Panasonic TH-50PH9UK User manual

©2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-50PH9UK
GPH9D Chassis
High Definition Plasma Display
Specifications
Power Source 120 V
A
C, 50/60Hz
Power Consumption
Maximum 460 W
Stand-b
y
condition Save OFF 0.5 W, Save ON 0.3 W
Power off condition 0.1W
Plasma Displa
y
panel Drive method:
A
C type 50-inch,
16:9 aspect ratio
Contrast Ratio Ma
x
10000:1
Screen size 43.5” (1,106 mm) (W) × 24.5” (622 mm) (H) × 50” (1,269 mm) (diagonal)
(No. of pixels) 1,049,088 (1,366 (W) × 768 (H) [4,098 × 768 dots]
Operating condition
Temperature 32 °F - 104 °F (0 °C - 40 °C)
Humidit
y
20 % - 80 %
Applicabl
e
signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 50i 24p 25p
30p 24sF .... SMPTE274M, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA,
SXGA, UXG
A
..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
A
V VIDEO IN / OUT (BNC) 1.0 Vp-p (75-ohm or high impedance)
S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
COMPONENT / RGB
Y
/ G (BNC) 1.0 Vp-p
/
composite (75-ohm)
0.7 Vp-p
/
non-composite (75-ohm)
PB/B (BNC), PR/R (BNC) 0.7 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
PC (HIGH-DENSIT
Y
Mini-D-SUB 15PIN) R,G,B
/
0.7 Vp-p (75-ohm)
ORDER NO. MTNC060689CE
D10 Canada: B07

