Murata GRT32DC81E106ME01 Series User manual

GRT32DC81E106ME01_ (1210, X6S, 10uF, DC25V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Apr.17,2015,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
1.0 min.
(1)-1 L
3.2±0.3
(1)-2 W
2.5±0.2
e
Chip Monolithic Ceramic Capacitor meet AEC-Q200 for Infotainment
mark
(4)
Rated
Voltage
Packaging Unit
DC 25 V
Temp. Range
(Ref.Temp.)
(8) Packaging
Temp. coeff
or Cap. Change
This product specification is applied to Chip Monolithic Ceramic Capacitor used for Car Multimedia, Car Interior, Car Comfort application and General Electronic
equipment.
Please contact us when using this product for any other applications than described in the above.
Do not use these products in applications critical to passenger safetyand car driving function (e.g. ABS, AIRBAG, etc.).
(2) T
2.0±0.2
-55 to 105 °C
-22 to 22 %
-55 to 105 °C
(25 °C)
(6)
Capacitance
Tolerance
10 uF
Specifications and Test
Methods
(Operating
Temp. Range)
±20 %
(3) Temperature Characteristics
(Public STD Code):X6S(EIA)
g
0.3 min.
(5) Nominal
Capacitance
L
f180mm Reel
EMBOSSED W8P4
1000 pcs./Reel
K
f330mm Reel
EMBOSSED W8P4
4000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code
(7)Murata’s
Control Code
GRT 32 DC8 1E 106 M E01 L
GRT32DC81E106ME01-01 1

Pre-and Post-Stress 
Electrical Test
2 High Temperature The measured and observed characteristics should satisfy the Set the capacitor for 1000±12 hours at maximumoperating
Exposure (Storage) specifications in the following table.
temperature ±3℃.
Appearance No marking defects Set for 24±2 hours at room temperature, then measure.
Capacitance R6, C8: Within ±12.5%
Change
Dissipation R6, C8: 0.2 max.
Factor
Insulation
25Ω・F min.
Resistance
3 Temperature Cycling The measured and observed characteristics should satisfy the Fix the capacitor to the supporting jig in the same manner and under
specifications in the following table. the same conditions as (18). Perform the 1000 cycles test according
Appearance No marking defects to the four heat treatments in the following table.
Capacitance R6, C8: Within ±7.5% Set for 24±2 hours at room temperature, then measure.
Change
Dissipation R6, C8: 0.2 max.
Factor
Insulation
50Ω・F min.
Resistance
・Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10 ℃for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measurement.
4 Destructive No defects or abnormalities Per EIA-469
Physical Analysis
5 Biased Humidity The measured and observed characteristics should satisfy the
Apply the rated voltage and 1.3+0.2/-0vdc (add 6.8kΩ resister)
specifications in the following table.
at 85±3℃and 80 to 85% humidity for 1000±12 hours.
Appearance No marking defects
Remove and set for 24±2 hours at room temperature, then measure.
Capacitance R6,C8: Within ±12.5%
The charge/discharge current is less than 50mA.
Change
Dissipation R6,C8: 0.2 max
・Measurement after test for high dielectric constant type
Factor
Perform a heat treatment at 150+0/–10°C for one hour and then let
sit for 24±2 hours at room temperature, then measure.
Insulation
5Ω・F min.
Resistance
-
1
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
Step
1
2
3
4
Temp.
(C)
-55+0/-3
Room
Temp.
85 +3/-0 (For R6)
105+3/-0 (For C8)
Room
Temp.
Time
(min.)
153
1
153
1
JEMCGS-01744J 2

