Philips TDA1576T User manual

DATA SHEET
Product specification
Supersedes data of February 1991
File under Integrated Circuits, IC01
1998 Nov 18
INTEGRATED CIRCUITS
TDA1576T
FM/IF amplifier/demodulator circuit

1998 Nov 18 2
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
FEATURES
•Fully balanced 4-stage limiting IF amplifier
•Symmetrical quadrature demodulator
•Field strength indication output for 1 mA ammeter
•Detune detector for side response and noise attenuation
•Detune voltage output
•Internal muting circuit
•0°and 180°AF output signals
•Reference voltage output
•Electronic smoothing of the supply voltage.
GENERAL DESCRIPTION
The TDA1576T is a monolithic integrated FM/IF amplifier
circuit for use in mono and stereo FM-receivers of car
radios or home sets.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPsupply voltage (pin 1) 7.5 8.5 15 V
IPsupply current 10 16 23 mA
ViIF(rms) input sensitivity (RMS value) −3 dB before limiting 14 22 35 µV
S/N = 26 dB −10 −µV
S/N = 46 dB −55 −µV
V
oAF(rms) AF output voltage (RMS value) 60 67 75 mV
THD total harmonic distortion with double
resonant circuits −0.02 −%
S/N signal-to-noise ratio Vi>1mV −72 −dB
αAM AM suppression −50 −dB
RR ripple rejection f = 100 Hz 43 48 −dB
I15 maximum indicator output current −−2mA
T
amb operating ambient temperature −30 −+80 °C
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA1576T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1998 Nov 18 3 Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
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BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MEH139
DETUNE
DETECTOR
0.5
mA
3.7 kΩ
8.3 kΩ
560 pF
33 pF
QL= 20
fo= 10.7 MHz
33 pF 6.8 nF
audio
outputs
10 Ω
0.1 µF 47 µF
3.7 kΩ
V2
MUTE
ATTENUATOR
QUADRATURE
DEMODULATOR
RES1IF1CPS VP
VP
V1 V2
RES2 IF2 VoAF1
VAF −VAF
VoAF2 n.c.
1098
Vi(det)
12
n.c.
11
Vo(det)
13
Vref
14
VF0
16
ViIF
17
VFB2 VFB1
0.1 µF0.1 µF
ViIF
RS
RS
18
GND
2 V (RMS)
20 19
VF
15
7654321 FMON
FM
on
REFERENCE
VOLTAGE
reference
voltage
detune
voltage
zero adjustment
of
field strength
indicator
field strength
LEVEL DETECTOR
4-STAGE
LIMITER/
AMPLIFIER
+4.9 V
+8.5 V
3.6 kΩ
25
kΩ
25
kΩ
1 nF 0.47 µF
1 mA
TDA1576T

1998 Nov 18 4
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
PINNING
SYMBOL PIN DESCRIPTION
VP1 positive supply voltage
CPS 2 smoothing capacitor of power supply
IF1 3 IF signal to resonant circuit
RES1 4 resonant circuit input 1
FMON 5 FM-ON, standby switch
RES2 6 resonant circuit input 2
IF2 7 IF signal to resonant circuit
VoAF1 8 AF output voltage 1 (0°phase)
VoAF2 9 AF output voltage 2 (180°phase)
n.c. 10 not connected
n.c. 11 not connected
Vi(det) 12 detune detector input voltage for
external audio reference
Vo(det) 13 detune detector output voltage
Vref 14 reference voltage output
VF15 level output for field strength
VF0 16 zero adjust voltage for field strength
ViIF 17 FM/IF input signal voltage
VFB2 18 DC feedback 2
VFB1 19 DC feedback 1
GND 20 ground (0 V) Fig.2 Pin configuration.
handbook, halfpage
TDA1576T
MEH140
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VP
CPS
IF1
RES1
FMON
RES2
IF2
n.c. n.c.
Vi(det)
Vo(det)
Vref
VF
VFB2
VFB1
GND
VF0
ViIF
VoAF1
VoAF2

1998 Nov 18 5
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
SYMBOL PARAMETER MIN. MAX. UNIT
VPsupply voltage (pin 1) 0 15 V
V2, 5, 16 voltage on pins 2, 5 and 16 0 VPV
Ptot total power dissipation 0 450 mW
Tstg storage temperature −55 +150 °C
Tamb operating ambient temperature −30 +80 °C
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air 85 K/W

