Nexcom Nex 980 User manual

NEXCOM International Co., Ltd.

Published March 2013 www.nexcom.com

Industrial Computing Solutions

Embedded Computing (Industrial Motherboard)

NEX 980

User Manual

Content

Contents

Preface

Disclaimer.............................................................................................. iv

Acknowledgements ............................................................................... iv

Regulatory Compliance Statements........................................................ iv

Declaration of Conformity...................................................................... iv

RoHS Compliance ................................................................................... v

Warranty and RMA ................................................................................ vi

Safety Information ................................................................................viii

Installation Recommendations...............................................................viii

Safety Precautions.................................................................................. ix

Technical Support and Assistance............................................................ x

Conventions Used in this Manual............................................................ x

Global Service Contact Information........................................................ xi

Package Contents.................................................................................xiv

Ordering Information .............................................................................xv

Chapter 1 : Product Introduction

1.1 Package Contents.......................................................................... 2

1.2 Specifications................................................................................. 3

1.3 Motherboard Layout ...................................................................... 5

1.4 I/O Panel........................................................................................ 7

Chapter 2 : Installation

2.1 Screw Holes ................................................................................... 8

2.2 Pre-installation Precautions............................................................. 8

2.3 Installation of Memory Modules (DIMM) ........................................ 9

2.4 Expansion Slot ............................................................................ 11

2.5 Jumpers Setup ............................................................................. 12

2.6 Onboard Headers and Connectors ............................................... 13

2.7 Serial ATA2 (SATA2) / Serial ATA3 (SATA3) Hard Disks Installation . 17

2.8 Hot Plug and Hot Swap Functions for SATA2 / SATA3 HDDs ......... 18

2.9 Driver Installation Guide .............................................................. 19

Chapter 3 : UEFI Setup utility

3.1 Introduction................................................................................... 20

3.1.1 UEFI Menu Bar......................................................................... 20

3.1.2 Navigation Keys....................................................................... 21

3.2 Main Screen................................................................................... 21

3.3 Advanced Screen ........................................................................... 22

3.3.1 CPU Configuration ................................................................. 23

3.3.2 North Bridge Configuration .................................................... 25

3.3.3 South Bridge Configuration.................................................... 26

3.3.4 Storage Configuration............................................................ 27

3.3.5 Intel®Rapid Start Technology .................................................. 28

3.3.6 Intel®Smart Connect Technology............................................ 29

3.3.7 AMT Configuration ................................................................ 30

3.3.8 Super IO Configuration........................................................... 32

3.3.9 ACPI Configuration ................................................................ 33

3.3.10 USB Configuration................................................................. 34

Content

3.3.11 Trusted Computing................................................................ 35

3.3.12 Voltage Configuration ........................................................... 36

3.4 Hardware Health Event Monitoring Screen ..................................... 37

3.5 Boot Screen ................................................................................... 38

3.6 Security Screen .............................................................................. 39

3.7 Exit Screen..................................................................................... 40

Chapter 4 : Software Support

4.1 Install Operating System................................................................. 41

4.2 Support CD Information................................................................. 41

4.2.1 Running Support CD ............................................................... 41

4.2.2 Drivers Menu........................................................................... 41

4.2.3 Utilities Menu.......................................................................... 41

4.2.4 Contact Information................................................................ 41

Preface

PrefaCe

Regulatory Compliance Statements

This section provides the FCC compliance statement for Class A devices

and describes how to keep the system CE compliant.

Declaration of Conformity

FCC

This equipment has been tested and verified to comply with the limits for

a Class A digital device, pursuant to Part 15 of FCC Rules. These limits are

designed to provide reasonable protection against harmful interference

when the equipment is operated in a commercial environment. This

equipment generates, uses, and can radiate radio frequency energy and,

if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications. Operation of this equip-

ment in a residential area (domestic environment) is likely to cause harmful

interference, in which case the user will be required to correct the

interference (take adequate measures) at their own expense.

The product(s) described in this manual complies with all applicable Euro-

pean Union (CE) directives if it has a CE marking. For computer systems to

remain CE compliant, only CE-compliant parts may be used. Maintaining

CE compliance also requires proper cable and cabling techniques.

