NXP Semiconductors TDA5051A Operational manual

1. General description
The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of
the home power supply network, at 600 baud or 1200 baud data rate. It operates from a
single 5 V supply.
2. Features and benefits
Full digital carrier generation and shaping
Modulation/demodulation frequency set by clock adjustment, from microcontroller or
on-chip oscillator
High clock rate of 6-bit D/A (Digital to Analog) converter for rejection of aliasing
components
Fully integrated output power stage with overload protection
Automatic Gain Control (AGC) at receiver input
8-bit A/D (Analog to Digital) converter and narrow digital filtering
Digital demodulation delivering baseband data
Easy compliance with EN50065-1 with simple coupling network
Few external components for low cost applications
SO16 plastic package
3. Applications
Home appliance control (air conditioning, shutters, lighting, alarms and so on)
Energy/heating control
Amplitude Shift Keying (ASK) data transmission using the home power network
TDA5051A
Home automation modem
Rev. 5 — 13 January 2011 Product data sheet

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 2 of 29
NXP Semiconductors TDA5051A
Home automation modem
4. Quick reference data
[1] The value of the total transmission mode current is the sum of IDD(RX/TX)(tot) + IDD(PAMP) in the Table 5 “Characteristics”.
[2] Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency.
[3] The minimum value can be improved by using an external amplifier; see application diagrams Figure 19 and Figure 20.
5. Ordering information
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDD supply voltage 4.75 5.0 5.25 V
IDD(tot) total supply current fosc =8.48MHz
Reception mode - 28 38 mA
Transmission mode;
DATA_IN =0;Z
L=30Ω
[1] -4768mA
Power-down mode - 19 25 mA
fcr carrier frequency [2] - 132.5 - kHz
fosc oscillator frequency 6.08 - 9.504 MHz
Vo(rms) output carrier signal (RMS value) DATA_IN = LOW;
ZL= CISPR16 120 - 122 dBμV
Vi(rms) input signal (RMS value) [3] 82 - 122 dBμV
THD total harmonic distortion on CISPR16 load
with coupling network -−55 - dB
Tamb ambient temperature −50 - +100 °C
Table 2. Ordering information
Type number Package
Name Description Version
TDA5051AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 3 of 29
NXP Semiconductors TDA5051A
Home automation modem
6. Block diagram
Fig 1. Block diagram
002aaf038
1
4
7
DGND
5
AGND
12
VDDA VDDAP
TX_OUT
RX_IN
APGND
PD
13
VDDD
311
10
9
15
14
8
2
8
U
H
LD
16
ROM
DAC clock
filter clock
OSCILLATOR
DATA_OUT
OSC2
OSC1
DIGITAL
DEMODULATOR
DIGITAL
BAND-PASS
FILTER
÷2
CONTROL LOGIC
D/A
modulated
carrier
TDA5051A
A/D
TEST1 SCANTEST
U/D
COUNT
PEAK
DETECT
POWER
DRIVE
WITH
PROTECTION
6
DATA_IN
CLK_OUT
5
10
6

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 4 of 29
NXP Semiconductors TDA5051A
Home automation modem
7. Pinning information
7.1 Pinning
7.2 Pin description
Fig 2. Pin configuration for SO16
TDA5051AT
DATA_IN TEST1
DATA_OUT PD
V
DDD
RX_IN
CLK_OUT V
DDA
DGND AGND
SCANTEST V
DDAP
OSC1 TX_OUT
OSC2 APGND
002aaf039
1
2
3
4
5
6
7
8
10
9
12
11
14
13
16
15
Table 3. Pin description
Symbol Pin Description
DATA_IN 1 digital data input (active LOW)
DATA_OUT 2 digital data output (active LOW)
VDDD 3 digital supply voltage
CLK_OUT 4 clock output
DGND 5 digital ground
SCANTEST 6 test input (LOW in application)
OSC1 7 oscillator input
OSC2 8 oscillator output
APGND 9 analog ground for power amplifier
TX_OUT 10 analog signal output
VDDAP 11 analog supply voltage for power amplifier
AGND 12 analog ground
VDDA 13 analog supply voltage
RX_IN 14 analog signal input
PD 15 power-down input (active HIGH)
TEST1 16 test input (HIGH in application)