1998 Nov 18 6
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
CHARACTERISTICS
VP= 8.5 V; fIF = 10.7 MHz; RS=60Ω; fm= 400 Hz with ∆f=±22.5 kHz; 50 µs de-emphasis (C8-9 = 6.8 nF);
Tamb =25°C and measurements taken in Fig.1; unless otherwise specified. The demodulator circuit is adjusted at
minimum second harmonic distortion for ViIF = 1 mV and a deviation ∆f=±75 kHz.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPsupply voltage (pin 1) 7.5 8.5 15 V
IPsupply current V5=V
9=V 13 = 0 10 16 23 mA
Reference voltage
Vref reference voltage (pin 14) I14 =−1mA −4.9 −V
∆Vref reference voltage dependence on
temperature −0.3 −%/K
I14 maximum output current short-circuit current 4 6 7.5 mA
R14 output resistor I14 < 1.2 mA −60 150 Ω
IF amplifier
ViIF(rms) input sensitivity (RMS value; pin 17) −3 dB before limiting 14 22 35 µV
R17-18 input resistance ViIF = 200 mV (RMS) 10 −−kΩ
C
17-18 input capacitance ViIF = 200 mV (RMS) −5−pF
VoIF(p-p) output voltage at pins 3 and 7
(peak-to-peak value) Z3, 7 = 10 pF parallel to 1MΩ610 680 750 mV
R3-7 output resistance 200 250 300 Ω
Demodulator
R4-6 input resistance 20 30 40 kΩ
C4-6 input capacitance −1 2.5 pF
R8, 9 output resistance 2.9 3.7 4.5 kΩ
V8, 9 DC offset voltage on output pins at
V4-6 =0 V
5> 3 V or V3-7 = 0 or
V13 < 0.3 V −0±100 mV
demodulator efficiency −40 −mV/°
demodulator efficiency dependent on
supply voltage −6.2 −mV/°
V/V DC voltage ratio 0.653 0.667 0.680 V/V
dependence on temperature −10−5−1/K
V14 ∆
V14 T∆×
----------------------
V14
∆I14
∆
------------
V∆ϕ∆
------- V8-9
∆ϕ∆
--------------
V8-9
ϕ∆ VP3VBE –()
-----------------------------------------
V8V9 +
2V2
-------------------
V∆T∆
------- V8V9
+
2V2
-------------------
∆
T∆
-----------------------

1998 Nov 18 7
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
Field strength output; see Fig.4
V15 output voltage ViIF = 0 0 0.1 0.25 V
ViIF = 1 mV (RMS) 1.1 1.5 1.9 V
ViIF = 250 mV (RMS) 3.2 3.6 4.1 V
S control steepness −0.85 −V/dec
R15 output resistance −150 200 Ω
dependence on temperature −0.3 −%/K
I15 standby operational cut-off current V5≥3 V; V15 =0to5V −−10 µA
Zero level adjustment
V16 internal bias voltage −260 −mV
R16 input resistance −19 −kΩ
S control steepness ViIF = 100 mV; 0.87 1.0 1.2 V/V
Detuning detector
I12 input bias current −20 100 nA
Z12 input impedance ; see Fig.5 630−MΩ
output voltage ratio for
∆ϕ =ϕ(V3-7)−ϕ(V4-6)−90°V1=V
2= 7.5 V;
R13-14 =10kΩ; pins 9
and 12 short-circuit;
see Fig.6
∆ϕ = 9.2°(43 kHz); Q = 20 V9, 12 = 334 mV 0.45 0.5 0.55 V/V
∆ϕ = 3.5°(16 kHz); Q = 20 V9, 12 = 138 mV 0.75 0.8 0.85 V/V
∆ϕ =14°(65 kHz); Q = 20 V9, 12 = 501 mV 0.335 0.345 0.355 V/V
I13 maximum output current V13 = 6 V; see Fig.7 0.4 0.5 0.6 mA
cut-off current V13 = 2.5 V; V9, 12 =0 −−−100 nA
Internal audio attenuation; see Fig.8
output voltage ratio α= attenuation factor
α= 1 dB 0.11 0.12 0.13 V/V
α= 7.2 dB 0.095 0.1 0.105 V/V
α≥40 dB −0.06 −V/V
I13 input current V13 ≤0.1 V −−−225 nA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V∆T∆
------- ViIF V15
∆
T∆V15
×
----------------------
=
AV15
∆V16
∆
------------
=
Z12 5V
I
12
∆
----------
=
V13
V14
---------
V13
V14
---------