This publication, including all photographs, illustrations and software, is

part of this manual may be reproduced, copied, translated or transmitted

in any form or by any means without the prior written consent from

NEXCOM International Co., Ltd.

Disclaimer

The information in this document is subject to change without prior notice

and does not represent commitment from NEXCOM International Co., Ltd.

However, users may update their knowledge of any product in use by con-

stantly checking its manual posted on our website: http://www.nexcom.

com. NEXCOM shall not be liable for direct, indirect, special, incidental, or

consequential damages arising out of the use of any product, nor for any

infringements upon the rights of third parties, which may result from such

use. Any implied warranties of merchantability or fitness for any particular

purpose is also disclaimed.

Acknowledgements

NEX 881 is a trademark of NEXCOM International Co., Ltd. All other

product names mentioned herein are registered trademarks of their

respective owners.

Preface

RoHS Compliance

NEXCOM RoHS Environmental Policy and Status

Update

NEXCOM is a global citizen for building the digital infra-

structure. We are committed to providing green products

and services, which are compliant with European Union

RoHS (Restriction on Use of Hazardous Substance in Electronic Equipment)

directive 2002/95/EU, to be your trusted green partner and to protect our

environment.

RoHS restricts the use of Lead (Pb) < 0.1% or 1,000ppm, Mercury (Hg)

< 0.1% or 1,000ppm, Cadmium (Cd) < 0.01% or 100ppm, Hexavalent

Chromium (Cr6+) < 0.1% or 1,000ppm, Polybrominated biphenyls (PBB) <

0.1% or 1,000ppm, and Polybrominated diphenyl Ethers (PBDE) < 0.1% or

1,000ppm.

In order to meet the RoHS compliant directives, NEXCOM has established an

engineering and manufacturing task force in to implement the introduction

of green products. The task force will ensure that we follow the standard

NEXCOM development procedure and that all the new RoHS components

and new manufacturing processes maintain the highest industry quality

levels for which NEXCOM are renowned.

The model selection criteria will be based on market demand. Vendors and

suppliers will ensure that all designed components will be RoHS compliant.

How to recognize NEXCOM RoHS Products?

For existing products where there are non-RoHS and RoHS versions, the suf-

fix “(LF)” will be added to the compliant product name.

All new product models launched after January 2006 will be RoHS compli-

ant. They will use the usual NEXCOM naming convention.

Preface

Warranty and RMA

NEXCOM Warranty Period

NEXCOM manufactures products that are new or equivalent to new in

accordance with industry standard. NEXCOM warrants that products will

be free from defect in material and workmanship for 2 years, beginning

on the date of invoice by NEXCOM. HCP series products (Blade Server)

which are manufactured by NEXCOM are covered by a three year warranty

period.

NEXCOM Return Merchandise Authorization (RMA)

?Customers shall enclose the “NEXCOM RMA Service Form” with the

returned packages.

?Customers must collect all the information about the problems encoun-

tered and note anything abnormal or, print out any on-screen messages,

and describe the problems on the “NEXCOM RMA Service Form” for

the RMA number apply process.

?Customers can send back the faulty products with or without acces-

sories (manuals, cable, etc.) and any components from the card, such as

CPU and RAM. If the components were suspected as part of the prob-

lems, please note clearly which components are included. Otherwise,

NEXCOM is not responsible for the devices/parts.

?Customers are responsible for the safe packaging of defective products,

making sure it is durable enough to be resistant against further damage

and deterioration during transportation. In case of damages occurred

during transportation, the repair is treated as “Out of Warranty.”

?Any products returned by NEXCOM to other locations besides the

customers’ site will bear an extra charge and will be billed to the

customer.

Repair Service Charges for Out-of-Warranty Products

NEXCOM will charge for out-of-warranty products in two categories, one

is basic diagnostic fee and another is component (product) fee.

System Level

?Component fee: NEXCOM will only charge for main components such

as SMD chip, BGA chip, etc. Passive components will be repaired for

free, ex: resistor, capacitor.

?Items will be replaced with NEXCOM products if the original one cannot

be repaired. Ex: motherboard, power supply, etc.

