Panasonic RR-US570PP User manual

© Panasonic Corporation 2009. All rights reserved.
Unauthorized copying and distribution is a violation of
law.
PSG0902009CE
A1
IC Recorder
Model No. RR-US570PP
RR-US570E
RR-US590P
Product Color: (K)...Black Type
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions----------------------------------------------- 3
1.1. General Guidelines---------------------------------------- 3
1.2. Protection Circuitry ---------------------------------------- 3
1.3. Safety Part Information (RR-US570, RR-
US590) ------------------------------------------------------- 3
2 Warning -------------------------------------------------------------- 4
2.1. Prevention of Electro Static Discharge (ESD)
to Electrostatically Sensitive (ES) Devices---------- 4
2.2. Service caution based on Legal restrictions -------- 5
3 Service Navigation ----------------------------------------------- 6
3.1. Service Information --------------------------------------- 6
3.2. Service Hint ------------------------------------------------- 6
4 Specifications ------------------------------------------------------7
5 Location of Controls and Components--------------------8
5.1. Components of IC Recorder ----------------------------8
5.2. Basic Operation --------------------------------------------9
6 Self-diagnostic/Doctor Mode-------------------------------- 10
6.1. Service Functions ---------------------------------------- 10
6.2. Firmware Update----------------------------------------- 13
7 Troubleshooting Guide --------------------------------------- 14
8 Disassembly and Assembly Instructions--------------- 17
8.1. Main Parts Location Diagram ------------------------- 18
8.2. Disassembly flow chart --------------------------------- 19
8.3. Disassembly of MIC Ornament and LED TIP----- 20

2
8.4. Disassembly of Rear Cabinet Assembly ----------- 21
8.5. Disassembly of Stand and Battery Cover ---------- 23
8.6. Replacement of Side Ornament, Mode Knob
and Hold Knob -------------------------------------------- 25
8.7. Replacement of Main P.C.B. -------------------------- 27
8.8. Disassembly of LCD P.C.B.---------------------------- 30
8.9. Disassembly of Rec Button---------------------------- 30
8.10. Disassembly of Up Down Button Unit and
Play Button------------------------------------------------- 31
8.11. Disassembly of Menu Button-------------------------- 32
8.12. Disassembly of Speaker Unit ------------------------- 33
8.13. Replacement of Front Ornament--------------------- 34
8.14. Disassembly of LCD Holder Unit --------------------- 35
9 Service Position ------------------------------------------------- 37
9.1. Checking and Repairing of Main P.C.B. and
LCD P.C.B.------------------------------------------------- 37
10 Voltage Measurement & Waveform Chart--------------- 39
10.1. MAIN P.C.B. (1/3) ---------------------------------------- 39
10.2. MAIN P.C.B. (2/3) ---------------------------------------- 40
10.3. MAIN P.C.B. (3/3) ---------------------------------------- 41
10.4. LCD P.C.B.------------------------------------------------- 42
10.5. Waveform Chart ------------------------------------------ 43
11 Illustration of IC’s, Transistors and Diodes ------------ 44
12 Block Diagram --------------------------------------------------- 45
13 Wiring Connection Diagram --------------------------------- 47
14 Schematic Diagram Notes ----------------------------------- 48
15 Schematic Diagram--------------------------------------------- 49
15.1. MAIN CIRCUIT (1/4) ------------------------------------ 49
15.2. MAIN CIRCUIT (2/4) ------------------------------------ 50
15.3. MAIN CIRCUIT (3/4) ------------------------------------ 51
15.4. MAIN CIRCUIT (4/4) ------------------------------------ 52
15.5. LCD CIRCUIT--------------------------------------------- 53
16 Printed Circuit Board ------------------------------------------ 54
16.1. MAIN P.C.B. ----------------------------------------------- 54
16.2. LCD P.C.B.------------------------------------------------- 55
17 Exploded View and Replacement Parts List ----------- 56
17.1. Exploded View and Mechanical Replacement
Parts List --------------------------------------------------- 56
17.2. Electrical Replacement Parts List-------------------- 60

3
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
• No sound is heard when the power is turned on.
• Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
1.3. Safety Part Information (RR-US570, RR-US590)
Safety Parts List:
There are special components used in this equipment which are important for safety.
These parts are marked by in the Schematic Diagrams, Exploded View & Replacement Parts List. It is essential that these
critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the
original design without permission of manufacturer.
Table 1
Safety Ref. No. Part No. Part Name & Description Remarks
13 RKS0454A-K REAR CABINET US570PP
13 RKS0454B-K REAR CABINET US570E
13 RKS0454H-K REAR CABINET US590P
ICP501 D4FB1R100015 RESETTABLE FUSE
ICP502 D4FB1R100015 RESETTABLE FUSE
A3 RQT9358-Y O/I BOOK (En/Cf) US570PP
A3 RQT9361-B O/I BOOK (En) US570E
A3 RQT9362-E O/I BOOK (Ge/It/Fr/Du/Sp/Cn/Ar/Sw/Da/
Cz/Po/Pr/Ru/Ur)
US570E
A3 RQT9359-P O/I BOOK (En) US590P

4
2Warning
2.1. Prevention of Electro Static Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin-
ium foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).

