construed according to
Spanish law without reference to any other substantive law.
Important information
This technical description contains important information for the start up and use of the MTX-DIN
modems.
Read it carefully before you start working with the MTX-DIN modems.
The warranty will be void should damage occur due to non-compliance with these instructions for
use.
We cannot accept any responsibility for consequential loss.
Service and Support
To contact customer support please use the contact details below:
Matrix Electrónica
Alejandro Sánchez, 109
28019 Madrid (SPAIN)
[email protected]
Information about MTX-DIN-2G product and accessories is available on the following web site:
www.mtxm2m.com
Or contact your local distributor / sales agent.

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Revision information
Revision
Date
Author
Changes
1.0
2009/10
JS
First edition
1.2
2010/07
JS
Second revision
2.0
2014/12
AEM/TP
New document format and general
revision. Language revision
2.1
2015/01
AEM
Minor revision
2.2
2015/05
AEM
Minor revision
2.3
2015/10
AEM
Minor revision
2.4
2017/06
JS
Approvals

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Index
General Notes.......................................................................................................................................... 2
Important information ............................................................................................................................ 2
Service and Support ................................................................................................................................ 2
Revision information ............................................................................................................................... 3
1. Introduction..................................................................................................................................... 8
1.1 Description .............................................................................................................................. 8
1.2 Ordering information .............................................................................................................. 9
1.3 Highlights............................................................................................................................... 10
1.4 Product label ......................................................................................................................... 14
1.5 Main features and services ................................................................................................... 15
1.5.1 Key features at a glance (2G models)............................................................................ 15
1.5.2 Key features at a glance (3G models)............................................................................ 17
1.5.3 Operating modes (2G models) ...................................................................................... 20
1.5.4 Operating modes (3G models) ...................................................................................... 21
1.5.5 Power Consumption (2G models) ................................................................................. 22
1.5.6 Power Consumption (3G models) ................................................................................. 23
1.5.7 RF antenna interface description (2G models).............................................................. 24
1.5.8 RF antenna interface description (3G models).............................................................. 25
1.5.9 SIM Card ........................................................................................................................ 27
1.6 Precautions............................................................................................................................ 27
1.7 Block diagram ........................................................................................................................ 28
1.7.1 2G models...................................................................................................................... 28
1.7.2 3G models...................................................................................................................... 28
1.8 Hardware revisions................................................................................................................ 29
2. Mechanical description ................................................................................................................. 30
2.1 Overview................................................................................................................................ 30
2.2 Dimensions ............................................................................................................................ 31
3. Electrical and environmental characteristics ................................................................................ 32
3.1 Electrical specifications ......................................................................................................... 32
3.1.1 Power supply ................................................................................................................. 32
3.1.2 RS232 interface ............................................................................................................. 32
3.1.3 RS485/422 interface...................................................................................................... 33
3.1.4 I2C/SPI interface............................................................................................................ 33

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3.1.5 Optoisolated Input/Output ........................................................................................... 34
3.1.6 Analog Input/Output (2G models) ................................................................................ 35
3.1.7 Analog Input/Output (3G models) ................................................................................ 36
3.2 Operating temperatures........................................................................................................ 37
3.2.1 2G models...................................................................................................................... 37
3.2.2 3G models...................................................................................................................... 37
3.3 Storage conditions................................................................................................................. 38
4. Interface description ..................................................................................................................... 39
4.1 Mini USB connector............................................................................................................... 40
4.2 Plug-in 52-way 5mm pitch terminal block............................................................................. 41
4.2.1 Connector pinout .......................................................................................................... 41
4.2.2 Power supply ................................................................................................................. 43
4.2.3 Main RS232/RS485/RS422 interface (ASC0) ................................................................. 44
4.2.4 Secondary RS232/RS485/RS422 interface (ASC1)......................................................... 46
4.2.5 I2C bus ........................................................................................................................... 48
4.2.6 SPI bus ........................................................................................................................... 49
4.2.7 Analog-to-Digital and Digital-to-Analog converters ...................................................... 50
4.2.8 Optoisolated I/O............................................................................................................ 54
4.2.9 Relay outputs................................................................................................................. 57
4.3 GSM/GPRS antenna connector ............................................................................................. 58
4.4 SIM card reader ..................................................................................................................... 59
4.5 Real Time Clock ..................................................................................................................... 60
4.6 Software updates .................................................................................................................. 60
5. Operation ...................................................................................................................................... 61
5.1 Switching on/off the modem. New “Automatic restart after shutdown” feature................ 61
5.2 Status LEDs ............................................................................................................................ 62
5.2.1 2G models...................................................................................................................... 62
5.2.2 3G models...................................................................................................................... 62
6. AT command interpreter............................................................................................................... 63
7. Embedded applications ................................................................................................................. 64
7.1 MTX-Tunnel software application ......................................................................................... 65
8. Safety and product care ................................................................................................................ 67
8.1 Safety instructions................................................................................................................. 67
8.2 General precautions .............................................................................................................. 67

