Numatics G3 Series EtherNet/IP User manual

G3 Series
EtherNet/IPTM
Technical Manual

G3 Series EtherNet/IPTM Technical Manual
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Conditions for use of this product
(1) ASCO Numatics G3 Manifold ("the PRODUCT") shall be used in conditions;
i) Where any problem, fault or failure occurring in the PRODUCT, if any, shall not lead to any major or serious accident.
ii) Where the backup and fail-safe function are systematically or automatically provided outside of the PRODUCT for the case of
any problem, fault or failure occurring in the PRODUCT.
(2) The PRODUCT has been designed and manufactured for the purpose of being used in general industries.
ASCO Numatics shall have no responsibility or liability including but not limited to any and all responsibility or liability based on
contract, warranty, tort, product liability for any injury or death to persons, loss or damage to property caused by the product
that are operated or used in application not intended or excluded by instructions, precautions or warnings contained in ASCO
Numatics Technical, User, Instruction, Safety manuals or bulletins.
Safety precautions
Before using this product, please read this manual and the relevant manuals carefully and pay attention to safety and product
application. The following symbols are used in the manual to identify important safety, installation and application information.
Caution symbol indicates a possible hazard which may cause injury or equipment damage.
Note symbol indicates important information regarding equipment installation and setup
NOTE!
CAUTION

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Electrical installation and operational guidelines
•To be connected to Class 2 power source only.
•All ASCO Numatics communication nodes should be grounded during the installation process. These grounding
guidelines can be found in National Electrical code IEC 60204-1 or EN 60204-1.
•All ASCO Numatics G3 Electronics Products to be installed or wired in accordance with ASCO Numatics’ published
instructions and applicable electrical codes.
•MULTIPLE CLASS 2 POWER SOURCES: When interconnects, class 2 sources shall be Listed and rated suitable for
parallel interconnection.
•Sources shall be Listed and rated suitable for parallel interconnection.
•CLASS 2 WIRING: All field wiring shall be suitable for Class 1, Electric Light and Power, or Class 2, 3 wirings are routed
separately and secured to maintain separation between 1) Class 2 wiring and all other class wiring, and 2) Limited
energy circuit conductors from unlimited energy circuit conductors.
•Class 2 Device Wiring Only – Do Not Reclassify and Install as Class 1, 3 or Power and Lighting Wiring.
•When using molded connector power cables, Do Not rely on wire colors for Pin-Out. Always use pin number
references.
•Wire connections shall be rated suitable for the wire size (lead and building wiring) employed.
•MULTIPLE CLASS 2 POWER SOURCES: When interconnects, class 2 sources shall be Listed and rated suitable for
parallel interconnection.
•Sources shall be Listed and rated suitable for parallel interconnection.
CAUTION