1998 Nov 18 8
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
OPERATING CHARACTERISTICS
VP= 8.5 V; fIF = 10.7 MHz; RS=60Ω; fm= 400 Hz with ∆f=±22.5 kHz; 50 µs de-emphasis (C8-9 = 6.8 nF);
Tamb =25°C and measurements taken in Fig.1; unless otherwise specified. The demodulator circuit is adjusted at
minimum second harmonic distortion with ViIF = 1 mV.
Standby switch; see Fig.9
V5input voltage for FM on ;
V19 = 0.3 V
2.4 2.5 −V
input voltage for FM off −2.9 3 V
linear range −350 −mV
I5input current V5=0to2V −−−100 µA
V5= 3.5 to 15 V −−1µA
temperature dependence FM on (3.5VBE)−7−mV/K
FM off (5VBE)−10 −mV/K
Supply voltage smoothing
V1-2 internal voltage drop proportional to
V1−3VBE
80 210 400 mV
R1-2 internal resistor 5.8 8.3 10.8 kΩ
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IF amplifier and demodulator
ViIF(rms) input sensitivity (RMS value) −3 dB before limiting 14 22 35 µV
S/N = 26 dB −10 −µV
S/N = 46 dB −55 −µV
V
oAF(rms) AF output voltage (RMS value) 60 67 75 mV
VoN noise voltage for ViIF = 0 (RMS value;
pins 8 and 9) RS= 300 Ω; f = 250 to 15000 Hz −900 −µV
weighted noise voltage in accordance with
“DIN 45405”
−2−mV
S/N signal-to-noise ratio (pins 8 and 9) ViIF = 1 mV (RMS);
see Fig.3 −72 −dB
αAM AM suppression ViIF = 0.5 to 200 mV;
FM: 70 Hz; ±15 kHz;
AM: 1 kHz; m = 30%
−50 −dB
αFM FM suppression for FM off ViIF = 500 mV; V5=3V 80 −−dB
∆V8, 9 AFC shift in relation to minimum second
harmonic distortion α2H
ViIF = 0.03 to 500 mV −25 −mV
DC offset at second harmonic distortion operating −0±100 mV
mute or FM off −0±50 mV
α3H distortion for third harmonic −0.65 −%
RR ripple rejection Vripple = 200 mV on VPf = 100 Hz 43 48 −dB
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V3, 7
V3, 7(max)
----------------------- 0.9=
V5
T∆
-------

1998 Nov 18 9
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
Fig.3 AF output voltage level on pins 8 and 9 as a function of ViIF at VP= 8.5 V; fm= 1 kHz; QL= 20 with
de-emphasis.
handbook, full pagewidth
−80
−60
−40
−20
0
20
10−610−510−410−310−210−11
V8, V9
(dB)
Vi 17 (rms) (V)
MEH166
S +N
N
Fig.4 Field strength output (I16 = 0).
handbook, full pagewidth
5
0
10−610−510−410−310−210−11
V15
(V)
ViIF (rms) (V)
MEH143
1
2
3
4

1998 Nov 18 10
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
Fig.5 Detuning input impedance.
handbook, halfpage
MEH144
I12
I12
Ri
V9, 12
Fig.6 Detuning curve.
handbook, halfpage
−1.2 −0.8 −0.4 0 0.4 0.8
V13/V14
1.2
V9, 12 (V)
1
MEH145
0.5
0
Fig.7 Detuning output.
handbook, halfpage
024
I
13
(mA)
6
V13 (V)
1
0
MEH146
0.5
|V9, 12|1.2 1 0.5 0
Fig.8 Internal audio attenuation.
handbook, halfpage
0 0.1 0.2
αVo
(dB)
0.3
V13 /V14
0
MEH147
−20
−40
−60
−80

1998 Nov 18 11
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
Fig.9 Standby switch.
handbook, halfpage
012
V
3-7
V3-7 (max)
3
V5(V)
∆V5
2
0
MEH148
1
Fig.10 An example of the TDA1576T when using a demodulator with two tuned circuits.
Adjustment of the demodulator circuit is obtained with an IF signal which is higher than the 3 dB limiting level; L2 should be short-circuited or detuned;
L1 should be adjusted to minimum d2distortion, and then L2 to minimum d2distortion.
(1) Coil data: L1 = L2 = 0.38 µH; Qo= 70; coil former KAN (C).
handbook, full pagewidth
MBK240
L1
(1) (1)
1 kΩ560
pF
560
pF L2 390 Ω
39 pF
39 pF
33 pF
33 pF
C8-9
VoAF
98
7
6
4
3
TDA1576T

1998 Nov 18 12
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
PACKAGE OUTLINE
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10 0.012
0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.050
1.4
0.055
0.419
0.394 0.043 0.039 0.035 0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
95-01-24
97-05-22

1998 Nov 18 13
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
SOLDERING
Introduction to soldering surface mount packages
Thistextgivesavery briefinsightto acomplextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screenprinting,stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
forsurface mountdevices (SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•Forpackages withleads onfour sides,thefootprintmust
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1998 Nov 18 14
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45°angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE SOLDERING METHOD
WAVE REFLOW(1)
BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, SMS not suitable(2) suitable
PLCC(3), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(3)(4) suitable
SSOP, TSSOP, VSO not recommended(5) suitable
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

1998 Nov 18 15
Philips Semiconductors Product specification
FM/IF amplifier/demodulator circuit TDA1576T
NOTES

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© Philips Electronics N.V. 1998 SCA60
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under patent- or other industrial or intellectual property rights.
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Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. [phone], Fax. [phone]
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]
Indonesia: PTPhilipsDevelopmentCorporation, SemiconductorsDivision,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone]
Printed in The Netherlands 545102/750/02/pp16 Date of release: 1998 Nov 18 Document order number: 9397 750 04823