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Disassembly 9
6.1. Removal of the Back Cover 9
6.2. Removal of the HU-Board 9
6.3. Removal of the HA-Board 9
6.4. Removal of the Slot Block 9
6.5. Removal of the J-Board 10
6.6. Removal of the HX-Board 10
6.7. Removal of the PB-Board 10
6.8. Removal of the DA-Board 11
6.9. Removal of the P-Board 11
6.10. Removal of the D-Board 12
6.11. Removal of the H3-Board (L, R) 12
6.12. Removal of the SU-Board and the SD-Board 12
6.13. Removal of the SC-Board 13
6.14. Removal of the SS2-Board and the SS3-Board 13
6.15. Removal of the SS-Board 13
6.16. Removal of the C1, C2, C3, C4, C5 and the C6-Board 13
6.17. Removal of the S1-Board 15
6.18. Removal of the Fan 15
6.19. Removal of the Escutcheon 16
6.20. Removal of the V1-Board and the V2-Board 16
6.21. Removal of the Plasma Panel 17
7 Location of Lead Wiring 20
7.1. Location of Lead Wiring (1) 20
7.2. Location of Lead Wiring (2) 21
7.3. Location of Lead Wiring (3) 22
7.4. Location of Lead Wiring (4) 22
8 Adjustment Procedure 23
8.1. Driver Set-up 23
8.2. Initialization Pulse Adjust 24
8.3. P.C.B. (Printed Circuit Board) Remove 24
8.4. Adjustment Volume Location 25
8.5. Test Point Location 25
9 Service mode 26
9.1. CAT (computer Aided Test) mode 26
9.2. IIC mode structure (following items value is sample data.)
29
10 Adjustment 30
10.1. RGB white balance adjustment 30
10.2. HD white balance adjustment 32
10.3. Power control adjustment 34
11 Trouble shooting guide 35
11.1. Self Check 35
HD, VD
/
1.0 - 5.0 Vp-p (high impedance)
Component
Y: 1.0 Vp-p (75-ohm : include sync)
PB/C
B: 0.7 Vp-p (75-ohm)
PR
/
CR: 0.7 Vp-p (75-ohm)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (6Ω) 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter EUR7636070R
Batteries 2×
AA
Size
Fixing bands (TMME203 or TMME187) × 2
Dimensions (
W
×H×D) 47.6” (1,210 mm) × 28.5” (724 mm) × 3.7” (95 mm)
Mass (weight)
main unit onl
y
approx. 81.6 lbs
with speakers approx. 90.4 lbs
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
· This equipment complies with the EMC standards listed below. EN55022, EN55024, EN61000-3-2, EN61000-3-3. (EK/ES/BK/BS)
CONTENTS
Page Page
2
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11.2. No Power 37
11.3. No Picture 37
11.4. Local screen failure 38
12 Option Setting 39
13 Conductor Views 41
13.1. P-Board 41
13.2. PB-Board 44
13.3. HA-Board 45
13.4. HU-Board 46
13.5. HX-Board 47
13.6. H3, S1, V1 and V2-Board 48
13.7. J-Board 49
13.8. DA-Board 51
13.9. D-Board 53
13.10. C1-Board 55
13.11. C2-Board 56
13.12. C3-Board 57
13.13. C4-Board 58
13.14. C5-Board 59
13.15. C6-Board 60
13.16. SC-Board 61
13.17. SU-Board 64
13.18. SD-Board 65
13.19. SS-Board 66
13.20. SS2 and SS3-Board 68
14 Block and Schematic Diagram 69
14.1. Schematic Diagram Notes 69
14.2. Main Block Diagram 70
14.3. P-Board Block Diagram 71
14.4. P-Board (1 of 2) Schematic Diagram 72
14.5. P-Board (2 of 2) Schematic Diagram 73
14.6. PB-Board Block and Schematic Diagram 74
14.7. HA-Board Block and Schematic Diagram 75
14.8. HU-Board Block Diagram 76
14.9. HU-Board (1 of 2) Schematic Diagram 77
14.10. HU-Board (2 of 2) Schematic Diagram 78
14.11. HX-Board Block and Schematic Diagram 79
14.12. V1 and V2-Board Block and Schematic Diagram 80
14.13. J-Board (1 of 2) Block Diagram 81
14.14. J-Board (2 of 2) Block Diagram 82
14.15. J-Board (1 of 5) and H3-Board Schematic Diagram 83
14.16. J-Board (2 of 5) Schematic Diagram 84
14.17. J-Board (3 of 5) Schematic Diagram 85
14.18. J-Board (4 of 5) Schematic Diagram 86
14.19. J-Board (5 of 5) Schematic Diagram 87
14.20. DA-Board (1 of 2) Block Diagram 88
14.21. DA-Board (2 of 2) Block Diagram 89
14.22. DA-Board (1 of 6) Schematic Diagram 90
14.23. DA-Board (2 of 6) Schematic Diagram 91
14.24. DA-Board (3 of 6) Schematic Diagram 92
14.25. DA-Board (4 of 6) Schematic Diagram 93
14.26. DA-Board (5 of 6) Schematic Diagram 94
14.27. DA-Board (6 of 6) Schematic Diagram 95
14.28. D-Board (1 of 2) Block Diagram 96
14.29. D-Board (2 of 2) Block Diagram 97
14.30. D-Board (1 of 8) Schematic Diagram 98
14.31. D-Board (2 of 8) Schematic Diagram 99
14.32. D-Board (3 of 8) Schematic Diagram 100
14.33. D-Board (4 of 8) Schematic Diagram 101
14.34. D-Board (5 of 8) Schematic Diagram 102
14.35. D-Board (6 of 8) Schematic Diagram 103
14.36. D-Board (7 of 8) Schematic Diagram 104
14.37. D-Board (8 of 8) Schematic Diagram 105
14.38. C1, C2, C5 and C6-Board Block Diagram 106
14.39. C3, C4, SS, S1, SS2 and SS3-Board Block Diagram 107
14.40. C1-Board (1 of 2) Schematic Diagram 108
14.41. C1-Board (2 of 2) Schematic Diagram 109
14.42. C2-Board (1 of 3) Schematic Diagram 110
14.43. C2-Board (2 of 3) Schematic Diagram 111
14.44. C2-Board (3 of 3) Schematic Diagram 112
14.45. C3-Board (1 of 2) Schematic Diagram 113
14.46. C3-Board (2 of 2) Schematic Diagram 114
14.47. C4-Board (1 of 2) Schematic Diagram 115
14.48. C4-Board (2 of 2) Schematic Diagram 116
14.49. C5-Board (1 of 3) Schematic Diagram 117
14.50. C5-Board (2 of 3) Schematic Diagram 118
14.51. C5-Board (3 of 3) Schematic Diagram 119
14.52. C6-Board (1 of 2) Schematic Diagram 120
14.53. C6-Board (2 of 2) Schematic Diagram 121
14.54. SS, S1, SS2 and SS3-Board Schematic Diagram 122
14.55. SC, SU and SD-Board Block Diagram 123
14.56. SC-Board (1 of 2) Schematic Diagram 124
14.57. SC-Board (2 of 2) Schematic Diagram 125
14.58. SU-Board (1 of 2) Schematic Diagram 126
14.59. SU-Board (2 of 2) Schematic Diagram 127
14.60. SD-Board (1 of 2) Schematic Diagram 128
14.61. SD-Board (2 of 2) Schematic Diagram 129
15 Parts Location 131
15.1. Exploded View 131
15.2. Fan part location enlarged views 132
15.3. Cable relation 133
15.4. Packing summary 134
16 Mechanical Replacement Parts List 135
17 Replacement Parts List 136
17.1. Replacement Parts List Notes 136
17.2. Electrical Replacement Parts List 137
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1 Applicable signals
4
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2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the readingshould be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outsideof the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
5
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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistorsand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
whichshould be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or
comparable conductivematerial).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
todamage an ES device).
