Protech Be-u830 series User manual

USER

MANUAL

BE-U830

EPIC CPU Board with Intel®

Elkhart Lake AtomTM / Pentium®/

Celeron®SoC CPU Processor

BE-U830 M1

BE-U830

EPIC CPU Board with Intel®Elkhart Lake

Atom™/ Pentium®/ Celeron®SoC CPU

All trademarks and registered trademarks mentioned herein are the

property of their respective owners.

This manual is copyrighted in Sep.2022. You may not reproduce or

transmit in any form or by any means, electronic, or mechanical,

including photocopying and recording.

DISCLAIMER

This user’smanual is meant to assist users in installing and setting up

the system. The information contained in this document is subject to

change without any notice.

CE NOTICE

This is a class A product. In a domestic environment this product may

cause radio interference in which case the user may be required totake

adequate measures.

FCC NOTICE

This equipment has been tested and found to comply with the limits for

a Class A digital device, pursuant to part 15 of the FCC Rules. These

limits are designed to provide reasonable protection against harmful

interference when the equipment is operated in a commercial

environment. This equipment generates, uses, and can radiate radio

frequency energy and, if not installed and used in accordance with the

instruction manual, may cause harmful interference to radio

communications. Operation of this equipment in a residential area is

likely to cause harmful interference in which case the user will be

required to correct the interference at his own expense.

You are cautioned that any change or modifications to the equipment

not expressly approve by the party responsible for compliance could

void your authority to operate such equipment.

CAUTION: Danger of explosion may occur when the battery

is incorrectly replaced. Replace the battery

only with the

same or equivalent typ

e recommended by the manufacturer.

Dispose of used batteries according to the manufacturer’s

instructions.

CAUTION:

Always touch the board components by the

edges. Never touch components such as a processor by its

pins. Take special cares while you are

holding electronic

circuit boards by the edges only. Do not touch BE-U830

components.

WARNING: Some internal parts of BE-U830 may have high

electrical voltage. We strongly recommend that only qualified

engineers are allowed to service and disassemble the

system. If any damages should occur on BE-U830 and are

caused by unauthorized servicing, it will not be covered by

the product warranty.

Contents

1Introduction ......................................................................................... 1-1

1.1 About This Manual .................................................................... 1-2

2Getting Started .................................................................................... 2-1

2.1 Package List.............................................................................. 2-2

2.2 BE-U830 Specifications............................................................. 2-3

2.3 Safety Precautions .................................................................... 2-6

3Hardware Configuration ..................................................................... 3-1

3.1 Jumper & Connector Quick Reference Table............................ 3-2

3.2 Component Locations ............................................................... 3-3

3.2.1 BE-U830 Top View ............................................................ 3-3

3.2.2 BE-U830 Jumper Setting................................................... 3-4

3.2.3 BE-U830 Bottom View..................................................... 3-11

3.2.4 BE-U830 I/O View ........................................................... 3-12

3.3 HOW TO SET JUMPERS ....................................................... 3-13

3.4 I/O Ports .................................................................................. 3-15

3.4.1 DC In 2 Pins Terminal Block (PWR_IN1) ........................ 3-15

3.4.2 Dual LAN Ports (LAN1, LAN2) ........................................3-16

3.4.3 3 x 1 USB 2.0 Ports (USB2) ............................................3-17

3.4.4 Dual USB 3.0 Ports (USB1) ............................................ 3-18

3.4.5 Display Port (DP) Port Connector (JDP_HDMI1)............ 3-19

3.4.6 HDMI Connector (JDP_HDMI1) ...................................... 3-20

3.5 SETTING CONNECTORS AND JUMPERS ...........................3-21

3.5.1 COM1 and COM2 Connector (JCOM1, JCOM2) ............3-21

3.5.2 2 x Internal USB 2.0 Pin Headers (JUSB1)......................3-22

3.5.4Digital Input / Output Connectors (JDIO1, JDIO2) ..........3-23

3.5.5HD Audio Connector (JAUDIO1) ..................................... 3-24

3.5.6Power Input Connector (PWR2)......................................3-25

3.5.7Mini PCI Express Slot (M_PCIE1)................................... 3-26

3.5.8Micro SIM Card Socket (SIM1)........................................ 3-27

3.5.9LVDS Inverter Connector (JINV1) ................................... 3-28

3.5.10 LVDS Connector (LVDS1) ............................................... 3-29

3.5.11M.2 Wi-FiExpress Slot (M2_E1) (option).........................3-30

3.5.12M.2 SSD Express Slot (M2_M1) ..................................... 3-32

3.5.13SATA 3.0 & HDD Power Connectors (SATA1, JHD_PWR1)

......................................................................................... 3-34

3.5.14RTC Connector (JBAT1).................................................. 3-35

3.5.15Power LED Connector (JLED1) ......................................3-35

3.5.16Power Button Connector (JBTN1)...................................3-35

3.5.17COM1 Port Voltage Selection (JP_COM1)...................... 3-36

3.5.18USB1 Port Power Selection (JP_USB1) ......................... 3-37

3.5.19LVDS Voltage Selection (JP_VDD1) ............................... 3-38

3.5.20 Low Pin Count Selection (JP_LPC1)...............................3-39

3.5.21LVDS Sequence Selection (JP1)..................................... 3-40

3.5.22LVDS Backlight Control Selection (JP7).......................... 3-41

3.5.23Clear CMOS Data Selection (JCOMS1)..........................3-42

4Software Utilities ................................................................................. 4-1

4.1 Introduction................................................................................ 4-2

4.2 Installing Intel®Chipset Software Installation Utility .................. 4-3

4.3 Installing Graphics Driver Utility ................................................ 4-4

4.4 Installing LAN Driver Utility........................................................ 4-5

4.5 Installing Sound Driver Utility .................................................... 4-6

3.5.3Internal USB 2.0 Wafers (JUSB2)....................................3-22

iii

4.6 Installing Intel®Management Engine Components Driver Installer

.................................................................................................. 4-7

5BIOS SETUP ........................................................................................ 5-1

5.1 Introduction................................................................................ 5-2

5.2 Accessing Setup Utility.............................................................. 5-3

5.3 Main........................................................................................... 5-6

5.4 Advanced .................................................................................. 5-8

5.4.1 Advanced – CPU Configuration ........................................ 5-9

5.4.2 Advanced – PCH-FW Configuration................................ 5-10

5.4.3 Advanced – ACPI Settings .............................................. 5-11

5.4.4 Advanced – F81967 Super IO Configuration .................. 5-12

F81967 Super IO Configuration – Serial Port 1 Configuration .... 5-13

F81967 Super IO Configuration – Serial Port 2 Configuration .... 5-14

5.4.5 Advanced – Hardware Monitor........................................ 5-15

5.4.6 Advanced – F81967 Watchdog .......................................5-16

5.4.7 Advanced – S5 RTC Wake Settings................................5-17

5.4.8 Advanced – PTN3460 EDID Configuration ..................... 5-18

5.4.9 Advanced – USB Configuration....................................... 5-19

5.4.10 Advanced – Network Stack Configuration .......................5-20

5.4.11 Advanced – NVMe Configuration .................................... 5-21

5.5 Chipset .................................................................................... 5-22

5.5.1 Chipset – System Agent (SA) Configuration ...................5-23

System Agent (SA) Configuration – Memory Configuration ........5-24

5.5.2 Chipset – PCH-IO Configuratioin .................................... 5-26

PCH-IO Configuration – PCI Express Configuration................... 5-27