Orbotech SPTS Xactix e1 Series User manual

Manual Version e1-4.3.0.ae-R3 (2015/04)
Xactix® e1 Series System Manual

Revision Notice
This is the 1st release of this publication on September 2015
This document is not for use, reproduction, or disclosure in any form without expressed written consent
from SPTS Technologies.
Every effort has been made to ensure the accuracy of the information presented herein. However,
specifications are subject to change without notice. Therefore, the user must always confirm critical
specifications with SPTS Technologies when necessary, using this manual as a guide.
Document Control
Please refer to the Document Number listed below when inquiring about Operations Manual updates.
Document No. SYS1412145-EX178
Issued To: UCL
Document revisions and copies of this manual in other media, such as cleanroom paper copies or CD
ROM versions, can be requested by contacting the SPTS Technologies. A fee will be charged for
additional copies.
Contact Information
For Technical Support refer to the Preventive Maintenance section of this manual for additional
instructions before contacting SPTS Technologies.
Contact: SPTS Technologies
7377 William Avenue
Allentown, PA 18106
Phone: [phone]
www: spts.com

TABLE OF CONTENTS
1TECHNICAL SPECIFICATIONS…………………………………………………………………………. 4
2PRECAUTIONS AND SAFETY INSTRUCTIONS………………………………………………………. 6
2.1 General Safety 6
2.2 Personal Protective Equipment (PPE) 6
2.3 Mechanical Safety 7
2.4 Compressed Air 8
2.5 Electrical Safety 8
2.5.1 Live Works 9
2.6 Gas Safety 9
2.6.1 General 10
2.6.2 Discovering a Gas Leak 10
2.6.3Treatment of Exhaust Gases 10
2.7 Contamination 11
2.8 Gas Lines (Toxic & Non-Toxic) 11
2.9 Hazardous Substances 12
2.9.1 Working with Hazardous Substances 12
2.9.2 Spillage of Hazardous Substances 12
2.10 Additional Safety Notes 13
2.11 System Cleaning 13
2.12 Unintended & Intended Releases 13
3DESCRIPTION OF THE PRODUCT; COMPOSITION OF THE PRODUCT…………………………14
4ASSEMBLY; INSTALLATION; FIRST OPERATION…………………………………………………..16
4.1 Preparation 16
4.1.1 General Requirements of the Site 16
4.1.2 Dimensions and Weights 16
4.1.3Space Requirements 17
4.1.4 Electrical Services Required 18
4.1.5 General Ambient Temperatures 18
4.1.6 Gas Requirements 19
4.1.7 Exhaust Requirements 20
4.1.8 Installation Material 21
4.2 Pre-Installation Checklist 22
4.3 Cylinder and valve for XeF2 23
4.4 Uncrating 24
4.4.1 Receiving the System 24
4.4.2 Storing the System Before Installation 24
4.5 Uncrating the System 25
4.6 Setup 28
4.7 Initial Start-up 39
4.7.1 Safety verification 39
4.7.2 Power Up and EMO reset 39
5DESCRIPTION OF OPERATION; METHOD OF USE………………………………………………… 42
5.1 e1 Series Log in 43
5.2 Main menu 44

