Panasonic TH-70LF50ER User manual

Service Manual
FULL HD LCD Display
TH-70LF50ER
LA40 Chassis
ORDER No. PCZ1212157CE
This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not
contain warnings or cautions to advise non-technical individuals of potencial dangers in attempting to service a product. Products
powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the
product or products deal within this service information by anyone else could result in serious injury or death.
Warning
© Panasonic Corporation 2012.
Unauthorized copying and
distribution is a violation of law.

CONTENTS
SAFETY PRECAUTIONS ........................................... 3
GENERAL GUIDE LINES...................................... 3
TOUCH – CURRENT CHECK.................................
PREVENTION OF ELECTROSTATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES .................................................................... 4
ABOUT LEAD FREE SOLDER (PBF)......................... 5
SUGGESTED PB FREE SOLDER........................ 5
APPLICABLE INPUT SIGNALS.................................. 6
SERVICE HINTS ........................................................ 9
CHASSIS BOARD LAYOUT ..................................... 10
OPERATING INSTRUCTIONS ................................. 11
OPTION MENU......................................................... 12
SERVICE MODE ...................................................... 13
CAT (COMPUTER AIDED TEST) MODE ................. 13
IIC MODE.................................................................. 13
CD MODE, SD MODE .............................................. 14
MS MODE, ID MODE..................................................15
IIC MODE STRUCTURE.............................................16
SELF CHECK ........................................................... 17
POWER LED BLINKING TIMING CHARD................ 18
ADJUSTMENT METHOD ......................................... 19
WIRING DIAGRAM................................................... 20
BLOCK DIAGRAM ................................................... 21
PARTS LOCATION................................................... 24
LOCATION OF LEAD WIRING ................................. 26
REPLACEMENT PARTS LIST NOTE....................... 27
SCHEMATIC DIAGRAMS NOTE.............................. 64
A-BOARD (1 OF 13) SCHEMATIC DIAGRAM .... 65
HX-BOARD SCHEMATIC DIAGRAM.................. 78
DS-BOARD (1 OF 2) SCHEMATIC DIAGRAM ... 79
V1-BOARD SCHEMATIC DIAGRAM .................. 81
V2-BOARD SCHEMATIC DIAGRAM .................. 82
CONDUCTOR VIEWS .............................................. 83
2

Safety Precautions
General Guide Lines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated
or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.
4. Always adjustment sheet TBMV100 is correctly replaced before returning to customer (see Fig.1).
Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth
ground such as a water pipe, as shown in Fig. 2.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and
2.0 mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100
kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should
be repaired and rechecked before it is returned to the customer.
Fig. 2
TO
APPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms ()
V
R0=500

RS=1500

CS=0.22

F
10k

0.022

F
COLD
WATER PIPE
(EARTH GROUND)
V: Voltmetr or oscilloscope
(r.m.s. or peak reading)
Measuring network for TOUCH CURRENTS
Input resistance: 1M

Input capacitance:200pF
Frequency range: 15Hz to 1MHz and d.c.respectively
NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms
U2(V)
Fig. 1
U1(V)
3

Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect
transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of
component damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on
your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD
wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD
protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity
(ESD) sufficient to damage an ES device).
There are special components used in this equipment which are important for safety.
These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do
not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
4

About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,
we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
stamped on the back of PCB.
Caution
Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)
higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before
applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
After applying PbF solder to double layered boards, please check the component side for excess solder which may
flow onto the opposite side. (see Fig.3)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)
Fig.3
Fig.4
5

