Panasonic Viera TC-26LX70 User manual

© 2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
LH65A Chassis
26”/32” DIAGONAL LCD TV
Specifications
Powe
r
Source
A
C 120-127 V, 60 Hz
Powe
r
Consumption
Aver
a
ge use 116 W (TC-26LX70)
132 W (TC-32LX70)
Maximum Current 2.1 A (TC-26LX70)
2.3 A (TC-32LX70)
Standby condition 0.1 W
Aspect Ratio 16 : 9
V
isible screen size
(W × H × Diagonal) 26.0 " DIAGONAL (66.1 cm DIAGONAL) (TC-26LX70)
31.5 " DIAGONAL (80.0 cm DIAGONAL) (TC-32LX70)
22.7 " × 12.8 " × 26.0 " (576 mm × 324 mm × 661 mm) (TC-26LX70)
27.5 " × 15.4 " × 31.5 " (698 mm × 392 mm × 800 mm) (TC-32LX70)
(No. o
f
pixels) 1,049,088 (1,366 (W) × 768(H)) [4,098 × 768 dots]
Sound
Speake
r
1wa
y
2 spea
k
ers
Audio Output 20 W (10 W × 2) ( 10 % THD )
Headphones M3 (3.5mm) Jack × 1
Channel Capability - VHF/UHF: 2 - 69, CATV: 1 - 135
ATSC
/
NTSC(Digital/Analog)
Operating Conditions Temperatu
r
e: 32 °F - 95 °F (0 °C - 35 °C)
Humidit
y
: 20 % - 80 % RH (non-condensing)
Connection Terminals
INPUT 1-2 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
S-VIDEO: Mini DIN 4-pin Y: 1.0 V [p-p] (75 ohm) C: 0.286 V [p-p] (75 ohm)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
INPUT 3 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
ORDER NO.MTNC070304CE
B05 Canada: B07

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Chassis Board Layout 8
6 Disassembly for Service 9
6.1. Pedestal assy 9
6.2. Rear cover 9
6.3. VESA metal 9
6.4. AC cord 10
6.5. Tuner cover 10
6.6. Power button bracket 10
6.7. Control panel assy 10
6.8. G-Board 11
6.9. Side AV bracket and Inverter shield 11
6.10. AP-Board 12
6.11. P-Board 12
6.12. DT-Board 12
6.13. A-Board and DT-Board metal 13
6.14. Chassis 13
6.15. LCD MTG and LCD panel 14
6.16. Speaker 14
6.17. V-Board 15
7 Caution statement 16
7.1. Caution statement. 16
8 Location of Lead Wiring 17
8.1. Wire dressing (32 inch) 17
8.2. Wire dressing (26 inch) 18
9 EMI Processing 19
9.1. EMI (32 inch) 19
9.2. EMI (26 inch) 21
10 Self-check Function 23
10.1. Check of the IIC bus lines 23
10.2. Power LED Blinking timing chart 24
10.3. No Power 25
11 Service Mode 26
11.1. How to enter into Service Mode 26
11.2. SRV-TOOL 27
12 Adjustment 28
12.1. Voltage chart of AP-board 28
12.2. Voltage chart of P-board 28
12.3. Voltage chart of A-board 28
12.4. Picture level adjustment (RF) 28
13 Hotel mode 29
14 Conductor Views 31
14.1. AP-Board (32 inch) 31
COMPONENT
VIDEO INPUT Y: 1.0 V [p-p] (including synchronization)
PB,P
R: ± 0.35 V [p-p]
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
HDMI 1-2 TYPE A Connecto
r
×2
AUDIO IN This TV supports “HDAVI Cont
r
ol 2" function.
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
OUTPUT VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
DIGITAL AUDIO OUT PCM/Dolb
y
Digital, Fibe
r
Optic
FEATURES 3D Y/C Digital Comb Filter, CLOSED CAPTION, V-Chip
HDMI (HDAVI Cont
r
ol 2)
Vesa compatible Photo Viewer
Dimensions (W × H × D)
Including TV stand 25.9 " × 20.3 " × 9.4 " (657 mm × 515 mm × 239 mm) (TC-26LX70)
31.1 " × 23.3 " × 9.4 " (791 mm × 592 mm × 239 mm) (TC-32LX70)
TV Set only 25.9 " × 18.4 " × 4.6 " (657 mm × 468 mm × 117 mm) (TC-26LX70)
31.1 " × 21.5 " × 4.6 " (791 mm × 545 mm × 117 mm) (TC-32LX70)
Weight 31.1 lb. (14.0 kg ) NET (TC-26LX70)
36.7 lb. (16.5 kg ) NET (TC-32LX70)
Note:
Design and Specifications are subject change without notice. Weight and Dimensions shown are approximate.
CONTENTS
Page Page
2
TC-26LX70 / TC-32LX70

