Qiyang GF-RK3399-Kit User manual
GF-RK3399-Kit Embedded Development Board
Hardware Manual
Ver.:2.0
2021.08
Zhejiang Qiyang Intelligent Technology Co., Ltd
Copyright Reserved
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Version Records
Version
Hardware
Description
Date
Reviser
1.0
GF-RK3399-MB-V1_00
Internal released
2020-04
wangwx
2.0
GF-RK3399-MB-V2_01
Updated picture
2021-08
wwx
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Catalogue
Notice: This manual introduces the hardware interface of the development board................................................... 4
I. Preface.................................................................................................................................................................... 4
1.1.Company Profile.......................................................................................................................................... 4
1.2.Suggestion for Using GF-RK3399-KIT development board....................................................................... 5
Ⅱ. Product Introduction......................................................................................................................................... 5
2.1.Chipset Introduction .................................................................................................................................... 5
2.2.Board Resources:......................................................................................................................................... 8
2.3.Core Board Resources ................................................................................................................................. 9
III.Base Board Interface Functions.......................................................................................................................11
3.1.Interface function’s Introduction ............................................................................................................... 13
3.2.Pin Definition ............................................................................................................................................ 15
IV.Size & Structure................................................................................................................................................ 33
4.1.Core Board Size......................................................................................................................................... 33
4.2.Base Board Size......................................................................................................................................... 34
V.Connector Picture............................................................................................................................................... 35
VII.Software Description...................................................................................................................................... 37
VIII.Remark........................................................................................................................................................... 37
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Notice: This manual introduces the hardware interface of the development board.
I. Preface
1.1.Company Profile
Zhejiang Qiyang Intelligent Technology Co., Ltd., established in 2007, which locates in Hangzhou,
Zhejiang, PRC. It is a high-end technological enterprise that specializes in exploitation, fabrication,
and selling embedded computer mainboards. With 10 years of experiences, Qiyang has established
the completed service chain from the design concept to mass production successfully.
The R&D team is organized by 30 more technical engineers. Qiyang focus on providing functional
embedded hardware, software tool and customization solutions. It has been applied to Industrial
Control, Internet of Things, New Retail, Smart Medical, Electricity Device, Environmental
Surveillance, Charging Pile etc.
With the growth of the business, Qiyang has set up a SMT factory in Zhuji, Zhejiang province,
which is 5000 ㎡, with a 2xSMT production lines. The SMT factory performs the ISO9001 Quality
Management System strictly. Relying on the solid production ability, the SMT factory’s annual
capacity is about a million sets, which totally guarantee the delivery date.
Qiyang has a thorough sales marketing network, professional sales, and after-sales team to provide
full technical support and service. The business has spread over 120 countries and areas, it helps the
clients to introduce the products into the market efficiently and successfully. The combination and
extension of research and development, production capacity, and market, that provide a solid
foundation for Qiyang to provide specialized, globalized embedded hardware and software.
We offer:
l. Software/Hardware Mainboard
Based on the CPU solution from NXP, Rockchip, MTK, Renesas, TI, Atmel, Cirrus Logic, etc.
Qiyang provides the ARM development kit/system on module/industrial board and periphery
products, paired tools and software for the user do further exploitation.
2. Customization Service
Fully taking the advantage of the technical accumulation on the ARM platform and Linux, Android,
Ubuntu OS. Qiyang provides the efficient OEM/ODM service to the users.
Sincerely thanks for using Qiyang’s product, we will try our best to offer you the technical
supports!
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1.2.Suggestion for Using GF-RK3399-KIT development board
1. Please read the instructions firstly, before using the development board.
2. Before using, please check the packing list and see whether there is a missing file in the CD.
3. Please understand the basic structure and composition of GF-RK3399-KIT development
board, including the hardware resource allocation, etc.
4. If you need to develop on Android system and burn program into the development board, in
addition to this document, we also suggest reading another document GF-RK3399-KIT Android
User Manual.
5. GF-RK3399-KIT development board supports batch order.
Ⅱ. Product Introduction
2.1.Chipset Introduction
GF-RK3399-KIT Development board, it is launched by Zhejiang Qiyang Intelligent
Technology Co., Ltd, it is based on the Rockchip RK3399 processor.
It adopts Big.Little architecture: Dual Cortex-A72 + Quad Cortex-A53, 64-bit CPU, the
frequency is 1.8GHz.
It integrates power management unit, onboard with 2GB 64bit LPDDR4, 8G EMMC/16G
EMMC.
It integrates Mali-T860 GPU, and it supports OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL,
DX11, and AFBC.