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 5 of 29
NXP Semiconductors TDA5051A
Home automation modem
8. Functional description
Both transmission and reception stages are controlled either by the master clock of the
microcontroller or by the on-chip reference oscillator connected to a crystal. This ensures
the accuracy of the transmission carrier and the exact trimming of the digital filter, thus
making the performance totally independent of application disturbances such as
component spread, temperature, supply drift and so on.
The interface with the power network is made by means of an LC network (see Figure 15).
The device includes a power output stage that feeds a 120 dBμV (RMS) signal on a
typical 30 Ωload.
To reduce power consumption, the IC is disabled by a power-down input (pin PD): in this
mode, the on-chip oscillator remains active and the clock continues to be supplied at
pin CLK_OUT. For low-power operation in reception mode, this pin can be dynamically
controlled by the microcontroller, see Section 8.4 “Power-down mode”.
When the circuit is connected to an external clock generator (see Figure 6), the clock
signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open-circuit.
Figure 7 shows the use of the on-chip clock circuit.
All logic inputs and outputs are compatible with TTL/CMOS levels, providing an easy
connection to a standard microcontroller I/O port.
The digital part of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST1,
are used for production test: these pins must be left open-circuit in functional mode
(correct levels are internally defined by pull-up or pull-down resistors).
8.1 Transmission mode
To provide strict stability with respect to environmental conditions, the carrier frequency is
generated by scanning the ROM memory under the control of the microcontroller clock or
the reference frequency provided by the on-chip oscillator. High frequency clocking rejects
the aliasing components to such an extent that they are filtered by the coupling
LC network and do not cause any significant disturbance. The data modulation is applied
through pin DATA_IN and smoothly applied by specific digital circuits to the carrier
(shaping). Harmonic components are limited in this process, thus avoiding unacceptable
disturbance of the transmission channel (according to CISPR16 and EN50065-1
recommendations). A −55 dB Total Harmonic Distortion (THD) is reachedwhen the typical
LC coupling network (or an equivalent filter) is used.
The DAC and the power stage are set in order to provide a maximum signal level of
122 dBμV (RMS) at the output.
The output of the power stage (TX_OUT) must always be connected to a decoupling
capacitor, because of a DC level of 0.5VDD at this pin, which is present even when the
device is not transmitting. This pin must also be protected against overvoltage and
negative transient signals. The DC level of TX_OUT can be used to bias a unipolar
transient suppressor, as shown in the application diagram (see Figure 15).
Direct connection to the mains is done through an LC network for low-cost applications.
However, an HF signal transformer could be used when power-line insulation has to be
performed.

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 6 of 29
NXP Semiconductors TDA5051A
Home automation modem
Remark: In transmission mode, the receiving part of the circuit is not disabled and the
detection of the transmitted signal is normally performed. In this mode, the gain chosen
before the beginning of the transmission is stored, and the AGC is internally set to
−6dBas long as DATA_IN is LOW. Then, the old gain setting is automatically restored.
8.2 Reception mode
The input signal received by the modem is applied to a wide range input amplifier with
AGC (−6 dB to +30 dB). This is basically for noise performance improvement and signal
level adjustment, which ensures a maximum sensitivity of the ADC. An 8-bit conversion is
then performed, followed by digital band-pass filtering, to meet the CISPR16
normalization and to comply with some additional limitations met in current applications.
After digital demodulation, the baseband data signal is made available after pulse
shaping.
The signal pin (RX_IN) is a high-impedance input which has to be protected and
DC decoupled for the same reasons as with pin TX_OUT. The high sensitivity (82 dBμV)
of this input requires an efficient 50 Hz rejection filter (realized by the LC coupling
network), which also acts as an anti-aliasing filter for the internal digital processing;
(see Figure 15).
8.3 Data format
8.3.1 Transmission mode
The data input (DATA_IN) is active LOW: this means that a burst is generated on the line
(pin TX_OUT) when DATA_IN pin is LOW.
Pin TX_OUT is in a high-impedance state as long as the device is not transmitting.
Successive logic 1s are treated in a Non-Return-to-Zero (NRZ) mode, see pulse shapes
in Figure 8 and Figure 9.
8.3.2 Reception mode
The data output (pin DATA_OUT) is active LOW; this means that the data output is LOW
when a burst is received. Pin DATA_OUT remains LOW as long as a burst is received.
8.4 Power-down mode
Power-down input (pin PD) is active HIGH; this means that the power consumption is
minimum when pin PD is HIGH. Now, all functions are disabled, except clock generation.

