Murata ZRB157R61C225KE11 Series User manual

ZRB157R61C225KE11_ (0402, X5R:EIA, 2.2uF, DC16V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Mar.7,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
g
0.1 to 0.4
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 16 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 85 °C
(25 °C)
Only Reflow Soldering
0.3 min.
(1)-1 L
1.0+0.22/-0.2
(1)-2 W
0.5±0.2
This product specification is applied to Chip Monolithic Ceramic Capacitor on Interposer used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
(2) T
e
Chip Monolithic Ceramic Capacitor on Interposer for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±10 %
(6)
Capacitance
Tolerance
2.2 uF
0.7±0.15
-55 to 85 °C
D
f180mm Reel
PAPER W8P2
8000 pcs./Reel
J
f330mm Reel
PAPER W8P2
30000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
ZRB 15 7R6 1C 225 K E11 D
ZRB157R61C225KE11-01 1

■Specifications and Test Methods
No
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage
range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.
4 Voltage proof No defects or abnormalities.
Measurement Point :
Between the terminations
Test Voltage :
250% of the rated voltage
Applied Time :
1 to 5 s
Charge/discharge current :
50mA max.
To apply the test voltge through the Interposer board termination.
5 Insulation Resistance(I.R.)
∙F (Whichever is smaller) Measurement Point : Between the terminations
Measurement Voltage :
DC Rated Voltage
Charging Time :
1 min
Charge/discharge current :
50mA max.
Measurement Temperature:
Room Temperature
To apply the test voltge through the Interposer board termination.
6 Capacitance Shown in Rated value.
Measurement Temperature:
Room Temperature
7 Dissipation Factor (D.F.) 0.1 max.
To apply the test voltge through the Interposer board termination.
8
Temperature No bias R6 : Within +/-10% (-55°C to +85°C) The capacitance change should be measured after 5 min.
Characteristics
R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.
of Capacitance C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.
D7 : Within +22/-33% (-55°C to +125°C)
· Measurement Voltage : 0.20+/-0.05Vrms
Test Conditions
To apply the test voltge through the Interposer board termination.
･Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Applied Force : 5N
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Capacitance
Frequency
Voltage
C≦
(10V min.)
1.0+/-0.1kHz
1.0+/-0.2Vrms
C≦
(6.3V max.)
1.0+/-0.1kHz
0.5+/-0.1Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp. +/-3
3
Reference Temp. +/-2
4
Max.Operating Temp. +/-3
5
Reference Temp. +/-2
JEMCGS-02410B 2

No
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value.
Kind of Vibration :
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
D.F. Within the specified initial value.
Total amplitude :
1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test Pressurization method : Shown in Fig.2
Capacitance Within +/-10% Flexure : 1mm
Change
Holding Time :
5+/-1s
Soldering Method :
Reflow soldering
12 Solderability of 95% of the terminations is to be soldered evenly and
Test Method :
Solder bath method
Interposer board termination continuously.
Flux :
Solution of rosin ethanol 25(mass)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time
:
2+/-0.5s
13
Resistance Appearance No defects or abnormalities.
Test Conditions :
Reflow method
to Solder : Sn-3.0Ag-0.5Cu
Soldering Capacitance Within +/-7.5% Solder Temp. : 255+/-10℃[Peak Temperature]
Heat
Change Heat Time of over 200°C : 120s max.
Exposure Time : 24+/-2h
D.F. Within the specified initial value. Preheat :
150℃to 160℃for 2 min
I.R. Within the specified initial value. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
Voltage proof No defects. let sit for 24+/-2h at room temperature,then measure.
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Perform the five cycles according to the four heat treatments
shown in the following table.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
I.R. Within the specified initial value. Exposure Time : 24+/-2h
Voltage proof No defects. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
Test Temperature :
40+/-2℃
High
Test Humidity :
90%RH to 95%RH
Humidity Capacitance Within +/-12.5%
Test Time :
500+/-12h
(Steady) Change
Applied Voltage :
DC Rated Voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
I.R.  let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature :
Max. Operating Temp. +/-3℃
Capacitance Within +/-12.5%
Test Time :
1000+/-12h
Change
Applied Voltage :
150% of the rated voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
I.R.  Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time
(min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-02410B 3