It owns dual MIPI-CSI and dual ISP, HDMI, EDP, PCIe, USB3.0, USB2.0, Type-C, etc.
It supports 4K VP9 and 4K 10bits H265/H264 video decoding, it reaches up to 60fps, USB3.0.
It supports various network port: Gigabit LAN, WIFI, Bluetooth, etc.
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◆Big.Little architecture: Dual Cortex-A72 + Quad Cortex-A53, 64-bit CPU, with 1.8Ghz
◆Support Mali-T8640GPU, and OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11, and
AFBC
◆Dual channel DDR3-1866/DDR3L-1866/LPDDR3-1866/LPDDR4, supports eMMC5.1, SDIO3.0
◆Support 4K VP9 and 4K 10bits H265/H264 video decoding, 60fps,1080P multi-format video
decoding (VC-1,MPEG-1/2/4, VP8), 1080P video encoding, it supports H.264, VP8, video
processor: De-crisscrossing, de-noising, edge/detail/color optimization
◆Dual VOP: The resolution supports 4096X2160 and 2560X1600, support dual channel MIPI-DSI
(Each channel 4-wire)
◆Display: eDP 1.3 (4-wire, 10.8Gbps), HDMI 2.0a supports 4K 60Hz, HDCP 1.4/2.2
◆Support Display Port 1.2 (4-wire, highest 4K 60Hz), support Rec.2020 and Rec.709 color gamut
switching
◆Dual ISP resolution reaches up to 13MPix/s, it supports dual camera signal input
◆Support dual USB3.0 Type-C, PCIe 2.1 (4 full-duplex lanes);
◆In-built low consumption MCU
◆Support 8-ch digital microphone array input
◆Package: FCBGA828 21mmx21mm, 0.65mm pitch
◆Operation system: support Android 7.1 OS
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2.2.Board Resources:
Hardware resources
CPU Model
No.
Rockchip RK3399 (28nm HKMG processing)
CPU
ARM Hexa-core 64 bit processor, up to 1.8GHz
Based on the big.LITTLE architecture, Dual Core Cortex-A72(Big Core)+Quad
Core Cortex-A53(Little Core)
GPU
ARM Mali-T860 MP4 Quad Core GPU
Support OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11
SupportAFBC (ARM Frame Buffer Compression)
VPU
Support 4K VP9 and 4K 10bits H265/H264 video decoding, with 60fps
1080P multiformat video decoding (WMV, MPEG-1/2/4, VP8)
1080P video decoding, support H.264, VP8 format
Video anaphase processor: Anti-interlacing, denoising, edge/detail/color
optimization
RAM
2GB LPDDR4 (64-bit Data Bus LPDDR4) (2GB/4GB optional)
Flash
8GB eMMC, EMMC5.1 (8GB/16GB/32GB optional)
PMU
RK808 Power Management Unit
Ethernet
1-ch 10M/100M/1000Mbps Ethernet (RGMII mode)
1-ch 10M/100M/1000Mbps Ethernet (PCIe extend)
WiFi
Onboard WiFi & Bluetooth 2-in-1 module, supports 2.4GHz/5GHz dual-band
WiFi, 802.11 a/b/g/n/ac protocol, Bluetooth supports BT4.0 (supports BLE)
4G
MINI-PCIE interface (USB2.0 communication), external 4G LTE module,
onboard SIM card slot
Display
Support HDMI 2.0a, supports 4K 60Hz, HDCP 1.4/2.2
Support dual-channel MIPI-DSI display interface (4 lines per channel), one of
which is a hardware expansion dual-channel LVDS display interface
Support eDP 1.3 (4-wire, 108Gbps)
Camera
Support MIPI camera interface
USB
1-ch USB3.0 HOST
1-ch USB Type-C
4-ch USB 2.0 HOST
UART
1-ch RS232 DEBUG
5-ch RS232 UART(3 wires)
1-ch UART-TTL (TTL level)
1-ch RS485
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Voice
2-ch Speaker out
1-ch earphone output
1-ch MIC input
Storage
1-ch TF card
Expansion
1-ch I2C interface, 8-ch GPIO interface
Others
Reset, Watch Dog, RTC
Power Supply
+12V power input
Software Resources
Development
Tools
Development environment: virtual machine VM9.02+Ubuntu 14.04 or Ubuntu
16.04 system
Application layer development and debugging tools
Cross compiler
Common terminal development and debugging tools
System Image
Image file corresponding to the operating system
Test Program
Interface application demo test program and test program source code
Source Code
Bootloader, kernel, file system source code
Manuals
Hardware manual, test manual, device manual,
Mechanical
Chart
Base Board structural drawing (DXF file)
Electrical Specification
Layer/Size
Core Board size: 82mm*63mm, 8-layer board high-precision immersion gold
process
Base Board size: 158mm*120mm, 4-layer board high-precision immersion gold
process
Power
Consumption
Power consumption ≤5W (Whole Board, no load power consumption)
Operation
Temperature
0℃~ +60℃
Storage
Temperature
0℃~ +60℃
Working
Humidity
5% to 95%, non-condensing
Core Board
Configuration
2GB DDR/8GB EMMC (Std.)