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Table of Contents
1. About EtherNet/IPTM......................................................................................................................................... 1-6
1.1 Overview ................................................................................................................................................ 1-6
1.2 G3 EtherNet/IPTM Features ........................................................................................................................ 1-6
1.3 G3 EtherNet/IPTM Performance Data ........................................................................................................... 1-6
2. G3 Introduction ................................................................................................................................................ 2-7
2.1 G3 Electronics Modularity.......................................................................................................................... 2-8
2.2 500 Series Pneumatic Valve Manifold ......................................................................................................... 2-9
2.3 500 Series Manifold Stations ................................................................................................................... 2-10
2.4 500 series Z-Board™Connectors ............................................................................................................. 2-11
2.5 2000 Series Pneumatic Valve Manifold...................................................................................................... 2-12
2.6 2000 Series Z-Board™Connectors........................................................................................................... 2-13
2.7 2000 Series Z-Board™and Ribbon Cable Example ..................................................................................... 2-14
2.8 2000 Series Z-Board™and Valve Side Sub-D Example .............................................................................. 2-15
3. Zoned Power ...................................................................................................................................................3-16
3.1 503 Series Zoned Power application ......................................................................................................... 3-16
3.2 503 Series Zoned Power example ............................................................................................................ 3-17
4. Communication Module ...................................................................................................................................4-18
4.1 EtherNet/IPTM Communication Module (Node) ............................................................................................ 4-18
4.2 Communication Module Description.......................................................................................................... 4-19
4.3 Connector Pin-Outs ................................................................................................................................ 4-20
4.4 Electrical Connections............................................................................................................................. 4-21
4.5 Ground Wiring ....................................................................................................................................... 4-23
4.6 Power Consumption ............................................................................................................................... 4-24
4.7 Diagnostics ........................................................................................................................................... 4-26
5. G3 Graphic Display ..........................................................................................................................................5-28
5.1 Main Menu Structure .............................................................................................................................. 5-29
5.2 IP Address ............................................................................................................................................ 5-30
5.3 Subnet Mask ......................................................................................................................................... 5-31
5.4 Gateway IP ........................................................................................................................................... 5-32
5.5 DHCP-BOOTP ........................................................................................................................................ 5-33
5.6 Web-Server .......................................................................................................................................... 5-34
5.7 MAC Address ......................................................................................................................................... 5-35
5.8 Advanced Settings - I/O Diag. Menu......................................................................................................... 5-36
5.9 Advanced Settings – Node Diagnostics (Diagnostic Word) ........................................................................... 5-37
5.10 Advanced Settings – Comm. Fault............................................................................................................ 5-38
5.11 Advanced Settings - Brightness ............................................................................................................... 5-39
5.12 Advanced Settings – Flip Display ............................................................................................................. 5-40
5.13 Advanced Settings – Parameters Lock ...................................................................................................... 5-41
5.14 Advanced Settings – Configuration Lock ................................................................................................... 5-42
5.15 Factory Defaults .................................................................................................................................... 5-43
5.16 Diagnostics ........................................................................................................................................... 5-44
5.17 Diagnostics - Self Test Mode ................................................................................................................... 5-45
5.18 Error Messages...................................................................................................................................... 5-46
6. ARM – Auto Recovery Module (Optional) .........................................................................................................6-47
6.1 ARM process flowchart............................................................................................................................ 6-48
7. Distribution .....................................................................................................................................................7-49
7.1 Sub-Bus Distribution Modules.................................................................................................................. 7-50
7.2 Sub-Bus Cables ..................................................................................................................................... 7-56
8. Digital I/O Module...........................................................................................................................................8-58
8.1 Digital I/O Module Usage ........................................................................................................................ 8-58
8.2 I/O Module Technical Data ...................................................................................................................... 8-59
8.3 I/O Module Descriptions and Menus.......................................................................................................... 8-60
8.4 Digital Input Modules ............................................................................................................................. 8-61
8.5 Digital Output Modules ........................................................................................................................... 8-69
8.6 Digital Input/Output Modules .................................................................................................................. 8-73
8.7 Sub-bus Valve Module ............................................................................................................................ 8-76
8.8 Sub-bus Valve Module without Distribution and I/O.................................................................................... 8-78
8.9 Valve Side Digital Output Module ............................................................................................................. 8-79
9. Analog I/O Modules ........................................................................................................................................9-80
9.1 Analog I/O Module Rules......................................................................................................................... 9-80
9.2 Analog Graphic Display........................................................................................................................... 9-84