6 Operational Life The measured and observed characteristics should satisfy the Apply 100% of the rated voltage for 1000±12 hours at maximum operating
specifications in the following table.
temperature ±3℃. Set for 24±2 hours at room temperature, then measure.
Appearance No marking defects The charge/discharge current is less than 50mA.
Capacitance R6,C8: Within ±12.5%
Change
・Initial measurement for high dielectric constant type
Dissipation R6,C8: 0.2max
Perform a heat treatment at 150+0/-10℃for one hour and then set
Factor for 24±2 hours at room temperature.
Perform the initial measurement.
・Measurement after test for high dielectric constant type
Insulation
5Ω・F min. Perform a heat treatment at 150+0/–10°C for one hour and then let
Resistance
sit for 24±2 hours at room temperature, then measure.
7 External Visual No defects or abnormalities Visual inspection
8 Physical Dimension Within the specified dimensions Using calipers
9 Resistance to Appearance No marking defects
Per MIL-STD-202 Method 215
Solvents Capacitance Within the specified tolerance Solvent 1 : 1 part (by volume) of isopropyl alcohol
Change
3 parts (by volume) of mineral spirits
Dissipation R6,C8: 0.125max Solvent 2 : Terpene defluxer
Factor
Solvent 3 : 42 parts (by volume) of water
1 part (by volume) of propylene glycol monomethyl ether
1 part (by volume) of monoethanolamine
Insulation
50Ω・F min.
Resistance
10 Mechanical Appearance No marking defects
Three shocks in each direction should be applied along 3 mutually
Shock Capacitance Within the specified tolerance
perpendicular axes of the test specimen (18 shocks).
Change
The specified test pulse should be Half-sine and should have a
Dissipation R6,C8: 0.125max
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
Factor
Insulation
50Ω・F min.
Resistance
11 Vibration Appearance No defects or abnormalities
Solder the capacitor to the test jig (glass epoxy board) in the same
Capacitance Within the specified tolerance
manner and under the same conditions as (18). The capacitor
Change
should be subjected to a simple harmonic motion having a total
Dissipation R6,C8: 0.125max
amplitude of 1.5mm, the frequency being varied uniformly between
Factor the approximate limits of 10 and 2000Hz. The frequency range, from
10 to 2000Hz and return to 10Hz, should be traversed in
approximately 20 minutes. This motion should be applied for 12
Insulation
50Ω・F min. items in each 3 mutually perpendicular directions (total of 36 times).
Resistance
12 Resistance to The measured and observed characteristics should satisfy the
Immerse the capacitor in a eutectic solder solution at 260±5℃for
Soldering Heat specifications in the following table.
10±1 seconds. Set at room temperature for 24±2 hours, then
Appearance No marking defects
measure.
Capacitance Within the specified tolerance
Change
・Initial measurement for high dielectric constant type
Dissipation R6,C8: 0.125max
Perform a heat treatment at 150+0/-10 ℃for one hour and then set
Factor
for 24±2 hours at room temperature.
Perform the initial measurement.
Insulation 50Ω・F min.
Resistance
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
JEMCGS-01744J 3

13 Thermal Shock The measured and observed characteristics shall satisfy the
Fix the capacitor to the supporting jig in the same manner and under
specifications in the following table.
the same conditions as (18). Perform the 300 cycles according to
Appearance No marking defects
the two heat treatments listed in the following table (Maximum
Capacitance R6,C8: Within ±10.0%
transfer time is 20 seconds).
Change
Set for 24±2 hours at room temperature, then measure.
Dissipation R6,C8: 0.125max
Factor
Insulation
50Ω・F min.
Resistance
・Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10 for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measurement.
14 ESD Appearance No marking defects
Per AEC-Q200-002
Capacitance Within the specified tolerance
Voltage setting level : 2kV
Change
Dissipation R6,C8: 0.125max
Factor
Insulation
50Ω・F min.
Resistance
15 Solderability
(a) Preheat at 155℃for 4 hours. After preheating, immerse the
capacitor in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-
5902) (25% rosin in weight proportion). Immerse in
eutectic solder solution for 5+0/-0.5 seconds at 235±5℃.
(b) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight
proportion). Immerse in eutectic solder solution for 5+0/-0.5
seconds at 235±5℃.
(c) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight
proportion). Immerse in eutectic solder solution for 120±5 seconds
at 260±5℃.
16 Electrical Appearance No defects or abnormalities Visual inspection.
Chatacteri- Capacitance Within the specified tolerance
The capacitance/Q/D.F. should be measured at 25℃at the
zation Change
frequency and voltage shown in the table.
Dissipation R6.C8 :0.125max
Factor
Insulation
50Ω・F min. The insulation resistance should be measured with a DC voltage not
Resistance
exceeding the rated voltage at 25℃and maximum operating temperature※
25℃within 1 minute of charging.
Insulation
5Ω・F min.
Resistance
※85+3/-0℃(For R6), 105+3/-0℃(For C8)
85℃(For R6)
105℃(For C8)
Dielectric No failure No failure should be observed when 250% of the rated voltage is
Strength applied between the terminations for 1 to 5 seconds, provided the
charge/ discharge current is less than 50mA.
95% of the terminations is to be soldered evenly and continuously.
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
Step
1
2
Temp.
(℃)
-55+0/-3
105+3/-0 (For C8)
85+3/-0 (For R6)
Time
(min.)
15±3
15±3
Char.
Item
R6,C8
6.3V max.
(C≦10F)
R6,C8
10V min.
(C≦10F)
R6,C8
(10F< C)
Frequency
10.1kHz
10.1kHz
12024Hz
Voltage
0.50.1Vrms
10.2Vrms
0.50.1Vrms
JEMCGS-01744J 4