Manual Version e1-4.3.0.ae-R3. Page
2
5.2.1 Sample Loading 44
5.2.2 Viewing the Log 48
5.2.3 Other Main Menu items 52
5.3 Software operation details 53
5.3.1 Recipe Storage 53
5.3.2 Recipe Manager 53
5.3.3 Performing an Etch 54
5.3.4 Etch Menu Features 55
5.3.5 Performing an Etch in the Normal Mode 57
5.3.6 Performing an Etch in the Normal with Delays Mode 59
5.3.7 Performing an Etch in the Advanced Normal Mode 60
5.3.8 Performing an Etch in the High Conductivity Mode 62
5.4 Maintenance Menu 64
5.4.1 Viewing the Full Log 65
5.4.2 User Manager 69
5.4.3 Configuration Menu 72
5.4.4 System Configuration Menu 73
5.4.5 Startup Configuration Menu 74
5.4.6 Standby Configuration Menu 76
5.4.7 Gas Bottle Change Parameters Menu 77
5.4.8 Etch Configuration Menu 78
5.5Leak-Back Utility 82
5.6 Main Chamber Purge 83
5.7 Pressure Sensor Recalibration Utility 83
6MAINTENANCE AND MAINTENANCE SCHEDULE…………………………………………………..85
6.1 Shutting Down 85
6.2 Electrical and Gas Disconnect and Lockout / Tagout 85
6.2.1 Electrical Disconnect 85
6.2.2 Gas Supply Disconnect and Lockout / Tagout 86
6.2.3 Panel Layouts 87
6.3 Turning on the System after Maintenance 87
6.4 Procedures and Schedules 88
6.4.1Maintenance Procedures 88
6.4.2 Regular Inspection 88
6.5 Recommended Spare Parts 88
6.6 XeF2Bottle Change 88
6.6.1 Bottle Change General information 88
6.6.2 Changing XeF2 Bottle 89
6.6.3 Completing Bottle Change 95
6.7 Adjusting Nitrogen Flow Rates 96
6.7.1 Main Chamber 96
6.7.2 Expansion Chamber 96
6.8 Roughing Pump 96
6.9 Chamber/Lid Cleaning 96
6.10 Showerhead Replacement 97
6.11 Showerhead hole plugs 97
6.12 Gas Box Heater 98
6.13 Vacuum Interlocks 100
6.13.1 Chamber interlock 100
6.13.2 Vacuum interlock 100
6.14 Manual valve operation 102
6.15 Ventilation shroud interlock 103
6.16 System startup through Normal issues 104
6.17 XeF2Bottle/Valve/Fitting Leak 109
6.17.1 Leak check bottle #1 connection and NPT to VCR adapter 109
6.17.2 Bottle and valve leak check for bottle 111

Manual Version e1-4.3.0.ae-R3. Page
3
6.18 Main Chamber Leak Check 112
7DECOMMISSIONING……………………………………………………………………………………..113
8DISMANTLING, DEMOLITION; STORAGE AND TRANSPORT……………………………………114
8.1 Dismantling and demolition 114
8.2 Storage 114
8.2.1 Storage in the clean room 114
8.3 Storage and transport 114
9BREAKDOWNS AND REPAIRS……………………………………………………………………….. 115
9.1 What to do in case of a problem. 115
9.2 Contacting Customer Support 115
10 DISCARD…………………………………………………………………………………………………...116

Manual Version e1-4.3.0.ae-R3. Page
4
1 Technical Specifications
1. The system provides pulsed delivery of xenon difluoride gas, using a single expansion chamber, to
a reaction chamber capable of holding a wide variety of samples up to a 6” wafer.
2. Physical Characteristics:
a. A table top unit to minimize use of expensive lab space (620mm wide X 780mm deep X
770mm high, plus computer, monitor, keyboard and pump control box).
b. Chamber optimized to hold parts up to 6” wafers.
c. Dry vacuum pump proven to hold up to XeF2. This is important; not all pumps stand up well
to XeF2. SPTS has spent a lot of time and resources finding a pump that will operate
reliably.
3. Sound Pressure Level: Less than 52dB(A). Sole source of sound is the pump.
4. Control: The system is computer controlled with a graphical user interface and provides the
following capabilities.
a. Multi-user software interface with password protected access for each user.
b. Password protected access to maintenance software.
c. Recipe storage.
d. Process parameters logged for each etch.
e. Set Cycle Time, Number of Cycles, XeF2Pressure from software user interface
f. Mix XeF2with Nitrogen. Set pressure for nitrogen from software user interface.
g. Define pause time between cycles from software user interface.
h. Plots process chamber pressure on GUI and records pressures in log file.
i. Interactive GUI for recipe definition, storage and editing.
j. Interactive GUI for configuring system operating variables
k. Automated pressure gauge recalibration. Can be run either interactively through the GUI or
scheduled to run automatically on a user defined frequency.
l. Leak back test utility for expansion chamber and process chamber
m. Automated system characterization to minimize over shoot and undershoot of XeF2
pressure in expansion chamber.
n. During etch process chamber pressure is sampled at regular intervals, plotted in the GUI
and stored for later review.
5. Inspection: The system provides the ability to view entire surface of sample (up to 6” wafer) while it
is being etched through a transparent process chamber lid and shower head.
6. Safety: The system provides the following features:
a. Built in, retractable fume hood with hardware interlock which automatically prevents venting
process chamber to atmosphere when fume hood is retracted.
b. Duplicate emergency power off (EPO) button for positioning with pump in chase.
c. Pump turned off with EPO and power switch on unit.
d. Hardware interlock automatically shuts off all valves with loss of vacuum.
e. Hardware interlock automatically closes XeF2source when process chamber is near
atmosphere
f. Exhausted gas box with inlet for purge gas.
g. Built in leak check after changing XeF2source bottles
h. Automated nitrogen purge of connections to XeF2source bottles before and after changing
XeF2source bottles.
i. Software guided XeF2source bottle change procedure.
j. Software controlled process chamber load/unload nitrogen purge.
k. Internal regulators limit CDA and N2 pressure to avoid unsafe failure from over pressure.
7. Other key features:
a. Modular gas panel to allow easy replacement of gas components.
b. DeviceNet communications protocol for control components.
c. CD drive allows writing CDs for transferring etching log data and picture from camera
option.
8. Available Options: The following options are available at either time of sale or for later upgrade of
the system.
a. Touch screen interface. (Available with purchase of the Touch Screen Option).
b. Binocular microscope and stand for viewing samples in the chamber while etching.
(Available with purchase of the Microscope Option).