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 7 of 29
NXP Semiconductors TDA5051A
Home automation modem
9. Limiting values
10. Characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 4.5 5.5 V
fosc oscillator frequency - 12 MHz
Tstg storage temperature −50 +150 °C
Tamb ambient temperature −50 +100 °C
Tjjunction temperature - 125 °C
Table 5. Characteristics
VDDD =V
DDA =5V
± 5%;T
amb =
− 40 ° C to +85 ° C; VDDD connected to VDDA; DGND connected to AGND.
Symbol Parameter Conditions Min Typ Max Unit
Supply
VDD supply voltage 4.75 5 5.25 V
IDD(tot) total supply current fosc =8.48MHz
Reception mode - 28 38 mA
Transmission
mode;
DATA_IN =0;
ZL=30Ω
[1] -4768mA
Power-down mode - 19 25 mA
IDD(RX/TX)(tot) total analog + digital
supply current VDD =5V±5%; Transmission or
Reception mode
-2838mA
IDD(PD)(tot) total analog + digital
supply current VDD =5V±5%; PD = HIGH;
Power-down mode
-1925mA
IDD(PAMP) power amplifier
supply current VDD =5V±5%; ZL=30Ω;
DATA_IN = LOW in
Transmission mode
-1930mA
IDD(PAMP)(max) maximum power amplifier
supply current VDD =5V±5%; ZL=1Ω;
DATA_IN = LOW in
Transmission mode
-76-mA
DATA_IN and PD inputs; DATA_OUT and CLK_OUT outputs
VIH HIGH-level input voltage 0.2VDD +0.9 - V
DD +0.5 V
VIL LOW-level input voltage −0.5 - 0.2VDD −0.1 V
VOH HIGH-level output voltage IOH =−1.6 mA 2.4 - - V
VOL LOW-level output voltage IOL = 1.6 mA - - 0.45 V

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 8 of 29
NXP Semiconductors TDA5051A
Home automation modem
OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit when
using an external clock generator)
VIH HIGH-level input voltage 0.7VDD -V
DD +0.5 V
VIL LOW-level input voltage −0.5 - 0.2VDD −0.1 V
VOH HIGH-level output voltage IOH =−1.6 mA 2.4 - - V
VOL LOW-level output voltage IOL = 1.6 mA - - 0.45 V
Clock
fosc oscillator frequency 6.080 - 9.504 MHz
fosc/fcr ratio between oscillator and
carrier frequency -64-
fosc/fCLKOUT ratio between oscillator and
clock output frequency -2-
Transmission mode
fcr carrier frequency fosc =8.48MHz [2] - 132.5 - kHz
tsu set-up time of the shaped
burst fosc = 8.48 MHz; see Figure 8 - 170 - μs
thhold time of the shaped
burst fosc = 8.48 MHz; see Figure 8 - 170 - μs
tW(DI)(min) minimum pulse width of
DATA_IN signal fosc = 8.48 MHz; see Figure 8 - 190 - μs
Vo(rms) output carrier signal
(RMS value) DATA_IN = LOW; ZL= CISPR16 120 - 122 dBμV
Io(max) power amplifier maximum
output current (peak value) DATA_IN = LOW; ZL=1Ω
- 160 - mA
Zooutput impedance of the
power amplifier -5-Ω
VOoutput DC level at
pin TX_OUT -2.5-V
THD total harmonic distortion on
CISPR16 load with the
coupling network (measured
on the first ten harmonics)
Vo(rms) = 121 dBμVon
CISPR16 load;
fosc = 8.48 MHz;
DATA_IN =LOW
(no modulation);
see Figure 3 and
Figure 22
-−55 - dB
B−20dB bandwidth of the shaped
output signal (at −20 dB)
on CISPR16 load with the
coupling network
Vo(rms) = 121 dBμVon
CISPR16 load;
fosc = 8.48 MHz;
DATA_IN = 300 Hz;
duty factor = 50 %;
see Figure 4
- 3000 - Hz
Table 5. Characteristics …continued
VDDD =V
DDA =5V
± 5%;T
amb =
− 40 ° C to +85 ° C; VDDD connected to VDDA; DGND connected to AGND.
Symbol Parameter Conditions Min Typ Max Unit

