Panasonic KX-TS500MXB User manual

ORDERNO. KM40305090C3
Telephone Equipment
KX-TS500MXB / KX-TS500MXC / KX-TS500MXH / KX-
TS500MXR / KX-TS500MXW
Integrated Telephone System
Black Version
Blue Version
GrayVersion
Red Version
White Version
(for Asia, MiddleNear East and Other areas)
SPECIFICATIONS
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1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthat contains lead.
We will use PbF Solderwhendiscussing the leadfree solderusedinourmanufacturing process
whichis made fromTin(Sn), Silver(Ag), and Copper(Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggest using the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solder has amelting point that is50°F ~70°F (30°C~ 40°C)
higher than Pb solder. Please use asoldering iron with
temperature control and adjust itto 700°F ± 20°F (370°C± 10°C). In
case of using high temperature soldering iron, please be careful
not to heat too long.
-PbF solder will tend to splash ifitisheated much higher than its
melting point, approximately1100°F (600°C).
-Ifyou must use Pb solder on aPCB manufactured using PbF
solder, remove as much of the original PbF solder as possibleand
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be sure that anyremaining ismelted prior to applying the Pb
solder.
-When applying PbF solder to doublelayered boards, please check
the component side for excess which mayflow onto the opposite
side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solderavailable commercially. While this product is
manufacturedusing Tin, Silver, and Copper
(Sn+Ag+Cu), you canalsouse Tinand Copper(Sn+Cu) orTin, Zinc, and Bismuth(Sn+Zn+Bi).
Please check the manufac
turer’s specific instructions forthe melting points of theirproducts and anyprecautions for
using theirproduct withother
materials.
The following leadfree (PbF) solderwire sizes are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
1.2. How to recognize that Pb Free solder isused
1.2.1. MainPCB
1.2.2. Operational PCB
Note:
The location of the “PbF“ marks is subject tochange without notice.
2. FOR SERVICE TECHNICIANS
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ICs and LSIs are vulnerable tostatic electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Cover the plasticparts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use aconductive mat on the worktable.
4. Donot touch ICor LSI pins with bare fingers.
3. CAUTION
Dangerof explosion if batteryis incorrectlyreplaced. Replace onlywiththe same orequivalent
type recommendencedbythe manufacturer.
Dispose of usedbatteries according tothe manufacture’s Instructions.
4. LOCATION OF CONTROLS
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5. SETTINGS
5.1. Connection
6. OPERATIONS
6.1. Making Calls
6.2. Answering Calls
7. SPECIAL FEATURES
7.1. For Call Waiting Service Users
7.2. TemporaryTone Dialing (For Rotaryor Pulse Service Users)
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8. DISASSEMBLY INSTRUCTIONS
ShowninFig—. To remove —. Remove —.
1 LowerCabinet Screws (2.6 × 12) . . . . . . . . . . . . . (A) × 5
2 P.C. Boards Remove the P.C.Boards
9. TROUBLE SHOOTING GUIDE
9.1. Service Hints
SYMPTOM CURE
NoTone Dialing Check IC1, Q2, Q1, C22 and R24.
Dead Check IC1, Q2, Q1 and D17.
Rings, no dial tone, no pulse ortone dial Check Q1, Q2, D17, Q3 and IC1.
Norings Check C1, R2, D4 and IC1.
Novolume Handset Check IC1, R24, C15 and C22.
Buttons stick underuppercabinet assembly.
Fromkeyboard Adijust the setting of buttons.
Nopulse dial Check Q1, Q2 and IC1.
9.2. Pulse Dialing Problems
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9.3. Problems With the Handset
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9.4. Tone Dialing Problems
9.5. Problems With Ringer
9.6. How to Check the IC1(Scanning to the key)
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9.7. Bell Ringing Problem and Volume Level Problem
WhenRingerPatternorVolume Level are not the default setting, please followsteps 1 to5.
