Quectel EG06 Series User manual

EG06 Manual
LTE-A Module Series
Rev. EG06_Hardware_Design_V1.0
Date: 2018-05-16
Status: Released

www.quectel.com

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Copyright © Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved

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About the Document
History
Revision
Date
Author
Description
1.0
2018-04-11
King MA/
Wison HE
Initial

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Contents
About the Document...................................................................................................................................2
Contents.......................................................................................................................................................3
Table Index...................................................................................................................................................6
Figure Index.................................................................................................................................................8
1Introduction........................................................................................................................................10
1.1. Safety Information....................................................................................................................11
2Product Concept................................................................................................................................13
2.1. General Description.................................................................................................................13
2.2. Key Features ...........................................................................................................................14
2.3. Functional Diagram .................................................................................................................16
2.4. Evaluation Board .....................................................................................................................17
3Application Interface .........................................................................................................................18
3.1. General Description.................................................................................................................18
3.2. Pin Assignment........................................................................................................................19
3.3. Pin Description.........................................................................................................................20
3.4. Operating Modes.....................................................................................................................30
3.5. Power Saving...........................................................................................................................31
3.5.1. Sleep Mode....................................................................................................................31
3.5.1.1. UART Application.................................................................................................31
3.5.1.2. USB Application with USB Remote Wakeup Function........................................32
3.5.1.3. USB Application with USB Suspend/Resume and RI Function ..........................33
3.5.1.4. USB Application without USB Suspend Function................................................33
3.5.2. Airplane Mode................................................................................................................34
3.6. Power Supply...........................................................................................................................35
3.6.1. Power Supply Pins.........................................................................................................35
3.6.2. Decrease Voltage Drop..................................................................................................36
3.6.3. Reference Design for Power Supply..............................................................................37
3.6.4. Monitor the Power Supply..............................................................................................37
3.7. Turn on and off Scenarios.......................................................................................................37
3.7.1. Turn on Module Using the PWRKEY.............................................................................37
3.7.2. Turn off Module..............................................................................................................39
3.7.2.1. Turn off Module Using the PWRKEY Pin ............................................................39
3.7.2.2. Turn off Module Using AT Command..................................................................40
3.8. Reset the Module.....................................................................................................................40
3.9. (U)SIM Interface ......................................................................................................................42
3.10. USB Interface ..........................................................................................................................44
3.11. UART Interfaces......................................................................................................................46
3.12. PCM and I2C Interfaces..........................................................................................................49
3.13. ADC Interfaces ........................................................................................................................51
3.14. Network Status Indication........................................................................................................52
3.15. STATUS...................................................................................................................................53

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3.16. Behavior of the RI....................................................................................................................54
3.17. PCIe Interface* ........................................................................................................................55
3.18. WLAN Control Interface*.........................................................................................................56
3.19. SD Card Interface....................................................................................................................57
3.20. SPI Interface............................................................................................................................59
3.21. USB_BOOT Interface..............................................................................................................60
4GNSS Receiver...................................................................................................................................62
4.1. General Description.................................................................................................................62
4.2. GNSS Performance.................................................................................................................62
4.3. Layout Guidelines....................................................................................................................63
5Antenna Interfaces.............................................................................................................................64
5.1. Main/Rx-diversity Antenna Interface .......................................................................................64
5.1.1. Pin Definition..................................................................................................................64
5.1.2. Operating Frequency .....................................................................................................64
5.1.3. Reference Design of RF Antenna Interface...................................................................66
5.1.4. Reference Design of RF Layout.....................................................................................66
5.2. GNSS Antenna Interface.........................................................................................................68
5.3. Antenna Installation.................................................................................................................69
5.3.1. Antenna Requirement....................................................................................................69
5.3.2. Recommended RF Connector for Antenna Installation.................................................71
6Electrical, Reliability and Radio Characteristics............................................................................74
6.1. Absolute Maximum Ratings.....................................................................................................74
6.2. Power Supply Ratings.............................................................................................................75
6.3. Operation and Storage Temperatures ....................................................................................75
6.4. Current Consumption ..............................................................................................................76
6.5. RF Output Power.....................................................................................................................78
6.6. RF Receiving Sensitivity..........................................................................................................78
6.7. Electrostatic Discharge............................................................................................................79
6.8. Thermal Consideration............................................................................................................80
7Mechanical Dimensions....................................................................................................................82
7.1. Mechanical Dimensions of the Module....................................................................................82
7.2. Recommended Footprint.........................................................................................................84
7.3. Design Effect Drawings of the Module....................................................................................85
8Storage, Manufacturing and Packaging..........................................................................................86
8.1. Storage ....................................................................................................................................86
8.2. Manufacturing and Soldering ..................................................................................................87
8.3. Packaging................................................................................................................................87
9Appendix A References.....................................................................................................................89
10 IC & FCC Requirement ......................................................................................................................93
10.1. FCC Regulations: ....................................................................................................................93
10.2. RF Exposure Information.........................................................................................................93
10.3. ISED Notice.............................................................................................................................93
10.4. ISED Radiation Exposure Statement......................................................................................94
10.5. IMPORTANT NOTE: ...............................................................................................................94

