Panasonic KX-TS500MXB User manual

ORDERNO. KM40305090C3
Telephone Equipment
KX-TS500MXB / KX-TS500MXC / KX-TS500MXH / KX-
TS500MXR / KX-TS500MXW
Integrated Telephone System
Black Version
Blue Version
GrayVersion
Red Version
White Version
(for Asia, MiddleNear East and Other areas)
SPECIFICATIONS
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1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthat contains lead.
We will use PbF Solderwhendiscussing the leadfree solderusedinourmanufacturing process
whichis made fromTin(Sn), Silver(Ag), and Copper(Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggest using the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solder has amelting point that is50°F ~70°F (30°C~ 40°C)
higher than Pb solder. Please use asoldering iron with
temperature control and adjust itto 700°F ± 20°F (370°C± 10°C). In
case of using high temperature soldering iron, please be careful
not to heat too long.
-PbF solder will tend to splash ifitisheated much higher than its
melting point, approximately1100°F (600°C).
-Ifyou must use Pb solder on aPCB manufactured using PbF
solder, remove as much of the original PbF solder as possibleand
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be sure that anyremaining ismelted prior to applying the Pb
solder.
-When applying PbF solder to doublelayered boards, please check
the component side for excess which mayflow onto the opposite
side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solderavailable commercially. While this product is
manufacturedusing Tin, Silver, and Copper
(Sn+Ag+Cu), you canalsouse Tinand Copper(Sn+Cu) orTin, Zinc, and Bismuth(Sn+Zn+Bi).
Please check the manufac
turer’s specific instructions forthe melting points of theirproducts and anyprecautions for
using theirproduct withother
materials.
The following leadfree (PbF) solderwire sizes are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
1.2. How to recognize that Pb Free solder isused
1.2.1. MainPCB
1.2.2. Operational PCB
Note:
The location of the “PbF“ marks is subject tochange without notice.
2. FOR SERVICE TECHNICIANS
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ICs and LSIs are vulnerable tostatic electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Cover the plasticparts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use aconductive mat on the worktable.
4. Donot touch ICor LSI pins with bare fingers.
3. CAUTION
Dangerof explosion if batteryis incorrectlyreplaced. Replace onlywiththe same orequivalent
type recommendencedbythe manufacturer.
Dispose of usedbatteries according tothe manufacture’s Instructions.
4. LOCATION OF CONTROLS
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5. SETTINGS
5.1. Connection
6. OPERATIONS
6.1. Making Calls
6.2. Answering Calls
7. SPECIAL FEATURES
7.1. For Call Waiting Service Users
7.2. TemporaryTone Dialing (For Rotaryor Pulse Service Users)
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8. DISASSEMBLY INSTRUCTIONS
ShowninFig—. To remove —. Remove —.
1 LowerCabinet Screws (2.6 × 12) . . . . . . . . . . . . . (A) × 5
2 P.C. Boards Remove the P.C.Boards
9. TROUBLE SHOOTING GUIDE
9.1. Service Hints
SYMPTOM CURE
NoTone Dialing Check IC1, Q2, Q1, C22 and R24.
Dead Check IC1, Q2, Q1 and D17.
Rings, no dial tone, no pulse ortone dial Check Q1, Q2, D17, Q3 and IC1.
Norings Check C1, R2, D4 and IC1.
Novolume Handset Check IC1, R24, C15 and C22.
Buttons stick underuppercabinet assembly.
Fromkeyboard Adijust the setting of buttons.
Nopulse dial Check Q1, Q2 and IC1.
9.2. Pulse Dialing Problems
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9.3. Problems With the Handset
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9.4. Tone Dialing Problems
9.5. Problems With Ringer
9.6. How to Check the IC1(Scanning to the key)
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9.7. Bell Ringing Problem and Volume Level Problem
WhenRingerPatternorVolume Level are not the default setting, please followsteps 1 to5.
1. Remove the telephone line fromthe unit.
2. Short VDD and VSS withleadwire. (See Fig.1)
3. Plug intothe telephone line.
4. Lift the handset off the unit, and confirm tohearthe tone dialing. Thenhang up the handset
on the unit (ON-HOOK).
5. Send the Bell signal tothe unit (Making a call), and confirm it normal call.
<Fig.1>
10. BLOCK DIAGRAM
11. OPTION JUMPER TABLE
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Note:
Referto Main (Flow Solder Side View) ()
12. CIRCUIT OPERATIONS
12.1. Telephone Line Interface and Pulse Dial Circuit
Whenthe hook switchSW1 is ON (off-hook), the circuit is closed, and current is suppliedtothe
base of Q2 via the diode bridge D17 and Q2 is OnQ1 is ON (OFF-HOOK condition).
Q1 and Q2 are the dial pulse generating circuits, and are drivenbythe DIALER (IC1), whenthe
DIALER Pin10 of IC1 is LOW Q2 is OFF and Q1 is OFF (break). If port Pin10 is HIGH Q2
is ON Q1 is ON (make).
12.2. Tone Dial Circuit
Function:
The tone dialing circuit consists of a DTMF(Dual Tone Multi Frequency) signal generator
(outputtedfromPin25 of the IC1) fortone dialing, and alsoa circuit foroutputting the signal to
line.
The DTMFcircuit identifies inputs fromthe 12 keys (1,2,3,4,5,6,7,8,9,0, and #) bymeans of a
total of sevenfrequencies, that is fourlowfrequencies (Lowgroup) and three high frequencies
(High group).
Circuit Description:
Whena dial keyis pressed, a DTMFsignal is output fromPin25 of IC1 as ananalog synthetic
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