Panasonic DVD-S75EG User manual

ORDERNO.CHM0305012C2
DVDPlayer
DVD-S75EG / DVD-S75EB/ DVD-S75E
DL2S MechanismSeries
Colour
(S).......................SilverType
(K).......................Black Type(S75EG/E Only)
SPECIFICATIONS
Specifications

Power supply: AC220-240 V, 50 Hz
Power consumption: 17 W
Dimensions: 430 (W)×303 (D)×52 (H)mm
(excluding protrusions)
Mass: 2.7kg
Signal system: PAL625/50, PAL525/60, NTSC
Operating temperature range: +5 to +35°C
Operating humidityrange: 5 to 90 %RH (no
condensation)
Region number: Region No.2
Discs played [8cm or12 cm]:
(1) DVD-RAM(DVD-VRcompatible)
(2) DVD-Audio
(3) DVD-Video
(4) DVD-R(DVD-Video compatible)
(5) CD-Audio (CD-DA)
(6) Video CD
(7) SVCD (Conforming to IEC62107)
(8) CD-R/CD-RW(CD-DA, Video CD, Supper Video-CD
formatted discs)
(9) MP3/WMA
Maximumnumber oftracks and groups
recognizable:
999 tracks and 99 groups
Compatiblecompression rate:
MP3: between 32 kbpsand 320
kbps
WMA: between 48 kbpsand 192
kbps
(10)JPEG
ExifVer 2.1JPEG Baselinefiles
Maximumnumber ofpictures and groups
recognizable:
3000 pictures and 300
groups
Picture resolution: between 320×240 and 6144×
4096 pixels
(Sub sampling is4:2:2or4:2:
0)
(11)HighMAT Level 2(Audio and Image)
Video output:
Outputlevel: 1Vp-p (75 )
Outputterminal: Pin jack (1system)/AV
Svideo output:
Youtputlevel: 1Vp-p (75 )
Coutputlevel: 0.300 Vp-p (75 )
Outputterminal: Sterminal (1system)/AV
Componentvideo output(576I):
Youtputlevel: 1Vp-p (75 )
PBoutputlebel: 0.7Vp-p (75 )

B
0.7
Vp
-
p
(
75
)
PRoutputlevel 0.7Vp-p (75 )
Outputterminal: Pin jack
(1system, Y:green, PB:
blue, PR:red)
RGBvideo output:
Routputlevel: 0.7Vp-p (75 )
G outputlevel: 0.7Vp-p (75 )
Boutputlevel: 0.7Vp-p (75 )
Outputterminal: AV
Audio output:
Outputlevel: 2Vrms (1kHz, 0dB)
Outputterminal: Pin jack/AV
Number ofterminals:
2channel: 1system
5.1-channel discrete
output
(5.1channel):
1system
Audio performance:
(1) Frequencyresponse:
DVD(linear audio): 4Hz-22 kHz(48 kHz
sampling)
4Hz-44 kHz(96 kHz
sampling)
DVD-Audio: 4Hz-88 kHz
(192 kHzsampling)
CD audio: 4Hz-20 kHz
(2) S/Nratio:
CD audio: 115 dB
(3) Dynamicrange:
DVD(linear audio): 102 dB
CD audio: 98 dB
(4) Total harmonicdistortion:
CD audio: 0.0025 %
Digital audio output:
Optical digital output: Optical terminal
Coaxial digital output: Pin jack
Pickup
Wavelength: 658 nm/790 nm
Laser power: CLASS 2/CLASS 1
Power consumption in standbymode:
1.9W
Note:
Specificationsare subjectto changewithoutnotice.
Mass and dimensionsare approximate.
Solder:
Thismodel uses lead free solder (PbF).

2003 ChinaHualu~Matsushita AVCCO., Ltd. All rights
reserved. Unauthorizedcopying and distribution isaviolation of
law.
1. Service Information Regarding MODULE P.C.B. of
DVD-S75EG/EB/E
1.1. Overview
DVD model DVD-S75EG/EB/Ewill be manufacturedusing 2 distinctlydifferent MODULEP.C.B..
These 2 versions of MODULEP.C.B. will be referredto as P.C.B. types “B”and “C”.
[This mainService Manual is applicable ONLYto P.C.B. “TYPE B”.]
P.C.B. type “C”is coveredbyotherSupplement Service Manual.
Firstproduction units will all have P.C.B. type “B”.
Note:
Although different IC partnumber’s are used, the features, function and performance are
identical.
1.2. HowtoDistinguishtheTypes ofMODULE P.C.B.
Types “B”and “C”of MODULEP.C.B. canbe distinguisheddepend on partnumberof MODULE
P.C.B. as shownbelow.
Figure