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9.3 Analog Module / Self Test Mode ............................................................................................................... 9-87
9.4 Analog Module / Factory Defaults............................................................................................................. 9-88
10. Specialty Modules........................................................................................................................................10-89
10.1 RTD Module ........................................................................................................................................ 10-89
10.2 Sub-Bus Hub Module...........................................................................................................................10-100
11. I/O Module Wiring Diagrams.....................................................................................................................11-108
11.1 NPN/PNP Definitions...........................................................................................................................11-108
12. EtherNet/IPTM G3 Web Server ...................................................................................................................12-110
12.1 Integrated Web Page Configuration.......................................................................................................12-110
12.2 Connecting to a G3 Series EtherNet/IPTM Node (Windows 7) .....................................................................12-110
12.3 Connecting to a G3 Series EtherNet/IPTM Node (Windows 10) ...................................................................12-115
12.4 EtherNet/IPTM Web Server functionality..................................................................................................12-120
12.5 IP Address Configuration .....................................................................................................................12-129
12.6 Configuration with RSLogix 5000 ..........................................................................................................12-130
12.7 User Configurable Device Parameters ....................................................................................................12-132
12.8 Communication Fault/Idle Mode Parameter ............................................................................................12-133
13. EtherNet/IPTM Mapping..............................................................................................................................13-134
13.1 I/O Sizes ...........................................................................................................................................13-134
13.2 Manifold and I/O Data Sizing Worksheet ................................................................................................13-135
13.3 Bit Mapping Rules ...............................................................................................................................13-136
13.4 Example No. 1....................................................................................................................................13-137
13.5 Example No. 2....................................................................................................................................13-139
13.6 Example No. 3....................................................................................................................................13-141
13.7 Example No. 4....................................................................................................................................13-143
13.8 Example No. 5....................................................................................................................................13-145
13.9 I/O Mapped Diagnostic Word................................................................................................................13-147
14. Appendix ...................................................................................................................................................14-149
14.1 System Specifications..........................................................................................................................14-149
14.2 Factory Default Settings ......................................................................................................................14-150
14.3 Troubleshooting..................................................................................................................................14-151
14.4 Glossary of Terms...............................................................................................................................14-152
14.5 Technical Support ...............................................................................................................................14-154

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1. About EtherNet/IPTM
1.1 Overview
EtherNet/IPTM is a communication protocol that uses the same network technology that can be found in commercial and
domestic operations worldwide, but has added benefits/features toward manufacturing applications. It is a CIP (common
industrial protocol) Network that follows the Open Systems Interconnection (OSI) model.
The ODVA (Open DeviceNet Vendor Association) is an independent organization that governs the EtherNet/IPTM specification
and oversees conformance testing for products.
EtherNet/IPTM uses industrial M12 IP67-rated connectors. The protocol can transfer data at two interface speeds of 10 Mbps and
100 Mbps. Maximum network cabling distance is limited to 100m segments at 20º C.
More information about EtherNet/IPTM and ODVA can be obtained from the ODVA web site www.odva.org.
1.2 G3 EtherNet/IPTM Features
1.3 G3 EtherNet/IPTM Performance Data
Features Description
EtherNet/IP
TM
Spec.
Supported Designed to EtherNet/IPTM Specification
Bus Topology Star and Multi-Star
Baud Rates Supported 10/100 Mbps and Autobaud
CE CE Compliant
Duplicate Address Detection If a duplicate address is detected on power up, duplicates will not
progress to run mode
Address Setting Via DHCP/BOOTP, Web Page Configuration, or Graphical Display
Duplex Half and Full supported
Conformance Tested Tested by ODVA for conformance
Protocols supported ACD, ARP, DHCP, HTTP, TCP/IP, UDP
Features Description
CIP connections consumed 1
CIP connections available 16
Packets per second (PPS) 10,000
RPI ≥ 5ms
Connection Type Multicast, Unicast

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2. G3 Introduction
The G3 Series is an electronic product platform that features an integrated graphic display for simple commissioning and
displaying of diagnostic information. In addition, it has an innovative distribution capability which allows the same I/O
components that make up a centralized manifold configuration to be used as the distribution components as well, decreasing
the need for duplicate components on centralized and distributed applications. The G3 platform interfaces to a variety of valve
series and fieldbus interface protocols and is capable of addressing a total of 1200 I/O points (150 bytes). With proper
assembly and termination, the G3 modules will have an IP65 / IP67 rating.
The manifold can be viewed as having two sections to it, the Valve Side and the Discrete I/O Side. The Valve Side supports a
maximum of 32 solenoid coils and the Discrete I/O Side supports a maximum of 16 modules capable of addressing up to 1200
outputs, 1200 inputs or various combinations.
Various discrete modules with integrated graphic display are available. They include digital I/O, analog I/O, and specialty
modules which cover various application needs. Pin-outs for all connectors are labeled on the side of the respective modules
and are also detailed in the module section of this document.
This manual details specific information for configuring and commissioning the ASCO Numatics G3 Series product line. For
more information relating to pneumatic valves and valve manifold assemblies, please refer to the Numatics “In Control “catalog
at www.asco.com.
Discrete I/O Side
Accepts up to 16 modules in
centralized or distributed
configuration
Communication Module (Node
)
Available with various
Industrial protocols
Sub
-
Bus OUT
Used to distribute
additional I/O and
manifolds
Valve Side
Drives up to 32 coils
Clips
Allows easy field changes of
electronic modules.
Graphic Display
Allows Easy
Configuration &
Diagnostic reporting
ARM
(Auto Recovery Module)
Automatically stores & reprograms
configuration information

