
Lead-Free require m e n t forservice
INDENTIFICATION:
R egardless ofspeciallogo (notalwaysindicated)
O ne m ust treat allsets from 1.1.2005 onw ards, according next
rules.
Im portantnote:In factalso products a little older can
also be treated in this wayas long as you avoid mixing
solder-alloys (leaded/ lead-free).S o best to alw ays
use SAC 305 and the higher tem peratures belong to
this.
D ue to lead-free technology som e rules have to be respected by the
workshop during a repair:
x Use only lead-free solderalloy Philips SAC 305 with
order code 0622 149 00106. Iflead-free
solder-paste is required, please contact the
m anufacturer of your solder-equipm ent.In general
use of solder-paste w ithin w orkshops should be
avoided because paste is noteasy to store and to
handle.
x U se only adequate solder tools applicable for
lead-free solderalloy.The soldertoolmustbe able
oTo reach at least a solder-tem perature of
400°C ,
oTo stabilize the adjusted tem perature at the
solder-tip
oTo exchange solder-tips for different
applications.
x Adjustyoursoldertoolso thata tem perature around
360°C – 380°C is reached and stabilized at the
solder joint.H eating-time ofthe solder-joint should
not exceed ~ 4 sec. Avoid tem peratures above
400°C otherwise w ear-outoftips willrise drastically
and flux-fluid willbe destroyed.To avoid w ear-outof
tips sw itch offun-used equipm ent,orreduce heat.
x Mix of lead-free solder alloy / parts w ith leaded
solder alloy / parts is possible but PHILIPS
recom m ends strongly to avoid mixed
solder alloy types (leaded and lead-free).Ifone
cannotavoid,clean carefully the
solder-jointfrom old solder alloy and re-solder with
new solderalloy (SA C 305).
x U se only original spare-parts listed in the
Service-M anuals.Notlisted standard-material
(com m odities) has to be purchased at
externalcom panies.
x Specialinformation forBG A-ICs:
-alw ays use the 12nc-recognizable soldering
tem perature profile of the specific B G A (for
de-soldering alw ays use highest lead-free
tem perature profile,in case ofdoubt)
-lead free BGA-ICs will be delivered in
so-called ‘dry-packaging’ (sealed pack
including a silica gel pack) to protect the IC
againstmoisture.Afteropening,dependentof
MSL-levelseen on indicator-labelin the bag,
the BG A-IC possibly stillhas to be baked dry.
This willbe com m unicated via AYS-w ebsite.
Donotre-use BGAsatall.
x Forsets produced before 1.1.2005,containing
leaded soldering-tin and com ponents, all
needed spare-parts w ill be available till the
end of the service-period. For repairof such
sets nothing changes.
x Onourw ebsite:
www.atyourservice.ce.Philips.com
You find more information to:
BGA-de-/soldering (+ baking instructions)
H eating-profiles ofBG As and otherICsused
in Philips-sets
You w ill find this and m ore technical
information w ithin the “m agazine”,chapter
“workshop new s”.
Foradditionalquestions please contactyourlocal
repair-helpdesk.
Warnings,N otes
1-5
www.freeservicemanuals.info