DFI BT700 User manual

www.dfi.comChapter 1 Introduction
1
BT700
Qseven Board
User’s Manual
A31430532

www.dfi.comChapter 1 Introduction
2
Copyright
This publication contains information that is protected by copyright. No part of it may be re-
produced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2015. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
Qseven Specification Reference
http://www.qseven-standard.org/
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compli-
ance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

www.dfi.comChapter 1 Introduction
3
Table of Contents
Copyright.............................................................................................................2
Trademarks........................................................................................................2
FCC and DOC Statement on Class B.....................................................2
About this Manual..........................................................................................4
Warranty ............................................................................................................4
Static Electricity Precautions......................................................................4
Safety Measures..............................................................................................4
About the Package.........................................................................................5
Chapter 1 - Introduction.............................................................................6
Specifications ................................................................................................6
Features..........................................................................................................7
Chapter 2 - Hardware Installation................................................8
Board Layout.................................................................................................8
Block Diagram...............................................................................................8
Mechanical Diagram....................................................................................9
System Memory..........................................................................................10
Cooling Option............................................................................................10
MXM Connector..........................................................................................11
MXM Connector Signal Description....................................................... 13
Installing BT700 onto a Carrier Board................................................. 18
Chapter 3 - BIOS Setup............................................................... 19
Overview .....................................................................................................19
AMI BIOS Setup Utility.............................................................................20
Main ..........................................................................................................20
Advanced...................................................................................................20
Chipset ......................................................................................................27
Security......................................................................................................32
Boot...........................................................................................................32
Save & Exit................................................................................................33
Updating the BIOS....................................................................................33
Notice: BIOS SPI ROM.............................................................................34
Chapter 4 - Supported Software ..........................................................35
Appendix A - System Error Message...................................................50
Appendix B - Troubleshooting................................................................51

www.dfi.comChapter 1 Introduction
4
About this Manual
An electronic file of this manual is included in the CD. To view the user’s manual in the CD, in-
sert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click
“User’s Manual” on the main menu.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product, in-
ability to use the product, unauthorized replacement or alteration of components and prod-
uct specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper instal-
lation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to the
product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con-
nectors by their ends.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servic-
ing. After installation or servicing, cover the system chassis before plugging the power
cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other com-
ponents. Perform the upgrade instruction procedures described at an ESD worksta-
tion only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chas-
sis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.

www.dfi.comChapter 1 Introduction
5
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One BT700 board
• One DVD
• One QR (Quick Reference)
• One Heat sink
Optional Items
• Q7X-151 carrier board kit
• Heat spreader
• Heat spreader with heat sink
• bracket
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.

www.dfi.comChapter 1 Introduction
6
Expansion
Interfaces • Supports 1 USB 3.0 port and 1 USB HSIC for 2 USB 2.0 (default); or
4 USB 2.0 ports* (BOM option)
• Supports 4 USB 2.0 ports
• Supports 3 PCIe x1 (default); or 1 PCIe x4 (PCIe port 3, by default, is shared
with the onboard LAN)*
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Suppotrs 1 UART interface (TX/RX/CTS/RTS)
Damage Free
Intelligence • Monitors CPU temperature
• Monitors system fan speed
• Monitors Vcore/VGFX/VSM voltages
• Watchdog timer function
BIOS • AMI BIOS
- 64Mbit SPI BIOS
Power • Input: VCC_RTC, 5V standby, 5V
Power
Consumption • BT700-T44-E45: 12.72W with E3845 at 1.91GHz and 4GB DDR3L memory
down
OS Support • Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 8.1 Enterprise x86 (32-bit)
• Windows 8.1 Enterprise x64 (64-bit)
Temperature • Operating
: 0oC to 60oC - Atom (Fanless)
: -20oC to 70oC - Atom (Fanless with air flow)
: -40oC to 85oC - Atom (Fanless with air flow)
• Storage: -40oC to 85oC
Humidity • 5% to 90%
PCB • Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 2.0
Chapter 1 - Introduction
Specifications
Processor • Intel®AtomTM processors
- E45: Intel®AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
- E26: Intel®AtomTM E3826, Dual Core, 1M Cache, 1.46GHz, 7W
- E15: Intel®AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
• BGA 1170 packaging technology
• 22nm process technology
System Memory • 2GB/4GB DDR3L memory down
• Supports DDR3L 1333MHz (-E45)
Supports DDR3L 1066MHz (-E26/-E15)
• Supports single channel memory interface
Graphics • Intel®HD Graphics
• Supports LVDS and DDI interfaces
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @60Hz
• Digital Display Interfaces: HDMI, DVI and DP
• HDMI, DVI: resolution up to 1920x1080 @60Hz
• DP: resolution up to 2560x1600 @60Hz
• Supports hardware acceleration for DirectX 11, OCL 1.2, OGL 4.0, H.264,
MPEG2, MVC, VC-1, WMV9 and VP8 (supported version dependent on OS)
Audio • Supports High Definition Audio interface
LAN • Intel®I210AT/IT Gigabit Ethernet Controller
- Intel®I210IT supports wide temperature (-40oC to 85oC)
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Serial ATA • Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
eMMC*
(optional) • Supports 4GB, 8GB, 16GB and 32GB eMMC onboard
• Supports Windows 8.1 only
SD Interface • Supports 1 SD interface
• Supports SDIO specification Ver. 3.0, HC Standard specification Ver. 3.0,
physical layer specification Ver. 3.0, security specification Ver. 1.01
Trusted
Platform
Module - TPM*
(optional)
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Watchdog
Timer • Watchdog timeout programmable via software from 1 to 255 seconds
Chapter 1
Note:
*Optional and is not supported in standard model. Please contact your sales represen-
tative for more information.