Applicable Input Signals
*Mark:applicable input signal
Signal name
Horizontal
frequency
(kHz)
Vertical
frequency
(Hz)
RGB IN
(Dot clock (MHz) PC IN (Dot clock (MHz)
DVI-D IN
(Dot clock (MHz)
HDMI
1 640x400@70Hz 31.46 70.07 * (25.17) * (25.17)
2 640x480@60Hz 31.47 59.94 * (25.18) * (25.18) * (25.18) *
3 640x480@72Hz 37.86 72.81 * (31.5) * (31.5)
4 640x480@75Hz 37.50 75.00 * (31.5) * (31.5)
5 640x480@85Hz 43.27 85.01 * (36.0) * (36.0)
6 800x600@56Hz 35.16 56.25 * (36.0) * (36.0)
7 800x600@60Hz 37.88 60.32 * (40.0) * (40.0) * (40.0) *
8 800x600@72Hz 48.08 72.19 * (50.0) * (50.0)
9 800x600@75Hz 46.88 75.00 * (49.5) * (49.5)
10 800x600@85Hz 53.67 85.06 * (56.25) * (56.25)
11 852x480@60Hz 31.47 59.94 * (33.24) *
12 1,024x768@50Hz 39.55 50.00 * (51.89) *
13 1,024x768@60Hz 48.36 60.00 * (65.0) * (65.0) * (65.0) *
14 1,024x768@70Hz 56.48 70.07 * (75.0) * (75.0)
15 1,024x768@75Hz 60.02 75.03 * (78.75) * (78.75)
16 1,024x768@85Hz 68.68 85.00 * (94.5) * (94.5)
17 1,066x600@60Hz 37.64 59.94 * (53.0) *
18 1,152x864@60Hz 53.70 60.00 * (81.62) *
19 1,152x864@75Hz 67.50 75.00 * (108.0) * (108.0)
20 1,280x768@60Hz 47.70 60.00 * (80.14) * (80.14)
21 1,280x960@60Hz 60.00 60.00 * (108.0) * (108.0)
22 1,280x960@85Hz 85.94 85.00 * (148.5) * (148.5)
23 1,280x1,024@60Hz 63.98 60.02 * (108.0) * (108.0) * (108.0) *
24 1,280x1,024@75Hz 79.98 75.02 * (135.0) * (135.0)
25 1,280x1,024@85Hz 91.15 85.02 * (157.5) * 1
26 1,366x768@50Hz 39.55 50.00 * (69.92) *
27 1,366x768@60Hz 48.36 60.00 * (86.71) * (86.71) * (87.44) *
28 1,400x1,050@60Hz 65.22 60.00 * (122.61) *
29 1,600x1,200@60Hz 75.00 60.00 * (162.0) * (162.0) * (162.0) *
30 1,920x1,080@60Hz 67.50 60.00 * (148.5) * (148.5) * (148.5) *
31 1,920x1,200@60Hz 74.04 59.95 * (154.0) *
32 Macintosh 13‘‘ (640 x 480) 35.00 66.67 * (30.24) * (30.24)
33 Macintosh 16‘‘ (832 x 624) 49.72 74.55 * (57.28) * (57.28)
34 Macintosh 21‘‘ (1,152 x 870) 68.68 75.06 * (100.0) * (100.0)
PC signals
6

*Mark:applicable input signal
*1: Based on SMPTE 274M standad.
*2: Based on SMPTE RP211 standad.
Signal name
Horizontal
frequency
(kHz)
Vertical
frequency
(Hz)
Component IN
(Dot clock (MHz) DVI_IN (Dot clock (MHz) HDMI
1 525(480)/60i 15.73 59.94 *(13.5) *(27.0) *
2 525(480)/60p 31.47 59.94 *(27.0) *(27.0) *
3 625(575)/50i 15.63 50.00 *(13.5)
4 625(576)/50i 15.63 50.00 *(27.0) *
5 625(575)/50p 31.25 50.00 *(27.0)
6 625(576)/50p 31.25 50.00 *(27.0) *
7 750(720)/60p 45.00 60.00 *(74.25) *(74.25) *
8 750(720)/50p 37.50 50.00 *(74.25) *(74.25) *
9 1.125(1.080)/60p 67.50 60.00
*(148.5)*1 *(148.5) *
10 1.125(1.080)/60i 33.75 60.00
*(74.25)*1 *(74.25) *
11 1.125(1.080)/50p 56.25 50.00
*(148.5)*1 *(148.5) *
12 1.125(1.080)/50i 28.13 50.00
*(74.25)*1 *(74.25) *
13 1.125(1.080)/24sF 27.00 48.00
*(74.25)*2
14 1.125(1.080)/30p 33.75 30.00
*(74.25)*1 *(74.25) *
15 1.125(1.080)/25p 28.13 25.00
*(74.25)*1 *(74.25) *
16 1.125(1.080)/24p 27.00 24.00
*(74.25)*1 *(74.25) *
Signal name
Horizontal
frequency
(kHz)
Vertical
frequency
(Hz)
1 NTSC 15.73 59.94
2 PAL 15.63 50.00
3 PAL60 15.73 59.94
4 SECAM 15.63 50.00
5 NTSC 4.43 15.73 59.94
6 PAL N 15.63 50.00
7 PAL M 15.73 59.94
Component signals
Video signals (VIDEO)
7

