Panasonic KX-T7665AL User manual

©2003 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-T7665AL
KX-T7665X
(for Australia, Asia, Middle Near East, Africa and Latin
America)
Digital Proprietary Telephone
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
ORDER NO. KMS0307792C3

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 3
1.1. SUGGESTED PbF SOLDER 3
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 4
2 FOR SERVICE TECHNICIANS 5
3 SPECIFICATIONS 5
4 LOCATION OF CONTROLS 5
5 CONNECTION 6
6 DISASSEMBLY INSTRUCTIONS 7
7 HOW TO REPLACE A FLAT PACKAGE IC 8
7.1. PREPARATION 8
7.2. PROCEDURE 8
7.3. REMOVING SOLDER FROM BETWEEN PINS 8
8 TROUBLESHOOTING GUIDE 9
8.1. NO OPERATION 9
8.2. LCD DOES NOT OPERATE 10
8.3. HANDSET DOES NOT WORK 11
8.4. SPEAKER-PHONE TROUBLE 12
8.5. DXDP-DPT DOES NOT WORK 13
9 BLOCK DIAGRAM 14
10 CIRCUIT OPERATIONS 15
10.1. KEY INPUT CONTROL CIRCUIT 15
10.2. LCD CONTROL CIRCUIT 16
10.3. LED CIRCUIT 17
10.4. RESET CIRCUIT 18
10.5. POWER SUPPLY CIRCUIT 18
10.6. DATA COMMUNICATION 19
10.7. DXDP COMMUNICATION 20
10.8. ANALOG CIRCUIT 21
11 IC DATA 23
11.1. IC2 23
11.2. IC6 25
12 TERMINAL GUIDE OF ICs, TRANSISTORS AND DIODES 26
13 CABINET AND ELECTRICAL PARTS LOCATION 27
14 ACCESSORIES AND PACKING MATERIALS 28
15 REPLACEMENT PARTS LIST 29
15.1. CABINET AND ELECTRICAL PARTS 29
15.2. ACCESSORIES AND PACKING MATERIALS 29
15.3. MAIN BOARD PARTS 29
16 FOR THE SCHEMATIC DIAGRAM 31
17 SCHEMATIC DIAGRAM 32
18 WAVEFORM 34
19 PRINTED CIRCUIT BOARD (MAIN BOARD) 37
19.1. COMPONENT VIEW 37
19.2. BOTTOM VIEW 38
CONTENTS
Page Page
2
KX-T7665AL / KX-T7665X

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
· PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
· PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
· When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi).
Please check the manufacturer’s specific instructions for the melting points of their products and any precautions for using their
product with other materials.
The following lead free (PbF) solder wire gauges are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
3
KX-T7665AL / KX-T7665X