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10.6. USERS MANUAL OF THE END PRODUCT:.........................................................................94
10.7. LABEL OF THE END PRODUCT:...........................................................................................95

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Table Index
TABLE 1: FREQUENCY BANDS OF EG06 SERIES MODULE....................................................................... 13
TABLE 2: KEY FEATURES OF EG06 MODULE.............................................................................................. 14
TABLE 3: I/O PARAMETERS DEFINITION...................................................................................................... 20
TABLE 4: PIN DESCRIPTION........................................................................................................................... 20
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................ 30
TABLE 6: VBAT AND GND PINS...................................................................................................................... 35
TABLE 7: PWRKEY PIN DESCRIPTION.......................................................................................................... 38
TABLE 8: RESET_N PIN DESCRIPTION......................................................................................................... 41
TABLE 9: PIN DEFINITION OF THE (U)SIM INTERFACE............................................................................... 42
TABLE 10: PIN DESCRIPTION OF USB INTERFACE..................................................................................... 44
TABLE 11: PIN DEFINITION OF THE MAIN UART INTERFACE.................................................................... 46
TABLE 12: PIN DEFINITION OF THE DEBUG UART INTERFACE................................................................ 47
TABLE 13: PIN DEFINITION OF THE BT UART INTERFACE......................................................................... 47
TABLE 14: LOGIC LEVELS OF DIGITAL I/O ................................................................................................... 47
TABLE 15: PIN DEFINITION OF PCM AND I2C INTERFACES....................................................................... 50
TABLE 16: PIN DEFINITION OF THE ADC INTERFACES.............................................................................. 51
TABLE 17: CHARACTERISTICS OF ADC INTERFACES................................................................................ 52
TABLE 18: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................... 52
TABLE 19: WORKING STATE OF THE NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ......... 52
TABLE 20: PIN DEFINITION OF STATUS........................................................................................................ 53
TABLE 21: BEHAVIOR OF THE RI................................................................................................................... 54
TABLE 22: PIN DEFINITION OF THE PCIE INTERFACE................................................................................ 55
TABLE 23: PIN DEFINITION OF WLAN CONTROL INTERFACE................................................................... 56
TABLE 24: PIN DEFINITION OF THE SD CARDINTERFACE......................................................................... 57
TABLE 25: PIN DEFINITION OF THE SPI INTERFACE .................................................................................. 59
TABLE 26: PARAMETERS OF SPI INTERFACE TIMING ............................................................................... 60
TABLE 27: PIN DEFINITION OF USB_BOOT INTERFACE............................................................................. 61
TABLE 28: GNSS PERFORMANCE................................................................................................................. 62
TABLE 29: PIN DEFINITION OF THE RF ANTENNA ...................................................................................... 64
TABLE 30: MODULE OPERATING FREQUENCIES ....................................................................................... 64
TABLE 31: PIN DEFINITION OF GNSS ANTENNA INTERFACE.................................................................... 68
TABLE 32: GNSS FREQUENCY ...................................................................................................................... 69
TABLE 33: ANTENNA REQUIREMENTS......................................................................................................... 70
TABLE 34: ABSOLUTE MAXIMUM RATINGS ................................................................................................. 74
TABLE 35: THE MODULE POWER SUPPLY RATINGS.................................................................................. 75
TABLE 36: OPERATION AND STORAGE TEMPERATURES......................................................................... 75
TABLE 37: EG06-E CURRENT CONSUMPTION............................................................................................. 76
TABLE 38: RF OUTPUT POWER..................................................................................................................... 78
TABLE 39: EG06-E CONDUCTED RF RECEIVING SENSITIVITY ................................................................. 79
TABLE 40: ELECTROSTATIC DISCHARGE CHARACTERISTICS................................................................. 80
TABLE 41: RELATED DOCUMENTS ............................................................................................................... 89