?Replace with 3rd party products if needed.

?If RMA goods can not be repaired, NEXCOM will return it to the

customer without any charge.

Board Level

?Component fee: NEXCOM will only charge for main components, such

as SMD chip, BGA chip, etc. Passive components will be repaired for

free, ex: resistors, capacitors.

?If RMA goods can not be repaired, NEXCOM will return it to the

customer without any charge.

Preface

Warnings

Read and adhere to all warnings, cautions, and notices in this guide and

the documentation supplied with the chassis, power supply, and accessory

modules. If the instructions for the chassis and power supply are incon-

sistent with these instructions or the instructions for accessory modules,

contact the supplier to find out how you can ensure that your computer

meets safety and regulatory requirements.

Cautions

Electrostatic discharge (ESD) can damage system components. Do the de-

scribed procedures only at an ESD workstation. If no such station is avail-

able, you can provide some ESD protection by wearing an antistatic wrist

strap and attaching it to a metal part of the computer chassis.

Safety Information

Before installing and using the device, note the following precautions:

▪Read all instructions carefully.

▪Do not place the unit on an unstable surface, cart, or stand.

▪Follow all warnings and cautions in this manual.

▪When replacing parts, ensure that your service technician uses parts

specified by the manufacturer.

▪Avoid using the system near water, in direct sunlight, or near a heating

device.

▪The load of the system unit does not solely rely for support from the

rackmounts located on the sides. Firm support from the bottom is highly

necessary in order to provide balance stability.

▪The computer is provided with a battery-powered real-time clock circuit.

There is a danger of explosion if battery is incorrectly replaced. Replace

only with the same or equivalent type recommended by the manufactur-

er. Discard used batteries according to the manufacturer’s instructions.

Installation Recommendations

Ensure you have a stable, clean working environment. Dust and dirt can

get into components and cause a malfunction. Use containers to keep

small components separated.

Adequate lighting and proper tools can prevent you from accidentally

damaging the internal components. Most of the procedures that follow

require only a few simple tools, including the following:

• A Philips screwdriver

• A flat-tipped screwdriver

• A grounding strap

• An anti-static pad

Using your fingers can disconnect most of the connections. It is recom-

mended that you do not use needlenose pliers to disconnect connections

as these can damage the soft metal or plastic parts of the connectors.

Preface

Safety Precautions

1. Read these safety instructions carefully.

2. Keep this User Manual for later reference.

3. Disconnect the equipment from an AC power outlet prior to install-

ing a component inside the chassis.

4. To prevent electrostatic build-up, leave the board in its anti-static bag

until you are ready to install it.

5. Keep the board away from humidity.

6. Put the board on a stable surface. Dropping it or letting it fall may

cause damage.

7. Do not leave the board in either an unconditioned environment or in

a above 60oC storage temperature as this may damage the board.

8. Wear an antistatic wrist strap.

9. Do all preparation work on a static-free surface.

10. Hold the board only by its edges. Be careful not to touch any of the

components, contacts or connections.

11. All cautions and warnings on the board should be noted.

12. Use the correct mounting screws and do not over tighten the screws.

13. Keep the original packaging and the anti-static bag; in case the

board has to be returned for repair or replacement.

Preface

Conventions Used in this Manual

Warning: Information about certain situations, which if not

observed, can cause personal injury. This will prevent injury to

yourself when performing a task.

Caution: Information to avoid damaging components or losing

data.

Note: Provides additional information to complete a task easily.

Technical Support and Assistance

1. For the most updated information of NEXCOM products, visit NEX-

COM’s website at www.nexcom.com.

2. For technical issues that require contacting our technical support team

or sales representative, please have the following information ready

before calling:

– Product name and serial number

– Detailed information of the peripheral devices

– Detailed information of the installed software (operating system,

version, application software, etc.)

– A complete description of the problem

– The exact wordings of the error messages

Preface

Headquarters

NEXCOM International Co., Ltd.

15F, No. 920, Chung-Cheng Rd.,

ZhongHe District, New Taipei City, 23586,

Taiwan, R.O.C.