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 9 of 29
NXP Semiconductors TDA5051A
Home automation modem
[1] The value of the total transmission mode current is the sum of IDD(RX/TX)(tot) + IDD(PAMP).
[2] Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency.
[3] The minimum value can be improved by using an external amplifier; see application diagrams Figure 19 and Figure 20.
Reception mode
Vi(rms) analog input signal
(RMS value) [3] 82 - 122 dBμV
VIDC level at pin RX_IN - 2.5 - V
ZiRX_IN input impedance - 50 - kΩ
RAGC AGC range - 36 - dB
tc(AGC) AGC time constant fosc = 8.48 MHz;
see Figure 5 - 296 - μs
td(dem)(su) demodulation delay
set-up time fosc = 8.48 MHz; see Figure 21 - 350 400 μs
td(dem)(h) demodulation delay
hold time fosc = 8.48 MHz; see Figure 21 - 420 470 μs
Bdet detection bandwidth fosc =8.48MHz-3-kHz
BER bit error rate fosc = 8.48 MHz;
600 baud;
S/N = 35 dB;
signal 76 dBμV;
see Figure 23
-1-1×10−4
Power-up timing
td(pu)(TX) delay between power-up
and DATA_IN in
transmission mode
XTAL = 8.48 MHz;
C1 = C2 = 27 pF;
Rp=2.2MΩ;
see Figure 10
-1-μs
td(pu)(RX) delay between power-up
and DATA_OUT in
reception mode
XTAL = 8.48 MHz;
C1 = C2 = 27 pF;
Rp=2.2MΩ;
fRXIN = 132.5 kHz;
120 dBμV sine wave;
see Figure 11
-1-μs
Power-down timing
td(pd)(TX) delay between PD = 0 and
DATA_IN in transmission
mode
fosc = 8.48 MHz;
see Figure 12 -10-μs
td(pd)(RX) delay between PD = 0 and
DATA_OUT in reception
mode
fosc = 8.48 MHz;
fRXIN = 132.5 kHz;
120 dBμV sine wave;
see Figure 13
- 500 - μs
tactive(min) minimum active time with
T = 10 ms power-down
period in reception mode
fosc = 8.48 MHz;
fRXIN = 132.5 kHz;
120 dBμV sine wave;
see Figure 14
-1-μs
Table 5. Characteristics …continued
VDDD =V
DDA =5V
± 5%;T
amb =
− 40 ° C to +85 ° C; VDDD connected to VDDA; DGND connected to AGND.
Symbol Parameter Conditions Min Typ Max Unit

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 10 of 29
NXP Semiconductors TDA5051A
Home automation modem
Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBμV (RMS); marker at
−5dBV(RMS)=115dBμV (RMS); the CISPR16 network provides an attenuation of 6 dB,
so the signal amplitude is 121 dBμV (RMS).
Fig 3. Carrier spectrum
Resolution bandwidth = 100 Hz; B−20dB = 3000 Hz (2 ×1500 Hz).
Fig 4. Shaped signal spectrum
Fig 5. AGC time constant definition (not to scale)
002aaf054
f (Hz)
10
5
10
6
−60
−40
−80
−20
0
V
o(rms)
(dBV)
−100
132.5 kHz
f (kHz)
117.5 147.5
002aaf057
−40
−30
−50
−20
−10
dBV
(RMS)
−60
132.5
20 dB
1500 Hz
002aaf05
8
V
RXIN
V
(I)
0
8.68 dB
AGC range
t
c(AGC)
(AGC time constant)
+30 dB
−6 dB
G
AGC
modulated sine wave 122 dBμV amplitude
t