Manual Version e1-4.3.0.ae-R3. Page
5
c. Set pump down pressure for chamber and expansion chambers when etching with XeF2
from software user interface. (Available with Purchase of the Advanced Recipe Package).
d. Digital camera integrated with and controlled by the control software to periodically capture
images either at a given time interval or every X pulses, where X is defined by the user in
the GUI. In addition the image from the camera and control of the camera is integrated into
the GUI for controlling the system. (Available with purchase of Imaging Option).
e. Additional heating and temperature control for the gas box, and heating for the expansion
chamber and process chamber. This increases the sublimation pressure of XeF2resulting
in significantly faster etch rates. It also increases the process stability by decreasing the
effect of the ambient temperature on all aspects of the process. (Available with purchase of
the heating package).
f. Integrated thermocouple interface for measuring temperature of substrates in the chamber;
including a bulk head connection for two thermocouples in the vacuum stack and automatic
logging and plotting in the GUI of the temperature recorded by the thermocouples.
(Available with purchase of the Advanced Experimentation/Manufacturing Package).
g. Add an MFC and pressure controller to implement a second type of etching which uses a
continuous flow of XeF2. This is in addition to the standard pulsed flow etching. The
continuous flow process recipe includes the flow rate of XeF2, the pressure of the process
chamber and the time to etch. (Available with Purchase of Continuous Flow Option).
h. High Conductance Mode Etching (Patent Pending). Alternates pulses of XeF2and nitrogen
to lower sample temperatures and minimize attack of silicon nitride, titanium nitride and
gold. (Available with purchase of Advanced Recipe Package).
9. Performance:
a. Etch rate range: 0.1-10 µm/min
b. WIW Non-Uniformity (Range/(2 x mean)< 15%
c. R2R Repeatability < 15%
10. XeF2Source and Facilities:
a. Source bottle: 300 cc bottle holding up to 600 gm of XeF2(not included with system)
b. Power: 120/220 V AC, 20A/10A (220V version is option)
c. N2: 10-20 psi
d. Compressed Dry Air: 70-100 psi
e. Exhaust:
1. Vacuum pump exhaust: 11.1 m3/hr
2. Gas box ventilation: -2.5 mm H2O static pressure
3. Chamber area ventilation: -25 mm H2O static pressure

Manual Version e1-4.3.0.ae-R3. Page
6
2 Precautions and Safety Instructions
WARNING
READ THIS MANUAL BEFORE INSTALLING AND U
SING
THE XACTIX E1 SERIES. FAILURE TO DO SO
COULD
RESULT IN HARM OR INJURY. ALSO, READ TH
E MSDS
FOR XENON DIFLUORIDE.
2.1 General Safety
CAUTION
XeF2
: Service personnel must be aware of and understand
the risks of exposure to XeF2and its by-products.
2.2 Personal Protective Equipment (PPE)
Provided the system is process contaminant free, routine maintenance can be undertaken wearing a
face mask, ‘double-gloved’ nitrile gloves and chemically resistant safety goggles that comply with BS
EN 166 and/or ANSI Z87.1.
CAUTION
PPE for Non-
Vented Systems: When the system cannot be
vented, there are strict procedures that must be followed
and full PPE suitable for dealing with XeF2and its by-
products must be worn. P
lease refer to the MSDS for details
on the PPE and contact SPTS as soon as practicable for
instruction.
CAUTION
PPE Compliance: All PPE must be used in accordance with
the manufacturer’s instructions or local PPE requirements.