1. Remove the telephone line fromthe unit.
2. Short VDD and VSS withleadwire. (See Fig.1)
3. Plug intothe telephone line.
4. Lift the handset off the unit, and confirm tohearthe tone dialing. Thenhang up the handset
on the unit (ON-HOOK).
5. Send the Bell signal tothe unit (Making a call), and confirm it normal call.
<Fig.1>
10. BLOCK DIAGRAM
11. OPTION JUMPER TABLE
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Note:
Referto Main (Flow Solder Side View) ()
12. CIRCUIT OPERATIONS
12.1. Telephone Line Interface and Pulse Dial Circuit
Whenthe hook switchSW1 is ON (off-hook), the circuit is closed, and current is suppliedtothe
base of Q2 via the diode bridge D17 and Q2 is OnQ1 is ON (OFF-HOOK condition).
Q1 and Q2 are the dial pulse generating circuits, and are drivenbythe DIALER (IC1), whenthe
DIALER Pin10 of IC1 is LOW Q2 is OFF and Q1 is OFF (break). If port Pin10 is HIGH Q2
is ON Q1 is ON (make).
12.2. Tone Dial Circuit
Function:
The tone dialing circuit consists of a DTMF(Dual Tone Multi Frequency) signal generator
(outputtedfromPin25 of the IC1) fortone dialing, and alsoa circuit foroutputting the signal to
line.
The DTMFcircuit identifies inputs fromthe 12 keys (1,2,3,4,5,6,7,8,9,0, and #) bymeans of a
total of sevenfrequencies, that is fourlowfrequencies (Lowgroup) and three high frequencies
(High group).
Circuit Description:
Whena dial keyis pressed, a DTMFsignal is output fromPin25 of IC1 as ananalog synthetic
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wave.
The signal flowtothe line is as follows.
Pin25 of IC1 Q3 R9 Q1 Tel Line.
The DTMFsignal is sent tothe line via the following path. Q3 is anamplifierwhichis usedto
output the signal toline.
Shownbelowis the signal flowusedtooutput the DTMFsignal fromthe handset as a monitor
tone whena dial keyis pressed.
Pin3 of IC1 R24 C15 Handset Speaker.
The signal combination and frequencycorresponding toeachdial keyis shownon next page.
12.3. Ringer Circuit
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Circuit Operation:
The bell signal passes through C1 (R1) pin21 of IC1 detect the bell signal.
The ring signal is output fromPin8 of IC1, and its volume is adjustedin3 steps (H-L-OFF) by
SW3 thenimpressedon the ceramic sound generator, and sois generated.
R15, R16 . . . . . . . . . . . . . Bell sensitivityadjustment
Belowcontent (inside ruledline) is information onlyforservice correspondence.
Usually, the default setting is digit 6.
12.4. Power Circuitand Redial Back-up Circuit
Function:
This set is poweredfromthe line. Whenit is anOFF-HOOK status, Tel Line D17 Q1
R9 Pin27 of IC1 (tobecome the powersupplyforIC1 speechnetwork).
The voltage fromthe line is turnedintoa constant voltage byD2 and thensuppliedtothe IC1,
reset circuit.
Through Tel Line R1 R3 D17 R14 tobecome the powersupplyforIC1, and the
redial Back-up will be done.
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13. CPU DATA
13

14. HOW TO REPLACE FLAT PACKAGE IC
14.1. Preparation
-PbF (: Pb free) Solder
-Soldering Iron
TipTemperature of 700°F ± 20°F (370°C± 10°C)
Note: We recommend a30 to 40 Watt soldering iron. Anexpert
maybe ableto use a60 to 80 Watt iron where someone with less
experience couldoverheat and damage the PCB foil.
-Flux
Recommended Flux: SpecificGravity0.82.
Type RMA(lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().
14.2. Procedure
1. Tack the flat pack ICto the PCB bytemporarilysoldering two
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diagonallyopposite pins inthe correct positions on the PCB.
Be certaineachpinis locatedoverthe correct padon the PCB.