4GB DDR/16GB EMMC (Opt.)
2.3.Core Board Resources
GF-RK3399-CM core board adopts 8-layer PCB board high-precision immersion gold process, high
TG board, with reliable electrical performance and anti-interference performance. It has integrated
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CPU, LPDDR4, eMMC, power management chip, etc. It adopts Gold Finger (317Pins) Interface
leads to function pins, which fully expanded the hardware resources of RK3399. And different
interface functions can be multiplexed and combined according to the pin conditions to make a
backplane that meets the requirements.
Picture 2
◆Onboard Rockchip RK3399 processor;
◆Onboard 2GB LPDDR4, 8GB EMMC (Std);
◆The Core Board adopts 8-layer PCB with high-precision gold immersion process;
◆Core Board size: 82mm*63mm, suits for various embedded occasions;
◆Core Board Gold Finger Connector: 317 Pins lead out the core board resources;
◆Using 5V power supply, onboard power management chip. Core board power consumption is less
than 2W;
◆Support Android7.1;
For the Pin definition of the Core Board, please refer to the Base Board interface function section.
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3.1.Interface function’s Introduction
No
Functions
J32
DC12V power input
J36
Gigabit Ethernet
J37
Gigabit Ethernet
J17
USB3.0 HOST
J16
Type-C
J18
HDMI
J26
TF Card Slot
J28
Earphone
J23
eDP display
J24
MIPI display
J19
3.3V/5.0V jumper
J22
LCD backlight
J21
I2C interface (capacitive touch screen)
J20
LVDS
J29
2-ch Speaker output
J27
MIC input
J30
WiFi-IPEx antenna
J31
8-ch GPIO
J15
USB2.0 HOST
J12
USB2.0 HOST
J4
RS232 port(COM3)
J2
RS232 port(COM1)
J5
RS232 port(COM4)
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J3
RS232 port(COM2)
J14
USB2.0 HOST
J13
USB2.0 HOST
J6
RS232 port(COM5)
J7
RS232 port(DEBUG)
J8
UART-TTL
J1
RS485
J35
DC12V power input
BT1
RTC battery(+3.0V), locate beneath the Core Board
U22
WIFI module, locate beneath the Core Board
J25
Camera, locate at the back side of Base Board
S1
SIM card slot, locate at the back side of Carrier Board
J11
MINI-PCIE
SW1
Reset Button
SW2
PWR Button
SW4
System Programming button
BZ1
Buzzer
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3.2.Pin Definition
J34- Pin Definition : MXM Connector
J34A
Pin #
Signal name
Description
IO
E1-1
VCC_SYS_5V0
5V power input (required)
E1-2
VCC_SYS_5V0
E1-3
VCC_SYS_5V0
E1-4
VCC_SYS_5V0
E1-5
VCC_SYS_5V0
E1-6
VCC_SYS_5V0
E1-7
VCC_SYS_5V0
E1-8
VCC_SYS_5V0
E1-9
VCC_SYS_5V0
E3-2
GND
E3-3
MAC_CLK
GPIO3_B3
E3-4
GPIO3_B7_u
E3-5
GPIO0_A1_u
E3-6
MAC_MDIO
GPIO3_B5
E3-7
MAC_MDC
GPIO3_B0
E3-8
GPIO3_B2_u
E3-9
GND
E3-10
MAC_TXEN
GPIO3_B4
1
MAC_TXD3
GPIO3_A1
3
MAC_TXD2
GPIO3_A0
5
MAC_TXD1
GPIO3_A5
7