Manual Version e1-4.3.0.ae-R3. Page
7
CAUTION
Air Sampling Checks: Before breaking seals and
undertaking air sampling checks, full Personal Protective
Equipment must be worn including a respirator. The
immediate area must be well ventilated. All non-
essential
personnel must be evacuated to a safe area and air
sampling warning notices must be displayed in the
immediate vicinity. When undertaking air sampling tests,
checks must be made to ascertain the concentration of
residual gases and hazardous by-
product gases such as
XeF2and HF.
CAUTION
Safety Goggles: It is recommended that maintenance
personnel wear safety goggles that conform to the current
local safety standards or minimally to BS EN 166 and/or
ANSI Z87.1.
2.3 Mechanical Safety
CAUTION
XeF2
: When the system cannot be vented, there are strict
procedures that must be followed and full PPE suitable for
dealing with XeF2and its by-
products must be worn. Please
refer to the MSDS for details on the PPE and contact SPTS
as soon as practicable for instruction.
CAUTION
Hazardous Gases/Materials: The gasbox
contains
equipment that may contain hazardous gases/materials.
Only SPTS approved technically qualified personnel who
are fully aware of all relevant safety precautions may open
the gasbox.

Manual Version e1-4.3.0.ae-R3. Page
8
CAUTION
Gasbox Extract: Ensure that the gasbox
extract is running
before opening the gasbox door. T
he gasbox extract
minimum threshold flow rate value is set during installation
and must not be altered.
2.4 Compressed Air
CAUTION
General Health Risk (Compressed Air): High pressure
gases should never
be brought into close contact with bare
skin; there is a possibility that hazardous or toxic
substances may enter the bloodstream through the skin.
CAUTION
Eye Hazard: Always direct compressed air away from eyes
and skin. Appropriate eye protection should be worn when
working on pneumatic systems and when compressed air
is used for blowing away swarf or dust, or for cooling
purposes.
Many functions on the equipment are operated pneumatically; all appropriate local Lockout/Tagout
procedures must be complied with whenever the compressed air system is being worked on. Hoses,
fittings, regulators, and valves should be inspected periodically for leaks, damage and other defects.
Customer should install regulators or valves capable of shutting off the compressed air supply to the
system.
2.5 Electrical Safety
CAUTION
Electrical Safety: To prevent risk of injury, all maintenance
and repair
procedures must be undertaken by technically
qualified personnel who are fully aware of all relevant
safety precautions associated with processing, operating
and maintaining the equipment. In addition, such persons
must be capable of operating Xetch software.

Manual Version e1-4.3.0.ae-R3. Page
9
WARNING
ELECTRICAL HAZARD (LOCKOUT/TAGOUT REQUIR
ED):
POTENTIALLY LETHAL VOLTAGES (IN EXCESS O
F 30
VOLTS AC AND 50 VOLTS DC) ARE PRESENT ON
THE
EQUIPMENT. TO PREVENT INJURY, ENSURE THE
SYSTEM,
CIRCUIT OR COMPONENT IS ISOLATED AND ‘LOC
KED
OFF’ FROM ITS SOURCE OF SUP
PLY PRIOR TO
UNDERTAKING ANY MAINTENANCE OR REPAIR OF
THE
EQUIPMENT. DO NOT RELY ON
CONTROL SYSTEM
INTERLOCKS OR DISPLAYS AS AN INDIC
ATION THAT IT IS
SAFE TO WORK ON POTENTIALLY HAZARDOUS ITEMS.
WHEN UNDERTAKING ELECTRICAL MAINTENANCE AND
REPAIR PROCEDURES, NEVER WORK ALONE.
2.5.1 Live Works
Whenever work is being carried out on live conductors ensure the following precautions are in place:
•Suitable warning notices should be posted close to the machine to alert other people of the
hazard.
•The machine should never be left unattended.
•Live electrical work should not be carried out by a lone worker.
•If electrical equipment is to be isolated using a breaker tripped to OFF a DVM must be used to
ensure that the equipment is no longer energized.
If a safety interlock is defeated to facilitate maintenance work, the following procedures should be
administered to safeguard personnel and minimize the hazard:
•Safety barriers should be erected around the affected equipment.
•At least two persons must be present at all times.
•Lockout/Tagout procedures should be followed.
•Supervisors should be notified.
•Any ‘Local’ machine maintenance policies should be adhered to.
2.6 Gas Safety
CAUTION
Equipment Damage/General Health Risk: To prevent injury,
all maintenance and repair procedures must be undertaken
by technically qualified personnel who are fully aware of all
relevant safety precautions associated with processing,
operating and maintainin
g the equipment. In addition, such
persons must be capable of operating Xetch software.

