Panasonic TX-15LV1 User manual

ORDERNO. ITD0209027C2
Combination 15.2”Diagonal LCD TV/DVDPlayer
TX-15LV1
LH5Chassis
SPECIFICATIONS
Specifications

Power Source
AC100-240V, 50/60Hz
Power Consumption
Averageuse:52W
Stand-bycondition:3.0W
TVset:DC 15 V2.8AMAX.
LCD
385 mm
16:9aspectratio LCD panel
Screen Size
(W)336 mm (H)189 mm
Receiving System
PAL I, PAL-525/60
M.NTSC
NTSC(AVonly)
Receiving Channels
UHF E21-E59
Sound
Speaker
Tweeter (4× 8cm 2pcs, 8 )
Woofer ( 5cm, 8 )

Audio Output
6.5W(2.0W+2.0W+2.5W](woofer)), 10%THD
Headphones
M3(3.5mm)Jack× 1
8 impedance
Features
DVDplayer, Aero-Hammer Woofer System
(2Way3Speaker System)
Disc Played
DVD-VIDEO disc
12cm single-sided, single-layer
12cm single-sided, dual-layer
12cm double-sided, single-layer
8cm single-sided, single-layer
8cm single-sided, dual-layer
8cm double-sided, single-layer
COMPACT disc (CD-DA, VIDEO CD)
12cm disc
8cm disc
Connection Terminals
AV1IN Video (21 pin) 1Vp-p 75
Audio (21 pin) 500mVrms 10k
RGB(21 pin)
AV1OUT Video (21 pin) 1Vp-p 75
Audio (21 pin) 500mVrms 1k
AV2IN S-Video IN(4pin) Y: 1Vp-p 75
C:0.3Vp-p 75
Audio (RCA×2) 500mVrms 10k
Video (RCA×1) 1Vp-p 75
DVDOUT S-Video OUT (4
pin) Y: 1Vp-p 75
C:0.3Vp-p 75
AUDIO L-R/ DIGITAL AUDIO (STEREO
M3Jack)1.3Vrms (1kHz, 0dB)/
BITSTREAM, Linear PCM
Operating Conditions
Temperature
42°F -95°F(5°C-35°C)
Humidity
20%-80%(non-condensing)
Dimensions(WxHxD)
Including TVStand
424 mm× 319 mm× 180 mm
TVSetOnly
424 mm× 283 mm× 80 mm
Weight(Mass)
6.0kg Net
DVDOUT
Audio output
Outputlevel

1.3Vrms (1kHz, 0dB)
Outputterminal
Mixed output(L/R)
RCA(1system), AV1/AV2
5.1ch discreteoutputOptical terminal
Audio signal outputcharacterstics
(1)Frequencyresponse
DVD(linear audio)
4Hz-22 kHz(48 kHzsampling)
4Hz-44 kHz(96 kHzsampling)
CD audio
115 dB(EIAJ)
(2)S/Nratio
CD audio:115 dB(EIAJ)
(3)Dynamicrange
DVD(linear audio)103 dB
CD audio 99dB(EIAJ)
(4)Total harmonicdistortion
CD audio 0.002%(EIAJ)
Digital audio output
Optical digital output
Optical terminal
Pickup
Wavelength:665 nm
Laser power
CLASS 1
Note:
Design and Specificationsare subjectto changewithoutnotice.
Weightand Dimensionsshown are approximate.
2002 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorizedcopying and distribution isaviolation oflaw.

1. SafetyPrecautions
1.1. General Guidelines
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperly
installed.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrom being exposedtoshock hazards.
1.2. Touch-CurrentCheck
1. Plug theACcord directlyintotheACoutlet. Donotuse an
isolation transformerfor thischeck.
2. Connect ameasuring networkfor touchcurrents betweeneach
exposedmetallicparton theset and agood earthground suchas
awaterpipe, as showninFigure1.

3. Use LeakageCurrentTester(Simpson 228 or equivalent) to
measurethepotential across themeasuring network.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. ReservetheACplug intheACoutlet and repeat eachoftheabove
measure.
6. Thepotential at anypoint(TOUGHCURRENT)expressedas
voltageU1and U2, does notexceedthefollowing values:
For a. c.:U1=35 V (peak) and U2=0.35 V (peak);
For d. c.:U1=1.0V,
Note:
The limitvalue of U2=0.35 V(peak)fora. c. and U1=1.0 Vford. c. correspond to the values 0.7
mA(peak)a. c. and 2.0 mAd. c.
The limitvalue U1=35 V(peak)fora. c. correspond to the value 70 mA(peak)a. c. for
frequencies greaterthan100 kHz.
7. Incase ameasurementisoutofthelimits specified, thereisa
possibilityofashock hazard, and theequipmentshouldbe
repairedand recheckedbeforeitisreturnedtothecustomer.
Figure 1
2. Prevention ofElectro StaticDischarge (ESD) to
ElectrostaticallySensitive(ES)Devices