6
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also beused.
7
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5Service Hint
Board Name Function
DA Digital Signal Processor, Micon
D Format Converter, Plasma Ai Processor
Sub-Filed Processor
J Slot Interface (Audio / Video / Sync inputSwitch), SYNC processor,
Sound processor
SS Sustain drive
SC Scan drive
SU Scan out (Upper)
SD Scan out (Lower)
C1 Data Drive (Upper Right)
C2 Data Drive (Upper Center)
C3 Data Drive (Upper Left)
C4 Data Drive (Lower Left)
C5 Data Drive (Lower Center)
C6 Data Drive (Lower Right)
H3 Speaker terminal
S1 Power switch
SS2 Sustain out (Upper)
SS3 Sustain out (Lower)
V1 Remote receiver, LED-G, R
V2 Key switch
PB Fan control
P Power supply
HX PC / RS-232C Input terminal
HU Dual Video terminal (BNC / S)
HA Component Video terminal (BNC)
Note:
Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC07040)
8
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6 Disassembly
· To disassemble P.C.B., wait for 1 minute after power was
off for discharge from electrolysis capacitors.
· and marks indicate screw positions.
6.1. Removal of the Back Cover
1. Remove the screws (×18 ,×6 ,×4 ) and then remove
the Back Cover.
6.2. Removal of the HU-Board
1. Remove the 4 screws(A) and then remove the HU Terminal
Block.
2. Remove the 4 screws(B).
3. Remove the 3 screws(C) and then remove the HU-Board.
6.3. Removal of the HA-Board
1. Remove the 4 screws(D) and then remove the HA Terminal
Block.
2. Remove the 4 screws(E).
3. Remove the 3 screws(F) and then remove the HA-Board.
6.4. Removal of the Slot Block
1. Disconnect the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15, J30).
2. Remove the 4 screws and then remove the Slot Block.
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6.5. Removal of the J-Board
1. Remove the HU Terminal Block and the HA Terminal Block.
(Reference to Removal of the HU-Board and the HA-
Board)
2. Remove the Slot Block.
(Reference to Removal of the Slot Block)
3. The Slot Block is turned inside out.
4. Remove the 6 screws and then remove the Slot cover.
5. Remove the 6 screws.
6. Release the coupler(J14) from HX-Board and then remove
the J-Board.
6.6. Removal of the HX-Board
1. Remove the HU Terminal Block and the HA Terminal Block.
(Reference to Removal of the HU-Board and the HA-Board)
2. Remove the Slot Block.
(Reference to Removal of the Slot Block)
3. Remove the J-Board.
(Reference to Removal of the J-Board)
4. Remove the 2 screws and then remove the Slot Case.
5. Remove the 4 Hexagonal-Head screws and the 1 screw
and then remove the HX-Board.
6.7. Removal of the PB-Board
1. Disconnect the couplers(PB30, PB31, PB33, PB35).
2. Remove the 1 screw and then remove the PB-Board.
10
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6.8. Removal of the DA-Board
1. Disconnect the couplers(PB30, PB31, PB33, PB35).
2. Remove the 2 screws and then remove the PB-Board
Block.
3. Disconnect the couplers(DA1, DA3, DA5, DA6).
4. Remove the Flexible Cable from the coupler(DA2).
5. Remove the 2 screws and then remove the DA-Board and
Fixed Plate.
Note:
A re-setup of the destination is performed by MS mode
after DA-Board exchange.
6.9. Removal of the P-Board
1. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23,
P25).
2. Remove the 6 screws and then remove the P-Board.
3. Remove the 11 screws (Bottom view).
4. Remove the 5 screws ( ).
Remove the P-Board from the 8 molding props ( ).