14.2. AP-Board (26 inch) 33
14.3. A-Board 35
14.4. DT-Board 38
14.5. G and V-Board 39
15 Schematic and Block Diagram 41
15.1. Schematic Diagram Notes 41
15.2. Block Diagram (1 of 2) 42
15.3. Block Diagram (2 of 2) 43
15.4. Interconnection Schematic Diagram 44
15.5. AP-Board (1 of 2) Schematic Diagram (26 inch) 45
15.6. AP-Board (2 of 2) Schematic Diagram (26 inch) 46
15.7. AP-Board (1 of 2) Schematic Diagram (32 inch) 47
15.8. AP-Board (2 of 2) Schematic Diagram (32 inch) 48
15.9. A-Board (1 of 10) Schematic Diagram 49
15.10. A-Board (2 of 10) Schematic Diagram 50
15.11. A-Board (3 of 10) Schematic Diagram 51
15.12. A-Board (4 of 10) Schematic Diagram 52
15.13. A-Board (5 of 10) Schematic Diagram 53
15.14. A-Board (6 of 10) Schematic Diagram 54
15.15. A-Board (7 of 10) Schematic Diagram 55
15.16. A-Board (8 of 10) Schematic Diagram 56
15.17. A-Board (9 of 10) Schematic Diagram 57
15.18. A-Board (10 of 10) Schematic Diagram 58
15.19. DT, G and V-Board Schematic Diagram 59
16 Exploded View and Replacement Parts List 61
16.1. Exploded View 61
16.2. Replacement Parts List Notes 62
16.3. Mechanical Replacement Parts List 63
16.4. Electrical Replacement Parts List 64
3
TC-26LX70 / TC-32LX70

1 Applicable signals
* Mark: Applicable input signal for Component (Y, PB,P
R) and HDMI
horizontal frequency (kHz) vertical frequency (kHz) COMPONENT HDMI
525 (480) / 60i 15.73 59.94 * *
525 (480) /60p 31.47 59.94 * *
750 (720) /60p 45.00 59.94 * *
1,125 (1,080) /60i 33.75 59.94 * *
1,125 (1,080)/60p 67.43 59.94 *
1,125 (1,080)/60p 67.50 60.00 *
Note:
·
· ·
· Signals other than those shown above may not be displayed properly.
·
· ·
· The above signals are reformatted for optimal viewing on your display.
4
TC-26LX70 / TC-32LX70

2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be 100 Mohm
and over.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15µF capacitors, between each exposed metallic part on
the set and a good earth ground such as a water pipe, as
shown in Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
5
TC-26LX70 / TC-32LX70

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
TC-26LX70 / TC-32LX70

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
7
TC-26LX70 / TC-32LX70

5 Chassis Board Layout
8
TC-26LX70 / TC-32LX70

6.1. Pedestal assy
1.Lay down the unit so that the rear cover faces upward.
2.Remove the 4 screws.
3.Remove the pedestal assy.
6.2. Rear cover
1.Remove the 16 (32”) / 14 (26”) screws.
2.Remove the rear cover.
6.3. VESA metal
1.Remove the 4 screws.
2.Remove the VESA metal.
6 Disassembly for Service
9
TC-26LX70 / TC-32LX70

6.4. AC cord
1.Remove the bushing of the AC cord from the tuner cover.
2.Disconnect the connector (CN1) of AC cord.
6.5. Tuner cover
1.Remove the 2 screws.
2.Remove the tuner cover.
6.6. Power button bracket
1.Remove the 2 screws.
2.Remove the power button bracket.
6.7. Control panel assy
1.Disconnect the connector (AP6).
2.Remove the 2 screws.
3.Remove the control panel assy.
10
TC-26LX70 / TC-32LX70