Test method : Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (ZRB15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Land Dimensions
Fig.3
c
b
a
Solder Resist
Chip Capacitor
Land
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
Type
Dimension (mm)
a
b
c
ZRB15
0.4
1.5
0.5
ZRB18
1.0
3.0
1.2
Type
Dimension (mm)
a
b
c
ZRB15
0.4
1.5
0.5
ZRB18
1.0
3.0
1.2
JEMCGS-02410B 4

1.Tape Carrier Packaging(Packaging Code:D/L/J/K)
1.1 Minimum Quantity(pcs./reel)
1.2 Dimensions of Tape
(1)ZRB15 (in:mm)
7
*3 Nominal value
1.0+0.22/-0.2
0.7±0.15
1.0±0.2
0.5±0.2
1.0±0.22
0.65±0.2
1.3
0.95
ZRB15
X
1.0±0.15
0.5±0.15
0.65±0.15
0.8
L
W
T
A *3
B *3
t *3
Type
Product Dimensions
10000
ZRB18
A
3000
8000
6
4000
ZRB15
X/7
8000
30000
Code:D
Code:L
Code:J
Code:K
Package
ZRB Type
Type


Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-02345F 5

(2)ZRB18 (in:mm)
L W T
6 1.6±0.22 0.6±0.2
A 1.6±0.2 1.0±0.2
*1 Nominal value
Type
Product Dimensions
A *1
B *1
t
ZRB18
0.8±0.2
1.1
2.0
1.7 max.
Package
ZRB Type
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1
JEMCGP-02345F 6

Package
ZRB Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
W
w1
ZRB15/18
16.5 max.
10±1.5
180+0/-3.0
330±2.0
 min.

2.0±0.5
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Chip
JEMCGP-02345F 7

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1 to 0.6N in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
ZRBType
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-02345F 8

Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip MLCC on Interposer (ZR□series) may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months after receipt ,
as prolonged storage may cause oxidation of the terminations (outer electrodes).
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCGC-02188C 9

2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
1-1. The load should be contained to the level
such that when measuring at atmospheric
temperature of 25°C, the product's self-heating
remains below 20°C and the surface
temperature of the capacitor in the actual circuit
remains within the maximum operating
temperature.
Caution
!
10 1 2 3
Current (Ar.m.s.)
4 5 6
Temperature Rise (℃)
100kHz
10
100 Ripple Current
500kHz
1MHz
[Example of Temperature Rise (Heat Generation) in Chip
Monolithic Ceramic Capacitors in Contrast to Ripple Current]
Sample: R(R1) characteristics 10 Rated voltage: DC10V
E
E
E
E
0
0
0
0
JEMCGC-02188C 10

5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
of the system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
6. Capacitance Aging
[Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have an Aging characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
-100
-80
-60
-40
-20
0
20
010 20 30
DC Voltage (V) 40 50
[Example of DC Voltage Characteristics]
Sample: R(R1) Characteristics 
Capacitance Change (%)
00.5 1
AC Voltage (Vr.m.s.) 1.5 2
[Example of AC Voltage Characteristics]
Sample: X7R(R7) Characteristics 
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
Floor
Crack
Mounting printed circuit board
Crack
!
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
C0G(5C)
X7R(R7)
X5R(R6)
JEMCGC-02188C 11

■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
Locate chip horizontal to the
direction in which stress acts.
(Bad Example) (Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
Contents of Measures
Caution
Screw Hole Recommended
!
①
②
③
1C
1B
1A
Perforation
Slit
A
B
C
D
①
1A
JEMCGC-02188C 12

3.Maintenance of the Mounting (pick and place) Machine
1. To adjust the inspection tolerance for automated appearance sorting machine of mounting position,
because ZR□series are easier to shift the mounting position than standard MLCC.
2. To check the overturn and reverse of ZR□series.
3. To control mounting speed carefully, because ZR□series is heavier than standard MLCC.
4. Make sure that the following excessive forces are not applied to the capacitors.
4-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
[Correct]
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Support Pin
JEMCGC-02188C 13