Note:
· When assembling the P-Board, the position of each
hole of the insulation sheets(A, B) are set to the position
of each hole of the P-Board and then assemble them.
(marks indicate setting positions.)
11
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6.10. Removal of the D-Board
1. Remove the Slot Block.
(Reference to Removal of the Slot Block)
2. Disconnect the couplers(D5, D20)
3. Remove the Flexible Cable from the couplers (D3, D31,
D32, D33, D34).
4. Remove the 4 screws and then remove the D-Board.
6.11. Removal of the H3-Board (L,
R)
1. Remove1screw each and then removethe Speaker
Terminal Block (L, R).
2. Disconnect the coupler(H37).
3. Remove the 3 screws (F) and then remove the H3-Board.
6.12. Removal of the SU-Board and
the SD-Board
1. Remove the Speaker Terminal Block(R).
(Reference to Removal of the H3-Board(L, R))
2. Remove the Flexible Cable from the couplers(SU1, SU2,
SU3, SU4, SD1, SD2, SD3, SD4).
3. Remove the 6 screws.
4. Disconnect the couplers(SU45, SD46).
5. Slide the SU-Board and the SD-Board to the left, remove
the SU-Board and the SD-Board from the couplers(SC41,
SC42).
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6.13. Removal of the SC-Board
1. Disconnect the couplers(SU45, SD46).
2. Disconnect the couplers(SC2, SC20, SC23).
3. Remove the 9 screws ( ) and then slide the SC-Board to
the right.
6.14. Removal of the SS2-Board and
the SS3-Board
1. Disconnect the coupler(SS23).
2. Disconnect the Flexible Cable(SS55).
3. Disconnect the coupler(SS22).
4. Disconnect the Flexible Cable(SS56).
5. Remove2screws each and then removethe SS2-
Board and the SS3-Board.
6.15. Removal of the SS-Board
1. Disconnect the couplers(SS11, SS12, SS20, SS21, SS33,
SS34, SS43, SS44).
2. Remove the Flexible Cable from the couplers(SS51, SS52,
SS53, SS54).
3. Remove the 7 screws and then remove the SS-Board.
6.16. Removal of the C1, C2, C3, C4,
C5 and the C6-Board
1. Remove the Slot Block.
(Reference to remove of the Slot Block).
2. Removethe Speaker Terminal Block(L, R).
(Refernce to remove of the Speaker Terminal Block(L, R).
3. Remove4screws each ()and then removethe Stand
Blocks(L, R).
4. Disconnect the Fan Relay Couplers.
5. Remove3screws each ()and then removethe 3Fan
Blocks.
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6.16.1. Removal of the C1-Board
1. Remove the Flexible Cable from the coupler(C10).
2. Remove the 6 screws ( ) and then remove the Flexible
Cable from the couplers(CA1, CA2, CA3).
3. Remove the 5 screws ( ) and then remove the C1-Board.
6.16.2. Removal of the C2-Board
1. Remove the Flexible Cable from the couplers(C20, C21,
C22).
2. Remove the 8 screws ( ) and then remove the Flexible
Cable from the couplers(CA4, CA5, CA6, CA7).
3. Remove the 5 screws ( ) and then remove the C2-Board.
6.16.3. Removal of the C3-Board
1. Remove the Flexible Cable from the couplers(C31, C32).
2. Disconnect the couplers(C33).
3. Remove the 8 screws and ( ) then remove the Flexible
Cable from the couplers(CA8, CA9, CA10, CA11).
4. Remove the 5 screws ( ) and then remove the C3-Board.
6.16.4. Removal of the C4-Board
1. Remove the Flexible Cable from the couplers(C41, C42).
2. Disconnect the couplers(C43, C44).
3. Remove the 8 screws ( ) and then remove the Flexible
Cable from the couplers(CB8, CB9, CB10,CB11).
4. Remove the 5 screws ( ) and then remove the C4-Board.
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6.16.5. Removal of the C5-Board
1. Remove the Flexible Cable from the couplers(C50, C51,
C52).
2. Remove the 8 screws ( ) and then remove the Flexible
Cable from the couplers(CB4, CB5, CB6, CB7).
3. Remove the 5 screws ( ) and then remove the C5-Board.
6.16.6. Removal of the C6-Board
1. Remove the Flexible Cable from the coupler(C60).
2. Remove the 6 screws and ( ) then remove the Flexible
Cable from the couplers(CB1, CB2, CB3).