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2.2. Service caution based on Legal restrictions
2.2.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees
C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)

6
3 Service Navigation
3.1. Service Information
This service manual contains technical information which will allow service personnel’s to understand and service this model.
If the circuit is changed or modified, this information will be followed by supplement service manual to be filled with original service
manual.
3.2. Service Hint
3.2.1. Flash NAND ROM IC
Flash NAND ROM IC, IC701 is supplied as service part.
RR-US570 (1GB) - RFKWNUS570-S
RR-US590 (2GB) - RFKWNUS590-K
3.2.2. USB Serial Number
Serial Number is required to obtain the Firmware Updates.
3.2.3. Firmware Version
To obtain updated Firmware version and procedures for updating, please refer to item 6.2.

7
4 Specifications
Power
Batteries DC 3.0 V (2 AAA LR03 batteries)
Audio
Sampling Frequency
(Stereo/Monaural)
XP: 44.1 kHz/44.1 kHz
LP: 22.05 kHz/16 kHz
SLP: 8 kHz/8 kHz
Recording Format MP3
Playable Bit Rate (MUSIC
folder)
8 kbps to 320 kbps
Playable Sampling
Frequency (MUSIC folder)
8 kHz to 48 kHz
Frequency Response
(-10 dB, Rec-Play,
Monaural)
XP: 180 Hz to 15,100 Hz
LP: 180 Hz to 6,700 Hz
SLP: 180 Hz to 2,900 Hz
Built-in Microphone S/N
Ratio
40.5 dB (XP) Filter (JIS A)
USB USB2.0 (Hi-Speed)
Audio Output Earphone ø 3.5 mm (1.8”), 16 Ω, Max: 3 mW
Speaker
output
ø 20 mm (25/32”), 8 Ω, Max: 330 mW
Audio Input External
Microphone
ø 3.5 mm (1/8”),
0.80 mV plug in power
Built-in Memory 1 GB*1 (RR-US570)
2 GB*1 (RR-US590)
Operating Temperature 0°C to 40°C (32°F to 104°F)
Operating Humidity 20% to 80% (non-condensing)
*1 GB means one billion bytes. Usable capacity will be less.
Battery life (may be less depending on the operating conditions.)
Battery (AAA
LR03)
Recording mode Rec*3Play*4
Alkaline
battery*2
Stereo XP approx. 23 h. approx. 35 h.
LP approx. 29 h. approx. 35 h.
SLP approx. 32 h. approx. 35 h.
Monaural XP approx. 32 h. approx. 35 h.
LP approx. 42 h. approx. 35 h.
SLP approx. 45 h. approx. 35 h.
*2 Using Panasonic Alkaline battery.
*3 When zoom microphone is off.
*4 When audio is output from speaker (Volume: 13, EQ: off, playback
speed control: x 1).
Standard recordable time (RR-US570)
Recording mode Time Bit rate
Stereo XP 17 h, 50 min. 128 kbps
LP 35 h, 50 min. 64 kbps
SLP 143 h, 40 min. 16 kbps
Monaural XP 35 h, 50 min. 64 kbps
LP 71 h, 50 min. 32 kbps
SLP 287 h, 30 min. 8 kbps
Standard recordable time (RR-US590)
Recording mode Time Bit rate
Stereo XP 36 h, 00 min. 128 kbps
LP 72 h, 00 min. 64 kbps
SLP 288 h, 00 min. 16 kbps
Monaural XP 72 h, 00 min. 64 kbps
LP 144 h, 00 min. 32 kbps
SLP 576 h, 10 min. 8 kbps
Max. Dimensions (WxHxD) 40.4 mm x 110.6 mm x 16.8 mm
(1-19/32” x 4-11/32” x 21/32”)
Cabinet Dimensions
(WxHxD)
39 mm x 110.6 mm x 15.1 mm
(1-17/32” x 4-11/32” x 19/32”)
Mass (Weight) Approx. 65 g (2.30 oz.) with battery
Approx. 43 g (1.52 oz.) without battery
Specifications are subject to change without notice.

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5 Location of Controls and Components
5.1. Components of IC Recorder

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5.2. Basic Operation

10
6 Self-diagnostic/Doctor Mode
6.1. Service Functions
6.1.1. Test Mode
Purpose: To enter into Test Mode for checking and inspection of unit.
Procedures:
1. Set the recording position switch to “MANUAL” at the power off.
(Setting to “MANUAL” after turning on the power is OK.)
2. Slide [OPR/HOLD] switch to “OPR” side to turn on the power.
3. Set to “HOLD” mode by pushing [OPR/HOLD] button.
4. Input the below keys while displaying the “HOLD”.
[MENU] --> [ERASE] --> [ ] --> [VOL-]
Note : Input of these keys are done within two seconds while displaying “HOLD”.
5. All segments of LCD will Light up & the unit will enter into the Operation Check Mode. During the Operation Check Mode, the
Recording LED will be blinking.
6. To cancel Test Mode, power off the unit by removing batteries.
6.1.2. USB Serial Number (ID) Confirmation Function
Purpose: To check USB Serial Number (ID) which is written in the NAND flash memory at the final process is confirmed in this
mode.
Procedures:
1. Enter into Test Mode, check all segments of LCD light up.
2. Press and hold [ ] for 10 seconds and the USB serial number which is written in NAND flash memory is displayed.
6.1.3. Reset Function
Purpose:
• To reset to factory default setting.
• Only USB Serial Number (ID) is not initialized, and NAND flash memory is not formatted logically in this mode.
Procedures:
1. Enter into Test Mode, check all segments of LCD light up.
2. Set the Recording position switch to “WIDE”.