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TABLE 42: TERMS AND ABBREVIATIONS..................................................................................................... 89

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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM............................................................................................................... 17
FIGURE 2: PIN ASSIGNMENT (TOP VIEW).................................................................................................... 19
FIGURE 3: DRX RUN TIME AND CURRENT CONSUMPTION IN SLEEP MODE ......................................... 31
FIGURE 4: SLEEP MODE APPLICATION VIA UART...................................................................................... 32
FIGURE 5: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP.................................................... 32
FIGURE 6: SLEEP MODE APPLICATION WITH RI......................................................................................... 33
FIGURE 7: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION................................................ 34
FIGURE 8: POWER SUPPLY LIMITS DURING TX POWER........................................................................... 36
FIGURE 9: STAR STRUCTURE OF THE POWER SUPPLY........................................................................... 36
FIGURE 10: REFERENCE CIRCUIT OF POWER SUPPLY............................................................................ 37
FIGURE 11: TURN ON THE MODULE USING DRIVING CIRCUIT................................................................. 38
FIGURE 12: TURN ON THE MODULE USING KEYSTROKE ......................................................................... 38
FIGURE 13: TIMING OF TURNING ON MODULE........................................................................................... 39
FIGURE 14: TIMING OF TURNING OFF MODULE......................................................................................... 40
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 41
FIGURE 16: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON...................................................... 41
FIGURE 17: TIMING OF RESETTING MODULE............................................................................................. 42
FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 43
FIGURE 19: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 43
FIGURE 20: REFERENCE CIRCUIT OF USB APPLICATION......................................................................... 45
FIGURE 21: REFERENCE CIRCUIT WITH TRANSLATOR CHIP................................................................... 48
FIGURE 22: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT.............................................................. 48
FIGURE 23: PRIMARY MODE TIMING............................................................................................................ 49
FIGURE 24: AUXILIARY MODE TIMING.......................................................................................................... 50
FIGURE 25: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 51
FIGURE 26: REFERENCE CIRCUIT OF THE NETWORK INDICATOR ......................................................... 53
FIGURE 27: REFERENCE CIRCUITS OF STATUS ........................................................................................ 54
FIGURE 28: REFERENCE CIRCUIT OF SD CARD APPLICATION................................................................ 58
FIGURE 29: SPI INTERFACE TIMING............................................................................................................. 59
FIGURE 30: SPI INTERFACE REFERENCE CIRCUIT WITH A LEVEL TRANSLATOR ................................ 60
FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE................................................................ 61
FIGURE 32: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 66
FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB..................................................................... 67
FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB................................................. 67
FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND).................................................................................................................................................. 67
FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND).................................................................................................................................................. 68
FIGURE 37: REFERENCE CIRCUIT OF GNSS ANTENNA............................................................................. 69
FIGURE 38: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)............................................... 71

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FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS............................................................................. 72
FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM).......................................................... 73
FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE)................. 81
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................... 81
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS.................................................................................... 82
FIGURE 44: MODULE BOTTOM DIMENSIONS (TOP VIEW)......................................................................... 83
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW).............................................................................. 84
FIGURE 46: TOP VIEW OF THE MODULE...................................................................................................... 85
FIGURE 47: BOTTOM VIEW OF THE MODULE.............................................................................................. 85
FIGURE 48: REFLOW SOLDERING THERMAL PROFILE.............................................................................. 87
FIGURE 49: TAPE SPECIFICATIONS.............................................................................................................. 88
FIGURE 50: REEL SPECIFICATIONS.............................................................................................................. 88

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1Introduction
This document defines the EG06 module and describes its air interface and hardware interface which are
connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EG06 module. Associated with application note
and user guide, customers can use EG06 module to design and set up mobile applications easily.