1.3. Difference Comparison Chart(onlymainparts)
[Differences and Comparison Chart]
Description / Ref. # Type A Type B Type C
MODULEP.C.B. Does not exist REP3500E REP3585C-C
AVdecorder(IC3001) ----- ROM2
(MN2DS0002AP1) ROM2 (MN2DS0002AP1)
SDRAM(IC3051) ----- 64Mbit
(C3ABPG000102) 64Mbit(Part# not yet decided)
SDRAM(IC3061) ----- 64Mbit
(C3ABPG000102) -----
LATCH (IC6311) ----- C0JBAH000074 -----
LATCH (IC6312) ----- C0JBAH000074 -----
FLASH ROM(IC6301) ----- RFKFSS70R160 Part# not yetdecided.
CAUTION:ALWAYSCONFIRMTHEP.C.B. PARTNUMBER AND TYPE AND REFER TOTHE
APPROPRIATESERVICEMANUALBEFORETROUBLESHOOTINGOR REPLACINGANYPARTS.
2. SAFETY PRECAUTIONS
2.1. GENERALGUIDELINES
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperly
installed.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrom being exposedtoshock hazards.
2.1.1. LEAKAGE CURRENT COLD CHECK

1. Unplug theACcord and connect ajumperbetweenthetwo
prongson theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Whentheexposedmetallicparthas areturn pathtothechassis,
thereading shouldbebetween1M and 5.2M . / Whenthe
exposedmetal does nothaveareturn pathtothechassis, the
reading must be . Figure 1
2.1.2. LEAKAGE CURRENT HOT CHECK (See Figure1.)
1. Plug theACcord directlyintotheACoutlet. Donotuse an
isolation transformerfor thischeck.
2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F
capacitors, betweeneachexposedmetallicparton theset and a
good earthground suchas awaterpipe, as shownin Figure 1 .
3. Use anACvoltmeter, with1000 ohms/voltor moresensitivity, to
measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A
leakagecurrenttester(Simpson Model 229 or equivalent) maybe
usedtomake thehotchecks, leakagecurrentmu3st notexceed1/
2milliamp. Incase ameasurementisoutsideofthelimits
specified, thereisapossibilityofashock hazard, and the
equipmentshouldberepairedand recheckedbeforeitisreturned

tothecustomer.
3. PREVENTIONOF ELECTROSTATICDISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor(solidstate)devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES)Devices. Examples of typical
ES devices are integratedcircuits and some field-effecttransistorsand semiconductor"chip"
components. The following techniques shouldbe usedto helpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybeforehandling anysemiconductor componentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischargingESDwrist strap, which
shouldberemovedfor potential shock reasonsprior toapplying
powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas alminum foil,
topreventelectrostaticchargebuildup or exposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderor unsolderES
devices.
4. Use onlyananti-staticsolderremoval device. Somesolder
removal devices notclassifiedas "anti-static(ESDprotected)"
cangenerate electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device from its protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, alminum foil or
comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial from the
leadsofareplacementES device, touchtheprotectivematerial to
thechassisor circuitassemblyintowhichthedevice will be

