Prestigio PAP4000 User manual

PAP4000 Service Manual
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Contents
1. Summary................................................................................................................................................2
1.1. Product summary.............................................................................................................................2
1.2. Appearance and corresponding functionalities................................................................................2
1.3. Abbreviations ..................................................................................................................................3
2. Specifications and features....................................................................................................................3
2.1. Technological specifications............................................................................................................4
2.2. Hardware features............................................................................................................................4
3. Upgrade guides ......................................................................................................................................6
3.1. Upgrade of main program ...............................................................................................................6
4. Guides of disassembling and assembling.............................................................................................9
4.1. Tools of disassembling and assembling...........................................................................................9
4.2. Steps of disassembling and assembling...........................................................................................9
5. Maintenance technologies...................................................................................................................16
5.1. Solutions to frequent failures.........................................................................................................16
5.1.1. The name and location of main board ...................................................................................16
5.1.2. Hardware system framework.................................................................................................18
5.1.3. Basic principles and analyses and maintenance of frequent failures.....................................18
（A）Functional failures ..............................................................................................................19
A．The failure of powering on ...................................................................................................19
B. Failures of receiving voice and ringtones .......................................................................20
C．The failures of displaying .......................................................................................................21
D．The failures of identifying SIM/UIM card and T card............................................................23
E．The failures of Bluetooth.........................................................................................................24
F．The failures of shooting photos and recording videos.............................................................25
G. The failures of keys...................................................................................................................25
H. The failures of motor ................................................................................................................26
I. The failures of charging......................................................................................................26
J. The failures of WIFI................................................................................................................27
（B）. RF section .........................................................................................................................29
A. RF section of WCDMA............................................................................................................29
B、GSM The working principle of RF circuit for GSM...............................................................34
6. Quality inspection................................................................................................................................35
6.1. Inspection tools..............................................................................................................................35
6.2. Inspection objects..........................................................................................................................35
6.3. Inspection items.............................................................................................................................35
7. Technological support .........................................................................................................................38
7.1. FTP Server (ftp://119.147.25.41/)..................................................................................................38
8. FAQ.......................................................................................................................................................38
9. Appendix ..............................................................................................................................................42

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1. Summary
1.1. Product summary
1）WCDMA:850/2100MHz，GSM 900/1800/1900MHz；
2）WVGA HD capacitance screen with 4.0 inch;
3）Handwriting input under capacitance touchscreen;
4）Qualcomm 7227-A（1GHz）CPU;
5）Supporting syncing with PC, connecting to PC with USB port conveniently;
6）Supporting GPS navigation;
7）Supporting BT/WIFI
1.2. Appearance and corresponding functionalities
Keys Functionalities
Menu key Tap to pop up the menu at the functionality interface
Back key Tap to go back to the previous interface
Volume key Adjust call, ringtone, music and video volumes
Power key When the backlight is on, press the button shortly to turn off the backlight, while
the device is asleep, press the button shortly to wake it up.
Home key Tap to go back to the functionality interface from the application interface

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1.3. Abbreviations
For your convenience, this handbook adopts the following abbreviations:
AP Application processor
BB Basic band
TD TD-SCDMA, full name is: Time Division Duplex-Synchronization
Code Division Multiple Access.
HSDPA Full name is: High Speed Downlink Packet Access
GSM Global system of mobile communication
GPRS General packet radio service
TW Touch Window
dBm Decibel (referenced to milliwatts)
BL (Boot Loader）Hardware to initialize functionalities and build
mapping for internal space (full name: Boot Loader)
DSP Processing digital signals （full name: Digital Signal
Processor）
RF Radio frequency
ESD Electrostatic discharge
FPC Flexible printed circuit
LCD Liquid crystal display
LDO Low dropout regulator
LED Light emitting diode
PCB Printed circuit board
PCM Pulse Code Modulation
PGA Programmable gain amplifier
PLL Phase locked loop
PMU Power Management Unit
RAM Random Access Memory
ROM Read Only Memory
RTC Real-Time Clock
SAW Surface acoustic wave
SIM Subscriber identity module
SLR Send loudness rating
SOC System On Chip
SRAM Static random access memory
STMR Side tone masking rating
TA Travel adapter
TDD Time division duplex
UART Universal asynchronous receiver transmitter
VCO Voltage controlled oscillator
VCTCXO Voltage controlled temperature compensated crystal oscillator
2. Specifications and features