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1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating EG06 module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for the customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. You must comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden, so as
to prevent interference with communication systems. Consult the airline staff about
the use of wireless devices on boarding the aircraft, if your device offers an
Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals,clinics or other health care
facilities. These requests are designed to prevent possible interference with
sensitive medical equipment.
Cellular terminals or mobiles operatingover radio frequency signal and cellular
network cannot be guaranteed to connect in all conditions, for example no mobile
fee or with an invalid (U)SIM card. While you are in this condition and need
emergent help, please remember using emergency call. In order to make or
receive a call, the cellular terminal or mobile must be switched on and in a service
area with adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,
it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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Please do not discard. Maybe wireless devices have an impact on the environment
so please do not arbitrarily discarded.

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2Product Concept
2.1. General Description
EG06 is a series of LTE-FDD/LTE-TDD/WCDMA wireless communication module with receive diversity,
which provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, and
WCDMA networks. It also provides GNSS1) and voice functionality2) to meet customers’ specific
application demands. EG06 contains five variants: EG06-E, EG06-A, EG06-LA, EG06-APAC and
EG06-AUTL. Customers can choose a dedicated type based on the region or operator. The following
table shows the frequency bands of EG06 series module.
Table 1: Frequency Bands of EG06 Series Module
Mode
EG06-E
EG06-A
EG06-LA
EG06-APAC
EG06-AUTL
LTE-FDD
(with
Rx-diversity)
B1/B3/B5/B7/
B8/B20/B28/
B323)
B2/B4/B5/B7/
B12/B13/B25/
B26/B293)/B30/
B66
B2/B3/B4/B5/
B7/B8/B20/B28
B1/B3/B5/B7/
B8/B18/B19/
B21/B26
B3/B7/B28
LTE-TDD
(with
Rx-diversity)
B38/B40/B41
Not supported
Not supported
B38/B39/B40/
B41
Not supported
2×CA
B1+B1/B5/B8/
B20/B28;
B3+B3/B5/B7/
B8/B20/B28;
B7+B5/B7/B8/
B20/B28;
B20+B323);
B38+B38;
B40+B40;
B41+B41
B2+B2/B5/B12/
B13/B26/B293);
B4+B4/B5/B12/
B13/B26/B293);
B7+B5/B7/B12/
B13/B26/B293);
B25+B5/B12/
B13/B25/B26/
B293);
B30+B5/B12/
B13/B26/B293);
B66+B5/B12/
B13/B26/B293)/
B66
B2+B2/B5/B8/
B20/B28;
B3+B3/B5/B7/
B8/B20/B28;
B4+B4/B5/B8/
B20/B28;
B7+B5/B7/B8/
B20/B28
B1+B3/B8/B18/
B19;
B3+B5/B19;
B7+B5/B7;
B21+B19;
B38+B38;
B39+B39;
B39+B41;
B40+B40;
B41+B41
B3+B3/B7/B28;
B7+B7/B28

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1. 1) GNSS function is optional.
2. 2) EG06 series module (EG06-E/EG06-A/EG06-LA/EG06-APAC/EG06-AUTL) contains Telematics
version and Data-only version. Telematics version supports voice and data functions, while
Data-only version only supports data function.
3. 3) B32 and B29 support Rx only, and in 2×CA they are only for secondary component carrier.
With a compact profile of 37.0mm × 39.5mm ×2.8mm, EG06 can meet almost all requirements for M2M
applications such as automotive, metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone, tablet PC, etc.
EG06 is an SMD type module which can be embedded in applications through its 299-pin LGA pads.
2.2. Key Features
The following table describes the detailed features of EG06 module.
Table 2: Key Features of EG06 Module
WCDMA
(with
Rx-diversity)
B1/B3/B5/B8
B2/B4/B5
B2/B3/B4/B5/
B8
B1/B5/B6/B8/
B9/B19
Not supported
GNSS
GPS,
GLONASS,
BeiDou/
Galileo,
QZSS
GPS,
GLONASS,
BeiDou/
Galileo,
QZSS
GPS,
GLONASS,
BeiDou/
Galileo,
QZSS
GPS,
GLONASS,
BeiDou/Galileo,
QZSS
GPS,
GLONASS,
BeiDou/Galileo,
QZSS
Feature
Details
Power Supply
Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
Transmitting Power
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
LTE Features
Support up to CA Cat 6 FDD and TDD
Support uplink QPSK and 16-QAM modulation
Support downlink QPSK, 16-QAM and 64-QAM modulation
Support 1.4MHz to 20MHz (2×CA) RF bandwidth
Support MIMO in DL direction
NOTES