Specifications
Power Source: 220-240V AC, 50/60 Hz
Power Consumption:
Power on: 260W
Stand-by condition: 0.5W
Power off condition: 0.3W
LCD Display panel: L5EDDYY00433
16:9 aspect ratio
Screen size: Wight: Height: Diagonal:
1,538mm 865mm 1,765mm
(No. of pixels) 2,073.600 (1,920 (W) x 1,080 (H))
Operating Conditions: Temperature: 0°C 40°C
Humidity: 20% 80%
Applicable signals:
Colour System: NTSC, PAL, PAL60, SECAM, NTSC 4.43, PAL M, PAL N
Scanning Format: 525 (480) / 60i, 60p
625 (575) / 50i, 50p
750 (720) / 60p, 50p
1,125 (1,080) / 60i, 60p, 50i, 50p, 24p, 25p, 30p, 24sF
PC signals: VGA, SVGA, XGA, SXGA, UXGA ....(compressed)
Horizontal scanning frequency 30 – 110 kHz
Vertical scanning frequency 48 – 120 Hz
Cennection Terminals:
VIDEO IN BNC 1.0 Vp-p (75)
AUDIO L-R RCA Pin jack x 2 0.5 Vrms
HDMI Type A Connectors
COMPONENT/RGB IN:
G/Y BNC with sync 1.0 Vp-p (75)
B/PB/CB BNC 0.7 Vp-p (75)
R/PR/CR BNC 0.7 Vp-p (75)
AUDIO L-R RCA Pin jack x 2 0.5 Vrms
DVI-D IN DVI-D 24 Pin x 2 Compliance with DVI Revision 1.0
Content Protection Compatible with HDCP 1.1
AUDIO Stereo mini jack (M3) x 1 0.5 Vrms (Shared with PC IN)
DVI-D OUT DVI-D 24 Pin x 2 Compliance with DVI Revision 1.0
PC IN High-Density Mini D-sub 15PIN G: with sync 1.0 Vp-p (75)
: without sync 0.7 Vp-p (75)
B: 0.7 Vp-p (75)
R: 0.7 Vp-p (75)
HD/VD: 1.0-5.0 Vp-p (hight impedance)
AUDIO Stereo mini jack (M3) x 1 0.5 Vrms (Shared with DVI-D IN)
SERIAL IN External Control Terminal
SERIAL OUT D-sub 9 Pin x 2 RS-232C compatible
SLOT 2.0 Yes
AUDIO OUT L-R RCA PIN JACK x 2 (INPUT 1 kHz / 0 dB, 10 KLoad)
LAN RJ45 10BASE-T/100BASE-TX, compatible with PJLink™
Accessories supplied : Remote Control 2 x R6 (UM3) Batteries
Dimensions:
Width: Height: Depth:
1,604mm 931mm 89mm
Weight: 47.0 kg
Specifications are subject to change without notice.
Mass and dimensions shown are approximate.
8

Service Hints
How to remove the backcover
Remove the 44 fixing screws and 4 caps.
SCREWS
(1) XYN4+F10FJK /31pcs/
(2) THEL0429 /11pcs/
(3) XTV3+12JFJK /2pcs/
(4) TKKL5493 /4pcs/
(1)
(1)
(1)
(1)
(1)
(1)
(1) (1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(2)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(3)
(3)
(4)
(4)
(4)
(4)
9

Chassis Board Layout
Board Name Function
A-Board ST micro, YUV, Video IN, HDMI, DVI-IN/OUT, PC, LAN
DS-Board Slot Interface
HX-Board RS-232C_IN/OUT, AUDIO IN/OUT
V1-Board Remote Control Sensor, Power Indicator, Brightness Sensor
V2-Board Power Switch, Key Switch
P-Unit Power Supply
P-UNIT
V1-BOARD
A-BOARD
DS-BOARD
HX-BOARD
V2-BOARD
10