Some semiconductor(solidstate)devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES)Devices. Examples of typical
ES devices are integratedcircuits and some field-effecttransistorsand semiconductor"chip"
components. The following techniques shouldbe usedto helpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybeforehandling anysemiconductor componentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischargingESDwrist strap, which
shouldberemovedfor potential shock reasonsprior toapplying
powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas alminum foil,
topreventelectrostaticchargebuildup or exposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderor unsolderES
devices.
4. Use onlyananti-staticsolderremoval device. Somesolder
removal devices notclassifiedas "anti-static(ESDprotected)"
cangenerate electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device from its protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, alminum foil or
comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial from the
leadsofareplacementES device, touchtheprotectivematerial to
thechassisor circuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisor circuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyour clothes fabricor thelifting ofyour footfrom a
carpetedfloor cangenerate staticelectricity(ESD) sufficient
todamageanES device).
3. Precaution ofLaser Diode
Caution
Thisunitutilizes aclass I laser. Invisiblelaserradiation isemitted
from theoptical pickup lenswhentheunitisturnedon:
1. Donotlookdirectlyintothepickup lens.
2. Donotuse optical instruments tolookat thepickup lens.
3. Donotadjust thepreset variableresistor on theoptical pickup.
4. Donotdisassembletheoptical pickup unit.
5. Iftheoptical pickup isreplaced, use themanufactures specified
replacementpickup only.
6. Use ofcontrol or adjustmentor performance ofprocedures other
thanthose specifiedherinmayresultinhazardousradiation
exposure.
4. Handling Precautions For Traverse Deck
The laserdiode inthe optical pickup maybreak downdue to potential difference causedby
static electricityof clothes orhumanbody.
Sobe careful of electrostatic break downduring repairof the optical pickup.
4.1. Handling ofoptical pickup
1. Donotsubject theoptical pickup tostaticelectricityas itis
extremelysensitivetoelectrical shock.
2. Topreventthebreakdownofthelaserdiode, anantistatic
shorting pinisinsertedintotheflexibleboard (FPCBoard). /
Whenremoving or connecting theshortpin, finishthejob inas
shorttimes as possible.
3. Becareful nottoapplyexcessivestress totheflexibleboard (FPC
Board).

4. Donotturn thevariableresistor (Laserpoweradjustment).
4.2. Grounding for electrostaticbreakdownprevention
1. Humanbodygrounding / Use theantistaticwrist strapto
dischargethestaticelectricityfrom your body.
2. Worktablegrounding / Putaconductivematerial (sheet) or steel
sheet on thearea wheretheoptical pickup isplacedand ground
thesheet.
Caution
Thestaticelectricityofyour clothes will notbegroundedthrough
thewrist strap. Sotake carenottolet your clothes touchthe
optical pickup.
5. Aboutlead free solder (PbF)
Note:Leadis listedas (Pb) inthe periodic table of elements.
Inthe information below, Pbwill referto Leadsolder, and PbF will referto LeadFree Solder.
The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).
Thatis Tin(Sn), Silver(Ag) and (Cu) although othertypes are available.
This model uses PbFree solderinit’s manufacture due to environmental conservation issues.

Forservice and repairwork, we’dsuggestthe use of Pbfree solderas well, although Pbsolder
maybe used.
PCBs manufacturedusing leadfree solderwill have the PbF withina leafSymbol
stampedon the back of PCB.
Caution
-Pbfree solderhas ahighermelting pointthanstandard solder.
Typicallythemelting pointis50 ~70 ~F(30~40~C) higher. Please
use ahigh temperaturesoldering iron and set itto700 ±20 ~F
(370 ±10 ~C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about
1100 ~For600~C).
Ifyou must use Pbsolder, please completelyremoveall ofthePb
free solderon thepinsor solderarea beforeapplying Pbsolder. If
thisisnotpractical, besuretoheat thePbfree solderuntil it
melts, beforeapplying Pbsolder.
-Afterapplying PbF soldertodoublelayeredboards, please check
thecomponentsidefor excess solderwhichmayflowontothe
opposite side. (see figurebelow)
SuggestedPbfree solder
There are several kinds of Pbfree solderavailable forpurchase. This productuses Sn+Ag+Cu
(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder
canalsobeused.