17 Board Flex Appearance No marking defects
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig1 using a eutectic solder. Then apply a force in the direction
shown in Fig 2 for 5±1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
Capacitance Within specified tolerance
soldering is uniform and free of defects such as heat shock.
Change
Dissipation R6,C8: 0.125max
Factor
Insulation
50Ω・F min.
Resistance
(in mm)
18 Terminal Appearance No marking defects Solder the capacitor to the test jig (glass epoxy board) shown in
Strength Fig.3 using a eutectic solder. Then apply *18N force in parallel with
Capacitance Within specified tolerance the test jig for 60sec.
Change The soldering should be done either with an iron or using the reflow
Dissipation R6,C8: 0.125max method and should be conducted with care so that the soldering is
Factor uniform and free of defects such as heat shock
Insulation
50Ω・F min.
Resistance
（in mm）
19 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.
< Chip L dimension : 2.5mm max. > Apply a force.
< Chip Length : 2.5mm max. >
< Chip L dimension : 3.2mm min. >
< Chip Length : 3.2mm min. >
Speed supplied the Stress Load : *0.5mm / sec.
*GRT03: 0.1mm/sec.
Chip thickness < 1.25mm rank : 15N
Chip thickness ≧1.25mm rank : 54.5N
Chip thickness > 0.5mm rank : 20N
Chip thickness ≦0.5mm rank : 8N
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
t : 1.6mm
(GRT03,15:0.8mm)
Fig.3
Fig.4
*2N(GRT03,15)
t : 1.6mm
(GRT03,15:0.8mm)
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
C
Fig.1
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Solder resist
Baked electrode
or copper foil
b
Iron Board
45
45
Flexure：≦2
(Chip thickness＞0.85mm rank
High Dielectric Type)
Flexure：≦1
(Chip thickness≦0.85mm rank
High Dielectric Type))
Capacitance meter
支持台
ｺﾝﾃﾞﾝｻ
45
45
Fig.2
R4
Pressurizing
speed:1.0mm/sec
Pressurize
20
114
L
0.6L
Type
a
b
c
GRT03
0.3
0.9
0.3
GRT15
0.5
1.5
0.6
GRT18
0.6
2.2
0.9
GRT21
0.8
3.0
1.3
GRT31
2.0
4.4
1.7
Type
a
b
c
GRT03
0.3
0.9
0.3
GRT15
0.4
1.5
0.5
GRT18
1.0
3.0
1.2
GRT21
1.2
4.0
1.65
GRT31
2.2
5.0
2.0
JEMCGS-01744J 5

20 Capacitance Capacitance R6 : Within ±15% The capacitance change should be measured after 5 min. at
Temperature Change (-55℃to +85℃) each specified temperature stage.
Characteristics The ranges of capacitance change compared with the above 25℃
C8 : Within ±22% value over the temperature ranges shown in the table should be
(-55℃to +105℃)within the specified ranges.
・Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10℃for one hour
and then set for 24±2 hours at room temperature.
Perform the initial measurement.
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
Step
Temperature.(C)
1
25±2
2
-55±3
3
25±2
4
85±3（for R6）, 105±3（for C8）
5
25±2
JEMCGS-01744J 6