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2.1. Technological specifications
Basic specifications
Size 123×65.8×11.8mm
Type Bar
Antenna Built-in
Phone card Mini-inserted card
Network mode WCDMA:850/2100MHz，GSM 900/1800/1900MHz
Operation system Android2.3
Processor Qualcomm 7227-A (1GHz)
Memory ROM:512MB+RAM：512 MB
SD card Support T-FLSHA card with 32GB at most
Camera camera with 3.2 megapixels （AF）
Port MINI-USB
Screen parameters
Type WVGA
Size 4.0 inch
Resolution 800*480
Main supported functionalities (take actual device for real)
Input method Language Simplified Chinese
Input method Handwriting
Contacts Max Contact number 5000 pieces
Call log Max number 2000 pieces
Picture (picture
viewer) Supported format jpg、jpeg、bmp、png、wbmp、gif
Messages Max storage 3000 pieces
Accessories
Battery
Battery name Lithium-ion chargeable battery
Specific capacity 1400mAh
Normal voltage 3.7V
2.2. Hardware features
1. Hardware configurations:
Name Specifications
CPU Qualcomm 7227-A
Power manager Qualcomm PM8029
Audio Qualcomm 7227-A
BT BROADCOM BCM4330FKUBG
Memory ROM 512MB+RAM 512MB
Primary camera Auto-focused camera with 3.2 megapixels

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Secondary
camera
Null
2. Feature parameters
Series
No. Items Specifications
2 Battery capacity
Number of battery Voltage
0 3.500V~3.660V
1 3.660V~3.730V
2 3.730V~3.800V
3 3.800~3.930V
4 >3.930V
24 Low voltage alarm
Incoming calls: if the voltage floats over
100mV, the current may come from module, so it
needs to lower the limit of low voltage
threshold, namely, primary card 3400 millivolt,
secondary card 3450 millivolt.
Standby: when the phone is at standby, and if
the voltage is lower than 3600 millivolt, it
needs to shut the communication functionality
down on secondary card, and if the voltage is
lower than 3550 millivolt, it needs to shut the
communication functionality down on primary
card.
25 The voltage of forcing
to power off 3.40±0.03V
26 Battery The voltage of full battery：4.2V
Capacity：1080mAh
27 Travel charger AC input：100~240V，50/60Hz
DC input：5V，1000mA
3. Current parameters
Item names Test data
Power on ≤300mA
Calls CDMA ≤300mA
Standby Base current（Not connected to BT）≤2mA
Current of powering off ≤0.1mA
Charging loop -400~-580mA

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3. Upgrade guides
3.1. Upgrade of main program
Preparations for upgrade:
Series
No. Name Specifications Quantity Notes
1 Computer No requirement 1
2 Data cable Standardized data cable (slotted 5PIN data
cable) 1
3 Phone 1
4 Battery 1 adequate
battery
5 Software Version software, upgrade tools, phone
driver and others.
Instructions：
1) Upgrade will lose the data stored in phone, so please note to save and backup the user data first
before performing upgrade for the occurrence of data losing.
2) The upgrade platform is installation-free version and supports multiport download, if it is needed,
it is advised to apply active USB-HUB to improve its stability.
Brief steps to upgrade：
1) It needs to install port driver of the device for the first time to connect to
computer.
2) To run the upgrade platform with installation-free version “Assemble customer
service Downloader.exe”.
3) When the phone is powered off, press its Volume + key and plug USB cable to computer
at the same time, and release when the screen displays “Communicating„Boot status
and version No.”. Click Start to download upgrade when the upgrade platform has
detected Online device.
Driver installation：
1) When the driver is installed, the phone is needed to be powered on.
2) Enable USB debug mode: Setting menu Select Application Select
Development Click and confirm Allow USB debug.
1) Connect phone to computer (Click No need to open USB memory device at USB large
memory dialogue). When the computer finds uninstalled new hardware, click Select from list or
designated location to install (Advanced), and select directory file of driver path (generally, it
locates in PC Driver directory) in Search includes this location, and then finish the installation
based on the instructions on computer. It needs to perform five-time installation for hardware
update wizard, as the following figure shows (installed device driver in device manager):
2)