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8.3 SIM card precautions............................................................................................................. 68
8.4 Antenna precautions ............................................................................................................. 68
8.5 Radio Frequency (RF) exposure and SAR............................................................................... 69
8.6 Personal medical devices ...................................................................................................... 69
9. Modem installation ....................................................................................................................... 70
9.1 Where to install the modem ................................................................................................. 70
9.1.1 Environmental conditions ............................................................................................. 70
9.1.2 Signal strength............................................................................................................... 70
9.1.3 Connections of components to MTX-DIN modem ........................................................ 70
9.1.4 Network and subscription ............................................................................................. 70
9.2 How to install the modem..................................................................................................... 71
9.2.1 Power supply ................................................................................................................. 71
9.2.2 Securing the modem ..................................................................................................... 71
9.3 Antenna ................................................................................................................................. 71
9.3.1 General .......................................................................................................................... 71
9.3.2 Antenna type ................................................................................................................. 71
9.3.3 Antenna placement ....................................................................................................... 72
9.3.4 The antenna cable ......................................................................................................... 72
9.3.5 Possible communications disturbances ........................................................................ 72
10. Conformity assessment ............................................................................................................. 73
10.1 Standards of European Type Approval (2G models) ............................................................. 73
10.2 Standards of European Type Approval (3G models) ............................................................. 74
10.3 FCC Compliant and SAR information (2G models) ................................................................ 75
10.4 FCC Compliant and SAR information (3G models) ................................................................ 76
11. Declaración de conformidad (Spanish) ..................................................................................... 77
11.1 Estándares de homologación europea (modelos 2G) ........................................................... 77
11.2 Estándares de homologación europea (modelos 3G) ........................................................... 78
11.3 Conformidad FCC e información de SAR ............................................................................... 79
11.4 Conformidad FCC (modelos 3G) ............................................................................................ 80
12. Regulatory and type approval information ............................................................................... 81
12.1 Directives and standards (2G models) .................................................................................. 81
12.2 Directives and standards (3G models) .................................................................................. 83
12.3 SAR requirements specific to portable mobiles .................................................................... 86
12.4 SELV requirements ................................................................................................................ 86

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13. RoHS Statement ........................................................................................................................ 87
14. Disposal of old electrical & electronic equipment .................................................................... 87
15. Abbreviations ............................................................................................................................ 88
16. AT command summary ............................................................................................................. 91
16.1 2G models.............................................................................................................................. 91
16.2 3G models.............................................................................................................................. 97
17. Accessories .............................................................................................................................. 102
18. Sales contact............................................................................................................................ 103

