Panasonic KX-T7633 User manual

ORDERNO. KMS0308802C1
F19
Digital ProprietaryTelephone
KX-T7633 / KX-T7633-B
White version
Black version
(forU.S.A.)
IMPORTANT INFORMATIONABOUT LEAD FREE, (PbF),
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SOLDERING
Ifleadfree solderwas usedinthemanufactureofthisproducttheprintedcircuitboardswill be
markedPbF.
Standard leaded, (Pb), soldercanbeusedas usual on boardswithoutthePbF mark.
Whenthismarkdoes appearplease readand followthespecial instructionsdescribedinthis
manual on theuse ofPbF and howitmightbepermissibletouse Pbsolderduring service and
repairwork.
1. ABOUTLEADFREE SOLDER (PbF:Pbfree)
Note:
Intheinformation below, Pb, thesymbol for leadintheperiodictableofelements, will referto
standard solderor solderthatcontainslead.
Wewill use PbF solderwhendiscussing theleadfree solderusedinour manufacturing process
whichismadefrom Tin, (Sn), Silver, (Ag), and Copper, (Cu).
Thismodel, and otherslike it, manufacturedusing leadfree solderwill have PbF stampedon the
PCB. For service and repairworkwesuggestusing thesametypeofsolderalthough, withsome
precautions, standard Pbsoldercanalsobeused.
Caution
-PbF solderhas amelting pointthat is50° ~70° F, (30° ~40°C)
higherthanPbsolder. Please use asoldering iron with
temperaturecontrol and adjust itto700° ±20° F, (370° ±10°C). In
case ofusing high temperaturesoldering iron, please becareful
nottoheat too long.
-PbF solderwill tend tosplashifitisheatedmuchhigherthanits
melting point, approximately1100°F, (600°C).
-Ifyou must use Pbsolderon aPCB manufacturedusing PbF
solder, removeas muchoftheoriginal PbF solderas possibleand
besurethat anyremaining ismeltedpriortoapplying thePb
solder.
-Whenapplying PbF soldertodoublelayeredboards, please check
thecomponentsideforexcess whichmayflow ontotheopposite
side(See figure, below).
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1.1. SUGGESTEDPbF SOLDER
Thereareseveral types ofPbF solderavailablecommercially. Whilethisproductismanufactured
using Tin, Silver, and Copper, (Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+Cu), or Tin,
Zinc, and Bismuth, (Sn+Zn+Bi).
Please check themanufacturer’sspecificinstructionsfor themelting pointsoftheirproductsand
anyprecautionsfor using theirproductwithothermaterials.
Thefollowing leadfree (PbF)solderwiregauges arerecommendedfor service ofthisproduct:
0.3mm, 0.6mm and 1.0mm.
1.2. HOWTO RECOGNIZETHATPbFREE SOLDERISUSED
PbF isstampedtoshowthatPbfree solderisused. (See thefigurebelow.)
2. FORSERVICE TECHNICIANS
ICsand LSIsarevulnerabletostaticelectricity.
Whenrepairing, thefollowing precautionswill helppreventrecurring malfunctions.
1. Covertheplasticparts boxes withaluminumfoil.
2. Ground thesoldering irons.
3. Use aconductivemat on theworktable.
4. DonottouchICorLSI pinswithbarefingers.
3. SPECIFICATIONS
Station Loop Limit: 90 ohms
Calling Method: 2pairwire
Jacks: HandsetJack, TELJack, HeadsetJack
Dimensions: LowAngle:265 (D)mm [Operate]×208 (W)mm ×128 (H)mm
(10 7/16”×8 3/16”×5 1/32”)
High Angle:
212 (D)mm [Operate]×208 (W)mm ×202 (H)mm
(8 11/32”×8 3/16”×7 15/16”)
213 (D)mm [Base](8 3/8”)
Weight: 1.13kg(39.86 oz.)
Design and specificationsaresubjecttochangewithoutnotice.
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4. LOCATIONOFCONTROLS
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5. CONNECTION
Caution:
ConsultyourdealerformoredetailsaboutXDP.
6. DISASSEMBLYINSTRUCTIONS
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1. Remove 9Screws(A).
2. Remove theBottom Cabinet.
3. Remove theP. C. Board from theTop Cabinet.
7. HOWTO REPLACE AFLATPACKAGEIC
7.1. PREPARATION
-PbF (:Pbfree) Solder
-Soldering Iron
TipTemperatureof700°F±20°F(370°C±10°C)
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Note:Werecommend a30 to40 Watt soldering iron. Anexpert
maybeabletouse a60 to80 Watt iron wheresomeonewithless
experience couldoverheat and damagethePCB foil.
-Flux
RecommendedFlux:SpecificGravity0.82.
TypeRMA(lowerresidue, non-cleaning type)
Note:See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().
7.2. PROCEDURE
1. Tack theflat pack ICtothePCB bytemporarilysoldering two
diagonallyopposite pinsinthecorrect positionson thePCB.
Becertaineachpinislocatedoverthecorrectpadon thePCB.
2. Applyfluxtoall ofthepinson theIC.
3. Being careful tonotunsolderthetack points, slidethesoldering
iron along thetipsofthepinswhilefeeding enough soldertothe
tipsothat itflowsunderthepinsas theyareheated.