MAC_TXD0
GPIO3_A4
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9
MAC_TXCLK
Ethernet signal
GPIO3_C1
11
GND
13
MAC_RXDV
GPIO3_B1
15
MAC_RXD0
GPIO3_A6
17
MAC_RXD1
GPIO3_A7
19
MAC_RXD2
GPIO3_A2
21
MAC_RXD3
GPIO3_A3
23
MAC_RXCLK
GPIO3_B6
25
GND
27
GPIO2_B4_u
29
I2C2_SDA
I2C signal
GPIO2_A0
31
I2C2_SCL
GPIO2_A1
33
GPIO2_A2_d
GPIO signal
35
GPIO2_A3_d
37
GPIO2_A4_d
39
GPIO2_A5_d
41
GPIO2_A6_d
43
I2C7_SDA
I2C signal
GPIO2_A7
45
I2C6_SDA
GPIO2_B1
47
I2C7_SCL
GPIO2_B0
49
GND
51
I2C6_SCL
GPIO2_B2
53
CIF_CLKOUT
GPIO2_B3
55
GND
57
VCC_DVP_1V8
59
VCC_DVP_2V8
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61
VCCA
63
SPI1_RXD
SPI signal
GPIO1_A7
65
SPI1_TXD
GPIO1_B0
67
SPI1_CLK
GPIO1_B1
69
SPI1_CSN0
GPIO1_B2
71
GND
73
PCIE_RCLK_100M_P
PCIe signal
75
PCIE_RCLK_100M_N
77
GND
79
PCIE_TX0_N
81
PCIE_TX0_P
83
GND
85
PCIE_RX0_N
87
PCIE_RX0_P
89
GND
91
PCIE_TX1_N
93
PCIE_TX1_P
95
GND
97
PCIE_RX1_N
99
PCIE_RX1_P
101
GND
103
PCIE_TX2_N
105
PCIE_TX2_P
107
GND
109
PCIE_RX2_N
111
PCIE_RX2_P
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113
GND
115
PCIE_TX3_N
117
PCIE_TX3_P
119
GND
121
PCIE_RX3_N
123
PCIE_RX3_P
125
GND
J34C
Pin #
Signal name
Description
IO
133
GPIO1_C2_u
135
GPIO1_C4_u
137
I2C4_SDA
I2C signal
139
I2C4_SCL
141
PWR_EN
Switch enable
143
PWR_KEY
Switch control
145
GPIO1_D0_d
147
GPIO0_A6_d
149
GPIO0_B5_d
151
MPU_RESET
System reset
153
GPIO0_A2_d
GPIO signal
155
GPIO0_B0_u
157
GPIO0_A5_u
159
GPIO2_D3_d
161
HDMI_CEC
GPIO4_C7
163
HDMI_HPD
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165
HDMI_I2C3_SCL
HDMI
GPIO4_C1
167
HDMI_I2C3_SDA
GPIO4_C0
169
GPIO1_A2_d
171
RTC_CLK_OUT
173
GND
175
GPIO0_A4_d
177
GPIO2_D2_u
179
UART0_RTSn
UART 0
GPIO2_C3
181
UART0_CTSn
GPIO2_C2
183
UART0_TXD
GPIO2_C1
185
UART0_RXD
GPIO2_C0
187
GPIO0_B1_d
189
SDIO0_D1
SDIO signal
GPIO2_C5
191
SDIO0_D0
GPIO2_C4
193
SDIO0_D2
GPIO2_C6
195
SDIO0_D3
GPIO2_C7
197
SDIO0_CLK
GPIO2_D1
199
SDIO0_CMD
GPIO2_D0
201
GPIO0_A3_d
203
GPIO0_B2_d
205
GND
207
RTC_CLKO_WIFI
209
PMIC_EXT_PWR_EN
211
OTP_RST_CTRL
213
TYPEC1_ID
Typec-ID
215
TYPEC0_ID
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217
GPIO4_D4_d
219
GPIO4_D5_d
221
UART2DBG_TXD
UART 2
GPIO4_C4
223
UART2DBG_RXD
GPIO4_C3
225
GPIO4_D3_d
227
GPIO4_D0_u
229
GPIO4_D1_d
231
GPIO4_D2_d
233
GPIO4_C6_d
235
GPIO4_C2_d
237
VCCA_CODEC_3V0
3.0V output
239
VCCA_CODEC_3V0
241
VCCA_CODEC_1V8
1.8V output
243
VCCA_CODEC_1V8
245
GND
247
I2S0_SCLK
I2S signal
GPIO3_D0
249
I2S0_LRCK_RX
GPIO3_D1
251
I2S0_LRCK_TX
GPIO3_D2
253
I2S0_SDI0
GPIO3_D3
255
GPIO3_D4_d
GPIO3_D4
257
GPIO3_D5_d
GPIO3_D5
259
GPIO3_D6_d
GPIO3_D6
261
I2S0_SDO0
I2S signal
GPIO3_D7
263
I2S_CLK
GPIO4_A0
265
GPIO4_A3_d
267
GPIO4_A4_d
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