3. Remove the 5 screws and ( ) then remove the C6-Board.
6.17. Removal of the S1-Board
1. Disconnect the coupler(SS34).
2. Remove the 2 screws(G) and then remove the S1-Board
Block.
3. Disconnect the coupler(S34).
4. Remove the 1 screw(H) and then remove the S1-Board.
6.18. Removal of the Fan
1. Disconnect the Fan Relay Couplers.
2. Remove3screws each and then removethe 3Fan
Blocks.
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3. Remove4screws each (J) and then removethe Fans.
4. Reassemble the Fans in reverse order.
5. Stick the Cushion (Fan) around the Fan.
Note:
The Cushion (Fan) are unsuitable to reuse.
Please use a new one at the time of Fan exchange.
6.19. Removal of the Escutcheon
1. Remove the S1-Board Block.
(Reference to Removal of the S1-Board)
2. Disconnect the couplers(J2, J15).
3. Remove the 2 screws of the Escutcheon.
4. Pull the bottom of the Plasma Panel forward (arrow1).
5. Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
6.20. Removal of the V1-Board and
the V2-Board
1. Remove the Escutcheon.
(Reference to Removal of the Escutcheon)
2. Remove the 6 screws and then remove the Fixed Angle.
3. Remove the 1 screw(K).
4. Disconnect the coupler(V2) and then remove the V1-Board.
5. Remove the operation button from the V2-Board.
6. Disconnect the coupler(V15) and then remove the V2-
Board.
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6.21. Removal of the Plasma Panel
1. Disconnect the Fan Relay Couplers.
2. Remove3screws each () and then remove the 3 Fan
Blocks.
3. Remove4screws each () and then remove the Stand
Black(L, R).
4. Remove1screws each () and then remove the
Speaker Terminal Black(L, R).
5. Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15, J30).
6. Remove the 4 screws and then remove the Slot Block.
7. Disconnect the coupler(DA5).
8. Remove the Flexible Cable from the coupler(DA2).
9. Remove the 4 screws and then remove the DA-Board
Block.
10. Disconnect the couplers(P2, P9, P11, P12, P23, P25).
11. Remove the 6 screws ( ) and then remove the P-Board.
12. Disconnect the coupler(D20).
13. Remove the Flexible Cable from the couplers(D31, D32,
D33, D34).
14. Remove the 4 screws and then remove the D-Board.
15. Remove the Flexible Cable from the couplers(SU1, SU2,
SU3, SU4, SD1, SD2, SD3, SD4).
16. Remove the 6 screws.
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17. Disconnect the couplers(SU45, SD46).
18. Slide the SU-Board and the SD-Board to the left, remove
the SU-Board and the SD-Board from the couplers(SC41,
SC42).
19. Remove the 2 screws and ( ) then remove the Clamper
and the Shield Sheet.
20. Remove the 9 screws and ( ) then remove the SC-Board.
21. Disconnect the couplers(S22, S23).
22. Remove the Flexible Cable from the couplers(S55, S56).
23. Remove2screws each and then removethe SS2-
Board and the SS-3Board.
24. Disconnect the couplers(SS33, SS43, SS44).
25. Remove the Flexible Cable from the couplers(SS51, SS52,
SS53, SS54).
26. Remove the 7 screws and then remove the SS-Board.
27. Remove the 22 screws.
28. Remove the Flexible Cable from the couplers(CA1, CA2,
CA3, CA4, CA5, CA6, CA7, CA8, CA9, CA10, CA11).
29. Remove the Flexible Cable from the couplers(C10, C21,
C22, C31).
30. Remove5screws each and then removethe C1-Board,
the C2-Board and the C3-Board.
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31. Remove the 22 screws
32. Remove the Flexible Cable from the couplers(CB1, CB2,
CB3, CB4, CB5, CB6, CB7, CB8, CB9, CB10, CB11).
33. Remove the Flexible Cable from the couplers(C41, C42,
C50, C51).
34. Remove5screws each and then removethe C4-Board,
the C5-Board and the C6-Board.
35. Remove the 2 screws and then remove the S1-Board Block.
36. Remove the 3 screws and then remove the AC-Inlet Block.
37. Remove the 2 screws of the Escutcheon.
38. Pull the bottom of the Plasma Panel forward (arrow1).
39. Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
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7 Location of Lead Wiring
7.1. Location of Lead Wiring (1)
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