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7.3. REMOVING SOLDERFROMBETWEENPINS
1. Add asmall amountofsoldertothebridgedpins.
2. Withahotiron, use asweeping motion along theflat partofthe
pintodraw thesolderfrombetweentheadjacentpads.
8. TROUBLESHOOTING GUIDE
8.1. NO OPERATION
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Note:
Referto(1)~(5)ofWAVEFORM () for waveform.
8.2. LCD DOES NOTOPERATE
9

Note:
Referto(6)ofWAVEFORM () for waveform.
8.3. HANDSETDOES NOTWORK
Receive
Send
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Note:
Referto(7)~(8)ofWAVEFORM () for waveform.
8.4. HEADSETDOES NOTWORK
Receive
Send
Note:
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Referto(7)~(8)ofWAVEFORM () for waveform.
8.5. SPEAKER-PHONETROUBLE
Receive
Send
Note:
Referto(7)~(8)ofWAVEFORM () for waveform.
8.6. DXDP-DPTDOES NOTWORK
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Note:
Referto(9)ofWAVEFORM () for waveform.
8.7. OPTIONDOES NOTWORK
9. BLOCK DIAGRAM
10. CIRCUITOPERATIONS
10.1. KEYINPUTCONTROLCIRCUIT
Thekey dataisunderthematrixcontrol by19 to23, 25, 44, 45(KEYOUT)and 28 to35(KEYIN) of
IC3.
Thekey information outputtedfrom KEYOUTisinputtedintoKEYIN, whenthekey ispressed.
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10.2. LCD CIRCUIT
LCD dataareoutputtedfrom pin57, 58, 59,10 and 12 ofIC3toLCD module.
IC8isaninverterfor achargepumpcircuitwhichoutputsthevoltagenecessaryfor LCD driving.
-4.5Vfrom-1.2Vgeneratedat IC8as areference to+3.3Vofthe
powersupplyvoltageispressurizedfourtimes intheLCD module
and usedas LCD driving voltage(approx. 18V).
LCD contrastissetbyelectronicvolumeintheLCD module.
ThetypeoftheLCD moduleisdistinguishedbypin62 ofIC3.
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Pin62 ofIC3
L KX-T7636 24 digits*6lines
HKX-T7630/KX-
T7633 24 digits*3lines
Thelighting ofthebacklightiscontrolledbyQ1.
-IC3-pin56 H Q1-ON BacklightON
-IC3-pin56 L Q1-OFF BacklightOFF
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10.3. LEDCIRCUIT
Thelighting oftheLEDiscontrolledbypin19 to28(Row)and pin11 to16(Colum)ofIC5.
TheLEDlightsup inadynamiclighting system.
Thedutyratiois1/8(ONtime1.5ms).
OnlyD107 ofLEDfor CO7lightsup inastaticlighting system.
-IC5-pin55 H:CO7GreenON
-IC5-pin55 L:CO7GreenOFF
-IC5-pin56 H:CO7RedON
-IC5-pin56 L:CO7RedOFF
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10.4. RESETCIRCUIT
ResetSignal isoutputtedfrom IC1and inputtedintoIC3and IC5attheconnection ofTELcord.
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10.5. POWERSUPPLYCIRCUIT
Thiscircuitconvertsthevoltagesuppliedfrom PBX intothepowersupplyvoltageof+3.3V by
IC6(Switching Regulator IC).
IC10 controlsthepowersupplycircuitas belowtoturn IC6on inlowconsumption currentat
starting up.
-InputVoltageapprox. 30Vorless IC10-pin1LIC6OFF
-InputVoltageapprox. 30VormoreIC10-pin1HiZ IC6ON
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10.6. DATACOMMUNICATION
Function
Thedatacommunication circuitserves thefollowing functions:
Information exchangerbetweenPBX and proprietarytelephone, key inputinformation as well as
datafor theLEDcontrol, LCD control, voice data, etc. Thisinformation iscontinuously
exchangedatall times.
CircuitOperation
Thedatareceivedfrom PBX isinputtedtothecomparator(pin68)builtinIC5through Pulse Trans
T1. Thethresholdvoltageofthecomparator isdeterminedbyR62 to64 and inputtedtopin67
and 29.
ThedatatoPBX isoutputtedfrom pin70 and 71 ofIC5, drives T1byTransistor Q2and
transmitted.
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10.7. DXDPCOMMUNICATION
Function
Thiscircuitperformsthesamecommunication as DXDP-compatibleDPTand PBX
communication connectedwithDXDP port.
CircuitOperation
ThedatatoSlave DPTisoutputtedfrom pin63 and 64 ofIC5and sentbyTransistor Q8and Q9.
Thedatafrom Slave DPTisinputtedtothecomparator(pin61)builtinIC5.
Thethresholdvoltageofthecomparator isdeterminedbyR65 to67 and inputtedtopin60 and 62.
Also, thesupplying powertoSlave DPTiscontrolledbyaconstantcurrentcircuitofQ15 as
below.
-IC5-pin58 as H:ConstantcurrentcircuitON
-IC5-pin58 as L:ConstantcurrentcircuitOFF
-IC5-pin57 as H:40mAFeeding (SlaveDPTusually)
-IC5-pin57 as L:10mAFeeding (SlaveDPTat starting up only)
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