1.Tape Carrier Packaging(Packaging Code:D/E/F/L/J/K)
1.1 Minimum Quantity(pcs./reel)
φ180mm reel φ330mm reel
Paper Tape Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:L Code:J/ F Code:K
GRT03 15000 50000
5(Dimensions Tolerance:±0.05) 10000 50000
5(Dimensions Tolerance:±0.1min.) 10000 40000
GRT18 4000 10000
64000 10000
94000 10000
B3000 10000
64000 10000
94000 10000
M3000 10000
C2000 6000
N2000 8000
D/E 1000 4000
1.2 Dimensions of Tape
(1)GRT03/15(Paper Tape) (in mm)
*3 Nominal value
Type
GRT21
GRT31
GRT15
Package
GRT Type
GRT32
GRT15 GRT15 GRT15
(Dimensions Tolerance
±0.05)
(Dimensions Tolerance
±0.1)
(Dimensions Tolerance
±0.2)
A *3 0.37 0.39 0.65 0.70 0.75
B *3 0.67 0.69 1.15 1.20 1.35
ｔ0.5 max. 0.5 max. 0.8 max. 0.8 max. 0.8 max.
Code
GRT03
(Dimensions Tolerance
±0.03)
GRT03
(Dimensions Tolerance
±0.05)
±0.03 0.37 0.67
±0.05 0.39 0.69
±0.05 0.65 1.15
±0.1 0.70 1.20
±0.2 0.75 1.35
GRT03
GRT15
0.5 max.
0.8 max.
A *3
B *3
ｔ
Type
LW Dimensions
Tolerance(Chip)
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-01742F 7

(2)GRT18/21/31/32(Paper Tape) (in mm)
(3)GRT21/31/32(Plastic Tape)
Package
GRT Type
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
0.8±0.1
0.8±0.15
±0.2 0.8±0.2
1.10±0.10 2.00±0.10
0.6±0.1
0.6+0/-0.15
0.85±0.1
0.85+0/-0.2
6 ±0.15 0.6±0.1
9 ±0.2 within 0.85±0.1
±0.15 within
±0.1
LW Dimensions
Tolerance(Chip)
GRT21
GRT31
T Dimensions
(Chip)
A
1.1 max.
1.55±0.15
2.30±0.15
2.00±0.20
B
t
1.05±0.10
1.85±0.10
±0.15 within
GRT18
Type
8
6
9
3.60±0.20
±0.1 1.25±0.1
1.45±0.20 2.25±0.20 1.7 max.
B ±0.15
1.25±0.15
±0.2
1.25±0.2
±0.15 1.15±0.1
±0.2 1.15±0.15
C ±0.2 1.6±0.2 2.5 max.
N 1.35±0.15 2.5 max.
D 2.0±0.2 3.0 max.
E 2.5±0.2 3.7 max.
B
LW Dimensions
Tolerance(Chip)
T Dimensions
(Chip)
1.7 max.
L:±0.3
W:±0.2
GRT32
2.80±0.20
3.50±0.20
t
A
GRT31
1.90±0.20
3.50±0.20
M
2.0 max.
Type
GRT21
1.50±0.20
2.30±0.20
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
Ａ
*
*1
2.5 max.(T≦1.8mm)
Ｂ
*1
*：2.0±0.1
0.3±0.1
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
JEMCGP-01742F 8

Package
GRT Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
φ21±0.8
ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 2.2.
Hole for Chip : As specified in 2.2.
Base Tape : As specified in 2.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRT32 max.
16.5 max.
10±1.5
φ180+0/-3.0
φ330±2.0
φ50 min.
φ13±0.5
2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01742F 9

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows. (in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1. There are possibly
to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N* in the direction as shown below.
* GRT03:0.05N to 0.5N
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GRT Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165 to 180°
Top tape
JEMCGP-01742F 10