2. Applyflux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering
iron along the tips of the pins whilefeeding enough solder to the
tipso that itflowsunder the pins as theyare heated.
14.3. Modification Procedure of Bridge
1. Add asmall amount of solder to the bridged pins.
2. With ahot iron, use asweeping motion along the flat part of the
pinto draw the solder from between the adjacent pads.
15. CABINET AND ELECTRICAL PARTS LOCATION
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16

16. ACCESSORY AND PACKING MATERIALS
17. TERMINAL GUIDE OF ICs TRANSISTORS AND
DIODES
18. REPLACEMENT PARTS LIST
1. RTL (Retention Time Limited)
Note:
The marking (RTL) indicates that the Retention Time is limitedforthis item.
Afterthe discontinuation of this assemblyinproduction, the itemwill continue tobe available
fora specific period of time. The retention period of availabilityis dependant on the type of
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assembly, and inaccordance withthe laws governing part and product retention. Afterthe end
of this period, the assemblywill no longerbe available.
2. Important safetynotice
Components identified bythe mark indicates special
characteristics important for safety. When replacing anyof these
components, onlyuse specified manufacture’sparts.
3. The Smark means the part isone of some identical parts. For that
reason, itmaybe different from the installed part.
4. ISO code (Example: ABS-94HB)of the remarks column shows
qualityof the material and aflame resisting grade about plastics.
5. RESISTORS&CAPACITORS
Unless otherwise specified;
All resistors are inohms ( )K=1000 , M=1000k
All capacitors are inMICRO FARADS( F)P= F
*Type &Wattage of Resistor
18.1. Base Unit
18.1.1. Cabinet and Electrical Parts
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Ref. No. PartNo. PartName& Description Remarks
1PQBH10033Z2 PUSH BUTTON (for KX-TS500MXB) ABS-HB
1PQBH10033Z8 PUSH BUTTON (for KX-TS500MXC) ABS-HB
1PQBH10033Z9 PUSH BUTTON (for KX-TS500MXH) ABS-HB
1PQBH10033Z3 PUSH BUTTON (for KX-TS500MXR) ABS-HB
1PQBH10033Z1 PUSH BUTTON (for KX-TS500MXW) ABS-HB
2PQGT16219Z NAMEPLATE(for KX-TS500MXC)
2PQGT16220Z NAMEPLATE(for KX-TS500MXH)
2PQGT16218Z NAMEPLATE(for KX-TS500MXR)
3PQKM10610Z2 CABINETBODY(for KX-TS500MXB) PS-HB
3PQKM10610Z4 CABINETBODY(for KX-TS500MXC) PS-HB
3PQKM10610Z5 CABINETBODY(for KX-TS500MXH) PS-HB
3PQKM10610Z3 CABINETBODY(for KX-TS500MXR) PS-HB
3PQKM10610Z1 CABINETBODY(for KX-TS500MXW) PS-HB
4PQSX10248Y KEYBOARD SWITCH, 16KEY (for KX-TS500MXB)(for KX-
