
GSM/GPRS Module Series
M66 Hardware Design
M66_Hardware_Design Confidential / Released 4 / 80
3.7.3. Auxiliary UART Port .......................................................................................................38
3.7.4. UART Application ...........................................................................................................38
3.8. Audio Interfaces.......................................................................................................................40
3.8.1. Decrease TDD Noise and other Noise ..........................................................................41
3.8.2. Microphone Interfaces Design .......................................................................................41
3.8.3. Receiver and Speaker Interface Design ........................................................................42
3.8.4. Earphone Interface Design ............................................................................................44
3.8.5. Audio Characteristics .....................................................................................................44
3.9. PCM Interface..........................................................................................................................45
3.9.1. Configuration..................................................................................................................45
3.9.2. Timing.............................................................................................................................46
3.9.3. Reference Design ..........................................................................................................48
3.9.4. AT Command .................................................................................................................48
3.10. SIM Card Interface...................................................................................................................49
3.11. ADC .........................................................................................................................................51
3.12. Behaviors of The RI.................................................................................................................51
3.13. Network Status Indication........................................................................................................53
3.14. RF Transmitting Signal Indication............................................................................................54
4Antenna Interface...............................................................................................................................56
4.1. GSM Antenna Interface ...........................................................................................................56
4.1.1. Reference Design ..........................................................................................................56
4.1.2. RF Output Power ...........................................................................................................57
4.1.3. RF Receiving Sensitivity ................................................................................................58
4.1.4. Operating Frequencies...................................................................................................58
4.1.5. RF Cable Soldering........................................................................................................59
4.2. Bluetooth Antenna Interface....................................................................................................59
5Electrical, Reliability and Radio Characteristics............................................................................61
5.1. Absolute Maximum Ratings.....................................................................................................61
5.2. Operating Temperature............................................................................................................61
5.3. Power Supply Ratings .............................................................................................................62
5.4. Current Consumption ..............................................................................................................63
5.5. Electro-static Discharge...........................................................................................................65
6Mechanical Dimensions....................................................................................................................66
6.1. Mechanical Dimensions of Module..........................................................................................66
6.2. Recommended Footprint.........................................................................................................68
6.3. Top View of the Module ...........................................................................................................69
6.4. Bottom View of the Module......................................................................................................69
7Storage and Manufacturing ..............................................................................................................70
7.1. Storage.....................................................................................................................................70
7.2. Soldering..................................................................................................................................71
7.3. Packaging................................................................................................................................71
7.3.1. Tape and Reel Packaging..............................................................................................72