Tel: +886-2-8226-7786

Fax: +886-2-8226-7782

www.nexcom.com

America

USA

NEXCOM USA

2883 Bayview Drive,Fremont CA 94538,

USA

Tel: +1-510-656-2248

Fax: +1-510-656-2158

Email: [email protected]

www.nexcom.com

Asia

Taiwan

Central Taiwan Office

16F, No.250, Sec. 2, Chongde Rd.,

Beitun Dist., Taichung City 406, R.O.C.

Tel: +886-4-2249-1179

Fax: +886-4-2249-1172

Email: [email protected]

www.nexcom.com.tw

Global Service Contact Information

Japan

NEXCOM Japan

9F, Tamachi Hara Bldg.,4-11-5, Shiba Minato-ku,

Tokyo, 108-0014, Japan

Tel: +81-3-5419-7830

Fax: +81-3-5419-7832

Email: [email protected]

www.nexcom-jp.com

China

NEXCOM China

2F, Block 4, Venus Plaza, Bldg. 21,

ZhongGuanCun Software Park, No. 8,

Dongbeiwang West Rd., Haidian District,

Beijing, 100193, China

Tel: +86-10-8282-5880

Fax: +86-10-8282-5955

Email: [email protected]

www.nexcom.cn

Shanghai Office

Room 1505, Greenland He Chuang Bldg.,

No. 450 Caoyang Rd.,

Shanghai, 200062, China

Tel: +86-21-6150-8008

Fax: +86-21-3251-6358

Email: [email protected]

www.nexcom.cn

Nanjing Office

Hall C, Block 17, Tian Xing Cui Lang Bldg.,

No. 49 Yunnan North Rd.,

Nanjing, 210018, China

Tel: +86-25-8315-3486

Fax: +86-25-8315-3489

Email: [email protected]

www.nexcom.cn

Shenzhen Office

Western Room 708, Block 210,

Tairan Industry & Trading Place,

Futian Area, Shenzhen,

518040, China

Tel: +86-755-8332-7203

Fax: +86-755-8332-7213

Email: [email protected]

www.nexcom.cn

Wuhan Office

1-C1804/ 1805, Mingze Liwan,

No. 519 South Luoshi Rd.,

Hongshan District,

Wuhan, 430070, China

Tel: +86-27-8722-7400

Fax: +86-27-8722-7400

Email: [email protected]

www.nexcom.cn

Preface

Chengdu Office

9F, Shuxiangxie, Xuefu Garden,

No.12 Section 1, South Yihuan Rd.,

Chengdu, 610061, China

Tel: +86-28-8523-0186

Fax: +86-28-8523-0186

Email: [email protected]

www.nexcom.cn

Europe

France

NEXCOM France

La Grande Arche-Paroi Nord,

92044 Paris La Défense, France

Tel: +33 (0) 1 40 90 33 35

Fax: +33 (0) 1 40 90 31 01

Email: [email protected]

www.nexcom.eu

Germany

NEXCOM GmbH

Leopoldstraße Business Centre,

Leopoldstraße 244,

80807 Munich, Germany

Tel: +49-89-208039-278

Fax: +49-89-208039-279

Email: [email protected]

www.nexcom.eu

Italy

NEXCOM ITALIA S.r.l

Via Gaudenzio Ferrari 29,

21047 Saronno (VA), Italia

Tel: +39 02 9628 0333

Fax: +39 02 9286 9215

Email: [email protected]

www.nexcomitalia.it

United Kingdom

NEXCOM EUROPE

10 Vincent Avenue,

Crownhill Business Centre,

Milton Keynes, Buckinghamshire MK8 0AB,

United Kingdom

Tel: +44-1908-267121

Fax: +44-1908-262042

Email: [email protected]

www.nexcom.eu

Chapter 1: Product Introduction

ChaPter 1: ProduCt IntroduCtIon

Thank you for purchasing NEXCOM NEX 980 motherboard, a reliable

motherboard produced under NEXCOM’s consistently stringent quality

control. It delivers excellent performance with robust design conforming to

NEXCOM’s commitment to quality and endurance.