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3. Press and hold [ ] for 10 seconds and enter this mode.
Caution:
If the password is set, the password will be initialized.
Recording files and data files other than mp3 are erased.
6.1.4. Password Deletion Function
Purpose: To retain the data of all folders only deleting the password when forgotten the password.
Procedures:
1. Enter into Test Mode, check all segments of LCD light up.
2. Press and hold [FOLDER] for 10 seconds and the password is automatically deleted.
Caution:
Pressing the [FOLDER] for 10 seconds is invalid when the password is unset (because of no need to delete the pass-
word).
6.1.5. Repeat Recording Function
Purpose: To measure recording battery life.
Procedures:
1. Enter into Test Mode, check all segments of LCD light up.
2. Press and hold [ERASE] for 10 seconds and enter the repeat recording mode.
Caution:
Recording mode, stereo/monaural and zoom setting are retained the final one before entering this mode. Therefore, can-
not set them in the repeat recording function.
6.1.6. Bad Blocks in the NAND Flash Memory Function
Purpose: To count the number of bad blocks in the NAND flash memory in order to evaluate the flash memory.
Procedures:
1. Enter into Test Mode, check all segments of LCD light up.

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2. Press and hold [ ] for 10 seconds and enter the number of bad blocks counting mode.
6.1.7. Check Sum in the Firmware Function
Purpose: To confirm the check sum in the Firmware stored area in the NAND flash memory in order to judge whether the data of the
Firmware area is normal or not.
Procedures:
1. Enter into Test Mode, check all segments of LCD light up.
2. Set the Recording position switch to “WIDE”.
3. Press and hold [ ] for 10 seconds and enter this mode.

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6.2. Firmware Update
6.2.1. Update Firmware and check its Version Number
•Updating the firmware
1. Insert battery with sufficient battery charge.
2. Connect IC-recorder to PC using USB cable.
3. Copy "XXXXXXXX.ebn" file to IC-recorder root folder.
4. Terminate PC to IC-recorder connection safely
(refer to icon at bottom right side of the monitor – "Unplug, Eject or Safely Remove Hardware").
5. Let IC-recorder perform system update, "UP" and "[F] ACCESS" will display on LCD.
6. Upon completing update, perform "FORMAT" function to erase all files in the IC-recorder.
– Press ERASE key
– Select the display which [FORMAT] is flashing in file erasing mode
– Select [YES] in the [YES no] display
– Press [ ]
•Checking Firmware Version
1. Press and hold [STOP] key for 10 seconds, LCD will display the firmware number.
Note: Firmware file and Firmware Version Number, please kindly obtain from TSN website.

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7 Troubleshooting Guide

15

16

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8 Disassembly and Assembly Instructions
Caution
“ATTENTION SERVICER”
Be careful when disassembling and servicing.
Some chassis components may have sharp edges.
Special Note:
1. This section describes the disassembly procedures for all the major printed circuit boards and main components.
2. Before the disassembly process was carried out, do take special note that all Safety Precautions are carried out.
3. For assembly after operation checks or replacement, reverse the respective procedures.
Special reassembly procedures are described only when required.
4. Do take note of the locators on each printed circuit board during reassembling procedures.
Special reassembly procedures are described only when required.
5. Select items from the following index when checks or replacement are required.
• Disassembly of MIC Ornament and LED Tip
• Disassembly of Rear Cabinet Assembly
• Disassembly of Stand and Battery Cover
• Replacement of Side Ornament, Mode Knob and Hold Knob
• Replacement of Main P.C.B.
• Disassembly of LCD P.C.B.
• Disassembly of Rec Button
• Disassembly of Up Down Button Unit and Play Button
• Disassembly of Menu Button
• Disassembly of Speaker Unit
• Replacement of Front Ornament
• Replacement of LCD Holder Unit

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8.1. Main Parts Location Diagram

19
8.2. Disassembly flow chart
The following chart is the procedure for disassembling the casing and inside parts for internal inspection when carrying out the ser-
vicing.
To assemble the unit, reverse the steps shown in the chart below.

20
8.3. Disassembly of MIC Ornament
and LED TIP
8.3.1. Disassembly of MIC Ornament
Step 1 : Remove 1 screw.
Step 2 : Remove MIC Ornament.
8.3.2. Disassembly of LED Tip
Step 1 : Use a Tweezers to remove the LED Tip.
Caution : Ensure the LED Tip is fixed exactly onto the
guides during assembly.