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 11 of 29
NXP Semiconductors TDA5051A
Home automation modem
11. Timing
11.1 Configuration for clock
For parameter description, see Table 6.
Fig 6. External clock
For parameter description, see Table 6.
Fig 7. Typical configuration for on-chip clock circuit
Table 6. Clock oscillator parameters
Oscillator
frequency fosc
Carrier
frequency fcr
Clock output frequency
1⁄2fosc
External components
6.080 MHz to
9.504 MHz 95 kHz to 148.5 kHz 3.040 MHz to 4.752 MHz C1 = C2 = 27 pF to 47 pF; Rp=2.2MΩto 4.7 MΩ;
XTAL = standard quartz crystal
Table 7. Calculation of parameters depending on the clock frequency
Symbol Parameter Conditions Unit
fosc oscillator frequency with on-chip oscillator: frequency of
the crystal quartz Hz
with external clock: frequency of the
signal applied at OSC1 Hz
fCLKOUT clock output frequency 1⁄2fosc Hz
fcr carrier frequency/digital filter tuning
frequency 1⁄64fosc Hz
tsu set-up time of the shaped burst 23/fcr or 1472/fosc s
thhold time of the shaped burst 23/fcr or 1472/fosc s
tW(DI)(min) minimum pulse width of DATA_IN
signal tsu + 1/fcr s
002aaf04
2
TDA5051A
7
5
OSC1
DGND
f
osc
CLK_OUT
GND
MICROCONTROLLER
XTAL
002aaf04
3
TDA5051A
4
5
CLK_OUT
DGND
1
/
2
f
osc
CLK_OUT
GND
MICROCONTROLLER
8
7
OSC2
OSC1
RpXTAL
C1
C2

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 12 of 29
NXP Semiconductors TDA5051A
Home automation modem
tW(burst)(min) minimum burst time of VO(DC) signal tW(DI)(min) + ths
tc(AGC) AGC time constant 2514/fosc s
tsu(demod) demodulation set-up time 3200/fosc (max.) s
th(demod) demodulation hold time 3800/fosc (≈max.) s
(1) tW(DI) >t
W(DI)(min)
(2) tW(DI)(min) =t
su +1/f cr
(3) tW(DI)(min) <t
su; wrong operation
Fig 8. Relationship between DATA_IN and TX_OUT (see Table 8)
Table 8. Relationship between DATA_IN and TX_OUT
X = don’t care.
PD DATA_IN TX_OUT
1 X high-impedance
0 1 high-impedance (after th)
0 0 active with DC offset
Fig 9. Pulse shape characteristics
Table 7. Calculation of parameters depending on the clock frequency …continued
Symbol Parameter Conditions Unit
002aaf04
4
tW(burst)
tsu
0
VO(DC)
th
tW(burst)(min)
TX_OUT
tW(DI)
tW(DI)(min)
DATA_IN
(1) (2) (3)
tW(burst)
tsu th
100 %
002aaf04
5

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 13 of 29
NXP Semiconductors TDA5051A
Home automation modem
11.2 Timing diagrams
(1) DATA_IN is an edge-sensitive input and must be HIGH before starting a transmission.
Fig 10. Timing diagram during power-up in Transmission mode
Fig 11. Timing diagram during power-up in Reception mode
Fig 12. Power-down sequence in Transmission mode
002aaf04
6
td(pu)(TX)
TX_OUT
DATA_IN(1)
VDD
90 % VDD
CLK_OUT
HIGH
not defined clock stable
002aaf04
7
td(pu)(RX)
td(dem)(h)
RX_IN
DATA_OUT
VDD
90 % VDD
CLK_OUT
HIGH
not defined
not defined
clock stable
002aaf04
8
t
d(pd)(TX)
normal operation wrong operation TX_OUT
delayed by PD
TX_OUT
DATA_IN
PD