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2.1 G3 Electronics Modularity
Discrete I/O
The G3 Series product line is a completely modular and scalable system. As shown below, all of the G3 electronic modules plug
together, via mechanical clips, allowing for easy assembly and field changes.

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2.2 500 Series Pneumatic Valve Manifold
The pneumatic valve manifold with internal circuit board technology is also modular. The valve solenoid coil connections are
automatically made using Z-Board™technology (plug together PC boards), which allow internal connection from solenoid coils to
output drivers without the use of wires). This allows easy assembly and field changes.

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2.3 500 Series Manifold Stations
Solenoid Coil Connections using Z-Board™Technology for 501/502/503 valve series
Z-Board™plug-together technology connects all valve solenoids to the valve coil output driver board, located in the valve
adapter. There is a maximum of 32 coil outputs available on the complete manifold assemblies. The 32 available outputs are
accessed on the 501 series valves utilizing 4 station manifolds and on the 502 and 503 series utilizing 2 station manifolds.
NOTE!
14 Solenoid,
Pin No. 1
Common,
Pin No. 4
12 Solenoid,
Pin No. 2
Not Used,
Pin No. 3
A single solenoid valve’s coil is always on the “14” end.

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2.4 500 series Z-Board™Connectors
The 501, 502 and 503 valve series utilize 2 different Z-Board™designs to achieve the single and double solenoid
output functions. This yields the possible 32 single, 16 double, or various combinations of valve coil output
capabilities.
501 Series 502 Series
503 Series

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2.5 2000 Series Pneumatic Valve Manifold
The pneumatic valve manifold with internal circuit board technology is also modular. The valve solenoid coil
connections are automatically made using Z-Board™technology (plug together PC boards), which allow internal
connection from solenoid coils to output drivers without the use of wires). This allows easy assembly and field
changes.

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2.6 2000 Series Z-Board™Connectors
The 2005/2012/2035 valve series utilize 2 different Z-Board™designs to achieve the single and double solenoid
output functions. This yields the possible 32 single, 16 double, or various combinations of valve coil output
capabilities.
Single Z-Board™Double Z-Board™
Ribbon Connection
Single Z-Board™
Ribbon Connection
Double Z-Board™
single double
The 17th solenoid (output group No. 2’s first bit) must be accessed via either
the valve side Sub-D output module or a ribbon connector type Z-board.
NOTE!

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2.7 2000 Series Z-Board™and Ribbon Cable Example
If fourteen (14) single solenoid and one (1) double solenoid valves are connected directly to the communication
node via their Z-Boards™, and one (1) single solenoid and four (4) double solenoid valves are connected to the
communication node via the ribbon cable, the following would be the valve side bit map:
Output Word 0 1
Output Byte 0 1 2 3
Output Bit No. 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
Solenoid Coil
Output No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 n/a
NOTE!
The ribbon cable and valve side Sub
-
D examples do not apply to 501,502 or 503 series
.

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2.8 2000 Series Z-Board™and Valve Side Sub-D Example
If sixteen (16) single solenoid valves are connected directly to the communication node via Z-Boards™and a valve
side Sub-D connector is connected to the communication node via the output Group No. 2 connector then the
following would be the valve side bit map:
Output Word 0 1
Output Byte 0 1 2 3
Output Bit No. 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
Solenoid Coil
Output No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