Manual Version e1-4.3.0.ae-R3. Page
10
CAUTION
Equipment Damage/General Health Risk: The system is
designed and tested only to use those gases indicated on
the system and the accompanying instructions.
modification of the system by the user to handle different
gases and/or flow rates may render the sys
tem unsafe.
Contact SPTS if such a need arises.
SPTS Technologies recommend that customers contact their local gas supplier for all information about
safety precautions and first aid treatment relating to the specific gases used on their systems before
connection.
2.6.1 General
1) Know the following:
a) The location of the nearest manual gas leak alarm call point.
b) The sound and sight of the gas leak alarm.
c) The boundaries of the gas risk area.
2) On hearing the gas leak alarm, if you are in the gas risk area leave the gas risk area by the nearest
exit.
3) Remain out of the gas risk area until it is safe to return.
4) After a gas leak alarm, be ready to carry out a full building evacuation if the fire alarm is
subsequently activated. In this event follow normal fire procedures.
2.6.2 Discovering a Gas Leak
1) If the alarm has not already been activated by an automatic gas leak detection system, sound the
gas alarm.
2) Leave the gas risk area by the nearest exit.
3) Go to the designated assembly point and provide the incident personnel with as much information
as you can regarding the location and type of leak.
2.6.3 Treatment of Exhaust Gases
1) It is the customer’s responsibility to ensure exhaust gases from the backing pump are abated in a
manner that conforms to national and/or local environmental and safety regulations. The following
information is for guidance only.
2) There are three techniques for the treatment of harmful gases. Where more than one option is
available, the choice of technique should be that which minimizes overall environmental impact.
2.6.3.1 Incineration/Oxidation
Most flammable gases can be readily oxidized either by passing them into a separately fuelled flame or,
in some instances, by passing them into a suitable oxidizing chemical reagent (solid or liquid). The
properties of the resultant oxidized material (which may be gaseous, liquid or solid) should be
considered with a view to establishing further treatment for environmentally appropriate disposal. Liquid
and solid wastes may need to be referred to specialist disposal contractors. Where the incineration
process results in the formation of particulate matter, further treatment in the form of filtration, water
spray or other techniques for removing particles from gas, should be used before discharge of the gas
to atmosphere or, if the gas remains an environmental hazard, the next treatment process.
2.6.3.2 Chemical Scrubbing
Some reactive gases can be absorbed by a suitable liquid or solid state chemical scrubber. Designs
can include:
•Scrubber Liquid Baths into which the waste gas is bubbled.
•Pumped Scrubber Liquor Systems involving packed columns and/or spray nozzles to improve
gas/liquor contact.