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 14 of 29
NXP Semiconductors TDA5051A
Home automation modem
Fig 13. Power-down sequence in Reception mode
Fig 14. Power saving by dynamic control of power-down
002aaf04
9
t
d(dem)(su)
t
d(pd)(RX)
t
d(pd)(RX)
DATA_OUT delayed by PD
DATA_OUT
RX_IN
PD
002aaf05
0
t
active(min)
I
DD(RX)
I
DD(PD)
I
DD
T
DATA_OUT
RX_IN
PD
0

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 15 of 29
NXP Semiconductors TDA5051A
Home automation modem
12. Application information
fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal.
Fig 15. Application diagram without power line insulation
250 V (AC)
max T 630 mA
1 mH
68 Ω
(2 W)
47 nF/X2
250 V (AC)
47 μH
low RS
MOV
250 V (AC)
47 nF
(63 V)
47 μH
100 μF
(16 V)
470 μF
(16 V)
7V5
(1.3 W) 1N4006
1N4006
2 μF
250 V (AC)
10 nF
VDDD VDDAP
APGND AGNDDGND
VDDA
RX_IN
TX_OUT
SA5.0A
1 μF
(16 V)
14
1
+5 V
+5 V
2
MICRO-
CONTROLLER
4
7
OSC1
XTAL
7.3728 MHz
2.2 MΩ
OSC2
85 9 12
3
31
2
1311
15
47 nF
78L05
PD
27 pF27 pF
10
DATA_IN
DATA_OUT
CLK_OUT
TDA5051A
002aaf059
U

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 16 of 29
NXP Semiconductors TDA5051A
Home automation modem
a. Gain
b. Input impedance
fcr = 115.2 kHz; L = 47 μH; C = 47 nF.
Main features of the coupling network: 50 Hz rejection > 80 dB; anti-aliasing for the digital filter >
50 dB at the sampling frequency (1⁄2fosc). Input impedance always higher than 10 Ωwithin the
95 kHz to 148.5 kHz band.
Fig 16. Gain (a) and input impedance (b) of the coupling network
002aaf055
f (Hz)
10 10
7
10
6
10
5
10
2
10
4
10
3
−60
−20
20
G
(dB)
−100
002aaf431
f (Hz)
10 10
7
10
6
10
5
10
2
10
4
10
3
10
2
10
3
Z
i
(Ω)
10

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 17 of 29
NXP Semiconductors TDA5051A
Home automation modem
with coupling network; L = 47 μH; C = 47 nF.
Fig 17. Output voltage as a function of line impedance
fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal.
Fig 18. Application diagram with power line insulation
002aaf056
Zline (Ω)
110
2
10
110
120
130
Vo
(dBμV)
100
250 V (AC)
max T 630 mA
100 Ω
(0.5 W)
470 nF/X2
250 V (AC)
47 μH
low RS
MOV
250 V (AC)
100 nF
22 μH
100 μF
(16 V)
470 μF
(16 V)
10 nF
VDDD VDDAP
APGND AGNDDGND
VDDA
RX_IN
TX_OUT
SA5.0A
1 μF
(16 V)
14
1
+5 V
+5 V
2
MICRO-
CONTROLLER
4
7
OSC1
XTAL
7.3728 MHz
2.2 MΩ
OSC2
85 9 12
3
31
2
1311
15
47 nF
78L05
PD
27 pF27 pF
10
DATA_IN
DATA_OUT
CLK_OUT
TDA5051A
002aaf060
(63 V)
100 Ω
Newport/
Murata
78250
5
6
1
2
230 V
6 V
1 VA
FDB08
+−
U