In this manual, chapter 1 and 2 contain introduction of the motherboard and

step-by-step guide to the hardware installation. Chapter 3 and 4 contain the

configuration guide to BIOS setup and information of the Support CD.

Because the motherboard specifications and the BIOS software

might be updated, the content of this manual will be subject to

change without notice.

In case any modifications of this manual occur, the updated

version will be available on NEXCOM website without further

notice. You may find the latest VGA cards and CPU support lists

on NEXCOM website as well.

NEXCOM website http://www.nexcom.com

If you require technical support related to this motherboard,

please visit our website for specific information about the model

you are using.

Chapter 1: Product Introduction

1.1 Package Contents

NEXCOM NEX 980 Motherboard

(ATX Form Factor: 12.0-in x 9.6-in, 30.5 cm x 24.4 cm)

NEXCOM NEX 980 Driver CD

NEXCOM NEX 980 Jumper setting instruction

1 x I/O Panel Shield

NEXCOM Reminds You...

To get better performance in Windows®8/ 8 64-bit/ 7/ 7

64-bit, it is recommended to set the BIOS option in Storage

Configuration to AHCI mode.

Chapter 1: Product Introduction

1.2 Specifications

Form Factor Dimensions ATX (12.0-in x 9.6-in)

Processor

System

CPU Socket LGA1155 for Intel®Core™ i7/i5/i3/

Celeron®(Sandy Bridge and Ivy Bridge)

Core

Number (By CPU, Max 4)

Max Speed (By CPU)

L3 Cache (By CPU)

Chipset Q77

BIOS UEFI

Expansion Slot

PCI 4

Mini-PCIE 1

PCIE 1 (x16) + 1 (x1) + 1 (x4)

CF Card

Socket 0

CFast Card

Socket 1

Memory

Technology Dual Channel DDR3 1066/1333/1600 MHz

SDRAM

Max. 32GB

Socket Long DIMM x 4

Graphics

Controller Intel®HD Graphics (By CPU)

VRAM Shared Memory

DSub Support max resolution 2048x1536

LVDS N/A

HDMI Support HDMI 1.4a, max resolution

1920x1200

DVI N/A

Display Port Support max resolution 2560x1600

Multi

Display Yes

Ethernet

Interface 10/100/1000 Mbps

Controller GbE LAN1:Intel®82579LM/V, LAN2:

Intel®82583V

Controller RJ-45 x 2 w/ LED

SATA

Max Data

Transfer

Rate

SATA2 X2 (3.0Gb/S), SATA3 X2 (6.0Gb/S),

Support RAID0/1/5/10

Rear I/O

VGA 1

HDMI 1

DVI 0

Display Port 1

Ethernet 2

USB 6 (USB 2.0 x4, USB 3.0 x2)

Audio 3 (Mic-In, Line-Out, Line-In)

Serial 2 (RS-232/422/485)

PS/2 1 (Combo)

Internal

Connector

USB 7 (USB 2.0 x4, USB 3.0 x2; Vertical Type

x1 )

LVDS/

Inverter 0

VGA 1

Serial 4 (RS-232)

SATA 4 (SATA2 X2, SATA3 X2), Support RAID

0/1/5/10

m-SATA 1

Mini-PCIE 1 (Support half-size card)

Parallel 1

IrDA 0

GPIO 4 x GPI + 4 x GPO

SATA PWR

Output Con 2

Speaker

Header 1

Chapter 1: Product Introduction

Watchdog

Timer

Output Output from super I/O to drag RESETCON#

Interval 256 Segments, 0,1,2…255 Sec/Min

Power

Requirements

Input PWR ATX PWR (8 + 24)

Power On

AT/ATX Supported

-AT : Directly PWR on as power input ready

-ATX : Press button to PWR on after power

input ready

Environment Temperature 0ºC – 60ºC

NEX 980 User Manual

Chapter 1: Product Introduction

1.3 Motherboard Layout

AT XPWR1

Intel

Q7 7

DDR3_A2 (64 bi t , 2 40 -pi n m od ule )

DDR3_A1 (64 bi t , 2 4 0- pin mo du le )

DDR3_B2 (64 bi t , 2 4 0-p in mo dul e )