4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and

2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,

between the component and the solvent within the range
shown in the table 1. [Allowable Reflow Soldering Temperature and Time]
Table 1
Series
ZRB
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
4-2.Flow Soldering
1. ZR□series is not apply flow soldering.
4-3.Correction of Soldered Portion
Do not correct with a soldering iron for ZR□series.
Correction with a soldering iron for ZR□series may cause loss suppress acoustic noise,
because the solder amount become excessive.
Atmosphere
Air or N2
Lead Free Solder
Peak Temperature
240 to 260℃
15/18
≦190℃
Caution
Chip Dimension(L/W) Code
Temperature Differential
!
Soldering Temperature(℃)
SolderingTime(s)
280
270
260
250
240
230
220
0
30
60
120
90
Temperature(℃)
PeakTemperature
Soldering
Gradual
Cooling
Preheating
ΔT
60-120seconds
30-60 seconds
Time
190℃
170℃
150℃
220℃
JEMCGC-02188C 14

5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended] [Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending] [Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Recommended
×
△*
△*
◯
2) Disc Separator
3) Router Type Separator
Level of stress on board
High
Medium
Medium
Low
Caution
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
!
Peeling
Test-probe
Support Pin
Test-probe
①
1A
JEMCGC-02188C 15

(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig] [Hand Separation]
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
(Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ]
[Disc Separator]
Top Blade Top Blade Top Blade Top Blade
Bottom Blade Bottom Blade Bottom Blade Bottom Blade
[V-groove Design]
Depth too Shallow
Depth too Deep
Example of Recommended
V-groove Design
Not Recommended
Left-right Misalignment
Low-Angle
Caution
Recommended
Not recommended
Recommended
Not recommended
Top-bottom Misalignment
Left-right Misalignment
Front-rear Misalignment
Printed Circuit Board
Top Blade
V-groove Bottom Blade
Top Blade Printed Circuit Board
V-groove
!
Board Cropping Jig
V-groove
Printed Circuit Board
Printed circuit
board
Components
Load point
Direction of
load
Printed circuit
board
Component
s
Load point
Direction of load
JEMCGC-02188C 16

(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using multiple support pins on the board,
periodically confirm that there is no difference in the height of each support pin.
2-3. Attaching/Removing Sockets
When the board itself is a connector, the board may bend when a socket is attached or removed.
Plan the work so that the board does not bend when a socket is attached or removed.
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Caution
!
Suction Nozzle
Component with Leads
Socket
Screwdriver
[ Outline Drawing ] Router
JEMCGC-02188C 17

■Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) This series are not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
Caution
!
JEMCGC-02188C 18

■Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
Notice
JEMCGC-02188C 19

■Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress  
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
2. Land Dimensions
2-1.Please refer to the land dimensions in Table 1 for ZRB series.
(1)Recommended Land Dimensions
Table1 Land Dimensions
(in mm)
* If distance between parts is too short, there is risk to cause electrical short.
Please confirm the mounting pitch (distance between centers of parts)
has 1.275mm or more. （ZRB18 only）
Please confirm the suitable mounting condition by evaluating of the actual SET / PCB.
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size
and material of the board.
0.8～1.0
ZRB
18 *
1.6×0.8
0.7～0.9
0.7～0.8
ZRB
15
1.0×0.5
0.4～0.6
0.4～0.5
0.5～0.7
Notice
Series
Chip Dimension
(L/W) Code
Chip(L×W)
a
b
c
Relationship with amount of strain to the board thickness, length, width, etc.]

3PL
2Ewh2
Relationshipbetweenloadandstrain
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
uce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.

·As the board width (w) decreases, the amount of strain increases.

·As the board thickness (h) decreases, the amount of strain increases.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.
：Strain on center of board (st)
L：Distance between supporting points (mm)
w：Board width (mm)
h：Board thickness (mm)
E：Elastic modulus of board (N/m2=Pa)
Y：Deflection (mm)
P：Load (N)
Y
P
h
w
L
ZRB
c
b
a
Solder Resist
Land
JEMCGC-02188C 20