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1. Introduction
1.1 Description
The MTX-DIN modems family is an innovative and powerful all-in-one solution enabling GSM, SMS,
fax and 2G/3G (GPRS&UMTS/HSPA) data transmission. It has an intrinsic TCP/IP communication stack
with Internet Services such as TCP, UDP, HTTP, FTP, SMTP, and POP3.
The MTX-DIN is the perfect choice for applications that are installed in DIN racks, have a DC or an AC
power supply and need to control high loads and communicate with RS232/RS485/RS422 serial
buses.
The MTX-DIN is Java J2ME programmable and can host and control your wireless applications. This
allows you to develop and embed your code directly inside the modem, minimizing the need for
extra hardware components, shortening time to market and reducing costs. Alternatively, it can be
used as a powerful standalone GPRS modem with its intrinsic TCP/IP stack.
The MTX-DIN also has a complete set of interfaces (2xRS232/RS485/RS422, USB, I2C, SPI,
optoisolated IOs, 4x 1P1C Relays, Analog-to-Digital converters, etc.)
The MTX-DIN family contains industrial features: the modem can be used in industrial environments
due to its extended operating temperature range and its DIN rail enclosure. It also features an
automatic restart after shutdown in case of power glitches or faulty conditions.
The MTX-DIN is a self contained modem with its own SIM card holder, USB 2.0 High Speed and
RS232/485/422 interfaces (among others), minimizing the need for further hardware development.
This modem can be used as a powerful and flexible device that can be integrated in a wide range of
telemetry applications that rely on the remote exchange of data, SMS or faxes via the GSM cellular
network.
With quad-band 900/1800MHz and 850/1900MHz, your applications can be deployed all over the
world.
The MTX-DIN modems can also be controlled via AT commands and standard interfaces such as USB
2.0 High Speed or RS232 with Linux and Windows® drivers.
The MTX-DIN family is RoHS & WEEE compliant and it is manufactured following the ISO 9001 & IS0
14001 Quality certifications.
A full list of antennas, cables and accessory supplies are available.
The MTX-DIN-2G modems are powered by an internal Cinterion® TC65i module
The MTX-DIN-3G modems are powered by an internal Cinterion® EHS6 module

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1.2 Ordering information
199801103: MTX-DIN-2G
GSM/GPRS, 2xRS232/RS485/RS422, USB, I2C, SPI,
4xRelays, 4xOptoisolated inputs, 2xOptoisolated I/O,
2xADC, 1xDAC
199801139: MTX-DIN-3G
UMTS/HSPA, 2xRS232/RS485/RS422, USB, I2C, SPI,
4xRelays, 4xOptoisolated inputs, 2xOptoisolated I/O,
2xADC, 1xDAC

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1.3 Highlights
Interfaces
GSM SMA F antenna connector
USB 2.0 High Speed port up to 480Mbps
SIM card interface 1.8V and 3V
Plug-in 52-way (45 usable) 5mm pitch terminal block:
o2x optoisolated inputs/outputs
o4x optoisolated inputs
o2x analog outputs
o1x analog input (PWM)
o1x I2C/SPI bus
o2x RS232/RS422/RS485 configurable ports
o4x form C switching contact relays
Operating status LEDs
General features (2G models)
Quad band GSM/GPRS/EDGE 850/900/1800/1900MHz
GPRS multislot class 12
GSM release 99
Output power:
oClass 4 (2W) for EGSM850 & EGSM900
oClass 1 (1W) for GSM1800 & GSM1900
SIM Application Toolkit, 3GPP release 99
Control via AT commands (Hayes, 3GPP TS 27.007, TS 27.005)
TCP/IP stack access via AT commands
Internet services: TCP, UDP, HTTP, FTP, SMTP, POP3
Supply voltage range:
oDC: 9 to 30VDC (typ. 12VDC)
oAC: 12-24VAC (typ. 24 VAC)
Power consumption at 12V (average)
oIdle mode (registered DRX=2): 17mA
oSleep mode: 7mA
oGPRS class 12: 570mA
Operating temperature range: -30ºC to +85ºC
Dimensions, excluding connectors: 157 x 86 x 58mm
Weight: < 300 g
Powered by Cinterion TC65i module