Manual Version e1-4.3.0.ae-R3. Page
11
•Packed Solid Reagent Beds into which the waste gas is passed.
The chemical reagents used in all such equipment shall be closely monitored to ensure continued
efficiency. The ‘spent’ scrubber liquid, or solid, will require disposal in an environmentally acceptable
manner.
2.6.3.3 Absorption
Some waste gases can be absorbed onto suitable materials, such as charcoal, molecular sieve and
chemically impregnated absorbent. These are often appropriate for localized equipment or gas cabinet
exhaust treatment, but usually still exhaust into a main duct leading to a main scrubber to ensure
absolute risk minimization. Again, ‘spent’ cartridges shall be correctly disposed to minimize
environmental impact.
2.7 Contamination
Processing with XeF2 will produce HF by-products and components in the gasbox, process chamber,
interconnecting pipework and gas train will become contaminated. The chamber vent procedure will
pump/purge the process chamber and gas train so that any remain contaminants will be below the
Threshold Limit Value (TLV). However the gasbox components such as valves, pressure sensors, and
MFC, if present and associated pipework may still contain above Threshold Limit Value (TLV).
contaminants.
2.8 Gas Lines (Toxic & Non-Toxic)
CAUTION
General Health Risk: When undertaking maintenance on
hazardous and non-
hazardous gas lines, warning notices
must be displayed to identify the status of specific gas line
valves and associated solenoid valves. When individual gas
line valves are shut, they must be locked shut to prevent
inadvertent operation.
CAUTION
General Health Risk: To prevent risk of personnel injury, the
helium leak check must be undertaken by technically
qualified personnel who are fully aware of all relevant
safety precautions associated with processing, operating
and maintaining the equipment
. In addition, such persons
must be capable of operating Xetch software.
CAUTION
General Health Risk: Before undertaking helium leak check,
always check the status of the chamber with the system’s
process engineer.

Manual Version e1-4.3.0.ae-R3. Page
12
CAUTION
Chemical Hazard:
Before undertaking air sampling checks,
full protective clothing must be worn including a respirator.
The immediate area must be well ventilated. All non-
essential personnel must be evacuated to a safe area and
air sampling warning notices must be displaye
d in the
immediate vicinity. When undertaking air sampling tests,
checks must be made to ascertain the concentration of
residual gases and hazardous by-
product gases such as
XeF2and HF.
2.9 Hazardous Substances
2.9.1 Working with Hazardous Substances
All work with any hazardous substance must be in accordance with the manufacturer’s instructions,
Material Safety Data Sheet (MSDS) and local regulations concerning the control of substances
hazardous to health.
•The substance’s MSDS must be consulted prior to the start of any work if the user is not
familiar with the hazardous material.
•Special care must be exercised with substances provided by the customer.
•It is the responsibility of the customer to ensure that any substance provided is suitable for its
intended purpose and is safe to use in that context.
•MSDSs must always be consulted for health and safety information for any substance with
which the service engineer is not completely familiar.
2.9.2 Spillage of Hazardous Substances
If a spillage occurs:
1) The Manager of the area together with the Environmental & Safety Manager must be informed
immediately and the area cleared of personnel depending on the liquid released.
2) PPE may be required. Collect the spillage kit and immediately surround the spillage with the
absorbent cloths, pillows, etc., until the spillage has been contained.
3) Obtain the MSDS and read the section which relates to emergency release measures. The MSDS
will also give you the relevant information on the chemical make up of the liquid.
4) Clean up the spillage as quickly as possibly by following the instructions on the MSDS. Further
information can be obtained by speaking with the Environmental & Safety Manager.
5) The MSDS will also inform you of what disposal methods may be required. Some liquids do not mix
with water and by adding water to dilute the spillage the following may occur: fumes or an acidic
liquid. NEVER add water to a liquid spillage unless you have consulted the MSDS first.
6) Using the correct PPE (as stated on the MSDS), clean up the contaminated absorbent and place
into the empty spillage kit.
7) Label the spillage kit stating that the kit has been used for a liquid spillage. Together with this place
a copy of the MSDS onto the outside of the container.
8) Inform site services as soon as the clean up procedure has been completed so they can arrange
for collection of the spillage kit into the designated holding area. Remember to inform site services
of the location of this used spillage kit.
9) Inform the Environmental & Safety Manager when the spillage has been dealt with so a report can
be created.
10) When it is safe to re-enter the area inform this fact to the Manager of the area.