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Detailed steps of upgrade

1) To run installation-free platform tool ；
2) When the phone is powered off, press its Volume + key and plug USB cable to computer
at the same time, and release when the screen displays “Communicating„Boot status
and version No.”. It indicates is working under upgrade module and communication
can be downloaded, when the upgrade platform has detected Online device.
Note: if the device cannot be Online with the platform in the course of upgrading,
the solution is to turn off the platform and turn it on again and get COM port set
well.
3) When the platform has detected being Online with device, click Start to enable
download upgrade.
Download the driver that APP
needs. If it prompts Apps failed to
search device at tool status bar, please
check if adb driver is normal and USB
debug is enabled.
Get port set

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4) When Integrated test is displayed in the tool status bar, it indicates the upgrade
of PAP4000 is done, please plug off its data cable for the next device.
Click Start to
enable
upgrade
Integrated test
is displayed,
which means its
upgrade is
done.

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5) Copy GPS map package/pre-installed resource package/install pack:
7260+ GPS map package is external; please copy it to memory card to use.
Copy COOLMAP package (decompressed) to memory card directory.
5.1.7260+ pre-installed resource package, presetapp-7260+.zip, (do not need to
be decompressed), copy it to COOLPAD directory located in memory card.
Note: the pre-installed resource package, presetapp-7260+.zip, included in
the new released software version may be different from that of the form one,
please re-copy the pre-installed resource package to its corresponding
directory in the memory card after the upgrade is done.
Precautions
1) If the device cannot be Online with the platform in the course of upgrading, the
solution is to turn off the platform and turn it on again (but the premise are the
following two points, a. the driver of USB port is installed well; b. the phone
is switched to upgrade mode successfully);
2) The default configuration of upgrade platform is not to perform Delete all, and
using QPST to backup NV parameters before performing upgrade is advised.
4. Guides of disassembling and assembling
4.1. Tools of disassembling and assembling
Device, instruments, jigs and tools
NO Name of product Specification Quantity
1 tweezers 1
2 screwdriver Cross shape 1
3 anti-electrostatic wrist
strap/anti-electrostatic glove 1
4 Disassemble plate 1
5 Knife 1
4.2. Steps of disassembling and assembling
4.2.1. Disassembling screws of the back shell
There are eight screws (cross shape) in 7260+ back shell, shown as the following figure:

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4.2.2. Separate the back shell
Use Disassemble plate to separate alongside with the seam.

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4.2.3. Separate the front shell
a. Disassembling tow screws and taking off the RF connection line;
b. Open TW/LCD/small board connector;

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4.2.4. Disassembling main board set

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4.2.5. Disassembling the set of the side shell
Disassemble FPCBA set
Open the connector
and turn over to the
back of the main
board.
Take off the RF
coaxial line
Open the connector and
take out the camera
use the tweezers or other
sharp objects to take off
positioning pillars.

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Before disassembling FPCBA set, it needs to
tear off the label on the bottom
Open the connector, take
out FPC and take out the
small board

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Note: the front shell of 7260+ adopts the new adhesive art, so they cannot be disassembled
respectively, and the solution is to exchange them as an entirety.
Disassemble alongside with
the seam with the tweezers or
other tools and take out
FPCBA set

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5. Maintenance technologies
5.1. Solutions to frequent failures
5.1.1. The name and location of main board