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3. Zoned Power
3.1 503 Series Zoned Power application
The Zoned Power Manifold blocks can be incorporated into a 503 Series manifold assembly to
isolate Power to a number of valve stations, independent from the main power of the
manifold. This is achieved by the integral 4-Pin M12 connector along with the modified
manifold board. The total number of Zoned Power Manifold blocks is determined by the
maximum solenoid outputs as defined by the type of interface (e.g. G3 Electronics, Terminal
Strip, D-Sub). For user flexibility, the Zoned Power Manifold blocks are available in both
"proprietary" and "ISO" versions and can be ordered with the M12 connector starting at the
first or second station.
Technical Data
Electrical Data
:
Voltage:
24 VDC (0 VDC must be common
with main power)
Connection:
4
-
Pin M12 Single Key Male
Environmental:
IP65 (with proper connection)
V Wiring Option
W Wiring Option
V
W
W & V Connector Pin Out

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3.2 503 Series Zoned Power example
In the example shown below there are two Zoned Power Manifold blocks used. One is a "W" wiring option and the
other is a "V" wiring option. The first (5) stations of the manifold assembly get their power from the M12 4-Pin
connector at station one. The next (5) stations get their power from the M12 4-Pin connector at station six. Each
of these "Zones" can be individually switched off if the machine or process requires. This example is considered a
manifold with (2) Power Zones. The Main Power (7/8" MINI) cannot be considered or used as a Power Zone;
Switched Power (Solenoid/Output Power) MUST be present for control to the solenoids.
S+
S
NC
S+
S-
NC
S+
S-
NC
24 VDC
V Wiring Option W Wiring Option
N
o
d
e
&
I
n
p
u
t
V
a
l
v
e
&
O
u
t
p
u
t
The 0 VDC reference for the +24 VDC applied to Pin 4 of the M12 connector MUST be the same
as the one used on G3/580/Terminal Strip/25 or 37 Pin Sub-D/19 or 26 Pin Round Connector.
If multiple 24 VDC power supplies are used the 0 VDC references of each supply MUST be
common.
NOTE!

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4. Communication Module
4.1 EtherNet/IPTM Communication Module (Node)
This module is the communication interface to the manifold. It contains communication electronics and internal short
circuit protection for power. It can be configured via software, via the graphic display or manually via DIP switches
through the optional Manual Configuration Module (MCM).
Communication Module Kit Part Number
EtherNet/IPTM Communication Module 240-181

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4.2 Communication Module Description
Detail No. Description
1 “Set” Button – used to navigate through user menus and to set parameters
2 Activity/Link Status LED
3 4 Pin M12 D-Coded Female Communication Connector
4 Mounting Hole
5 “Next” Button – used to navigate through user menus and to set parameters
6 Graphic Display – used to display parameter information
7 Network Status LED
8 Slot for text ID tags
9 Keying for preventing I/O module insertion
10 4 Pin MINI Male Power Connector
6
9
8
7
3
10
4
1
2
5

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4.3 Connector Pin-Outs
Industry standard connectors are used for communication and auxiliary power. The EtherNet/IPTM communication
connector is a D-coded keyway 4 pin female M12 connector. The Power connector is a single keyway
4-pin male 7/8” MINI connector.
EtherNet/IPTM Communication Connector Pin-Out
Pin No. Function Description
1 TX+ Positive Transmit Line
2 RX+ Positive Receive Line
3 TX- Negative Transmit Line
4 RX- Negative Receive Line
Power Connector with Cenelec Pin-Out
Cenelec
Pin No. Function Description
1+24 VDC
(Valves and Outputs)
Voltage used to power outputs
(valve coils and discrete outputs) SW
2+24 VDC
(Node and Inputs)
Voltage used to power discrete inputs and
node electronics UNSW
30 VDC
(Node and Inputs)
0 VDC Voltage used to power discrete inputs and
node electronics UNSW
40 VDC
(Valves and Outputs)
0 VDC Voltage used to power outputs
(valve coils and discrete outputs) SW
•Power common (0 VDC) pins 3 and 4 are isolated from each other to allow separate
(isolated) power supply connection if required. However, they can be tied together if a
single common, non-isolated, application is preferred.
•The combined draw of the +24VDC Valves and Outputs and +24VDC Node and Inputs
pins cannot exceed 8 Amps, at any given moment in time.
•The Node and Input power pin (2) supplies power to the node electronics. This pin
must be powered at all times for communication node to be functional.
CAUTION