Manual Version e1-4.3.0.ae-R3. Page
13
2.10 Additional Safety Notes
To maintain cleanliness within the vacuum system and to prevent contamination, corrosion, and reduce
particulate levels; consideration must be given to preventing air from coming into contact with gases or
process by-products in the vacuum system. This can be achieved by means of nitrogen purging, for
example.
2.11 System Cleaning
You must perform a successful unload procedure to open the chamber (see section 5.2.1 which will
perform pump purges and vents).
•Cleaning the wafer holder and chamber must be done using Texwipe TX1086 or TX1046 or
equivalent cleanroom wipes (6% IPA + 94% DI Water pre-wetted wipes).Over time, the
showerhead will become cloudy but wiping does not generally make a difference and should be
replaced if maintaining optical clarity is important.
•During the cleaning procedures, contaminated particulate material will be created. All
appropriate safety precautions must be observed for this kind of hazard. Ensure that
contaminated material is disposed of in accordance with appropriate site policy and
procedures.
•Cleanroom wipes and abrasives will become contaminated during cleaning procedures. Ensure
that contaminated wipes and abrasives are placed inside a clearly labelled bag and disposed of
in accordance with appropriate site policy and procedures.
2.12 Unintended & Intended Releases
The system is designed to operate at negative pressures, consequently any leaks will usually be ‘in to’
not ‘out of’ the system. These ingresses will therefore be pumped away by the pumping system to the
customer’s Local Exhaust Ventilation (LEV) system.
The system does not produce intentional releases. After processing, all waste products are pumped
away by the pumping system to the customer’s Local Exhaust Ventilation (LEV) system. The by-
products of using XeF2may include hydrogen fluoride and other fluorine compounds. Because of this,
SPTS recommend that a local gas detection system should be fitted to the tool with sensor located in
pipework medially after the gasbox extract bulkhead. It is recommended that the detector should be F2
detection with a Fluorine/Oxidizer sensor. Area sensors near the tool are also recommended.

Manual Version e1-4.3.0.ae-R3. Page
14
3 Description of the product; composition of the product
Thank you for purchasing the XACTIX®e1 Series™ xenon difluoride etching system.
XeF2(xenon difluoride) isotropic silicon etching is particularly well suited to MEMS applications. XeF2
vapor phase etching exhibits nearly infinite selectivity of silicon to photo-resist, silicon dioxide, silicon
nitride and aluminum. Being a vapor phase etchant, XeF2avoids many of the problems typically
associated with wet processes. K. Pister discusses the use of xenon difluoride, as an etchant for MEMS
applications, in part in US patent number 5,726,480.
The Xactix e1 Series is the ideal solution for those seeking a cost effective R&D xenon difluoride etch
system. Built for high etch uniformity, simplicity, low cost of ownership, and a small footprint, the e1
Series is well suited for both research laboratories and universities.
This manual covers un-crating, installation, initial start-up, operation, and maintenance of the unit.
To use the e1 Series, simply place your wafer, die, or other structure into the etch chamber, close the
lid, set the etching conditions, and press start on the software. The details of the process sequence are
captured in the control software, and the user just has to set target etch conditions. Etch progress is
easily monitored using the stereomicroscope located above the transparent chamber lid.
Installation is very easy since only 120V AC input (220V AC option available); dry compressed air,
nitrogen, system and chamber area fume exhaust, and a pump exhaust line are required. The XeF2
canister is contained within the etch system. The combination of a robust design, tested etchant control
software, top quality components, and experienced workmanship results in a dependable and flexible
etching tool for your research needs.
The e1 Series is a system designed to expose samples to xenon difluoride gas in either a cyclic
(pulsed) mode in which the etch chamber is repeatedly filled with XeF2gas and pumped out again.
Depending on the options purchased with the system, the e1 Series can be fitted with the following
components:
•Microscope
•Multiple process software modules
•Electronic image capture of the process chamber