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5.1.2. Hardware system framework
Antenna
switch
GSM900/18
00/1900M
PA
Attenuator
RTR6285A
GSM900
GSM1800
GSM1900 MN
MN
MN
GSM PA control
MSM7227A
SAW LNA SAW
GPS
antenna
SSBI_2
VPH
VPH
PM8029
From 8029
Antenna switch controlling signal
Battery
EBI2
EBI1 DDR
NAND
IO
VCHG
Periphery
control
circuit of
charging
Charging control
SDIO1
SD
card
SIM1
I2C
VBAT
VPH
USB_D+
USB_D-
TO and from
MSM7227A
Motor
VPH
CAMERA BUS
BCM4330
HPH_L
EAR10_M
EAR10_P Receiver
SBI
Keyboard
backlight VPH
VREG_S3
WCDMA
850M PA WCDMA PA control
WCDMA
2100M PA
VPH
WCDMA PA control
Duplexer
Duplexer
WCDMA850
Attenuator
Attenuator
WCDMA2100
Key
TW
LCD
MIC1
EAR_MIC
Brightness and
proximity sensor
Earphone
Loudspeaker
320W
CAMERA
SIM2
VREG_L12
RF switch
SDIO
RF
RF
+1V8_VREG_S3
VPH
UART
PCM
VREG_L13
I2C
Accelerometer
From
PM8029
EAR10_M
EAR10_M
EAR10_M
EAR10_M
HPH_R
LINE_O_RM
LINE_O_LP
5.1.3. Basic principles and analyses and maintenance of frequent failures

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（A）Functional failures
A．The failure of powering on
There are lots of reasons to cause the device cannot power on or suffers from
powering-on failures such as insufficient battery, battery connector being disconnected or
welded poorly, broken component on system main board and malfunctioned structure.
When the battery is low or the battery is broken, its voltage should be measured first.
If it voltage is lower than 3.6V, the battery needs to be charged by a charger; if the battery
cannot be charged, then it needs to be exchanged for a new one.
When J2001, the battery connector, is broken or bad welded, it is another reason to
cause the device cannot be powered on. If this failure still exists after installing a new
battery, J2001 is needed to be verified if it is broken or bad welded, if it is or has worse
case, it needs to be re-welded.
If the reason is none of the above cases, the polarity voltages (namely, pin 3 and pin 1)
of J2001, the connector, should be measured by using a multi-meter directly, verifying if
they are shot circuited, if it is shot circuited, it means there is broken component and then
it needs to locate the broken component and replace it; if it is not short circuited, it needs
to verify if there is current response on pressing the Power key, if there is current
response, and the current is lower than 40mA, it needs low format upgrade again; if the
current is over 90mA, it needs to perform exchanging tests for the LCD module, if the
device can be powered on, it represents the LCD module is broken and it must be
exchanged; if it is not current response, then it needs to check the powering-on circuit, the
powering-on key is SW2000, therefore it needs to verify if SW2000, the keyboard
connector, is broken or welded poorly.

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B. Failures of receiving voice and ringtones
The audio system framework of 7260+ is as follows:
MSM7227A
BCM4330
PM8029
BT Antenna
SPEAKER
UART1
T card
EAR1_O/P LINE_ON/OP
PCM
RECEIVER
SDC1
EBI2 NAND
RTR6285A(
WCDMA/GSM
)
RF
multi-
channel
switch BT
earph
one
MAIN
MIC
EAR
MIC
Earphone
The audio system of 7260+ takes MSM7227A as its center with other functionalities such as PM8029
(built-in loudspeaker, earphone PA and echo canceling), power management chip, BCM4330, BT chip
which realizes WG communication hand-hold, hand-free, BT and earphone calls. Additionally, 7260+
supports the handhold mode to constrain the noise of calls in order to constrain the surrounding noise and
improve user’s call quality under the noise surroundings.
As for problems of audio, the problems of MIC, RECEIVER and SPEAKER can be confirmed by the
relevant test programs in the Net monitor. If it verifies there are failures, it needs to verify if there are poor
welded or connected components. For instance, it needs to verify if MIC is welded badly, RECEIVER or
SPEAKER is assembled correctly. If all the components are verified to be fine, then it needs to exchange
them all to perform exchanging tests to verify if they are not malfunctioned. If the exchanging tests are
proved to be OK, then the corresponding broken component needs to be exchanged, however, if the
problems still exist after perform exchanging tests, it needs to verify if the relevant circuits are normal.
As for the failure that MIC fails to deliver sounds, it needs to verify if its working circuit is normal.
For instance, if the level of MIC_BIAS, MIC bias power supply, is at 1.8V, the normal voltage, and if MIC
outputs signal when speaks to it.