TS500MXC)(for KX-TS500MXH)(for KX-TS500MXR)
4PQSX10248X KEYBOARD SWITCH, 16KEY (for KX-TS500MXH)
4PQSX10248Z KEYBOARD SWITCH, 16KEY (for KX-TS500MXW)
5PQYF10573Y2 CABINETCOVER (for KX-TS500MXB) PS-HB
5PQYF10573X4 CABINETCOVER (for KX-TS500MXC) PS-HB
5PQYF10573X5 CABINETCOVER (for KX-TS500MXH) PS-HB
5PQYF10573X3 CABINETCOVER (for KX-TS500MXR) PS-HB
5PQYF10573Z1 CABINETCOVER (for KX-TS500MXW) PS-HB
6PQYL10013Z2 STAND, WALL MOUNTADAPTOR (for KX-TS500MXB) PS-HB
6PQYL10013Z4 STAND, WALL MOUNTADAPTOR (for KX-TS500MXC) PS-HB
6PQYL10013Z5 STAND, WALL MOUNTADAPTOR (for KX-TS500MXH) PS-HB
6PQYL10013Z3 STAND, WALL MOUNTADAPTOR (for KX-TS500MXR) PS-HB
6PQYL10013Z1 STAND, WALL MOUNTADAPTOR (for KX-TS500MXW) PS-HB
7L0DDFD000002 BUZZER
18.1.2. MainP.C.Boards Parts
Ref. No. PartNo. PartName& Description Remarks
PCB1 PQWP1TS500MX MAIN P.C.BOARD ASS'Y(RTL)
(IC)
IC1 N5BCBZ000001 IC
(TRANSISTORS)
Q1 2SA1625 TRANSISTOR(SI) S
Q2 PQVT2N6517CA TRANSISTOR(SI) S
Q3 PQVTKSB564AC TRANSISTOR(SI) S
Q4 2SD1819A TRANSISTOR(SI)
(DIODES)
D2 MA40510 DIODE(SI)
D3 MA2J11100L DIODE(SI)
D4 MA42000 DIODE(SI)
D5 MA43000
D8 1SS119 DIODE(SI) S
D9 1SS119 DIODE(SI) S
D13 MA41000
D14 MA40510 DIODE(SI)
D17 PQVDS1ZB60F1 DIODE(SI) S
D19 1SS119 DIODE(SI) S
D20 1SS119 DIODE(SI) S
(RESISTORS)
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Ref. No. PartNo. PartName& Description Remarks
R1 ERJ3GEYJ335 3.3M
R2 ERDS1VJ682 6.8K
R3 ERJ3GEYJ185 1.8M
R4 ERJ3GEYJ392 3.9K
R5 ERJ3GEYJ222 2.2K
R6 ERJ3GEYJ562 5.6K
R7 ERJ3GEYJ823 82K
R8 ERJ3GEYJ334 330K
R9 ERDS1TJ330 33 S
R10 ERJ3GEYJ331 330
R11 ERJ3GEYJ103 10K
R13 ERDS2TJ104 100K
R14 ERJ3GEYJ334 330K
R15 ERJ3GEYJ334 330K
R16 ERJ3GEYJ224 220K
R17 ERJ3GEYJ470 47
R18 ERJ3GEYJ104 100K
R19 ERJ3GEYJ152 1.5K
R20 ERJ3GEYJ222 2.2K
R21 ERJ3GEYJ182 1.8K
R22 ERJ3GEYJ182 1.8K
R23 ERJ3GEYJ102 1K
R24 ERJ3GEYJ181 180
R25 ERJ3GEYJ104 100K
R26 ERJ3GEYJ104 100K
R28 ERJ3GEYJ473 47K
R31 ERJ3GEYJ153 15K
R32 ERJ3GEYJ682 6.8K
R46 ERDS2TJ470 47
R47 ERJ3GEY0R00 0
R51 ERJ3GEYJ101 100
R52 ERJ3GEYJ101 100
JP18 ERJ3GEY0R00 0
JP22 ERJ3GEY0R00 0
JP23 ERJ3GEY0R00 0
(CAPACITORS)
C1 F0C2E105A037 1
C5 ECUV1H123KBV 0.012
C6 ECEA1HKA010 1
C9 ECEA0JKS220 22 S
C10 ECEA1HKS100 10 S
C11 ECEA0JKA101 100
C12 ECUV1C683KBV 0.068
C13 ECUV1C683KBV 0.068
C15 ECEA1CKA100 10
C16 ECKD2H681KB 680P S
C17 ECKD2H681KB 680P S
C20 ECEA1CKA100 10
C21 ECUV1H103KBV 0.01
C22 ECEA1CKA100 10
C25 ECUV1H333KBV 0.033 S
C26 ECEA1HKA010 1
C29 ECEA1CKA100 10
C30 ECUV1H120JCV 12P
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