Manual Version e1-4.3.0.ae-R3. Page
15
Figure 1. System Overview. Blue, thin lines indicate electrical and
orange, thick, indicates vacuum connections.
The top level diagram showing the major components of the system is shown in Figure 1. Within these
main components are:
•XeF2 source bottle (supplied by customer) contains solid XeF2, a white crystalline substance
much resembling rock salt. At room temperature, the vapor pressure of XeF2is 3.9 Torr.
•N2source: supplies N2gas (supplied by customer) for venting and purging the process
chamber, and combining with XeF2for etching.
•Expansion chamber: sublimated XeF2and nitrogen gas collect in the expansion chamber
before entering the process chamber. The pressure of XeF2and the pressure of N2are
selected by the user, and gases are allowed into the process chamber only when these
pressures have been achieved.
•Process chamber: this is where the etching occurs for the amount of time specified by the user.
When the etch cycle time is up, gas is pumped out and another etch cycle begins.
•Vacuum pump: this pumps gases out of both the process chamber and the expansion
chamber.
•N2regulator in the gas box which controls the pressure of the N2for the venting of the main
chamber and N2filling of the expansion chamber. Higher pressures lead to faster fill rates but
may lead to reduced fill accuracy or in the case of venting, disturbances to the sample.
•Needle valve for accurately adjusting the flow rate of N2for the Expansion chamber is located
on the left side of the system, on the gas panel. It should not need to be adjusted for normal
use, and should remain partially open. Regulation of XeF2and nitrogen (N2) is automatically
accomplished through a series of computer controlled valves. The needle valve provides fine
control of the flow rate of N2whereas the regulator provides gross control.
•Displays of pressure in the expansion chamber and process chamber are located on the
computer screen.
This manual gives physical details of the services and ambient conditions required to accommodate the
Xactix e1 Series xenon difluoride etching system and to allow it to produce the high performance for
which it is designed.
It must be emphasized that the time and expense devoted to proper site preparation will be rewarded
by the consequent trouble-free, consistent operation and the resulting reduction in downtime.
Etch
Module
Remote
Box
Vacuum
Pump
PC
AC Power
AC Power

Manual Version e1-4.3.0.ae-R3. Page
16
4 Assembly; Installation; First operation
4.1 Preparation
4.1.1 General Requirements of the Site
A solid laboratory table capable of accommodating the weight of the e1 Series must be provided. The
table should be flat and rigid, and allow adequate airflow and access around the system.
Normal clean room and/or laboratory environmental conditions are adequate for the system.
WARNING
BECAUSE OF THE WEIGHT OF THE XACTIX E1 SERIES
,
THREE OR MORE PEOPLE ARE REQUI
RED DURING THE
INSTALLATION TO REMOVE THE UNIT F
ROM THE
SHIPPING CONTAINER AND TO POSITION IT IN
TO ITS
FINAL POSITION FOR OPERATION.
4.1.2 Dimensions and Weights
Crated dimensions (W x D x H): 54.5” x 34” x 58.5”
(1385mm x 864mm x 1486mm)
Crated weight: ~600 lb (272 kg)
e1 Series dimensions: See Figure 2.
e1 Series weight: ~200 lb (90 kg)

Manual Version e1-4.3.0.ae-R3. Page
17
Figure 2. Machine dimensions and locations of utility connections. Note, some systems
do not require connection 4. Please contact SPTS for more info.
4.1.3 Space Requirements
The suggested free table space for the e1 Series in the clean room or laboratory environment is shown
in Figure 2. In addition, sufficient space must be provided behind the unit, or in the service chase, for
the system’s electrical box (see Figure 3) and vacuum pump (see Figure 4).
Figure 3. e1 System electrical power box to be mounted near e1. This unit is connected to the
e1 system via a 5m cable connecting to the left of the electrical box. The mass of this box is 10
kg and all dimensions are in mm.
e1

Manual Version e1-4.3.0.ae-R3. Page
18
Figure 4. nXDS6i pump dimensions in mm. Graphic taken from Edwards nXDS6i datasheet. See
www.edwardsvacuum.com for more details. The pump is to be connected near the system
using the supplied 1.2 m long bellows connection. If necessary, longer connections are
possible with customer supplied connections. The mass of this pump is 26.2 kg.
4.1.4 Electrical Services Required
For North American operations only, the e1 Series is supplied with an appropriate 115-volt single-phase
power cable and plug. For all other countries the unit is delivered with a mains power cable terminating
with bare wires as standard. It is the responsibility of the customer to provide a suitable mains
connector that complies with the local regulations governing electrical connections. The vacuum pump
is controlled via the system’s electrical box.
4.1.5 General Ambient Temperatures
The area accommodating the e1 Series should have:
•Adequate space all around the unit for servicing,
•Adequate space behind the unit for proper ventilation, and
•No unnecessary items near the unit.
Temperature range for operation of the system: 5-40°C
Temperature range for maintaining proper process range: 19-24°C
Humidity range for operation of the system: Less than 50% at 40°C
Humidity range for maintaining proper process range: 68°F (20°C) 40-70%
Maximum Altitude for operation of the system: 2,000m above mean sea level