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General features (3G models)
World Wide Version (default)
oUMTS/HSPA+: Five-Band 800/850/900/1900/2100MHz
oGSM/GPRS/EDGE: Quad band 850/900/1800/1900MHz
European Version
oUMTS/HSPA+: Dual-Band 900/2100MHz
oGSM/GPRS/EDGE: Dual band 900/1800MHz
American Version
oUMTS/HSPA+: Dual-Band 850/1900MHz
oGSM/GPRS/EDGE: Dual band 850/1900MHz
3GPP Release 6, 7
SIM Application Toolkit, 3GPP release 99
Control via AT commands (Hayes, TS 27.007, TS 27.005)
TCP/IP stack access via AT commands
Internet services: TCP, UDP, HTTP, FTP, SMTP, POP3
Power consumption at 12V (average)
oIdle: 12mA
oSleep mode: 7mA
oHSPA data transfer: 152mA
Temperature range
oOperating: -30ºC to +85ºC
Dimensions, excluding connectors: 157 x 86 x 58mm
Weight: < 300 g
Powered by Cinterion EHS6 module
Drivers
USB, MUX driver for Microsoft® Windows XP™, Vista™, Windows 7™
RIL, USB driver for Microsoft® Windows Embedded Handheld™>= 6.x
USB, MUX driver for Microsoft® Windows Embedded Compact™ >= 5.x
USB serial/CDC-ACM driver for Linux
Specifications (2G models)
GPRS data transmission
oGPRS class 12
oMobile station class B
oPBCCH support
oCoding schemes CS 1-4
CSD data transmission
oUp to 14.4kbps
oV.110
oNon-transparent mode
oUSSD support
Voice features

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oTriple-rate codec for HR, FR and EFR
oAdaptive multirate AMR
oBasic hands-free operation
oEcho cancellation
oNoise reduction
SMS
oPoint-to-point MO and MT
oSMS cell broadcast
oText and PDU mode
Specifications (3G models)
HSPA (3GPP Release 6,7)
oDL 7.2Mbps, UL 5.7Mbps
oHSDPA Cat.8 / HSUPA Cat.6 data rates
oCompressed mode (CM) according to 3GPP TS25.212
UMTS (3GPP Release 4)
oPS data rate –384 kbps DL, UL 384kbps
oCS data rate –64 kbps DL, UL 64kbps
HSPA (3GPP Release 6,7)
oDL 7.2Mbps, UL 5.7Mbps
oHSDPA Cat.8 / HSUPA Cat.6 data rates
GPRS
oGPRS class 12
oMobile station class B
oPBCCH support
oCoding schemes CS 1-4
EGPRS
oMultislot class 12
oEDGE E2 power class for 8PSK
CSD data transmission
oUp to 9.6kbps
oV.110
oNon-transparent mode
oUSSD support
SMS
oPoint-to-point MO and MT
oSMS cell broadcast
oText and PDU mode
Fax
Group 3, class 1,2

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JavaTM features (2G models)
JavaTM profile IMP-NG & CLDC 1.1 Hl, GPS support
Multi-threading programming and program execution
Memory space for Java applications: 1.7MB RAM & 8MB Flash
JavaTM features (3G models)
Oracle Java ME Embedded 3.2
Compliant to CLDC 1.1 HI and IMP-NG standards
Capable of running multiple MIDlets in parallel with inter-MIDlet communication
Additional Java standards APIs:
oJSR75 (FileConnection)
oJSR177 (CRYPTO)
oJSR280 (XML)
Additional accessible periphery for Java applications
oI/O pins, I2C, ADC/DAC
oSerial interfaces (API): ASC0, ASC1, USB
Memory space for Java applications
oFlash File System: 8MB
oRAM: 6MB
oJust-in-Time (JIT) Compiler execution optimization
Special features (2G models)
Secure data transmission with HTTPS, SSL and PKI
Serial interface modem for Microsoft® 7TM/XPTM/VistaTM
RLS Monitoring (Jamming detection)
Firmware update via USB/RS232
Integrated Firmware Update Over The Air (FOTA), configurable and royalty free
TLS for IP over AT
Tunneling mode for external serial devices
Real time clock with alarm functionality
Informal Network Scan
Special features (3G models)
USB interfaces support multiple composite modes and a Linux/Mac compliant mode
Firmware update via USB/RS232
Real time clock with alarm functionality
Multiplexer according 3GPP TS 27.010
RLS Monitoring (Jamming detection)
Informal Network Scan
Customer IMEI/SIM-Lock as variant
Integrated FOTA, configurable and royalty free