www.dfi.comChapter 1 Introduction
7
Features
• DDR3L
DDR3L is a higher performance DDR3 SDRAM interface providing less voltage and higher
speed successor. DDR3L supporting 1066MHz (-E26/-E15) or 1333MHz (-E45) delivers increased
system bandwidth and improved performance to provide its higher bandwidth and its increase
in performance at a lower power than DDR3 and DDR2.
• Graphics
The integrated Intel®HD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with out-
standing graphics responsiveness. These enhancements deliver the performance and compat-
ibility needed for today’s and tomorrow’s business applications. Supports HDMI, DVI and DP
interfaces for display outputs.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 2.0a specification. With speed of
up to 3Gb/s (SATA 2.0), it improves hard drive performance faster than the standard parallel
ATA whose data transfer rate is 100MB/s.
• Gigabit LAN
The Intel®I210AT/IT Gigabit Ethernet Controller supports up to 1Gbps data transmission.
• Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
Chapter 1
Specification Comparison Table
The table below shows the Qseven standard specifications and the corresponding specifications
supported on the BT700 module.
System I/O Interface ARM/RISC Based
Minimum Configuration X86 Based Minimum Configuration Maximum Configuration DFI BT700 Configuration
PCI Express Lanes 0 1 (x1 link) 4 3+1(shared with
Ethernet
)
Serial ATA channel
s
0022
USB 2.0 ports 3 4 8 6+2(shared with 1 USB 3.0 port) - BOM
option
USB 3.0
p
orts 0 0 2 1
LVDS channel
s
embedded Dis
p
la
y
Por
t
0 0 Dual Channel 24bits Dual Channel 24bits
Dis
p
la
y
Port
,
TMDS 0 0 1 1
Hi
g
h Definition
A
udio
/
AC'97
/
I2
S
0011
Ethernet 10/100
Mbit
/
Gi
g
abit 0 0 1 (Gigabit Ethernet) 1
UART 0 0 1 1
Low Pin Count bus 0 0 1 1
Secure Di
g
ital I/O 8-bi
t
for SD
/
MMC cards 0011
S
y
stem Mana
g
emen
t
0111
I2C Bus 1111
SPI Bus 0 0 1 1
CAN Bus 0 0 1 0
Watchdo
g
Tri
gg
er 1 1 1 1
Power Button 1 1 1 1
Power Good 1 1 1 1
Reset Button 1 1 1 1
LID Button 0 0 1 1
Slee
p
Button 0 0 1 1
Suspend To RAM (S3
mode
)
0011
Wake 0 0 1 1
Batter
y
low alarm 0 0 1 1
Thermal control 0 0 1 1
FAN control 0 0 1 1

www.dfi.comChapter 2 Hardware Installation
8
Chapter 2
Chapter 2 - Hardware Installation
Board Layout
Top View
Bottom View
Block Diagram
PCIe x1
2GB/4GB DDR3L
memory down
Atom E3800
Series
AMXM Golden Finger
HDA
LPC
PCIe x1 3x
SM Bus
SD
UART
I2C Bus
HDA
LPC
LPC
SM Bus
PCI
e
x1
3x
PCI
ex
1
3x
SM
Bus
SM
Bus
SD
2
UART
I
C
Bus
GbE
SPI Flash
64Mbit
eMMC
Switch
SATA 2.0 2x
GLAN
I210
PCIe x1 (Opt.)
USB 2.0 4x
USB
2.0
4x
eDP
LVDS PTN3460
USB
HSIC
USB
HSIC
USB 3.0 1x
USB 2.0 2x
USB 2.0 2x
(Opt. share with USB 3.0)
DDI
DDI
eMMC
(optional)
USB
3.0
1x
DDR3 1333MHz
Single Channel
DDR3L
DDR3L
DDR3L DDR3L
SPI Flash BIOS
E3800 Series
Intel Atom NXP
PTN3460
IDT
P9145
DDR3L
DDR3L
DDR3L
DDR3L
Intel
WGI210AT
SMSC
USB4604

www.dfi.comChapter 2 Hardware Installation
9
Chapter 2
Mechanical Diagram
BT700 Module with thermal solution
Side View of the Module with thermal solution and Carrier Board
BT700 Module
20.00
70.00
1.20
6.00 14.00
64.90
20.00
Module PCB
Heatsink
Bottom Vie
w
Top View
0.00
0.00
56.50
64.90
70.00
3.95
2.99 11.52 66.05 66.99
70.00
56.50
0.00
0.00
11.53

www.dfi.comChapter 2 Hardware Installation
10
Chapter 2
System Memory
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other com-
ponents. Perform the upgrade instruction procedures described at an ESD worksta-
tion only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chas-
sis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.
Cooling Option
Heat Spreader with Heat Sink
• “1” and “2“ denote the locations of the
thermal pads designed to contact the
corresponding components that are on
BT700.
• Remove the plastic covering from the
thermal pads prior to mounting the heat
sink onto BT700.
Top View of the Heat Sink
Bottom View of the Heat Sink
1
2
The system board is equipped with eight 2GB/4GB DDR3L onboard memory inerfaces.
• Supports DDR3L 1333MHz (-E45/-E27/-J00/-N30/-N07)
Supports DDR3L 1066MHz (-E26/-E25/-E15)
• Supports single channel memory interface
DDR3L
DDR3L
Top View
Bottom View