DDR3_B1 (64 bi t , 2 4 0-p in mo dul e )

PCI1

PCIE 1

HD_AUDIO1

COM6

COM5

COM3

COM4

CMOS

Battery

HDLEDRESET

PLED PWRBTN

PANEL1

Supe r

I/O

SA TA 2_2

SA TA 3_0

SA TA 3_1SATA2_3

CLRCMOS 1

CHA_F AN2

64Mb

BIOS

CPU_FAN1

CPU_FAN2

24.4cm(9.6in)

30.5cm (12.0 in)

USB8_9

USB10_11

CI 1

CI 2

JGPIO_PWR1

PWR_JP 1

LPT1

SET_CM1

SET_CM2

SET_CM6

SET_CM5

BUZZ1

MINI_S AT A1

JPWR 1JPWR 2

USB12

JG PIO1

USB3_2_3

12345679

3031

323334

RoHS

Top:

RJ-45

US B2.0

T: USB4

B: USB 5

Top:

RJ-45

US B3.0

T: USB 0

B: USB 1

US B2.0

T: USB 6

B: USB 7

HDM I

Top:

Line In

Center:

Line Out

Bottom:

MicIn

COM2

VGA1

COM1

PS2

Keyboard

/Mouse

DISPL AY 1

MINI_PCIE1

PCIE 2

PCIE 3

PCI2

PCI3

AT X 1 2V 1

CHA_F AN1

TPM1

SET_CM4

SET_CM3

PCI4

AUDI O

CODE C

LA N

1 COM Port Signal/Power Setting Jumper (For COM1)

2 COM Port Signal/Power Setting Jumper (For COM2)

3 ATX 12V Power Connector

4 3-Pin CPU FAN Connector (+12V)

5 4-Pin CPU FAN Connector (+12V)

6 CPU Socket

7 Flash Memory (64Mb)

8 2 x 240-pin DDR3 DIMM Slots (DDR3_A1, DDR3_B1)

9 2 x 240-pin DDR3 DIMM Slots (DDR3_A2, DDR3_B2)

10 24-pin ATX Power Input Connector

11 RS232 Port 4 Pin Header (COM6)

12 RS-232 Port 4 Pin Header (COM5)

13 RS-232 Port 4 Pin Header (COM4)

14 RS-232 Port 4 Pin Header (COM3)

15 COM Port Signal/Power Setting Jumper (For COM6)

16 COM Port Signal/Power Setting Jumper (For COM4)

17 COM Port Signal/Power Setting Jumper (For COM3)

18 COM Port Signal/Power Setting Jumper (For COM5)

19 Mini-PCIe Slot

20 Digital Input/ Output Power Select

21 Mini-SATA Slot

22 ATX/AT Mode Selection

23 CFast Card Socket

24 System Panel Header

25 SATA Power Connector 2

26 SATA Power Connector 1

27 SATA2 Connector (SATA2_2)

28 SATA2 Connector (SATA2_3)

29 SATA3 Connector (SATA3_1)

30 SATA3 Connector (SATA3_0)

31 TPM Header

Chapter 1: Product Introduction

32 Intel®Q77 Chipset

33 Printer Port Header

34 USB2.0 Port (USB12)

35 USB3.0 Header (USB3_2_3)

36 USB2.0 Header (USB10_11)

37 USB2.0 Header (USB8_9)

38 Chassis Intrusion Header 2

39 Clear CMOS Header

40 Front Panel Audio Header

41 Chassis Intrusion Header 1

42 PCI Slot

43 PCI Express Slot

44 PCI Slot

45 PCI Slot

46 PCI Express Slot

47 PCI Slot

48 Digital Input/ Output Pin Header

49 PCI Express Slot

50 4-Pin Chassis FAN Connector (+12V)

51 3-Pin Chassis FAN Connector (+12V)

Chapter 1: Product Introduction

Activity/ Link LED SPEED LED

Status Description Status Description

Off No Link Off 10Mbps connection

Blinking Data Activity Orange 100Mbps connection

On Link Green 1Gbps connection

LAN Port LED Indications

ACT/LINK

LED

SPEED

LED

LAN Port

* There are two LED next to the LAN port. Please refer to the table below for the LAN port LED

indications.

