Panasonic KX-T7633 User manual

ORDERNO. KMS0308802C1
F19
Digital ProprietaryTelephone
KX-T7633 / KX-T7633-B
White version
Black version
(forU.S.A.)
IMPORTANT INFORMATIONABOUT LEAD FREE, (PbF),
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SOLDERING
Ifleadfree solderwas usedinthemanufactureofthisproducttheprintedcircuitboardswill be
markedPbF.
Standard leaded, (Pb), soldercanbeusedas usual on boardswithoutthePbF mark.
Whenthismarkdoes appearplease readand followthespecial instructionsdescribedinthis
manual on theuse ofPbF and howitmightbepermissibletouse Pbsolderduring service and
repairwork.
1. ABOUTLEADFREE SOLDER (PbF:Pbfree)
Note:
Intheinformation below, Pb, thesymbol for leadintheperiodictableofelements, will referto
standard solderor solderthatcontainslead.
Wewill use PbF solderwhendiscussing theleadfree solderusedinour manufacturing process
whichismadefrom Tin, (Sn), Silver, (Ag), and Copper, (Cu).
Thismodel, and otherslike it, manufacturedusing leadfree solderwill have PbF stampedon the
PCB. For service and repairworkwesuggestusing thesametypeofsolderalthough, withsome
precautions, standard Pbsoldercanalsobeused.
Caution
-PbF solderhas amelting pointthat is50° ~70° F, (30° ~40°C)
higherthanPbsolder. Please use asoldering iron with
temperaturecontrol and adjust itto700° ±20° F, (370° ±10°C). In
case ofusing high temperaturesoldering iron, please becareful
nottoheat too long.
-PbF solderwill tend tosplashifitisheatedmuchhigherthanits
melting point, approximately1100°F, (600°C).
-Ifyou must use Pbsolderon aPCB manufacturedusing PbF
solder, removeas muchoftheoriginal PbF solderas possibleand
besurethat anyremaining ismeltedpriortoapplying thePb
solder.
-Whenapplying PbF soldertodoublelayeredboards, please check
thecomponentsideforexcess whichmayflow ontotheopposite
side(See figure, below).
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1.1. SUGGESTEDPbF SOLDER
Thereareseveral types ofPbF solderavailablecommercially. Whilethisproductismanufactured
using Tin, Silver, and Copper, (Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+Cu), or Tin,
Zinc, and Bismuth, (Sn+Zn+Bi).
Please check themanufacturer’sspecificinstructionsfor themelting pointsoftheirproductsand
anyprecautionsfor using theirproductwithothermaterials.
Thefollowing leadfree (PbF)solderwiregauges arerecommendedfor service ofthisproduct:
0.3mm, 0.6mm and 1.0mm.
1.2. HOWTO RECOGNIZETHATPbFREE SOLDERISUSED
PbF isstampedtoshowthatPbfree solderisused. (See thefigurebelow.)
2. FORSERVICE TECHNICIANS
ICsand LSIsarevulnerabletostaticelectricity.
Whenrepairing, thefollowing precautionswill helppreventrecurring malfunctions.
1. Covertheplasticparts boxes withaluminumfoil.
2. Ground thesoldering irons.
3. Use aconductivemat on theworktable.
4. DonottouchICorLSI pinswithbarefingers.
3. SPECIFICATIONS
Station Loop Limit: 90 ohms
Calling Method: 2pairwire
Jacks: HandsetJack, TELJack, HeadsetJack
Dimensions: LowAngle:265 (D)mm [Operate]×208 (W)mm ×128 (H)mm
(10 7/16”×8 3/16”×5 1/32”)
High Angle:
212 (D)mm [Operate]×208 (W)mm ×202 (H)mm
(8 11/32”×8 3/16”×7 15/16”)
213 (D)mm [Base](8 3/8”)
Weight: 1.13kg(39.86 oz.)
Design and specificationsaresubjecttochangewithoutnotice.
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4. LOCATIONOFCONTROLS
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5. CONNECTION
Caution:
ConsultyourdealerformoredetailsaboutXDP.
6. DISASSEMBLYINSTRUCTIONS
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1. Remove 9Screws(A).
2. Remove theBottom Cabinet.
3. Remove theP. C. Board from theTop Cabinet.
7. HOWTO REPLACE AFLATPACKAGEIC
7.1. PREPARATION
-PbF (:Pbfree) Solder
-Soldering Iron
TipTemperatureof700°F±20°F(370°C±10°C)
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Note:Werecommend a30 to40 Watt soldering iron. Anexpert
maybeabletouse a60 to80 Watt iron wheresomeonewithless
experience couldoverheat and damagethePCB foil.
-Flux
RecommendedFlux:SpecificGravity0.82.
TypeRMA(lowerresidue, non-cleaning type)
Note:See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().
7.2. PROCEDURE
1. Tack theflat pack ICtothePCB bytemporarilysoldering two
diagonallyopposite pinsinthecorrect positionson thePCB.
Becertaineachpinislocatedoverthecorrectpadon thePCB.
2. Applyfluxtoall ofthepinson theIC.
3. Being careful tonotunsolderthetack points, slidethesoldering
iron along thetipsofthepinswhilefeeding enough soldertothe
tipsothat itflowsunderthepinsas theyareheated.
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7.3. REMOVING SOLDERFROMBETWEENPINS
1. Add asmall amountofsoldertothebridgedpins.
2. Withahotiron, use asweeping motion along theflat partofthe
pintodraw thesolderfrombetweentheadjacentpads.
8. TROUBLESHOOTING GUIDE
8.1. NO OPERATION
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Note:
Referto(1)~(5)ofWAVEFORM () for waveform.
8.2. LCD DOES NOTOPERATE
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Note:
Referto(6)ofWAVEFORM () for waveform.
8.3. HANDSETDOES NOTWORK
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