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
PbF is stamped to show that Pb free solder is used. (See the figure below.)
R521
R516
C107
R112 R116
R114
C108
R115
R109 C102
R104
R106
R107
R108 R110
C105
C104
C103
R100
R111
C106
C114
R129
R119
R402 R303
R310 R306
R309 R311
R305 R302 R301 R304 R300
L2 L1 C605
L3
L4
R611
D62
D61 C604
D63
C603
R308 R307
R406
C401
R517
R113
R103
C404
C405 R400
C101
R105
W
2
A6 B6
B5 E2 E1 IC6
F8
F6
F4 F2
F3
R407
IC2
C400
C403
X1 B4
JK1
H
C110
R114
C118
C112
D1
T1
101
59
L
F1
A2
A1
Q33 Q34 Q35
Q31
Q32
R519
R520
A3
A4 PN9
16
33 48
R401
C402
C407
R102
C100
R101 C406 R403
IC7
Q1
Q2
R132
C113 C109
C116
C115
R130
1
17
32 49
64
16
C607
C606
10 1
CN5
R601
C602 R602
R604
R603 R600 C601C600
E4
IC8
D5V
R607
IC5
R609
R608
C609
E3 JK2
R
T
G1
R610
33 48
1
17
32 49
64
1
CN3
R
W
21 CN2
R200
C205
PSUP1439Z-A
PbF
F5
F7
A5
B1
B2
B3
R135
C120
D3V Q5
Q3
Q6
R139 R138
R133
R137
C204
R
JK3
AG1
SP1
SPN
SPP
Q52
Q51
R504
IC4
IC3
Q23
C203
R206
R209
IC1
R208
R204
Q4
Q22
R207
Q21
C201 R202
L21
C504
C518
R514
R511
C528
R513
R518
MIC2
AG2
GNDC516
R510
C509
C511
C512 R509
C508
C507
R512
C514 R507C519
C502
R508
C513
R605
C608
R606
R503
C503
C510
C521
A3V
MIC1
C500
W
C501
R527
C525
R522
R523 C527
C517
R500 R501
R502
R505
C520
C524
C522 R525
R142
R140
R119
R205 R203
R524
C202
C200
R136
R134
D21
R131 C111
R201
R117
C117
R515 R526
C505
R506
C506
C515
C526
C523
RU CNGen
GRA
DB
L51 L52
2
1
CN1
R
A
PSUP1439Z-B
PbF
D44
D43
Marked PbF
KX-T7665AL / KX-T7665X : MAIN BOARD
4
KX-T7665AL / KX-T7665X

2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1.Cover the plastic parts boxes with aluminum foil.
2.Ground the soldering irons.
3.Use a conductive mat on the worktable.
4.Do not touch IC or LSI pins with bare fingers.
3 SPECIFICATIONS
Station Loop Limit: 90 ohms
Calling Method: 2 pair wire
Jacks: Handset Jack, TEL Jack
Dimensions: Low Angle:
High Angle: 213 (D)mm ×177 (W)mm ×107 (H)mm 201 (D)mm ×177 (W)mm ×127 (H)mm
Weight: 0.7 kg
Design and specifications are subject to change without notice.
4 LOCATION OF CONTROLS
5
KX-T7665AL / KX-T7665X

5 CONNECTION
Caution:
The availability of D-XDP function depends on the software version of the connected Business Telephone System.
Consult your dealer for more details about D-XDP.
6
KX-T7665AL / KX-T7665X

6 DISASSEMBLY INSTRUCTIONS
1. Remove the Stand.
2. Remove 5 Screws (A).
3. Remove the Cabinet Cover.
4. Remove the Connector from the Main Board.
5. Remove 2 Screws (A).
6. Remove the Main Board and the LCD from the Cabinet Body.
7
KX-T7665AL / KX-T7665X

7.1. PREPARATION
· PbF (: Pb free) Solder
· Soldering Iron
Tip Temperature of 700°F±20°F (370°C±10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where
someone with less experience could overheat and damage
the PCB foil.
· Flux
Recommended Flux: Specific Gravity →0.82.
Type →RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free)
(P.3).
7.2. PROCEDURE
1.Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on the
PCB.
Be certain each pin is located over the
correct pad on the PCB.
2.Apply flux to all of the pins on the IC.
3.Being careful to not unsolder the tack points, slide the
soldering iron along the tips of the pins while feeding
enough solder to the tip so that it flows under the pins as
they are heated.
7.3. REMOVING SOLDER FROM
BETWEEN PINS
1.Add a small amount of solder to the bridged pins.
2.With a hot iron, use a sweeping motion along the flat part of
the pin to draw the solder from between the adjacent pads.
7 HOW TO REPLACE A FLAT PACKAGE IC
8
KX-T7665AL / KX-T7665X

8 TROUBLESHOOTING GUIDE
8.1. NO OPERATION
Note:
Refer to (1)~(4) of WAVEFORM (P.34) for waveform.
9
KX-T7665AL / KX-T7665X

8.2. LCD DOES NOT OPERATE
Note:
Refer to (5)ofWAVEFORM(P.34) for waveform.
10
KX-T7665AL / KX-T7665X