1.4 I/O Panel

1 COM Port (COM1)

2 COM Port (COM2)

* 3 LAN RJ-45 Port

4 USB 2.0 Ports (USB67)

* 5 LAN RJ-45 Port

6 Line In (Light Blue)

7 Line out (Lime)

8 Microphone (Pink)

9 USB 3.0 Ports (USB3_01)

10 HDMI Port (HDMI1)

11 USB 2.0 Ports (USB45)

12 D-Sub Port (VGA1)

13 PS/2 Mouse/Keyboard Port

** 14 DisplayPort (DP1)

Chapter 2 : Installation

ChaPter 2 : InstallatIon

This is an ATX form factor (12.0” x 9.6”, 30.5 x 24.4 cm) motherboard.

Before you install the motherboard, study the configuration of your chassis

to ensure that the motherboard fits into it.

Make sure to unplug the power cord before installing or

removing the motherboard. Failure to do so may cause physical

injuries to you and damages to motherboard components.

2.2 Pre-installation Precautions

Take note of the following precautions before you install motherboard

components or change any motherboard settings.

▪Unplug the power cord from the wall socket before touching any

components.

▪To avoid damaging the motherboard’s components due to static electricity,

NEVER place your motherboard directly on the carpet or the like. Also

2.1 Screw Holes

Place screws into the holes to secure the motherboard to the chassis.

Do not over-tighten the screws! Doing so may damage the

motherboard.

remember to use a grounded wrist strap or touch a safety grounded

object before you handle the components.

▪Hold components by the edges and do not touch the ICs.

▪Whenever you uninstall any component, place it on a grounded antistatic

pad or in the bag that comes with the component.

Before you install or remove any component, ensure that the

power is switched off or the power cord is detached from the

power supply. Failure to do so may cause severe damage to the

motherboard, peripherals, and/or components.

Chapter 2 : Installation

2.3 Installation of Memory Modules

(DIMM)

This motherboard provides four 240-pin DDR3 (Double Data Rate 3) DIMM

slots, and supports Dual Channel Memory Technology. For dual channel

configuration, you always need to install identical (the same brand, speed,

size and chip-type) DDR3 DIMM pair in the slots of the same color. In

other words, you have to install identical DDR3 DIMM pair in Dual Channel

(DDR3_A1 and DDR3_B1; Blue slots) or identical DDR3 DIMM pair in Dual

Channel (DDR3_A2 and DDR3_B2; White slots), so that Dual Channel

Memory Technology can be activated. This motherboard also allows you to

install four DDR3 DIMMs for dual channel configuration, and please install

identical DDR3 DIMMs in all four slots. You may refer to the Dual Channel

Memory Configuration Table below.

Dual Channel Memory Configuration

DDR3_A1

(Blue Slot)

DDR3_A2

(White Slot)

DDR3_B1

(Blue Slot)

DDR3_B2

(White Slot)

(1) Populated - Populated -

(2) - Populated - Populated

(3)* Populated Populated Populated Populated

* For configuration (3), please install identical DDR3 DIMMs in all four slots.

1. If you want to install two memory modules, for optimal

compatibility and reliability, it is recommended to install them

in the slots of the same color. In other words, install them

either in the set of blue slots (DDR3_A1 and DDR3_B1), or in

the set of white slots (DDR3_A2 and DDR3_B2).

2. If only one memory module or three memory modules are

installed in the DDR3 DIMM slots on this motherboard, it is

unable to activate the Dual Channel Memory Technology.

3. If a pair of memory modules is NOT installed in the same Dual

Channel, for example, installing a pair of memory modules

in DDR3_A1 and DDR3_A2, it is unable to activate the Dual

Channel Memory Technology .

4. It is not allowed to install a DDR or DDR2 memory module

into DDR3 slot; otherwise, this motherboard and DIMM may

be damaged.

5. Some DDR3 1GB double-sided DIMMs with 16 chips may not

work on this motherboard. It is not recommended to install

them on this motherboard.

Table of contents

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