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1.4 Product label
The label fixed to the bottom of a MTX Modem comprises the following information:
No.
Information
1
MTX Modems logo
2
Product name (model)
3
Product ordering number
4
Hardware and Firmware Revisions
5
FCC ID
6
Year/Week of fabrication
7
Barcode (Code 128) (IMEI)
8
Product IMEI
9
RoHS symbol
10
Pb-Free symbol
11
WEEE symbol
12
CE logo
13
PTCRB Certification logo

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1.5 Main features and services
The MTX-DIN-2G performs a set of telecom services (TS) according to GSM standard phase 2+, ETSI
and ITU-T. The services and functions of the MTX-DIN-2G are implemented by issuing customized
applications embedded on the device, by AT commands issued internally or over the USB, RS232,
RS422 or RS485 interfaces.
1.5.1 Key features at a glance (2G models)
The MTX-DIN-2G is a GSM/GPRS band mobile station with the characteristics shown in the table
below.
Feature
Implementation
General
Frequency bands
GSM/GPRS: Quad band, 850/900/1800/1900MHz
GSM class
Small MS
Output power
Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
The values stated above are maximum limits. According to Release 99, the maximum output power in
a multislot configuration may be lower. The nominal reduction of maximum output power varies with
the number of uplink timeslots used and amounts to 2.0dB for 2Tx, 4.0dB for 3Tx and 6.0dB for 4Tx.
Power supply
Single supply voltage
DC: 9 to 30V
AC: 12-24VAC
Physical
Dimensions: 157 x 86 x 58 mm Weight: approx. <300g
RoHS
All hardware components fully compliant with EU RoHS Directive
GSM / GPRS features
Data transfer
GPRS
Multislot Class 12
Full PBCCH support
Mobile Station Class B
Coding Scheme 1 –4
CSD
V.110, RLP, non-transparent
9.6kbps
USSD
PPP-stack for GPRS data transfer
SMS
Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus 25 SMS locations in mobile equipment
Transmission of SMS alternatively over CSD or GPRS. Preferred mode can be user defined
Fax
Group 3; Class 1
Software
AT commands
Hayes, 3GPP TS 27.007, 27.005, Gemalto M2M
JavaTM Open
Platform
JavaTM Virtual Machine with APIs for amongst others AT Parser, Serial Interface, FlashFile System and
TCP/IP Stack.
Major benefits: seamless integration into Java applications, ease of programming, no need for
application microcontroller, extremely cost-efficient hardware and software design –ideal platform