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 18 of 29
NXP Semiconductors TDA5051A
Home automation modem
fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal.
Fig 19. Application diagram without power line insulation, with improved sensitivity
(68 dBμV typ.)
250 V (AC)
max T 630 mA
1 mH
68 Ω
(2 W)
47 nF/X2
250 V (AC)
47 μH
low RS
MOV
250 V (AC)
47 nF
(63 V)
47 μH
100 μF
(16 V)
470 μF
(16 V)
7V5
(1.3 W) 1N4006
1N4006
2 μF
250 V (AC)
10 nF
VDDD VDDAP
APGND AGNDDGND
VDDA
RX_IN
TX_OUT
SA5.0A
1 μF
(16 V)
14
1
+5 V
+5 V
2
MICRO-
CONTROLLER
4
7
OSC1
XTAL
7.3728 MHz
2.2 MΩ
OSC2
85 9 12
3
31
2
1311
15
47 nF
78L05
PD
27 pF27 pF
10
DATA_IN
DATA_OUT
CLK_OUT
TDA5051A
002aaf0
61
BC547B
1 kΩ
10 kΩ
150 kΩ
33 kΩ
10 nF
U

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 19 of 29
NXP Semiconductors TDA5051A
Home automation modem
fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal.
Fig 20. Application diagram with power line insulation, with improved sensitivity
(68 dBμV typ.)
250 V (AC)
max T 630 mA
100 Ω
(0.5 W)
470 nF/X2
250 V (AC)
47 μH
low RS
MOV
250 V (AC)
100 nF
22 μH
100 μF
(16 V)
470 μF
(16 V)
10 nF
VDDD VDDAP
APGND AGNDDGND
VDDA
RX_IN
TX_OUT
1 μF
(16 V)
14
1
+5 V
+5 V
2
MICRO-
CONTROLLER
4
7
OSC1
XTAL
7.3728 MHz
2.2 MΩ
OSC2
85 9 12
3
31
2
1311
15
47 nF
78L05
PD
27 pF27 pF
10
DATA_IN
DATA_OUT
CLK_OUT
TDA5051A
002aaf062
(63 V)
100 Ω
Newport/
Murata
78250
5
6
1
2
230 V
6 V
1 VA
FDB08
+−
SA5.0A
BC547B
1 kΩ
10 kΩ
150 kΩ
33 kΩ
10 nF
U

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 20 of 29
NXP Semiconductors TDA5051A
Home automation modem
13. Test information
Fig 21. Test set-up for measuring demodulation delay
(1) Square wave TTL signal 300 Hz, duty factor = 50 % for measuring signal bandwidth
(see Figure 3).
(2) DATA_IN + LOW for measuring total harmonic distortion (see Figure 3).
(3) Tuned for fcr = 132.5 kHz.
(4) The CISPR16 network provides a −6 dB attenuation.
Fig 22. Test set-up for measuring THD and bandwidth of the TX_OUT signal
30 Ω
1 μF
10 nF
XTAL
DATA_IN
DATA_OUT
td(dem)(su) td(dem)(h)
DATA_OUT
DATA_IN
TX_OUT/RX_IN
OSCILLOSCOPE
Y1
TDA5051A
(to be tested)
pulse
generator
300 Hz
50 %
Y2
TX_OUT
RX_IN
fosc
2
110
14
78
002aaf051
G
002aaf05
2
TDA5051A
POWER
SUPPLY SPECTRUM
ANALYZER
50 Ω
10
7
8
OSC1
OSC2 12, 5, 9
1 13, 3, 11
TX_OUT
AGND, DGND, APGND
VDDA, VDDD, VDDAP 5 Ω
50 Ω
10 μF
33 nF
250 nF
47 μH
50 μH
33 nF 47 μH
coupling network(3) CISPR16 network(4)
+5 V
(2)(1)
DATA_IN
G
250 nF
5 Ω
50 μH
002aaf05
2
TDA5051A
POWER
SUPPLY SPECTRUM
ANALYZER
50 Ω
10
7
8
OSC1
OSC2 12, 5, 9
1 13, 3, 11
TX_OUT
AGND, DGND, APGND
VDDA, VDDD, VDDAP 5 Ω
50 Ω
10 μF
33 nF
250 nF
47 μH
50 μH
33 nF 47 μH
coupling network(3) CISPR16 network(4)
+5 V
(2)(1)
DATA_IN
G
250 nF
5 Ω
50 μH