installed.
Caution
Besureno powerisappliedtothechassisor circuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
togetherofyour clothes fabricor thelifting ofyour footfrom a
carpetedfloor cangenerate staticelectricity(ESD) sufficient
todamageanES device).
4. Precaution ofLaser Diode
5. Aboutlead free solder (PbF)
Distinction of PbF PCB:PCBs (manufactured) using leadfree solderwill have a PbF stamp on
the PCB.
Caution:
-Pbfree solderhas ahighermelting pointthanstandard solder;
Typicallythmelting pointis50 -70°F(30 -40°C) higher. Please use
ahigh temperaturesoldering iron. Incase ofthesoldering iron
withtemperaturecontrol,please set itto700 ±20°F(370 ±10°C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about
1100°F/ 600°C).
Whensoldering or unsoldering, please completelyremoveall ofthe
solderon thepinsor solderarea, and besuretoheat thesoldering
points withthePbfree solderuntil itmelts enough.
6. General Description
6.1. Operating instructions
7. PREVENTIONOF STATICELECTRICITY
DISCHARGE
The laserdiode inthe traverse unit(optical pickup) maybrake downdue to static electricityof
clothes orhumanbody. Use due caution to electrostatic breakdownwhenservicing and
handling the laserdiode.
7.1. Grounding for electrostaticbreakdownprevention
Some devices suchas the DVD playeruse the optical pickup (laserdiode)and the optical
pickup will be damagedbystatic electricityinthe working environment. Proceedservicing
works underthe working environment where grounding works is completed.
7.1.1. Worktablegrounding
1. Putaconductivematerial (sheet) or iron sheet on thearea where
theoptical pickup isplaced, and ground thesheet.
7.1.2. Humanbodygrounding
1. Use theanti-staticwrist straptodischargethestaticelectricity
form your body.
7.1.3. Handling ofoptical pickup
1. Tokeepthegood qualityoftheoptical pickup maintenance parts
during transportation and beforeinstallation, thebothendsofthe
laserdiodeareshort-circuited. Afterreplacing theparts withnew
ones, removetheshortcircuitaccordingtothecorrect procedure.
(See thisTechnical Guide.)

2. Donotuse atestertocheck thelaserdiodefor theoptical pickup.
Failuretodo sowill damagethelaserdiodeduetothepower
supplyinthetester.
7.2. Handling Precautionsfor Traverse Unit(Optical Pickup)
1. Donotgiveaconsiderableshock tothetraverse unit(optical
pickup)as ithas anextremelyhigh-precise structure.
2. Whenreplacing theoptical pickup, install theflexiblecableand
cutits shortland withanipper. See theoptical pickup
replacementprocedureinthisTechnical Guide. Beforereplacing
thetraverse unit, removetheshortpinfor preventingstatic
electricityand install anewunit. Connect theconnector as short
times as possible.
3. Theflexiblecablemaybecutoff ifanexcessiveforce isapplied
toit. Use caution whenhandling thecable.
4. Thehalf-fixedresistor for laserpoweradjustmentcannotbe
adjusted. Donotturn theresistor.
8. DISASSEMBLINGTHE CASINGAND CHECKING
P.C.B.S
8.1. DisassemblyProcedure

8.2. Casing Parts and P.C.B. Positions
8.3. Top Panel
1. Unscrewthescrews.
8.4. Tray(Whentaking outdisc manually)
1. Separates thegearfor drawing outtrayfrom themechanismunit.
Itinserts ascrewdriverinthegear. (Thegearjig)
2. Insertthegearjigintothetrayopen/ close hole.
3. Turn thegearjigcounterclockwise toopenthetray.

8.5. FrontPanel
1. Release thetabs.
2. Removetheconnector.

8.6. ModuleP.C.B.
1. Unscrewthescrews.
2. Removetheconnectors.
3. Press eachtabwiththenippertomodulePCB vertically.
8.7. MechanismUnit
1. Unscrewthescrews.
2. Removetheconnectors.
3. Pull outthemechanismunitvertically.

8.8. Front(L)P.C.B. and Front(R) P.C.B.
1. Unscrewthescrews.
2. RemovetheFrontangle(L).
3. Removetheconnector.
4. Release thetabs.
5. Unscrewthescrews.
6. RemovetheFrontangle(R).
7. Removetheconnector.
8. Release thetabs.

8.9. Rearpanel
1. Unscrewthescrews
2. Release thetabs.
8.10. PowersupplyP.C.B.
1. Unscrewthescrew.
2. Removetheconnector.
8.11. MotherP.C.B.
1. Unscrewthescrews.

8.12. Service Position
8.12.1. Servicing position oftheModuleP.C.B.
8.12.2. Servicing position oftheMother P.C.B. &Power supplyP.C.B.

8.12.3. List oftheExtension Cables
9. ASSEMBLINGAND DISASSEMBLINGTHE
MECHANISMUNIT
9.1. DisassemblyProcedure

9.2. Traverse Unit
1. Removetheconnector.

2. Slidethelever(A)inthearrowdirection (totheopposite side) till
itstops.
3. Slidethelever(A)furtherbybending thetabat therightsideof
theleverAintherightdirection. (Therightgrooveopensand the
boss becomes seen.)
4. Openthelever(B) toleft. (The2grooves at theleft sideopen.)
5. Removethetraverse unit