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for industrial GSM applications.
The memory space available for Java programs is around 1.7MB in the flash file system and around
6MB RAM. Application code and data share the space in the flash file system and in RAM.
SIM Application
Toolkit
SAT Release 99
TCP/IP stack
Access by AT commands
Remote SIM
Access
MTX-DIN-2G supports Remote SIM Access. RSA enables MTX-DIN-2G to use a remote SIM card via its
serial interface and an external application, in addition to the SIM card locally attached to the
modem. The connection between the external application and the remote SIM card can be a
Bluetooth wireless link or a serial link. The necessary protocols and procedures are implemented
according to the “SIM Access Profile Interoperability Specification of the Bluetooth Special Interest
Group”
Firmware update
Firmware update from host application over RS232/USB. Over-the-air (OTA) firmware is also possible.
Interfaces (depending on models)
USB
Supports a USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s) compliant
RS232 (4-wires)
Adjustable baud rates: 1200bps to 921600bps
Autobauding: 1200 to 230400bps
Supports RTS/CTS hardware flow control
Multiplex ability according to GSM 07.10 Multiplexer Protocol
RS422
Adjustable baud rates: 1200bps to 921600bps
Autobauding: 1200 to 230400bps
Multiplex ability according to GSM 07.10 Multiplexer Protocol
RS485
Adjustable baud rates: 1200bps to 921600bps
Autobauding: 1200 to 230400bps
Half-duplex
I2C interface
Supports I2C serial interface up to 400kbps
GPIO
2x Optoisolated input/outputs and 4 Optoisolated inputs
ADC
2x analog-to-digital converters
DAC
1x digital-to-analog converter
Relays
4x form C switching contacts relays
Status
2x status LEDs (GSM status and user programmable
UICC interface
Supported chip cards: UICC/SIM/USIM 3V, 1.8V
Antenna
50 Ohms. GSM/UMTS main antenna
Power on/off, Reset
Power on/off
Automatic switch-on at power supply
Switch off by AT command
Switch off by hardware signal TURN_OFF
Automatic switch-off in case of critical temperature or voltage conditions
Software Reset
Orderly shutdown and reset by AT command
Special features
Antenna
SAIC (Single Antenna Interference Cancellation) / DARP (Downlink Advanced Receiver Performance)
Rx Diversity (receiver type 3i –64-QAM) / MIMO

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1.5.2 Key features at a glance (3G models)
The MTX-DIN-3G is a UMTS/HSPA band mobile station with the characteristics shown in the table
below.
Feature
Implementation
General
Frequency bands
UMTS/HSPA+: Five band, 800/850/900/1900/2100MHz
GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz
GSM class
Small MS
Output power
Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+27dBm +3dB/-4dB) for GSM 1800 8-PSK
Class E2 (+27dBm +3/-4dB) for GSM 1900 8-PSK
Class E2 (+26dBm +3/-4dB) for GSM 1800 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI
Class 3 (+24dBm +1/-3dB) for UMTS 1900, WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Class 3 (+24dBm +1/-3dB) for UMTS 800, WCDMA FDD BdVI
Power supply
Single supply voltage
DC: 9 to 30V
AC: 12-24VAC
Physical
Dimensions: 157 x 86 x 58 mm Weight: approx. <300g
RoHS
All hardware components are fully compliant with the EU RoHS Directive
HSPA features
3GPP Release 6,7
DL 7.2Mbps, UL 5.7Mbps
HSDPA Cat.8 / HSUPA Cat.6 data rates
Compressed mode (CM) supported according to 3GPP TS25.212
UMTS features
3GPP Release 8
PS data rate –384 kbps DL / 384 kbps UL
CS data rate –64kbps DL / 64 kbps UL
GSM / GPRS / EGPRS features
Data transfer
GPRS
Multislot Class 12
Full PBCCH support
Mobile Station Class B
Coding Scheme 1 –4
EGPRS
Multislot Class 12
EDGE E2 power class for 8 PSK
Downlink coding schemes –CS 1-4, MCS 1-9