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FDD: Max 300Mbps (DL)/50Mbps (UL)
TDD: Max 226Mbps (DL)/28Mbps (UL)
UMTS Features
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL)/384Kbps (UL)
Internet Protocol Features
Support PPP/QMI/TCP*/UDP*/FTP*/HTTP*/NTP*/PING*/HTTPS*/SMTP*/
MMS*/FTPS*/SMTPS*/SSL* protocols
Support the protocols PAP (Password Authentication Protocol) and CHAP
(Challenge Handshake Authentication Protocol) usually used for PPP
connections
SMS
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface
Support (U)SIM card: 1.8V/3.0V
Audio Features
Support one digital audio interface: PCM interface
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
PCM Interface
Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
Support master and slave modes, but must be the master in long frame
synchronization
USB Interface
Compliant with USB 3.0 and 2.0 specifications, with maximum transmission
rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0.
Used for AT command communication, data transmission, firmware
upgrade, software debugging, GNSS NMEA sentence output and voice
over USB*
Support USB serial drivers for: Windows XP/Vista 7/8/8.1/10;
WinCE 5.0/6.0/7.0*; Linux 2.6/3.x/4.1~4.14; Android 4.x/5.x/6.x/7.x
UART Interface
Main UART:
Used for AT command communication and data transmission
Baud rate reaches up to 921600bps, 115200bps by default
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output
115200bps baud rate
BT UART:
Used for Bluetooth communication

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1. 1) Within operation temperature range, the module is 3GPP compliant.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to
the normal operating temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of EG06 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
PCIe Interface*
Comply with PCI Express Specification Revision 2.1
Used for Ethernet or WLAN communication
Rx-diversity
Support LTE/WCDMA Rx-diversity
GNSS Features
Gen8C-Lite of Qualcomm
Protocol: NMEA 0183
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Network Indication
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Antenna Interface
Including main antenna interface (ANT_MAIN), Rx-diversity antenna
interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)
Physical Characteristics
Size: (37.0±0.15)mm ×(39.5±0.15)mm ×(2.8±0.2)mm
Weight: approx. 6.7g
Temperature Range
Operation temperature range: -35°C ~ +75°C1)
Extended temperature range: -40°C ~ +85°C2)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
USB2.0 interface and DFOTA*
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES

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Baseband
PMIC
Transceiver NAND
DDR2
SDRAM
Tx/Rx Blocks
ANT_MAIN ANT_DIVANT_GNSS
VBAT_BB
VBAT_RF
APT
PWRKEY
ADCs
VDD_EXT USB2.0/3.0 USIM PCM UART
I2C
RESET_N
19.2M
XO
STATUS
GPIOs
Control
IQ Control
Tx
PRx DRx
PCIe*
CLK_OUT
SD
SPI
Figure 1: Functional Diagram
“*” means under development.
2.4. Evaluation Board
In order to help customers develop applications with EG06, Quectel supplies an evaluation board (EVB),
USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.
NOTE

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3Application Interface
3.1. General Description
EG06 is equipped with 299-pin LGA pads that can be connected to cellular application platform.
Sub-interfaces included in these pads are described in detail in the following chapters:
Power supply
(U)SIM interface
USB interface
UART interfaces
PCM and I2C interfaces
ADC interfaces
Network status indication
PCIe interface*
WLAN control interface*
SD card interface
USB_BOOT interface
“*” means under development.
NOTE