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MTX M2M® by MATRIX ELECTRONICA S.L.U
Uplink coding schemes –CS 1-4, MCS 1-9
SRB loopback and test mode B
8-bit, 11-bit RACH
PBCCH support
1 phase/2 phase access procedures
Link adaptation and IR
NACC, extended UL TBF
Mobile Station Class B
CSD
V.110, RLP, non-transparent
9.6kbps
USSD
SMS
Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus SMS locations in mobile equipment
Software
AT commands
Hayes, 3GPP TS 27.007, 27.005, Gemalto M2M
AT commands for RIL compatibility
JavaTM Open
Platform
JavaTM Open Platform with
JavaTM profile IMP-NG & CLDC 1.1 HI
Secure data transmission via HTTPS/SSL
Multi-threading programming and multi-application execution
Major benefits: seamless integration into Java applications, ease of programming, no need for
application microcontrollers, extremely cost-efficient hardware and software design –an ideal
platform for industrial GSM applications.
The memory space available for Java programs is around 8MB in the flash file system and around 6MB
of RAM. Application code and data share the space in the flash file system and in the RAM.
MicrosoftTM
compatibility
RIL for Pocket PC and Smartphone
SIM Application
Toolkit
SAT Release 99
Firmware update
Firmware update from host application over USB.
Interfaces (depending on models)
USB
Supports a USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s) compliant
RS232 (4-wires)
Adjustable baud rates: 1200bps to 921600bps
Autobauding: 1200 to 230400bps
Supports RTS/CTS hardware flow control
Multiplex ability according to GSM 07.10 Multiplexer Protocol
RS422
Adjustable baud rates: 1200bps to 921600bps
Autobauding: 1200 to 230400bps
Multiplex ability according to GSM 07.10 Multiplexer Protocol
RS485
Adjustable baud rates: 1200bps to 921600bps
Autobauding: 1200 to 230400bps
Half-duplex
I2C interface
Supports I2C serial interface up to 400kbps
GPIO
2x digital input/outputs and 4 Optoisolated inputs
ADC
2x analog-to-digital converters

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MTX M2M® by MATRIX ELECTRONICA S.L.U
DAC
1x digital-to-analog converter
Relays
4x form C switching contacts relays
Status
2x status LEDs (GSM status and user programmable
Power on/off, Reset
Power on/off
Automatic switch-on at power supply
Switch off by AT command
Switch off by hardware signal TURN_OFF
Automatic switch-off in case of critical temperature or voltage conditions
Software Reset
Orderly shutdown and reset by AT command
Special features
Antenna
SAIC (Single Antenna Interference Cancellation) / DARP (Downlink Advanced Receiver Performance)
Rx Diversity (receiver type 3i –64-QAM) / MIMO

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MTX M2M® by MATRIX ELECTRONICA S.L.U
1.5.3 Operating modes (2G models)
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Limits
Function
Normal operation
GSM / GPRS
SLEEP
Various power saving modes set with AT+CFUN command. Software is
active to the minimum extent. If the modem was registered to the GSM
network in IDLE mode, it is registered and paging with the BTS in SLEEP
mode too. Power saving can be chosen at different levels: the NON-
CYCLIC SLEEP mode (AT+CFUN=0) disables the AT interface. The CYCLIC
SLEEP modes AT+CFUN=7 and 9 alternately activate and deactivate the
AT interfaces to allow permanent access to all AT commands.
GSM IDLE
Software is active. Once registered to the GSM network, paging with BTS
is carried out. The modem is ready to send and receive.
GSM TALK
Connection between two subscribers is in progress. Power consumption
depends on the network coverage individual settings, such as DTX off/on,
FR/EFR/HR, hopping sequences, antenna.
GPRS IDLE
Modem is ready for GPRS data transfer, but no data is currently sent or
received. Power consumption depends on network settings and GPRS
configuration (e.g. used multislot settings).
GPRS DATA
GPRS data transfer in progress. Power consumption depends on network
settings (e.g. power control level), uplink / downlink data rates and
GPRS configuration (e.g. used multislot settings).
Sleep mode
Normal shutdown after sending the AT^SMSO command. The internal GSM engine enters in a
power down mode where only a voltage regulator is active for powering the internal RTC.
Software is not active. Interfaces are not accessible.
Airplane mode
Airplane mode shuts down the radio part of the modem, causes the modem to log off from the
GSM/GPRS network and disables all AT commands whose execution requires a radio connection.
Airplane mode can be controlled by using AT commands AT^SCFG and AT+CALA:
With AT^SCFG=MEopMode/Airplane/OnStart the modem can be configured to enter
Airplane mode each time it is switched on or reset
The parameter AT^SCFG=MEopMode/Airplane can be used to switch back and forth
between Normal mode and Airplane mode at any time during operation.
Setting an alarm with AT+CALA followed by AT^SMSO wakes the modem up into
Airplane mode at the scheduled time.